Register USPTO Patent
Application Number 17991503
Status Pending
Filing Date 2022-11-21
First Publication Date 2023-03-23
Publication Date 2023-03-23
Owner Intel Corporation (USA)
  • Keser, Lizabeth
  • Ort, Thomas
  • Wagner, Thomas
  • Waidhas, Bernd


A semiconductor device and method is disclosed. Devices shown include a die coupled to an integrated routing layer, wherein the integrated routing layer includes a first width that is wider than the die. Devices shown further included a molded routing layer coupled to the integrated routing layer.

IPC Classes  ?

  • H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
  • H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
  • H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
  • H01L 21/66 - Testing or measuring during manufacture or treatment
  • H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices