Semiconductor Chip Package Having Internal I/O Structures With Modulated Thickness To Compensate For Die/Substrate Warpage
|First Publication Date||2023-03-23|
|Owner||Intel Corporation (USA)|
AbstractAn apparatus is described. The apparatus includes I/O structures having pads and solder balls to couple with a semiconductor chip, wherein, a first subset of pads and/or solder balls of the pads and solder balls that approach the semiconductor chip during coupling of the semiconductor chip to the I/O structures are thinner than a second subset of pads and/or solder balls of the pads and solder balls that move away from the semiconductor chip during the coupling of the semiconductor chip to the I/O structures.
IPC Classes ?
- H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
- H01L 23/498 - Leads on insulating substrates
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
- H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers