Abstract

A proportional valve includes a casing and a valve trim. The casing has at least one fluid inlet, a fluid outlet, at least one first connection passageway, at least one second connection passageway and an accommodating space. The first connection passageway is connected with the fluid inlet. The second connection passageway is connected with the fluid outlet. The valve trim is located in the accommodating space, including a flow splitter an adjusting rotor. The flow splitter has at least one third connection passageway and at least one fourth connection passageway. The third connection passageway is connected with the first connection passageway. The fourth connection passageway is connected with the second connection passageway. The adjusting rotor has a channel and at least one blocking portion. The adjusting rotor is rotatably disposed on the flow splitter so that the blocking portion blocks a part of the third connection passageway.

IPC Classes  ?

• F16K 11/074 - Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves; Arrangement of valves and flow lines specially adapted for mixing fluid with all movable sealing faces moving as one unit comprising only sliding valves with pivoted closure members with flat sealing faces
• F16K 27/04 - Construction of housings; Use of materials therefor of sliding valves
• F16K 31/04 - Operating means; Releasing devices magnetic using a motor

Abstract

A two-phase immersion cooling apparatus including a coolant tank, at least one condenser, a heat transfer enhancer, and at least one heat dissipating component is provided. Vapor and liquid regions are formed in the coolant tank. Pressure enhanced and boiling regions are formed in the heat transfer enhancer. Accelerated flow and at least one recycling flow region are formed between the heat transfer enhancer and coolant tank. The at least one condenser is in thermal communication with the vapor region. The pressure enhanced and boiling regions and accelerated flow and at least one recycling flow region, are in fluid communication thereamong. A temperature and pressure within the pressure enhanced and boiling regions is greater than that within the at least one recycling flow region, maximizing heat absorption and enhancing vapor bubble nucleation, and accelerating fluid circulation from the at least one recycling flow region to the boiling region.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A liquid cooling pumping unit including a cover, rotor, housing, driver, flow spray plate, and thermal plate is provided. The cover is configured above the housing, the housing above the base, and the base above the thermal plate. A first fluid chamber is defined by a chamber of the cover and an annular chamber of the housing. An inlet of the housing is in fluid connection with the first fluid chamber. A second fluid chamber is defined by the flow spray plate and a recess of the thermal base. An outlet of the base is in fluid connection with the second fluid chamber. An impeller of the rotor is rotatable in the first fluid chamber. The driver is configured above the base and under the housing, driving the rotor to rotate with respect to the housing. The first fluid chamber is in fluid communication with the second fluid chamber.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven
• F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps

Abstract

A thinned pump includes a casing, a rotor assembly and a stator assembly. The casing includes a base and a cover. The cover covers the base so as to form a fluid chamber together, the cover has an inlet channel and an outlet channel, and the inlet channel and the outlet channel are in fluid communication with the fluid chamber. The rotor assembly includes an impeller and a magnetic component. The impeller is rotatably disposed in the casing, and the magnetic component is embedded into the impeller. The stator assembly includes a plurality of magnetically conductive pillars and a plurality of coils. The magnetically conductive pillars are mounted at one side of the base located opposite to the fluid chamber, and the coils are respectively disposed on the magnetically conductive pillars.

IPC Classes  ?

• F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps
• F04D 25/06 - Units comprising pumps and their driving means the pump being electrically driven

Abstract

A water cooling assembly is configured to be mounted at an electrical connector of a circuit board. The water cooling assembly includes a mounting plate and a water cooling radiator. The mounting plate includes a mounting portion and a plugging portion. The plugging portion is connected to a side of the mounting portion, and the plugging portion is configured to be inserted into the electrical connector of the circuit board. The water cooling radiator is fastened to the mounting portion of the mounting plate.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• G06F 1/18 - Packaging or power distribution

Abstract

A liquid cooling heat exchange casing including a chassis having a first side is provided. The first side includes a first inlet flow passageway system having a first inlet liquid coolant opening, a first outlet flow passageway system having a first outlet liquid coolant opening, a plurality of adapters, and at least one radiator. The at least one radiator is mounted to the first inlet flow passageway system via a radiator inlet and one of the plurality of adapters and to the first outlet flow passageway system via a radiator outlet and another of the plurality of adapters. A cooling fluid flows from the first inlet liquid coolant opening, through the first inlet flow passageway system, through the at least one radiator, and through the first outlet flow passageway system, to the first outlet liquid coolant opening, before being circulated to repeat the flow process again.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

The disclosure provides a control valve which includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate, and a diameter of the cylindrical valve gate is be smaller than a caliber of an opening of the valve body. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.

IPC Classes  ?

• F16K 5/10 - Means for additional adjustment of the rate of flow
• F16K 11/076 - Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves; Arrangement of valves and flow lines specially adapted for mixing fluid with all movable sealing faces moving as one unit comprising only sliding valves with pivoted closure members with sealing faces shaped as surfaces of solids of revolution
• F16K 5/04 - Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary with plugs having cylindrical surfaces; Packings therefor

Abstract

A universal mounting mechanism including a mounting bracket configured to mount a liquid-cooling heat exchange apparatus to a substrate or an electronic component and at least one universal fastener assembly is provided. The at least one universal fastener assembly is orthogonally assembled through the mounting bracket. The liquid-cooling heat exchange apparatus includes a first liquid-cooling heat exchange apparatus having a first waterblock set or a second liquid-cooling heat exchange apparatus having a second waterblock set. The first waterblock set has a first block thickness, and the second waterblock set has a second block thickness. The substrate or the electronic component includes receiving portions having a fastened thickness. A thickness of the second block thickness and the fastened thickness is greater than a thickness of the first block thickness and the fastened thickness.

IPC Classes  ?

• F28F 99/00 - Subject matter not provided for in other groups of this subclass
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.

IPC Classes  ?

• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

The disclosure provides a manufacturing method of a flat heat exchanger. The manufacturing method includes flattening a round heat pipe to a flat heat pipe, welding a first part of the flat heat pipe, and welding a second part of the flat heat pipe. After welding the second part of the flat heat pipe, the manufacturing method further includes cutting off part(s) of the first part or the second part of the flat heat pipe and trimming the flat heat pipe. Before welding the first part or the second part of the flat heat pipe, there is no pipe shrinkage process performed on the flat heat pipe.

IPC Classes  ?

• F28F 1/02 - Tubular elements of cross-section which is non-circular
• B23K 26/21 - Bonding by welding

Abstract

A water replenishment device includes a water generator and a container. The water generator includes a seat body, a heat exchanger, and a thermoelectric cooler. The seat body has a fluid channel and a catchment hole. The catchment hole is in fluid communication with the fluid channel, and the fluid channel is configured for an environment airflow to pass therethrough. The heat exchanger is partially located in the fluid channel. The thermoelectric cooler has a cold surface and a hot surface. The cold surface of the thermoelectric cooler is thermally coupled to the heat exchanger. The container has a storage space. The storage space is in fluid communication with the fluid channel via the catchment hole. The thermoelectric cooler is configured to condense the environment airflow to a liquid, and the liquid is configured to be stored in the storage space via the catchment hole.

IPC Classes  ?

• B01D 53/26 - Drying gases or vapours
• F28F 23/00 - Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
• F25B 21/02 - Machines, plants or systems, using electric or magnetic effects using Nernst-Ettinghausen effect

Abstract

The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28F 13/08 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels

Abstract

A light-emitting fan includes a fan frame, a light-permeable impeller mounted on the fan frame, a first and a second light source assembly. The light-permeable impeller includes a hub and blades. The hub includes a top plate and an annular side plate. The annular side plate is connected to the top plate, the top plate and the annular side plate together form an accommodation space. The annular side plate has an annular side surface facing away from the accommodation space and an inclined incident surface facing away from the annular side surface and non-parallel to the annular side surface. The blades are connected to the annular side surface. The first light source assembly is located in the accommodation space and configured to emit light to the top plate. The second light source assembly is located in the accommodation space and configured to emit light to the inclined incident surface.

IPC Classes  ?

• F21V 33/00 - Structural combinations of lighting devices with other articles, not otherwise provided for
• F04D 29/66 - Combating cavitation, whirls, noise, vibration, or the like; Balancing
• F04D 29/32 - Rotors specially adapted for elastic fluids for axial-flow pumps
• F04D 19/00 - Axial-flow pumps specially adapted for elastic fluids

Abstract

A multi-material boss, configured for fastening of a fastener thereto, being a feature of a the cast part, comprising a boss cylinder, an augmenting cylinder, and a filler metal layer is provided. The boss cylinder is made of the same material as the die cast part having a first hardness, and has a first interior. The augmenting cylinder is made of an augmenting material having a second hardness, is fixedly secured in the first interior of the boss cylinder, and has a second interior defined by a second cylindrical shaped wall, a base rim, and a second opening. The second hardness is greater than the first hardness. The fastener is fastened to the multi-material boss via the second opening of the augmenting cylinder having the higher liquidus temperature and greater hardness.

IPC Classes  ?

• F16B 33/02 - Shape of thread; Special thread-forms
• F16B 37/06 - Devices for fastening nuts to surfaces, e.g. sheets, plates by means of welding or riveting

Abstract

This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A water cooling radiator includes a first radiator having a liquid tank, first liquid return tank, first inlet radiator portion, and first outlet radiator portion. The first inlet radiator portion is adjacent to the first outlet radiator portion and both are between the liquid tank and first liquid return tank. The first inlet radiator portion includes at least one first inlet pipe thermally coupled to at least one first inlet heat dissipating fin. The first outlet radiator portion includes at least one first outlet pipe thermally coupled to at least one first outlet heat dissipating fin. A first inlet temperature of a liquid coolant at a first inlet fluid input end is greater than a first return temperature of the liquid coolant at a first outlet fluid input end. A pitch measurement of a first inlet fin pitch is greater than a pitch measurement of a first outlet fin pitch.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A light-emitting fan includes a fan frame, an impeller, a circuit board and a light-emitting component. The impeller includes a light guiding hub and a plurality of blades. The light guiding hub is disposed on the fan frame. The light guiding hub has an outer top surface, an outer annular surface, an inner annular surface, and a recess. The outer annular surface is connected to the outer top surface, the inner annular surface faces away from the outer annular surface. The blades are connected to the outer annular surface. The recess is located at the inner annular surface so as to form a light guiding protrusion of the light guiding hub. The circuit board is disposed on the fan frame. The light-emitting component is disposed on the circuit board. Light generated by the light-emitting component is emitted from the outer top surface through the light guiding protrusion.

IPC Classes  ?

• F21V 33/00 - Structural combinations of lighting devices with other articles, not otherwise provided for
• F04D 29/00 - NON-POSITIVE-DISPLACEMENT PUMPS - Details, component parts, or accessories
• F04D 19/00 - Axial-flow pumps specially adapted for elastic fluids

Abstract

A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.

IPC Classes  ?

• G06F 1/20 - Cooling means
• F24F 1/022 - Self-contained room units for air-conditioning, i.e. with all apparatus for treatment installed in a common casing comprising a compressor cycle
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat dissipation device includes a plurality of fins, at least one first heat pipe and at least one second heat pipe. Each of the fins includes a main body and two first deflectors. The main body has an inflow side, an outflow side and two first communication openings. The first communication openings are located between the inflow side and the outflow side. The first deflectors are arranged obliquely relative to the main body and respectively located on sides of the first communication openings. Air flowing out of the first communication openings is guided by the first deflectors to flow into an area between the first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the first deflectors located relatively far away from the other one of the first deflectors.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H05K 1/02 - Printed circuits - Details

Abstract

A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure

Abstract

A heat dissipation structure has a heat dissipation base and at least one heat conduction assembly mounted in a through hole of the heat dissipation base. Each of the at least one heat conduction assembly includes a resilient clamp and a heat pipe. When a transceiver is inserted in the through hole of the heat dissipation base, two heat conducting sections of the heat pipe are pushed by the resilient clamp to abut against the transceiver and the heat dissipation base respectively. Heat generated while the transceiver is operating can be quickly and efficiently conducted through the heat pipe to the heat dissipation base and then dissipated. Temperature increase of the transceiver can be effectively avoided and performance and reliability of the transceiver during operation can be ensured.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure

Abstract

A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.

IPC Classes  ?

• F28D 1/03 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or mo with the heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
• F28D 15/00 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls

Abstract

A variable-part liquid cooling pumping unit comprising a water block unit having a water block set, flow guiding plate, and water block cover, and a pump unit having a pump housing assembly is provided. The pump housing assembly comprises an impeller cavity inlet, flow adjusting disc, impeller cavity, and impeller cavity outlet opening. Inlet and outlet ports are positioned on a same side of and plane as the pump housing assembly. More than one water block unit and pump unit are provided and interchangeable. During operation, working fluid is sucked via the inlet port through the impeller cavity inlet, pass the flow adjusting disc, into the impeller cavity, to a plurality of curved blades of a rotor assembly unit impeller. From there, the working fluid travels through the impeller cavity outlet opening, flow guiding plate, and water block set, before exiting through the flow guiding plate, and outlet port.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F04D 1/00 - Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
• F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps
• F04D 29/44 - Fluid-guiding means, e.g. diffusers
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• G06F 1/20 - Cooling means

Abstract

A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28D 1/03 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or mo with the heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups

Abstract

This disclosure relates to a thin pump including a case, a rotor, and a stator. The case has a bottom surface, a lower chamber, an upper chamber, and an accommodation space. The upper chamber is located further away from the bottom surface than the lower chamber. The upper chamber has two opposite ends respectively in fluid communication with the lower chamber and the accommodation space. The rotor includes an impeller and a magnet. The impeller is rotatably disposed in the lower chamber of the case. The magnet is disposed on the impeller. The stator is disposed in the case. The stator corresponds to the magnet of the rotor so as to drive the rotor to rotate with respect to the case.

IPC Classes  ?

• F04D 25/06 - Units comprising pumps and their driving means the pump being electrically driven
• F04D 17/16 - Centrifugal pumps for displacing without appreciable compression
• F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps

Abstract

A cooling apparatus includes a casing, pumping unit, and heat exchange unit. The pumping unit includes a body and housing. The body includes a wishbone-shaped indentation and lollipop shaped indentation separate from the wishbone-shaped indentation. The housing includes a wishbone-shaped flow path and lollipop-shaped flow path separate from the wishbone-shaped flow path. The body is coupled to the housing such that the wishbone-shaped indentation and the wishbone-shaped flow path define a first flow path and the lollipop-shaped indentation and the lollipop-shaped flow path define a second flow path. The pumping unit is coupled to the heat exchange chamber such that the first flow path and the second flow path is in fluid communication with the heat exchange chamber via a first end opening and second end opening, and third opening, respectively.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids

Abstract

A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A liquid cooling multi-pumping unit comprising a main body and first and second pumps arranged in series is provided. During operation, cooling fluid is sucked via a cooling fluid inlet into a first fluid chamber and then into a first central chamber opening to a plurality of curved blades of a first impeller assembled in a first pump chamber. From there, the cooling fluid travels and is sucked through a fluid distribution channel into a second fluid chamber and then into a second central chamber opening to a plurality of curved blades of a second impeller assembled in a second pump chamber, before exiting through a fluid outlet. The series arrangement of the first and second pumps increases head pressure, and provides sufficient liquid flow in the case where one liquid cooling pump fails. Additionally, lower energy consumption is achieved due to the lower operating speeds required.

IPC Classes  ?

• F04D 13/14 - Combinations of two or more pumps the pumps being all of centrifugal type
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven
• F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps
• F04D 29/62 - Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps
• F04D 13/12 - Combinations of two or more pumps

Abstract

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

IPC Classes  ?

• F28D 20/00 - Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups or
• B21D 53/02 - Making other particular articles heat exchangers, e.g. radiators, condensers
• B21D 53/04 - Making other particular articles heat exchangers, e.g. radiators, condensers of sheet metal
• F28F 3/14 - Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation

Abstract

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

IPC Classes  ?

• F28D 20/00 - Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups or
• B21D 53/02 - Making other particular articles heat exchangers, e.g. radiators, condensers
• B21D 53/04 - Making other particular articles heat exchangers, e.g. radiators, condensers of sheet metal
• F28F 3/14 - Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation

Abstract

This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• H05K 1/02 - Printed circuits - Details

Abstract

A fixing structure of a heat dissipation device is provided. The fixing structure has a plate portion and at least one fixing set. The plate portion forms an opening and at least one groove. The opening and the groove form through the plate portion. The opening is configured to fix a heat dissipation assembly. The fixing set is mounted through the groove and can be moved in an extending direction of the groove and a direction perpendicular to the plate portion. The shape of the groove may correspond to various locations of the fixing hole on the various substrates. The fixing set can be moved in the groove to align various fixing holes of the substrate. In other words, with the movable fixing sets, the fixing structure can be mounted on various substrates or correspond to the electronic component in various shapes and dimensions.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28F 9/007 - Auxiliary supports for elements

Abstract

A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, at least a second conduit, stand, and at least a propulsion-like apparatus. The at least a first and second conduits have first and second modifiable portions comprising first and second openings. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel generating at least a first flow channel for directing a first flow of the dielectric thermally conductive fluid. The at least a propulsion-like apparatus moves the dielectric thermally conductive fluid from one face to an opposite face in the same direction as the first flow, supplementing and enhancing circulation within the fluid-tight containment vessel.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

This disclosure relates to a fin structure including a main body and at least one minor structure. The main body includes a main plate and two side plates. The main plate has at least one through hole. The two side plates are respectively connected to two opposite sides of the main plate and protrude from the main plate. The at least one minor structure protrudes from the main plate and is located at a side of the main plate. The at least one minor structure is spaced apart from the two side plates. The at least one minor structure partially covers the at least one through hole. The at least one minor structure has a length, in a longitudinal direction of the main plate, less than a length of the at least one through hole of the main plate.

IPC Classes  ?

• F28F 13/12 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation

Abstract

An integrated cooling system including heat exchanger and refrigeration system. Heat exchanger has cold fluid inlet, cold fluid outlet, hot fluid inlet and hot fluid outlet. Refrigeration system includes first thermal expansion valve, first manifold, second thermal expansion valve, air-cooling unit, second manifold, compressor and heat dissipation assembly. First thermal expansion valve is in fluid communication with cold fluid inlet. First manifold includes first to third pipe part. The second thermal expansion valve is in fluid communication with second pipe part. Air-cooling unit is in fluid communication with second thermal expansion valve. Second manifold has fourth to sixth pipe part. Fourth pipe part is in fluid communication with air-cooling unit. Fifth pipe part is in fluid communication with cold fluid outlet. Compressor is in fluid communication with sixth pipe part. Heat dissipation assembly is in fluid communication between compressor and third pipe part.

IPC Classes  ?

• F25B 41/31 - Expansion valves
• F25B 13/00 - Compression machines, plants or systems, with reversible cycle

Abstract

A method includes providing a first metal sheet and a second metal sheet, printing a channel pattern on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, forming a plurality of channels by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, sealing the first metal sheet and the second metal sheet, and forming a plurality of through holes in locations where the first metal sheet and the second metal sheet are bonded to each other. The plurality of through holes are arranged in a plurality of rows, each row including at least two through holes, and each location where the first metal sheet and the second metal sheet are bonded to each other includes a single through hole of the plurality of through holes.

IPC Classes  ?

• F28D 20/00 - Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups or
• B21D 53/04 - Making other particular articles heat exchangers, e.g. radiators, condensers of sheet metal
• B21D 53/02 - Making other particular articles heat exchangers, e.g. radiators, condensers
• F28F 3/14 - Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation

Abstract

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

IPC Classes  ?

• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups
• F28F 13/00 - Arrangements for modifying heat transfer, e.g. increasing, decreasing
• H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
• F28F 13/06 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media

Abstract

A cooling apparatus includes a base plate configured to dissipate heat, a top plate coupled to the base plate, the top plate includes a second opening positioned above the heat exchange chamber, a cover coupled to the base plate, the cover and the base plate defining a heat exchange chamber, the cover is over the second opening, the cover includes a first opening and a third opening defined adjacent to the first opening, the first opening and the third opening positioned above the heat exchange chamber, the first opening in fluid communication with the heat exchange chamber through the second opening, and a pumping unit disposed on the base plate, the pumping unit is over the first opening and the third opening, the pumping unit configured to circulate fluid into and out of the heat exchange chamber

IPC Classes  ?

• G06F 1/20 - Cooling means
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids

Abstract

A method includes providing a first metal sheet and a second metal sheet, printing a plurality of channels on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other to obtain a fin body, bending a first portion of the fin body to be transverse to a second portion of the fin body, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

IPC Classes  ?

• F28D 20/00 - Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups or
• B21D 53/04 - Making other particular articles heat exchangers, e.g. radiators, condensers of sheet metal
• B21D 53/02 - Making other particular articles heat exchangers, e.g. radiators, condensers
• F28F 3/14 - Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation

Abstract

A computer includes a casing, an electronic assembly, and a water cooling assembly. The casing, forms an accommodation space. The casing has an interior fluid channel located at at least one side of the casing, and a fluid inlet and a fluid outlet which are in fluid communication with the interior fluid channel. The electronic assembly is located in the accommodation space. The water cooling assembly includes a first water block and a radiator. The first water block is in thermal contact with the electronic assembly, the first water block, the radiator, and the interior fluid channel located at the at least one side of the casing are in fluid communication with each other so as to form a circulation channel, and the fluid inlet and the fluid outlet of the casing are respectively in fluid communication with the radiator and the first water block.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, and at least a second conduit. The at least a first and second conduits have first and second modifiable portions comprising first and second openings submerged within the dielectric thermally conductive fluid, respectively. The at least one of the first conduit or second conduit circulates dielectric thermally conductive fluid from a heat exchanger outlet into the fluid-tight containment vessel and the other, circulates dielectric thermally conductive fluid from the fluid-tight containment vessel to a heat exchanger inlet via the pump. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• F28D 1/02 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or mo with the heat-exchange conduits immersed in the body of fluid

Abstract

A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.

IPC Classes  ?

• F28D 15/00 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
• F28D 1/03 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or mo with the heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups

Abstract

A heat sink is provided. The heat sink includes a cylindrical body and a plurality of fins. The fins are connected to and protruding from the cylindrical body. At least a part of the plurality of fins each include a first protrusion portion and a second protrusion portion, a distal edge of the first protrusion portion is located farther away from a central axis of the cylindrical body than a distal edge of the second protrusion portion. In addition, the disclosure also provides a heat dissipation device having the heat sink.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate comprises a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.

IPC Classes  ?

• F28D 15/00 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

A liquid cooling system is provided. The liquid cooling system comprises a radiator having first and second built-in fluid tank reservoirs, a multi-fan unit, at least one heat exchanger pump, and a plurality of fluid conduits. The radiator comprises at least one first flow port and at least one second flow port for attachment of the plurality of fluid conduits thereto for actively moving a cooling fluid to and from the at least one heat exchanger pump. Heat generated from a heat generating device is transferred to cooling fluid flowing through the at least one heat exchanger pump, and then output to the radiator. The heated cooling fluid flows through the radiator having the built-in fluid tank, cooling along a plurality of heat exchanger fins, whereby the multi-fan unit expels heat therefrom. The cooling fluid flows to the heat exchanger pump to once again begin the cooling loop.

IPC Classes  ?

• F28D 1/02 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or mo with the heat-exchange conduits immersed in the body of fluid
• F28D 17/00 - Regenerative heat-exchange apparatus in which a stationary intermediate heat-transfer medium or body is contacted successively by each heat-exchange medium, e.g. using granular particles

Abstract

A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.

IPC Classes  ?

• F28D 1/03 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or mo with the heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• F28F 3/14 - Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation
• B21D 53/04 - Making other particular articles heat exchangers, e.g. radiators, condensers of sheet metal
• B23P 15/26 - Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers
• B23K 101/14 - Heat exchangers
• B21D 39/03 - Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal otherwise than by folding

Abstract

A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28F 3/06 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups

Abstract

A liquid cooling heat exchange apparatus for memory modules comprising a thermal conduction assembly, fastening assembly, and first and second working fluid splitters is provided. The thermal conduction assembly, mounted on the memory nodules via the fastening assembly, comprises a pair of flat flexible conduits, each having at least one fluid passageway communicating with the first and second working fluid splitters, and a pair of cooling spreaders. The pair of flat flexible conduits is in thermal contact with heat producing chips of the memory modules, thermally coupling the first and second working fluid splitters together for transferring heat from the heat producing chips. The pair of cooling spreaders is in thermal contact with the pair of flat flexible conduits for transferring heat from the heat producing chips to the thermal conduction assembly. Each of the at least one fluid passageway is expandable.

IPC Classes  ?

• F28F 7/00 - Elements not covered by group , , or
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H05K 1/02 - Printed circuits - Details

Abstract

This disclosure relates to a liquid-cooling device that includes a liquid block and a radiator. The liquid block is in thermal contact with an interface card. The radiator includes a first tank, a second tank, and a heat dissipation channel structure. The first tank and the second tank respectively have a first chamber and a second chamber. The heat dissipation channel structure includes a plurality of liquid transmission components. The first chamber and the second chamber are respectively connected to two opposite sides of the heat dissipation channel structure. Each of the liquid transmission components has an end in fluid communication with the first chamber of the first tank and another end in fluid communication with the second chamber of the second tank. The first chamber and the second chamber are in fluid communication with the liquid block to form a cooling cycle.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A liquid cooling device includes a thermally conductive base, a cover, and a metallic partition. The thermally conductive base has a fluid chamber and a plurality of fins. The fins are located in the fluid chamber and protrudes from an inner surface of the thermally conductive base facing the fluid chamber. Every two of the fins located adjacent to each other define a channel therebetween. Distal ends of at least part of the fins located away from the inner surface together form a covering structure partially coving the channels. The metallic partition is located between and welded to the covering structure and the cover.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• F28F 3/08 - Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning

Abstract

A liquid cooling heat exchange apparatus comprising a water block set and pump unit is provided. The water block set has a water block cover having an inlet port, cover diversion channel, cover diversion opening, cover outlet through hole and outlet port, surge directing plate having a plate cover end, and water block. The pump unit has a rotor housing having an impeller cavity comprising an inlet and outlet. The inlet and outlet ports and the cover diversion opening is at a same side, the cover outlet through hole is at an opposite side. During operation, working fluid is sucked via the inlet port, pass the cover diversion channel covered by the plate cover end, through the cover diversion opening and impeller cavity inlet, through the impeller cavity, and outlet, and cover outlet through hole, and through the water block, before exiting through the outlet port.

IPC Classes  ?

• F04D 29/58 - Cooling; Heating; Diminishing heat transfer
• F04D 29/40 - Casings; Connections for working fluid
• F04D 29/00 - NON-POSITIVE-DISPLACEMENT PUMPS - Details, component parts, or accessories

Abstract

A liquid cooling multi-pumping unit comprising a main body and first and second pumps arranged in series is provided. During operation, cooling fluid is sucked via a cooling fluid inlet into a first fluid chamber and then into a first central chamber opening to a plurality of curved blades of a first impeller assembled in a first pump chamber. From there, the cooling fluid travels and is sucked through a fluid distribution channel into a second fluid chamber and then into a second central chamber opening to a plurality of curved blades of a second impeller assembled in a second pump chamber, before exiting through a fluid outlet. The series arrangement of the first and second pumps increases head pressure, and provides sufficient liquid flak in the case where one liquid cooling pump fails. Additionally, lower energy consumption is achieved die to the lower operating speeds required.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F04D 13/14 - Combinations of two or more pumps the pumps being all of centrifugal type
• F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps
• F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven
• F04D 29/62 - Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps
• F04D 13/12 - Combinations of two or more pumps

Abstract

A joint assembly configured to be connected to a tube and including a first joint, a second joint and an engagement sleeve. The first joint has a channel and an engagement recess. The engagement recess is located in the channel of the first joint. The second joint has a first end, a second end and a channel. The second end is opposite to the first end. The channel of the second joint extends from the first end to the second end. The first end of the second joint is inserted into the tube. The engagement sleeve is sleeved on the tube. The tube is at least partially clamped by the engagement sleeve and the first end of the second joint. The engagement sleeve has an engagement structure located at an end of the engagement sleeve.

IPC Classes  ?

• F16L 43/00 - Bends; Siphons
• F16L 33/03 - Self-locking elastic clips
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A multi-material boss, configured for fastening of a fastener thereto, being a feature of a die cast part, comprising a boss cylinder, an augmenting cylinder, and a filler metal layer is provided. The boss cylinder is made of the same material as the die cast part having a first hardness, and has a first interior. The augmenting cylinder is made of an augmenting material having a second hardness, is fixedly secured in the first interior of the boss cylinder, and has a second interior defined by a second cylindrical shaped wall, a base rim, and a second opening. The second hardness is greater than the first hardness. The fastener is fastened to the multi-material boss via the second opening of the augmenting cylinder having the higher liquidus temperature and greater hardness.

IPC Classes  ?

• F16B 37/16 - Wing nuts
• F16B 33/02 - Shape of thread; Special thread-forms
• F16B 37/06 - Devices for fastening nuts to surfaces, e.g. sheets, plates by means of welding or riveting
• B23K 103/20 - Ferrous alloys and aluminium or alloys thereof
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering

Abstract

The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• B21D 53/04 - Making other particular articles heat exchangers, e.g. radiators, condensers of sheet metal
• F28F 3/14 - Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation
• B23P 15/26 - Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• B23K 101/14 - Heat exchangers
• B21D 39/03 - Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal otherwise than by folding

