EMBEDDED GLASS CORES IN PACKAGE SUBSTRATES AND RELATED METHODS
| Register | USPTO Patent |
|---|---|
| Application Number | 17483444 |
| Status | Pending |
| Filing Date | 2021-09-23 |
| First Publication Date | 2023-03-23 |
| Publication Date | 2023-03-23 |
| Owner | Intel Corporation (USA) |
| Inventor |
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Abstract
Embedded glass cores in package substrates and related methods are disclosed herein including an integrated circuit including a substrate having a first side and a second side opposite the first side, a plurality of vias disposed within the substrate to electrically couple corresponding contacts on the first and second sides of the substrate, a glass core surrounding a first via of the plurality of vias, and an organic core surrounding a second via of the plurality of vias, the second via different than the first via.IPC Classes ?
- H01L 23/498 - Leads on insulating substrates
- H01L 23/15 - Ceramic or glass substrates
- H01L 49/02 - Thin-film or thick-film devices
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups