A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.
An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H01S 5/02325 - Mechanically integrated components on mount members or optical micro-benches
3.
Systems and Methods for Passively-Aligned Optical Waveguide Edge-Coupling
A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.
A package assembly includes a photonic integrated circuit chip that includes an optical fiber attachment area. The package assembly also includes at least one optical fiber positioned within the optical fiber attachment area. The package assembly also includes a lid structure disposed over the at least one optical fiber. The package assembly also includes a plurality of soldered connections that secure the lid structure to the photonic integrated circuit chip. The plurality of soldered connections are configured to draw the lid structure toward the photonic integrated circuit chip so as to press the lid structure against the at least one optical fiber to mechanically hold the at least one optical fiber against the optical fiber attachment area. The package assembly also includes a package component to which the photonic integrated circuit chip is flip-chip attached after formation of the plurality of soldered connections.
A package assembly includes a photonic integrated circuit chip that includes an optical fiber attachment area. The package assembly also includes at least one optical fiber positioned within the optical fiber attachment area. The package assembly also includes a lid structure disposed over the at least one optical fiber. The package assembly also includes a plurality of soldered connections that secure the lid structure to the photonic integrated circuit chip. The plurality of soldered connections are configured to draw the lid structure toward the photonic integrated circuit chip so as to press the lid structure against the at least one optical fiber to mechanically hold the at least one optical fiber against the optical fiber attachment area. The package assembly also includes a package component to which the photonic integrated circuit chip is flip-chip attached after formation of the plurality of soldered connections.
An optical waveguide includes a core region extending substantially along a lengthwise centerline of the optical waveguide, a first cladding region formed along a first side of the core region, and a second cladding region formed along a second side of the core region. The optical waveguide includes a first diode segment and a second diode segment that each include respective portions of the core region, the first cladding region, and the second cladding region. The second diode segment is contiguous with the first diode segment. The first diode segment forms a first diode across the optical waveguide such that a first intrinsic electric field extends across the first diode segment in a first direction, and the second diode segment forms a second diode across the optical waveguide such that a second intrinsic electric field extends across the second diode segment in a second direction opposite the first direction.
G02F 1/025 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction in an optical waveguide structure
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
7.
Pooled Memory System Enabled by Monolithic In-Package Optical I/O
A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04B 10/516 - Transmitters - Details of coding or modulation
G11C 5/04 - Supports for storage elements; Mounting or fixing of storage elements on such supports
G11C 5/06 - Arrangements for interconnecting storage elements electrically, e.g. by wiring
G11C 11/42 - Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled
G02B 6/42 - Coupling light guides with opto-electronic elements
An electro-optic receiver includes a polarization splitter and rotator (PSR) that directs incoming light having a first polarization through a first end of an optical waveguide, and that rotates incoming light from a second polarization to the first polarization to create polarization-rotated light that is directed to a second end of the optical waveguide. The incoming light of the first polarization and the polarization-rotated light travel through the optical waveguide in opposite directions. A plurality of ring resonators is optically coupled the optical waveguide. Each ring resonator is configured to operate at a respective resonant wavelength, such that the incoming light of the first polarization having the respective resonant wavelength optically couples into said ring resonator in a first propagation direction, and such that the polarization-rotated light having the respective resonant wavelength optically couples into said ring resonator in a second propagation direction opposite the first propagation direction.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.
An optical data communication system includes an optical power supply and an electro-optical chip. The optical power supply includes a laser that generates laser light at a single wavelength. A comb generator receives the light at the single wavelength and generates multiple wavelengths of continuous wave light from laser light at the single wavelength. The multiple wavelengths of continuous wave light are provided as light input to the electro-optical chip. The electro-optical chip includes at least one transmit macro that receives the multiple wavelengths of continuous wave light and that modulates one or more of the multiple wavelengths of continuous wave light to generate modulated light signals that convey digital data.
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04Q 11/00 - Selecting arrangements for multiplex systems
11.
Systems and Methods for Coupling Light Into a Multi-Mode Resonator
A photonic system includes a passive optical cavity and an optical waveguide. The passive optical cavity has a preferred radial mode for light propagation within the passive optical cavity. The preferred radial mode has a unique light propagation constant within the passive optical cavity. The optical waveguide is configured to extend past the passive optical cavity such that at least some light propagating through the optical waveguide will evanescently couple into the passive optical cavity. The passive optical cavity and the optical waveguide are collectively configured such that a light propagation constant of the optical waveguide substantially matches the unique light propagation constant of the preferred radial mode within the passive optical cavity.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
12.
Systems and Methods for Wafer-Level Photonic Testing
A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.
H01L 21/66 - Testing or measuring during manufacture or treatment
H04B 10/073 - Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an out-of-service signal
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G01R 31/3185 - Reconfiguring for testing, e.g. LSSD, partitioning
A strip-loaded optical waveguide includes a slab layer, a strip layer, and a cladding region. The slab layer has a first optical refractive index and a first width measured in a transverse direction that is perpendicular to a light propagation direction through the strip-loaded optical waveguide. The strip layer is disposed above the slab layer. The strip layer has a second optical refractive index and a second width as measured the transverse direction. The second width is less than the first width of the slab layer. The second optical refractive index is less than the first optical refractive index of the slab layer. The cladding region is disposed above the slab layer and above the strip layer. The cladding region has a third optical refractive index that is less than the second optical refractive index of the strip layer.
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02F 1/025 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction in an optical waveguide structure
A strip-loaded optical waveguide includes a slab layer, a strip layer, and a cladding region. The slab layer has a first optical refractive index and a first width measured in a transverse direction that is perpendicular to a light propagation direction through the strip-loaded optical waveguide. The strip layer is disposed above the slab layer. The strip layer has a second optical refractive index and a second width as measured the transverse direction. The second width is less than the first width of the slab layer. The second optical refractive index is less than the first optical refractive index of the slab layer. The cladding region is disposed above the slab layer and above the strip layer. The cladding region has a third optical refractive index that is less than the second optical refractive index of the strip layer.
A strip-loaded optical waveguide includes a slab layer, a strip layer, and a cladding region. The slab layer has a first optical refractive index and a first width measured in a transverse direction that is perpendicular to a light propagation direction through the strip-loaded optical waveguide. The strip layer is disposed above the slab layer. The strip layer has a second optical refractive index and a second width as measured the transverse direction. The second width is less than the first width of the slab layer. The second optical refractive index is less than the first optical refractive index of the slab layer. The cladding region is disposed above the slab layer and above the strip layer. The cladding region has a third optical refractive index that is less than the second optical refractive index of the strip layer.
An optical distribution network includes a fore-positioned optical multiplexer section that has a plurality of optical inputs and a plurality of intermediate optical outputs. Each of the plurality of optical inputs of the fore-positioned optical multiplexer section receives a respective one of a plurality of input light signals of different wavelengths. The fore-positioned optical multiplexer section multiplexes a unique subset of the plurality of input light signals onto each of the plurality of intermediate optical outputs. The optical distribution network also includes an optical coupler section that has a plurality of optical inputs respectively optically connected to the plurality of intermediate optical outputs of the fore-positioned optical multiplexer section. The optical coupler section distributes a portion of each light signal received at each of the plurality of optical inputs of the optical coupler section to each and every one of a plurality of optical outputs of the optical coupler section.
An optical distribution network includes a fore-positioned optical multiplexer section that has a plurality of optical inputs and a plurality of intermediate optical outputs. Each of the plurality of optical inputs of the fore-positioned optical multiplexer section receives a respective one of a plurality of input light signals of different wavelengths. The fore-positioned optical multiplexer section multiplexes a unique subset of the plurality of input light signals onto each of the plurality of intermediate optical outputs. The optical distribution network also includes an optical coupler section that has a plurality of optical inputs respectively optically connected to the plurality of intermediate optical outputs of the fore-positioned optical multiplexer section. The optical coupler section distributes a portion of each light signal received at each of the plurality of optical inputs of the optical coupler section to each and every one of a plurality of optical outputs of the optical coupler section.
G02F 1/025 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction in an optical waveguide structure
An electro-optical chip includes a plurality of transmit macros, each of which includes an optical waveguide and a plurality of ring resonators positioned along the optical waveguide. An optical distribution network is implemented onboard the electro-optical chip. The optical distribution network has a plurality of optical inputs and a plurality of optical outputs. The optical distribution network conveys a portion of light received at each and every one of the plurality of optical inputs to each of the plurality of optical outputs, such that light conveyed to each of the plurality of optical outputs includes all wavelengths of light conveyed to the plurality of optical inputs. Each of the plurality of optical outputs is optically connected to the optical waveguide in a corresponding one of the plurality of transmit macros. The electro-optical chip is optically connected to a remote optical power supply.
G02B 6/124 - Geodesic lenses or integrated gratings
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
19.
Optical Communication System with a Simplified Remote Optical Power Supply
An electro-optical chip includes a plurality of transmit macros, each of which includes an optical waveguide and a plurality of ring resonators positioned along the optical waveguide. An optical distribution network is implemented onboard the electro-optical chip and includes a plurality of optical inputs and a plurality of optical outputs. The optical distribution network conveys a portion of light received at a subset of the plurality of optical inputs to one or more of the plurality of optical outputs, such that light conveyed to said one or more of the plurality of optical outputs includes wavelengths of light conveyed to said subset of the plurality of optical inputs. The subset of the plurality of optical inputs includes at least two of the plurality of optical inputs. Each of the plurality of optical outputs is optically connected to the optical waveguide in a corresponding one of the plurality of transmit macros.
H04B 10/2519 - Arrangements specific to fibre transmission for the reduction or elimination of distortion or dispersion due to chromatic dispersion using Bragg gratings
H04B 10/294 - Signal power control in a multiwavelength system, e.g. gain equalisation
20.
OPTICAL COMMUNICATION SYSTEM WITH SIMPLIFIED REMOTE OPTICAL POWER SUPPLY
An electro-optical chip includes a plurality of transmit macros, each of which includes an optical waveguide and a plurality of ring resonators positioned along the optical waveguide. An optical distribution network is implemented onboard the electro-optical chip. The optical distribution network has a plurality of optical inputs and a plurality of optical outputs. The optical distribution network conveys a portion of light received at each and every one of the plurality of optical inputs to each of the plurality of optical outputs, such that light conveyed to each of the plurality of optical outputs includes all wavelengths of light conveyed to the plurality of optical inputs. Each of the plurality of optical outputs is optically connected to the optical waveguide in a corresponding one of the plurality of transmit macros. The electro-optical chip is optically connected to a remote optical power supply.
A first portion of incoming light and a second portion of incoming light travel in opposite directions within a first optical waveguide. A ring resonator in-couples the first portion of incoming light and the second portion of incoming light from the first optical waveguide, such that the first portion of incoming light and the second portion of incoming light travel in opposite directions within the ring resonator. A second optical waveguide is disposed to in-couple the first portion of incoming light and the second portion of incoming light couple from the ring resonator, such that the first portion of incoming light and the second portion of incoming light travel in opposite directions within the second optical waveguide away from the ring resonator. One or more photodetector(s) are optically connected to receive the first portion of incoming light and the second portion of incoming light from the second optical waveguide.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
A first portion of incoming light and a second portion of incoming light travel in opposite directions within a first optical waveguide. A ring resonator in-couples the first portion of incoming light and the second portion of incoming light from the first optical waveguide, such that the first portion of incoming light and the second portion of incoming light travel in opposite directions within the ring resonator. A second optical waveguide is disposed to in-couple the first portion of incoming light and the second portion of incoming light couple from the ring resonator, such that the first portion of incoming light and the second portion of incoming light travel in opposite directions within the second optical waveguide away from the ring resonator. One or more photodetector(s) are optically connected to receive the first portion of incoming light and the second portion of incoming light from the second optical waveguide.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/42 - Coupling light guides with opto-electronic elements
An optical power supply includes a plurality of lasers in a laser array. Each of the plurality of lasers is configured to generate a separate beam of continuous wave laser light. The optical power supply includes a temperature sensor that acquires a temperature associated with the laser array. The optical power supply includes a digital controller that receives notification of the temperature from the temperature senor. The optical power supply includes an optical power adjuster controlled by the digital controller. The optical power adjuster adjusts an optical power level of one or more beams of continuous wave laser light generated by the plurality of lasers to produce an optical power encoding that conveys information about the temperature associated with the laser array as acquired by the temperature sensor. An electro-optic chip receives the beams of continuous wave laser light from the optical power supply and decodes the optical power encoding.
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04B 10/077 - Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal using a supervisory or additional signal
An optical power supply includes a plurality of lasers in a laser array. Each of the plurality of lasers is configured to generate a separate beam of continuous wave laser light. The optical power supply includes a temperature sensor that acquires a temperature associated with the laser array. The optical power supply includes a digital controller that receives notification of the temperature from the temperature senor. The optical power supply includes an optical power adjuster controlled by the digital controller. The optical power adjuster adjusts an optical power level of one or more beams of continuous wave laser light generated by the plurality of lasers to produce an optical power encoding that conveys information about the temperature associated with the laser array as acquired by the temperature sensor. An electro-optic chip receives the beams of continuous wave laser light from the optical power supply and decodes the optical power encoding.
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Semiconductors which integrate photonics and electronics
into a single silicon chip; light engine and light source,
namely, a light engine subsystem consisting of light
emitting diodes, light pipe lamp modules, and delivery
optics; electrical components in the nature of integrated
circuits; integrated circuits modules; integrated circuits;
computer networking hardware; network communications
hardware; electronic components in the nature of connectors
and remote optical lasers; optical connectors; electronic
and optical communications instruments and components,
namely, optical transmitters and receivers; lasers, not for
medical purposes; integrated circuit modules; integrated
circuit cards and components; integrated circuit cards and
components, namely, chiplets, computer chipsets, and
multi-chip modules (mcms); processor circuits; computer
hardware; microprocessors and semiconductors;
microcontrollers; electronic circuit boards; digital and
optical microprocessors; connectors for electronic circuits;
downloadable computer software for use in processing
semiconductor wafers; application-specific hardware
accelerators; peripheral component interface (pci)
accelerator cards; semiconductor asics (application-specific
integrated circuits); electronic circuit boards and other
computer hardware for high-speed processing; downloadable
computer software, namely, computer application software for
processing acceleration and for managing hardware or
software components used for processing. Custom manufacture of computer hardware, electronic
components, communication devices, semiconductors,
processors, memory chips, wafers and integrated circuits;
fabricating of computer hardware, semiconductors,
processors, memory chips, wafers and integrated circuits;
processing and assembling of computer hardware, electronic
components for computers, semiconductors, computer
processors, and semiconductor wafers and integrated circuits
for others. Design of integrated circuits; hardware design services for
computer hardware, processor circuits, integrated circuits,
semiconductors, chiplets, computer chipsets, co-processors,
processor designs; computer hardware development; computer
software development; computer design, engineering,
development implementation and consulting for others in
connection with computer hardware and software; computer
services, namely, cloud hosting provider services; research,
custom design and testing for new product development in the
field of semiconductors and chiplets; technological
consultation regarding electrical and electronic products,
semiconductors, semiconductor systems, semiconductor cell
libraries, wafer and integrated circuits; research, design,
and development services in the field of semiconductor,
computer processor, memory chips, and communication and
electronic component technology; technological consultation
in relation to the development of semiconductors, computer
processors, integrated circuits, memory chips, wafers, and
communication devices and electronic components; platform as
a service (paas) featuring computer software platforms for
online design, development, and testing of semiconductor,
computer processors, memory chips, and communication and
electronic component technology; providing temporary use of
on-line non-downloadable software for cognitive computing,
deep learning, artificial intelligence.
27.
Optical Data Communication System and Associated Method
An optical data communication system includes a plurality of resonator structures and a laser array that includes a plurality of lasers optically connected to the plurality of resonator structures. Each resonator structure has a respective free spectral wavelength range and a respective resonance wavelength. A maximum difference in resonance wavelength between any two resonator structures in the plurality of resonator structures is less than a minimum free spectral wavelength range of any resonator structure in the plurality of resonator structures. Each laser in the plurality of lasers is configured to generate continuous wave light having a respective wavelength. The laser array has a central wavelength. A variability of the central wavelength is greater than a minimum difference in resonance wavelength between any two spectrally neighboring resonator structures in the plurality of resonator structures.
An optical input polarization management device includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization so as to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Light within the first and second OW's is input to a first two-by-two optical splitter (2×2OS). A first phase shifter (PS) is interfaced with either the first or second OW. Light is output from the first 2×2OS into a third OW and a fourth OW. Light within the third and fourth OW's is input to a second 2×2OS. A second PS is interfaced with either the third or fourth OW. Light is output from the second 2×2OS into a fifth OW for further processing.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Semiconductors which integrate photonics and electronics into a single silicon chip; Light engine and light source, namely, a light engine subsystem consisting of light emitting diodes, light pipe lamp modules, and delivery optics; Electrical components in the nature of integrated circuits; Integrated circuits modules; Integrated circuits; Computer networking hardware; Network communications hardware; Electronic components in the nature of connectors and remote optical lasers; Optical connectors; Electronic and optical communications instruments and components, namely, optical transmitters and receivers; Lasers, not for medical purposes; Integrated circuit modules; Integrated circuit cards and components; Integrated circuit cards and components, namely, chiplets, computer chipsets, and multi-chip modules (MCMs); Processor circuits; Computer hardware; Microprocessors and semiconductors; Microcontrollers; Electronic circuit boards; Digital and optical microprocessors; Connectors for electronic circuits; Downloadable computer software for use in processing semiconductor wafers; Application-specific hardware accelerators; Peripheral component interface (PCI) accelerator cards; Semiconductor ASICs (application-specific integrated circuits); Electronic circuit boards and other computer hardware for high-speed processing; Downloadable computer software, namely, computer application software for processing acceleration and for managing hardware or software components used for processing. Custom manufacture of computer hardware, electronic components, communication devices, semiconductors, processors, memory chips, wafers and integrated circuits; Fabricating of computer hardware, semiconductors, processors, memory chips, wafers and integrated circuits; Processing and assembling of computer hardware, electronic components for computers, semiconductors, computer processors, and semiconductor wafers and integrated circuits for others. Design of integrated circuits; Hardware design services for computer hardware, processor circuits, integrated circuits, semiconductors, chiplets, computer chipsets, co-processors, processor designs; Computer hardware development; Computer software development; Computer design, engineering, development implementation and consulting for others in connection with computer hardware and software; Computer services, namely, cloud hosting provider services; Research, custom design and testing for new product development in the field of semiconductors and chiplets; Technological consultation regarding electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits; Research, design, and development services in the field of semiconductor, computer processor, memory chips, and communication and electronic component technology; Technological consultation in relation to the development of semiconductors, computer processors, integrated circuits, memory chips, wafers, and communication devices and electronic components; Platform as a service (PAAS) featuring computer software platforms for online design, development, and testing of semiconductor, computer processors, memory chips, and communication and electronic component technology; Providing temporary use of on-line non-downloadable software for cognitive computing, deep learning, artificial intelligence.
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Semiconductors which integrate photonics and electronics into a single silicon chip; light engine and light source, namely, a light engine subsystem consisting of light emitting diodes, light pipe lamp modules, and delivery optics; electrical components in the nature of integrated circuits; integrated circuits modules; integrated circuits; computer networking hardware; network communications hardware; electronic components in the nature of connectors and remote optical lasers; optical connectors; electronic and optical communications instruments and components, namely, optical transmitters and receivers; lasers, not for medical purposes; integrated circuit modules; integrated circuit cards and components; integrated circuit cards and components, namely, chiplets, computer chipsets, and multi-chip modules (mcms); processor circuits; computer hardware; microprocessors and semiconductors; microcontrollers; electronic circuit boards; digital and optical microprocessors; connectors for electronic circuits; downloadable computer software for use in processing semiconductor wafers; application-specific hardware accelerators; peripheral component interface (pci) accelerator cards; semiconductor asics (application-specific integrated circuits); electronic circuit boards and other computer hardware for high-speed processing; downloadable computer software, namely, computer application software for processing acceleration and for managing hardware or software components used for processing. (1) Custom manufacture of computer hardware, electronic components, communication devices, semiconductors, processors, memory chips, wafers and integrated circuits; fabricating of computer hardware, semiconductors, processors, memory chips, wafers and integrated circuits; processing and assembling of computer hardware, electronic components for computers, semiconductors, computer processors, and semiconductor wafers and integrated circuits for others.
(2) Design of integrated circuits; hardware design services for computer hardware, processor circuits, integrated circuits, semiconductors, chiplets, computer chipsets, co-processors, processor designs; computer hardware development; computer software development; computer design, engineering, development implementation and consulting for others in connection with computer hardware and software; computer services, namely, cloud hosting provider services; research, custom design and testing for new product development in the field of semiconductors and chiplets; technological consultation regarding electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits; research, design, and development services in the field of semiconductor, computer processor, memory chips, and communication and electronic component technology; technological consultation in relation to the development of semiconductors, computer processors, integrated circuits, memory chips, wafers, and communication devices and electronic components; platform as a service (paas) featuring computer software platforms for online design, development, and testing of semiconductor, computer processors, memory chips, and communication and electronic component technology; providing temporary use of on-line non-downloadable software for cognitive computing, deep learning, artificial intelligence.
A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
32.
Thermal Management System for Multi-Chip-Module and Associated Methods
A plurality of lid structures include at least one lid structure configured to overlie one or more heat sources within a multi-chip-module and at least one lid structure configured to overlie one or more temperature sensitive components within the multi-chip-module. The plurality of lid structures are configured and positioned such that each lid structure is separated from each adjacent lid structure by a corresponding thermal break. A heat spreader assembly is positioned in thermally conductive interface with the plurality of lid structures. The heat spreader assembly is configured to cover an aggregation of the plurality of lid structures. The heat spreader assembly includes a plurality of separately defined heat transfer members respectively configured and positioned to overlie the plurality of lid structures. The heat spreader assembly is configured to limit heat transfer between different heat transfer members within the heat spreader assembly.
G02B 6/42 - Coupling light guides with opto-electronic elements
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
An electro-optic combiner includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Each of the first and second OW's has a respective combiner section. The first and second OW combiner sections extend parallel to each other and have opposite light propagation directions. A plurality of ring resonators is disposed between the combiner sections of the first and second OW's and within an evanescent optically coupling distance of both the first and second OW's. Each of ring resonators operates at a respective resonant wavelength to optically couple light from the combiner section of the first OW into the combiner section of the second OW.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.
A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.
An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H01S 5/02325 - Mechanically integrated components on mount members or optical micro-benches
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Semiconductors which integrate photonics and electronics into a single silicon chip; Light engine and light source, namely, a light engine subsystem consisting of laser light emitting diodes and delivery optics in the nature of fiber optics; Electrical components in the nature of integrated circuits; Integrated circuits modules; Integrated circuits; Computer networking hardware; Computer hardware in the nature of network communications hardware; Electronic components in the nature of connectors and remote optical lasers in the nature of lasers not for medical purposes; Optical fiber connectors; Electronic and optical communications instruments and components, namely, optical transmitters and receivers; Lasers, not for medical purposes; Integrated circuit modules; Integrated circuit cards and components; Integrated circuit cards and components, namely, chiplets in the nature of tiny integrated circuit modules, computer chipsets, and multi-chip modules (MCMs) in the nature of microcircuits; Integrated circuits, namely, Processor circuits; Computer hardware; Microprocessors and semiconductors; Microcontrollers; Electronic circuit boards; Digital and optical microprocessors; Connectors for electronic circuits; Downloadable computer software for use in processing semiconductor wafers; Computer hardware, namely, Application-specific hardware accelerators; Computer hardware, namely, Peripheral component interface (PCI) accelerator cards; Semiconductor ASICs (application-specific integrated circuits); Electronic circuit boards and other computer hardware for high-speed processing, namely telecommunication base stations, radio transmitters, and high performance computer hardware; Downloadable computer software, namely, computer application software for processing acceleration and for managing hardware or software components used for processing Custom manufacture of computer hardware, electronic components, communication devices, semiconductors, processors, memory chips, wafers and integrated circuits; Custom Fabricating of computer hardware, semiconductors, processors, memory chips, wafers and integrated circuits; Custom manufacture of computer hardware, electronic components for computers, semiconductors, computer processors, and semiconductor wafers and integrated circuits for others Design of integrated circuits; Hardware design services for computer hardware, processor circuits, integrated circuits, semiconductors, chiplets, computer chipsets, co-processors, processor designs; Computer hardware development; Computer software development; Computer design, engineering, development implementation and consulting for others in connection with computer hardware and software; Computer services, namely, cloud hosting provider services; Research, custom design and testing for new product development in the field of semiconductors and chiplets; Technological consultation regarding design and development of electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits; Research, design, and development services in the field of semiconductor, computer processor, memory chips, and communication and electronic component technology; Technological consultation in relation to the development of semiconductors, computer processors, integrated circuits, memory chips, wafers, and communication devices and electronic components; Platform as a service (PAAS) featuring computer software platforms for online design, development, and testing of semiconductor, computer processors, memory chips, and communication and electronic component technology; Providing temporary use of on-line non-downloadable software for cognitive computing, deep learning, artificial intelligence
09 - Scientific and electric apparatus and instruments
Goods & Services
Semiconductors which integrate photonics and electronics into a single silicon chip; Light engine and light source, namely, a light engine subsystem consisting of laser light emitting diodes, and delivery optics in the nature of fiber optics; Electrical components in the nature of integrated circuits; Integrated circuits; Computer networking hardware; Network communications hardware, namely, integrated electronic-photonic circuits for high-speed chip-to-chip communication; Electronic components in the nature of connectors and non-medical remote optical lasers; Optical fiber connectors; Electronic and optical communications instruments and components, namely, optical transmitters and receivers; Integrated circuit modules; Integrated circuit cards and components; Integrated circuit cards and components, namely, chiplets in the nature of tiny integrated circuit modules, computer chipsets, and multi-chip modules (MCMs) in the nature of microcircuits; Processor circuits being micro processors; Digital and optical microprocessors; Computer hardware; Microprocessors and semiconductors; Microcontrollers; Electronic circuit boards; Connectors for electronic circuits; Application-specific hardware accelerators, namely, machine learning and artificial intelligence accelerators being computer accelerator boards and graphics accelerators; Semiconductor ASICs (application-specific integrated circuits), namely, integrated circuits; all of the foregoing for use primarily with optical interconnects
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Semiconductors which integrate photonics and electronics into a single silicon chip; Light engine and light source, namely, a light engine subsystem consisting of laser light emitting diodes and delivery optics in the nature of fiber optics; Electrical components in the nature of integrated circuits; Integrated circuits modules; Integrated circuits; Computer networking hardware; Computer hardware in the nature of network communications hardware; Electronic components in the nature of connectors and remote optical lasers in the nature of lasers not for medical purposes; Optical fiber connectors; Electronic and optical communications instruments and components, namely, optical transmitters and receivers; Lasers, not for medical purposes; Integrated circuit modules; Integrated circuit cards and components; Integrated circuit cards and components, namely, chiplets in the nature of tiny integrated circuit modules, computer chipsets, and multi-chip modules (MCMs) in the nature of microcircuits; Integrated circuits, namely, Processor circuits; Computer hardware; Microprocessors and semiconductors; Microcontrollers; Electronic circuit boards; Digital and optical microprocessors; Connectors for electronic circuits; Downloadable computer software for use in processing semiconductor wafers; Computer hardware, namely, Application-specific hardware accelerators; Computer hardware, namely, Peripheral component interface (PCI) accelerator cards; Semiconductor ASICs (application-specific integrated circuits); Electronic circuit boards and other computer hardware for high-speed processing, namely telecommunication base stations, radio transmitters, and high performance computer hardware; Downloadable computer software, namely, computer application software for processing acceleration and for managing hardware or software components used for processing Custom manufacture of computer hardware, electronic components, communication devices, semiconductors, processors, memory chips, wafers and integrated circuits; Custom Fabricating of computer hardware, semiconductors, processors, memory chips, wafers and integrated circuits; Custom manufacture of computer hardware, electronic components for computers, semiconductors, computer processors, and semiconductor wafers and integrated circuits for others Design of integrated circuits; Hardware design services for computer hardware, processor circuits, integrated circuits, semiconductors, chiplets, computer chipsets, co-processors, processor designs; Computer hardware development; Computer software development; Computer design, engineering, development implementation and consulting for others in connection with computer hardware and software; Computer services, namely, cloud hosting provider services; Research, custom design and testing for new product development in the field of semiconductors and chiplets; Technological consultation regarding design and development of electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits; Research, design, and development services in the field of semiconductor, computer processor, memory chips, and communication and electronic component technology; Technological consultation in relation to the development of semiconductors, computer processors, integrated circuits, memory chips, wafers, and communication devices and electronic components; Platform as a service (PAAS) featuring computer software platforms for online design, development, and testing of semiconductor, computer processors, memory chips, and communication and electronic component technology; Providing temporary use of on-line non-downloadable software for cognitive computing, deep learning, artificial intelligence
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Semiconductors which integrate photonics and electronics into a single silicon chip; Light engine and light source, namely, a light engine subsystem consisting of laser light emitting diodes and delivery optics in the nature of fiber optics; Electrical components in the nature of integrated circuits; Integrated circuits modules; Integrated circuits; Computer networking hardware; Computer hardware in the nature of network communications hardware; Electronic components in the nature of connectors and remote optical lasers in the nature of lasers not for medical purposes; Optical fiber connectors; Electronic and optical communications instruments and components, namely, optical transmitters and receivers; Lasers, not for medical purposes; Integrated circuit modules; Integrated circuit cards and components; Integrated circuit cards and components, namely, chiplets in the nature of tiny integrated circuit modules, computer chipsets, and multi-chip modules (MCMs) in the nature of microcircuits; Integrated circuits, namely, Processor circuits; Computer hardware; Microprocessors and semiconductors; Microcontrollers; Electronic circuit boards; Digital and optical microprocessors; Connectors for electronic circuits; Downloadable computer software for use in processing semiconductor wafers; Computer hardware, namely, Application-specific hardware accelerators; Computer hardware, namely, Peripheral component interface (PCI) accelerator cards; Semiconductor ASICs (application-specific integrated circuits); Electronic circuit boards and other computer hardware for high-speed processing, namely telecommunication base stations, radio transmitters, and high performance computer hardware; Downloadable computer software, namely, computer application software for processing acceleration and for managing hardware or software components used for processing Custom manufacture of computer hardware, electronic components, communication devices, semiconductors, processors, memory chips, wafers and integrated circuits; Custom Fabricating of computer hardware, semiconductors, processors, memory chips, wafers and integrated circuits; Custom manufacture of computer hardware, electronic components for computers, semiconductors, computer processors, and semiconductor wafers and integrated circuits for others Design of integrated circuits; Hardware design services for computer hardware, processor circuits, integrated circuits, semiconductors, chiplets, computer chipsets, co-processors, processor designs; Computer hardware development; Computer software development; Computer design, engineering, development implementation and consulting for others in connection with computer hardware and software; Computer services, namely, cloud hosting provider services; Research, custom design and testing for new product development in the field of semiconductors and chiplets; Technological consultation regarding design and development of electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits; Research, design, and development services in the field of semiconductor, computer processor, memory chips, and communication and electronic component technology; Technological consultation in relation to the development of semiconductors, computer processors, integrated circuits, memory chips, wafers, and communication devices and electronic components; Platform as a service (PAAS) featuring computer software platforms for online design, development, and testing of semiconductor, computer processors, memory chips, and communication and electronic component technology; Providing temporary use of on-line non-downloadable software for cognitive computing, deep learning, artificial intelligence
An optical coupling device includes an optical waveguide disposed on a substrate. An index of refraction of the optical waveguide is greater than an index of refraction of the substrate. The optical coupling device includes a cladding material disposed alongside and above the optical waveguide. An index of refraction of the cladding material is less than the index of refraction of the optical waveguide. The optical coupling device includes an optical buffering layer disposed within the cladding material above the optical waveguide. The optical buffering layer has an index of refraction greater than the index of refraction of the cladding material. The optical buffering layer is positioned a distance away from a top surface of the optical waveguide so as to guide an input optical mode at controlled vertical level relative to the optical waveguide, with the input optical mode overlapping the optical waveguide.
A photodetector includes a photodiode that has a germanium junction formed between an n-doped region and a p-doped region. The germanium junction is formed to have an input interface at a light input end of the germanium junction. The input interface has a substantially flat shape or a convex-faceted shape. The photodetector also includes an input waveguide connected to the input interface of the germanium junction. The input waveguide has a substantially linear shape along a lengthwise centerline of the input waveguide. The input waveguide is oriented so that the lengthwise centerline of the input waveguide is positioned at a non-zero angle relative to input interface of the germanium junction.
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/109 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PN heterojunction type
G02B 6/42 - Coupling light guides with opto-electronic elements
43.
LOW NON-LINEAR LOSS SILICON WAVEGUIDES WITH SWEEP-OUT DIODES
An optical waveguide includes a core region extending substantially along a lengthwise centerline of the optical waveguide, a first cladding region formed along a first side of the core region, and a second cladding region formed along a second side of the core region. The optical waveguide includes a first diode segment and a second diode segment that each include respective portions of the core region, the first cladding region, and the second cladding region. The second diode segment is contiguous with the first diode segment. The first diode segment forms a first diode across the optical waveguide such that a first intrinsic electric field extends across the first diode segment in a first direction, and the second diode segment forms a second diode across the optical waveguide such that a second intrinsic electric field extends across the second diode segment in a second direction opposite the first direction.
G02F 1/025 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction in an optical waveguide structure
G02B 6/10 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02F 1/015 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction
44.
Low non-linear loss silicon waveguides with sweep-out diodes
An optical waveguide includes a core region extending substantially along a lengthwise centerline of the optical waveguide, a first cladding region formed along a first side of the core region, and a second cladding region formed along a second side of the core region. The optical waveguide includes a first diode segment and a second diode segment that each include respective portions of the core region, the first cladding region, and the second cladding region. The second diode segment is contiguous with the first diode segment. The first diode segment forms a first diode across the optical waveguide such that a first intrinsic electric field extends across the first diode segment in a first direction, and the second diode segment forms a second diode across the optical waveguide such that a second intrinsic electric field extends across the second diode segment in a second direction opposite the first direction.
G02F 1/025 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction in an optical waveguide structure
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
G02B 6/42 - Coupling light guides with opto-electronic elements
46.
Photonic systems to enable top-side wafer-level optical and electrical test
An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01L 21/66 - Testing or measuring during manufacture or treatment
G01M 11/00 - Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
An optical grating coupler includes a primary layer formed of a material having a first refractive index. A first plurality of scattering elements is formed within the primary layer. The first plurality of scattering elements has a second refractive index that is different than the first refractive index. A secondary layer is formed over the primary layer. The secondary layer is formed of a material having a third refractive index. A second plurality of scattering elements is formed within the secondary layer. The second plurality of scattering elements has a fourth refractive index that is different than the third refractive index. The fourth refractive index is different than the second refractive index. At least some of the second plurality of scattering elements at least partially overlap corresponding ones of the first plurality of scattering elements.
A beam steering structure includes an alignment structure shaped to receive and align an optical fiber such that an axis of a core of the optical fiber is oriented in a first direction. The beam steering structure includes an end portion having an angled optical surface oriented at a non-zero angle relative to the first direction. The end portion is shaped and positioned so that light propagating along the first direction from the optical fiber passes through the end portion to reach the angled optical surface. A reflecting system is positioned on the angled optical surface across the first direction. The reflecting system is configured to reflect incident light propagating along the first direction into a first reflected beam of a first polarization and a second reflected beam of a second polarization. The first and second reflected beams are directed into first and second optical communication channels, respectively.
An optical grating coupler includes a primary layer formed of a material having a first refractive index. A first plurality of scattering elements is formed within the primary layer. The first plurality of scattering elements has a second refractive index that is different than the first refractive index. A secondary layer is formed over the primary layer. The secondary layer is formed of a material having a third refractive index. A second plurality of scattering elements is formed within the secondary layer. The second plurality of scattering elements has a fourth refractive index that is different than the third refractive index. The fourth refractive index is different than the second refractive index. At least some of the second plurality of scattering elements at least partially overlap corresponding ones of the first plurality of scattering elements.
An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
A multi-MCP (multi-chip package) module assembly includes a plate, an integrated optical fiber shuffle disposed on the plate, a first MCP disposed on the plate, a second MCP disposed on the plate, a first optical fiber jumper disposed on the plate, and a second optical fiber jumper disposed on the plate. The first optical fiber jumper optically connects the first MCP to the integrated optical fiber shuffle. The second optical fiber jumper optically connects the second MCP to the integrated optical fiber shuffle. The integrated optical fiber shuffle includes an optical network configured to direct optical signals to and from each of the first optical fiber jumper and the second optical fiber jumper.
A network switch system-in-package includes a carrier substrate with a network switch chip and a plurality of photonic input/output modules disposed on the carrier substrate. Each of the plurality of photonic input/output modules includes a module substrate and a plurality of photonic chip pods disposed on the module substrate. Each photonic chip pod includes a pod substrate with a photonic input/output chiplet and a gearbox chiplet attached to the pod substrate. The photonic input/output chiplet includes a parallel electrical interface, a photonic interface, and a plurality of optical macros implemented between the photonic interface and the parallel electrical interface. The gearbox chiplet electrically connects with the parallel electrical interface of the photonic input/output chiplet and a serial electrical interface of the network switch chip. The gearbox chiplet converts between the parallel electrical interface of the photonic input/output chiplet and the serial electrical interface of the network switch chip.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/126 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind using polarisation effects
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/30 - Optical coupling means for use between fibre and thin-film device
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
G06F 13/24 - Handling requests for interconnection or transfer for access to input/output bus using interrupt
53.
Low-Power Optical Input/Output Chiplet for Ethernet Switches (TeraPHYe)
A network switch system-in-package includes a carrier substrate with a network switch chip and a plurality of photonic input/output modules disposed on the carrier substrate. Each of the plurality of photonic input/output modules includes a module substrate and a plurality of photonic chip pods disposed on the module substrate. Each photonic chip pod includes a pod substrate with a photonic input/output chiplet and a gearbox chiplet attached to the pod substrate. The photonic input/output chiplet includes a parallel electrical interface, a photonic interface, and a plurality of optical macros implemented between the photonic interface and the parallel electrical interface. The gearbox chiplet electrically connects with the parallel electrical interface of the photonic input/output chiplet and a serial electrical interface of the network switch chip. The gearbox chiplet converts between the parallel electrical interface of the photonic input/output chiplet and the serial electrical interface of the network switch chip.
A multi-MCP (multi-chip package) module assembly includes a plate, an integrated optical fiber shuffle disposed on the plate, a first MCP disposed on the plate, a second MCP disposed on the plate, a first optical fiber jumper disposed on the plate, and a second optical fiber jumper disposed on the plate. The first optical fiber jumper optically connects the first MCP to the integrated optical fiber shuffle. The second optical fiber jumper optically connects the second MCP to the integrated optical fiber shuffle. The integrated optical fiber shuffle includes an optical network configured to direct optical signals to and from each of the first optical fiber jumper and the second optical fiber jumper.
An optical data communication system includes an optical transmitter and an optical receiver. A polarization-maintaining optical data communication link extends from an optical output of the optical transmitter to an optical input of the optical receiver. The polarization-maintaining optical data communication link includes at least two sections of polarization-maintaining optical fiber optically connected through an optical connector. The at least two sections of polarization-maintaining optical fiber have different lengths. The optical connector is configured to optically align a fast polarization axis of a first polarization-maintaining optical fiber to a slow polarization axis of a second polarization-maintaining optical fiber. The optical connector is also configured to optically align a slow polarization axis of the first polarization-maintaining optical fiber to a fast polarization axis of the second polarization-maintaining optical fiber.
G02B 6/42 - Coupling light guides with opto-electronic elements
H04B 10/2569 - Arrangements specific to fibre transmission for the reduction or elimination of distortion or dispersion due to polarisation mode dispersion [PMD]
56.
MITIGATION OF POLARIZATION IMPAIRMENTS IN OPTICAL FIBER LINK
An optical data communication system includes an optical transmitter and an optical receiver. A polarization-maintaining optical data communication link extends from an optical output of the optical transmitter to an optical input of the optical receiver. The polarization-maintaining optical data communication link includes at least two sections of polarization-maintaining optical fiber optically connected through an optical connector. The at least two sections of polarization-maintaining optical fiber have different lengths. The optical connector is configured to optically align a fast polarization axis of a first polarization-maintaining optical fiber to a slow polarization axis of a second polarization-maintaining optical fiber. The optical connector is also configured to optically align a slow polarization axis of the first polarization-maintaining optical fiber to a fast polarization axis of the second polarization-maintaining optical fiber.
A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.
A ring resonator device includes a passive optical cavity having a circuitous configuration into which is built a photodetector device. The photodetector device includes a first implant region formed within the passive optical cavity that includes a first type of implanted doping material. The photodetector device includes a second implant region formed within the passive optical cavity that includes a second type of implanted doping material, where the second type of implanted doping material is different than the first type of implanted doping material. The photodetector device includes an intrinsic absorption region present within the passive optical cavity between the first implant region and the second implant region. A first electrical contact is electrically connected to the first implant region and to a detecting circuit. A second electrical contact is electrically connected to the second implant region and to the detecting circuit.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02F 1/225 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour by interference in an optical waveguide structure
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/105 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PIN type
59.
Pooled memory system enabled by monolithic in-package optical I/O
A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.
G11C 11/42 - Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04B 10/516 - Transmitters - Details of coding or modulation
G02B 6/42 - Coupling light guides with opto-electronic elements
60.
Systems and methods for coupling light into a multi-mode resonator
A photonic system includes a passive optical cavity and an optical waveguide. The passive optical cavity has a preferred radial mode for light propagation within the passive optical cavity. The preferred radial mode has a unique light propagation constant within the passive optical cavity. The optical waveguide is configured to extend past the passive optical cavity such that at least some light propagating through the optical waveguide will evanescently couple into the passive optical cavity. The passive optical cavity and the optical waveguide are collectively configured such that a light propagation constant of the optical waveguide substantially matches the unique light propagation constant of the preferred radial mode within the passive optical cavity.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
A thermo-optic phase shifter includes a substrate having a cavity formed into an upper region of the substrate. The thermo-optic phase shifter includes an optical waveguide disposed above the substrate. The optical waveguide extends across and above the cavity. The thermo- optic phase shifter also includes a heater device disposed along a lateral side of the optical waveguide. The heater device extends across and above the cavity. The cavity is formed by an undercut etching process after the optical waveguide and the heater device is formed. The optical waveguide can be formed to include one or more segments that pass over the cavity. Also, a second heater device can be included such that the one or more segments of the optical waveguide that extend over the cavity are bracketed by heater devices. Thermal transmission structures can be included to enhance heat transfer between the heater device(s) and the optical waveguide.
G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
G02F 1/025 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction in an optical waveguide structure
A thermo-optic phase shifter includes a substrate having a cavity formed into an upper region of the substrate. The thermo-optic phase shifter includes an optical waveguide disposed above the substrate. The optical waveguide extends across and above the cavity. The thermo-optic phase shifter also includes a heater device disposed along a lateral side of the optical waveguide. The heater device extends across and above the cavity. The cavity is formed by an undercut etching process after the optical waveguide and the heater device is formed. The optical waveguide can be formed to include one or more segments that pass over the cavity. Also, a second heater device can be included such that the one or more segments of the optical waveguide that extend over the cavity are bracketed by heater devices. Thermal transmission structures can be included to enhance heat transfer between the heater device(s) and the optical waveguide.
G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
H01S 5/06 - Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.
An optical data communication system includes a plurality of resonator structures and a laser array that includes a plurality of lasers optically connected to the plurality of resonator structures. Each resonator structure has a respective free spectral wavelength range and a respective resonance wavelength. A maximum difference in resonance wavelength between any two resonator structures in the plurality of resonator structures is less than a minimum free spectral wavelength range of any resonator structure in the plurality of resonator structures. Each laser in the plurality of lasers is configured to generate continuous wave light having a respective wavelength. The laser array has a central wavelength. A variability of the central wavelength is greater than a minimum difference in resonance wavelength between any two spectrally neighboring resonator structures in the plurality of resonator structures.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
An optical data communication system includes a plurality of resonator structures and a laser array that includes a plurality of lasers optically connected to the plurality of resonator structures. Each resonator structure has a respective free spectral wavelength range and a respective resonance wavelength. A maximum difference in resonance wavelength between any two resonator structures in the plurality of resonator structures is less than a minimum free spectral wavelength range of any resonator structure in the plurality of resonator structures. Each laser in the plurality of lasers is configured to generate continuous wave light having a respective wavelength. The laser array has a central wavelength. A variability of the central wavelength is greater than a minimum difference in resonance wavelength between any two spectrally neighboring resonator structures in the plurality of resonator structures.
A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
G02B 6/42 - Coupling light guides with opto-electronic elements
67.
SYSTEMS AND METHODS FOR PASSIVELY-ALIGNED OPTICAL WAVEGUIDE EDGE-COUPLING
A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
68.
Systems and methods for passively-aligned optical waveguide edge-coupling
A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.
An optical input polarization management device includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization so as to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Light within the first and second OW's is input to a first two-by-two optical splitter (2×2OS). A first phase shifter (PS) is interfaced with either the first or second OW. Light is output from the first 2×2OS into a third OW and a fourth OW. Light within the third and fourth OW's is input to a second 2×2OS. A second PS is interfaced with either the third or fourth OW. Light is output from the second 2×2OS into a fifth OW for further processing.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
An electro-optic combiner includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Each of the first and second OW's has a respective combiner section. The first and second OW combiner sections extend parallel to each other and have opposite light propagation directions. A plurality of ring resonators is disposed between the combiner sections of the first and second OW's and within an evanescent optically coupling distance of both the first and second OW's. Each of ring resonators operates at a respective resonant wavelength to optically couple light from the combiner section of the first OW into the combiner section of the second OW.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/27 - Optical coupling means with polarisation selective and adjusting means
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/34 - Optical coupling means utilising prism or grating
An electro-optic receiver includes a polarization splitter and rotator (PSR) that directs incoming light having a first polarization through a first end of an optical waveguide, and that rotates incoming light from a second polarization to the first polarization to create polarization-rotated light that is directed to a second end of the optical waveguide. The incoming light of the first polarization and the polarization-rotated light travel through the optical waveguide in opposite directions. A plurality of ring resonators is optically coupled the optical waveguide. Each ring resonator is configured to operate at a respective resonant wavelength, such that the incoming light of the first polarization having the respective resonant wavelength optically couples into said ring resonator in a first propagation direction, and such that the polarization-rotated light having the respective resonant wavelength optically couples into said ring resonator in a second propagation direction opposite the first propagation direction.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
A polarization splitter and rotator (PSR) is implemented within various electro-optic receiver, transmitter, and combiner devices to transform incoming light having two polarizations that are uncharacterized and/or time-varying into light of a single polarization for processing. The single-polarization light is either detected in the receiver embodiment or modulated in the transmitter embodiment. Multiple ring resonators are used to facilitate detection and/or modulation of the single-polarization light, where each ring resonator optically couples to one or more optical waveguides that extend from PSR outputs. In some transmitter embodiments, polarization-rotated light output by the PSR is polarization-derotated after modulation by a reverse-connected PSR. In some receiver embodiments, polarization-rotated light and polarization-non-rotated light (having the same polarization) is output from the PSR into a same optical waveguide in opposite directions for coupling into one or more photodetectors. Linear photodetectors separately detect light corresponding to different polarizations in the incoming light signal.
An optical data communication system includes an optical power supply and an electro- optical chip. The optical power supply includes a laser that generates laser light at a single wavelength. A comb generator receives the light at the single wavelength and generates multiple wavelengths of continuous wave light from laser light at the single wavelength. The multiple wavelengths of continuous wave light are provided as light input to the electro-optical chip. The electro-optical chip includes at least one transmit macro that receives the multiple wavelengths of continuous wave light and that modulates one or more of the multiple wavelengths of continuous wave light to generate modulated light signals that convey digital data.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H04B 10/2587 - Arrangements specific to fibre transmission using a single light source for multiple stations
An optical data communication system includes an optical power supply and an electro-optical chip. The optical power supply includes a laser that generates laser light at a single wavelength. A comb generator receives the light at the single wavelength and generates multiple wavelengths of continuous wave light from laser light at the single wavelength. The multiple wavelengths of continuous wave light are provided as light input to the electro-optical chip. The electro-optical chip includes at least one transmit macro that receives the multiple wavelengths of continuous wave light and that modulates one or more of the multiple wavelengths of continuous wave light to generate modulated light signals that convey digital data.
H04J 14/02 - Wavelength-division multiplex systems
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04Q 11/00 - Selecting arrangements for multiplex systems
An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02F 1/095 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on magneto-optical elements, e.g. exhibiting Faraday effect in an optical waveguide structure
77.
Chip-last wafer-level fan-out with optical fiber alignment structure
A redistribution layer is formed on a carrier wafer. A cavity is formed within the redistribution layer. An electro-optical die is flip-chip connected to the redistribution layer. A plurality of optical fiber alignment structures within the electro-optical die is positioned over and exposed to the cavity. Mold compound material is disposed over the redistribution layer and the electro-optical die. A residual kerf region of the electro-optical die interfaces with the redistribution layer to prevent mold compound material from entering into the optical fiber alignment structures and the cavity. The carrier wafer is removed from the redistribution layer. The redistribution layer and the mold compound material are cut to obtain an electro-optical chip package that includes the electro-optical die. The cutting removes the residual kerf region from the electro-optical die to expose the plurality of optical fiber alignment structures and the cavity at an edge of the electro-optical chip package.
G02B 6/42 - Coupling light guides with opto-electronic elements
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
A redistribution layer is formed on a carrier wafer. A cavity is formed within the redistribution layer. An electro-optical die is flip-chip connected to the redistribution layer. A plurality of optical fiber alignment structures within the electro-optical die is positioned over and exposed to the cavity. Mold compound material is disposed over the redistribution layer and the electro-optical die. A residual kerf region of the electro-optical die interfaces with the redistribution layer to prevent mold compound material from entering into the optical fiber alignment stmctures and the cavity. The carrier wafer is removed from the redistribution layer. The redistribution layer and the mold compound material are cut to obtain an electro-optical chip package that includes the electro-optical die. The cutting removes the residual kerf region from the electro-optical die to expose the plurality of optical fiber alignment stmctures and the cavity at an edge of the electro-optical chip package.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals. The optical macro transmits the incoming electrical data signals through the electrical interface to the high-bandwidth memory interface.
A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals. The optical macro transmits the incoming electrical data signals through the electrical interface to the high-bandwidth memory interface.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04B 10/516 - Transmitters - Details of coding or modulation
G11C 5/04 - Supports for storage elements; Mounting or fixing of storage elements on such supports
G11C 5/06 - Arrangements for interconnecting storage elements electrically, e.g. by wiring
G11C 11/42 - Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled
G02B 6/42 - Coupling light guides with opto-electronic elements
A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.
G11C 5/04 - Supports for storage elements; Mounting or fixing of storage elements on such supports
G11C 5/06 - Arrangements for interconnecting storage elements electrically, e.g. by wiring
G11C 11/42 - Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H04B 10/516 - Transmitters - Details of coding or modulation
82.
Vertical integrated photonics chiplet for in-package optical interconnect
A vertical integrated photonics chiplet assembly includes a package substrate and an external device connected to a top surface of the package substrate. A photonics chip is disposed within the package substrate. The photonics chip includes optical coupling devices positioned at a top surface of the photonics chip. A plurality of conductive via structures are disposed within the package substrate in electrical connection with electrical circuits within the photonics chip. The plurality of conductive via structures are electrically connected through the package substrate to the external device. An opening is formed through the top surface of the substrate to expose a portion of the top surface of the photonics chip at which the optical coupling devices are positioned. An optical fiber array is disposed and secured within the opening such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/30 - Optical coupling means for use between fibre and thin-film device
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
83.
VERTICAL INTEGRATED PHOTONICS CHIPLET FOR IN-PACKAGE OPTICAL INTERCONNECT
A vertical integrated photonics chiplet assembly includes a package substrate and an external device connected to a top surface of the package substrate. A photonics chip is disposed within the package substrate The photonics chip includes optical coupling devices positioned at a top surface of the photonics chip. A plurality of conductive via structures are disposed within the package substrate in electrical connection with electrical circuits within the photonics chip. The plurality of conductive via structures are electrically connected through the package substrate to the external device. An opening is formed through the top surface of the substrate to expose a portion of the top surface of the photonics chip at which the optical coupling devices are positioned. An optical fiber array is disposed and secured within the opening such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices.
A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.
H01L 21/66 - Testing or measuring during manufacture or treatment
H04B 10/073 - Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an out-of-service signal
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G01R 31/3185 - Reconfiguring for testing, e.g. LSSD, partitioning
F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/30 - Optical coupling means for use between fibre and thin-film device
G02B 6/40 - Mechanical coupling means having fibre bundle mating means
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
A handle-integrated composite wafer assembly includes a handle wafer attached to a device wafer. The device wafer includes a device layer formed on a buried oxide layer. The device layer includes an optical resonator structure. The handle wafer includes a base layer and a layer of anti-reflective material disposed on a top side of the base layer. The base layer has a cavity extending into the base layer from the top side of the base layer. The cavity has at least one side surface and a bottom surface. The layer of anti-reflective material is substantially conformally disposed within the cavity on the at least one side surface and bottom surface of the cavity. The handle wafer is attached to the device wafer with the layer of anti-reflective material affixed to the buried oxide layer, and with the cavity substantially aligned with the optical resonator structure in the device layer.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02F 1/313 - Digital deflection devices in an optical waveguide structure
An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.
A plurality of lid structures include at least one lid structure configured to overlie one or more heat sources within a multi-chip-module and at least one lid structure configured to overlie one or more temperature sensitive components within the multi-chip-module. The plurality of lid structures are configured and positioned such that each lid structure is separated from each adjacent lid structure by a corresponding thermal break. A heat spreader assembly is positioned in thermally conductive interface with the plurality of lid structures. The heat spreader assembly is configured to cover an aggregation of the plurality of lid structures. The heat spreader assembly includes a plurality of separately defined heat transfer members respectively configured and positioned to overlie the plurality of lid structures. The heat spreader assembly is configured to limit heat transfer between different heat transfer members within the heat spreader assembly.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
G02B 6/42 - Coupling light guides with opto-electronic elements
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
92.
Laser module for optical data communication system
A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01S 4/00 - Devices using stimulated emission of electromagnetic radiation in wave ranges other than those covered by groups , or , e.g. phonon masers, X-ray lasers or gamma-ray lasers
93.
Laser module for optical data communication system within silicon interposer
An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H01S 5/02325 - Mechanically integrated components on mount members or optical micro-benches
An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
95.
Photonics systems to enable top-side wafer-level optical and electrical test
An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01L 21/66 - Testing or measuring during manufacture or treatment
G01M 11/00 - Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
96.
Systems and methods for coupling light into a multi-mode resonator
A photonic system includes a passive optical cavity and an optical waveguide. The passive optical cavity has a preferred radial mode for light propagation within the passive optical cavity. The preferred radial mode has a unique light propagation constant within the passive optical cavity. The optical waveguide is configured to extend past the passive optical cavity such that at least some light propagating through the optical waveguide will evanescently couple into the passive optical cavity. The passive optical cavity and the optical waveguide are collectively configured such that a light propagation constant of the optical waveguide substantially matches the unique light propagation constant of the preferred radial mode within the passive optical cavity.
G02F 1/035 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels or Kerr effect in an optical waveguide structure
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
97.
SYSTEMS AND METHODS FOR COUPLING LIGHT INTO A MULTI-MODE RESONATOR
A photonic system includes a passive optical cavity and an optical waveguide. The passive optical cavity has a preferred radial mode for light propagation within the passive optical cavity. The preferred radial mode has a unique light propagation constant within the passive optical cavity. The optical waveguide is configured to extend past the passive optical cavity such that at least some light propagating through the optical waveguide will evanescently couple into the passive optical cavity. The passive optical cavity and the optical waveguide are collectively configured such that a light propagation constant of the optical waveguide substantially matches the unique light propagation constant of the preferred radial mode within the passive optical cavity.
G02B 6/10 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
G02F 1/025 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction in an optical waveguide structure
H01S 5/10 - Construction or shape of the optical resonator
A ring resonator device includes a passive optical cavity having a circuitous configuration into which is built a photodetector device. The photodetector device includes a first implant region formed within the passive optical cavity that includes a first type of implanted doping material. The photodetector device includes a second implant region formed within the passive optical cavity that includes a second type of implanted doping material, where the second type of implanted doping material is different than the first type of implanted doping material. The photodetector device includes an intrinsic absorption region present within the passive optical cavity between the first implant region and the second implant region. A first electrical contact is electrically connected to the first implant region and to a detecting circuit. A second electrical contact is electrically connected to the second implant region and to the detecting circuit.
G02F 1/025 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction in an optical waveguide structure
G02F 1/00 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
G02F 1/015 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on semiconductor elements with at least one potential jump barrier, e.g. PN, PIN junction
99.
Ring resonator with integrated photodetector for power monitoring
A ring resonator device includes a passive optical cavity having a circuitous configuration into which is built a photodetector device. The photodetector device includes a first implant region formed within the passive optical cavity that includes a first type of implanted doping material. The photodetector device includes a second implant region formed within the passive optical cavity that includes a second type of implanted doping material, where the second type of implanted doping material is different than the first type of implanted doping material. The photodetector device includes an intrinsic absorption region present within the passive optical cavity between the first implant region and the second implant region. A first electrical contact is electrically connected to the first implant region and to a detecting circuit. A second electrical contact is electrically connected to the second implant region and to the detecting circuit.
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G02F 1/225 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour by interference in an optical waveguide structure
100.
Apparatus for Optical Fiber-to-Photonic Chip Connection and Associated Methods
A photonic chip includes a substrate, an electrical isolation region formed over the substrate, and a front end of line (FEOL) region formed over the electrical isolation region. The photonic chip also includes an optical coupling region. The electrical isolation region and the FEOL region and a portion of the substrate are removed within the optical coupling region. A top surface of a the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a plurality of optical fibers. The grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the FEOL region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.