Abstract

A multi-thermal characteristic heat sink fin, comprising a first heat spreading plate, a second heat spreading plate, and a primary heat spreading plate is provided. A plurality of multi-thermal characteristic heat sink fins is assembled together to form a heat sink, further having at least a heat pipe assembled therethrough, and a base plate, assembled to the at least a heat pipe and in contact with a heat source. The primary heat spreading plate is sandwiched and enclosed within the first and second heat spreading plates, hindering debris, contaminants, and moisture from entering the surface interfaces therebetween. The material of the heat pipes and primary heat spreading plate is different from that of the first and second heat spreading plates. No heat treatment process of two or more different materials is required for assembly of the multi-thermal characteristic heat sink fin and at least a heat pipe assembled thereto.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups

Abstract

A thin pump includes a casing, a rotor, and a stator. The casing has a bottom surface, an outer surface, a lower chamber, an upper chamber, an inlet channel, and an outlet channel. The outer surface is connected to the bottom surface. The upper chamber and the lower chamber connected to each other are surrounded by the outer surface. The upper chamber is located further away from the bottom surface than the lower chamber. The inlet channel and the outlet channel are located on the outer surface. The inlet channel and the outlet channel are respectively connected to the upper chamber and the lower chamber. The rotor includes an impeller rotatably disposed in the lower chamber and a magnetic component disposed on the impeller. The stator disposed in the casing corresponds to the magnetic component so as to drive the rotor to rotate with respect to the casing.

IPC Classes  ?

• F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven
• F04D 1/04 - Helico-centrifugal pumps
• F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps

Abstract

A fan device comprises a processor, a fan motor and a light emitting element. The processor comprises an input terminal, a first and a second output terminals. An initial mode of the processor is in one of a rotation speed control mode and a light emission control mode. The input terminal is configured to receive an input instruction, and the input instruction comprises a first characteristic. The fan motor is electrically connected to the first output terminal, and the light emitting element is electrically connected to the second output terminal. When a value of the first characteristic is within a characteristic value range, the processor is switched from the initial mode to the other of the rotation speed control mode and the light emission control mode. When the value of the first characteristic is not within the characteristic value range, the initial mode of the processor is maintained.

IPC Classes  ?

• H02P 7/29 - Arrangements for regulating or controlling the speed or torque of electric DC motors for regulating or controlling an individual dc dynamo-electric motor by varying field or armature current by master control with auxiliary power using discharge tubes or semiconductor devices using semiconductor devices controlling armature supply only using pulse modulation
• H05B 45/325 - Pulse-width modulation [PWM]
• H05B 45/10 - Controlling the intensity of the light
• F04D 27/00 - Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids

Abstract

A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F04D 1/06 - Multi-stage pumps
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• F04D 13/14 - Combinations of two or more pumps the pumps being all of centrifugal type
• F04D 1/00 - Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps

Abstract

A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.

IPC Classes  ?

• F28F 3/00 - Plate-like or laminated elements; Assemblies of plate-like or laminated elements
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28F 3/14 - Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation

Abstract

A vehicle electronic control unit water block is provided. The vehicle electronic control unit water block comprises a mounting plate, cooling plate, at least one heat sink, at least one heat sink fin set, and at least one lift plate. The mounting plate and cooling plate define a cooling chamber therein having a first, second and third flow channel. The cooling liquid flows through the first and second flow channels having the at least one lift plate and at least one heat sink therein with a generally minimal and even liquid flow resistance distribution. The at least one lift plate corresponds to an elevated position of the at least one heat sink, such that the volume of cooling liquid flow is even over the lift plates and the thickness of the heat sink is minimized.

IPC Classes  ?

• F01P 5/12 - Pump-driving arrangements
• F28F 3/04 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
• G06F 1/20 - Cooling means

Abstract

A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate and second continuity plate comprise a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. The second continuity plate comprises a second continuity plate attachment surface having a third elevated continuity channel. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.

IPC Classes  ?

• F28D 15/00 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

IPC Classes  ?

• F28D 20/00 - Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups or
• F28F 3/14 - Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation
• B21D 53/02 - Making other particular articles heat exchangers, e.g. radiators, condensers
• B21D 53/04 - Making other particular articles heat exchangers, e.g. radiators, condensers of sheet metal

Abstract

A method includes providing a first metal sheet and a second metal sheet, printing patterns of a plurality of obstructers, a plurality of channels, an evaporator channel, a condenser channel, and a connecting channel on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

IPC Classes  ?

• F28D 20/00 - Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups or
• B21D 53/04 - Making other particular articles heat exchangers, e.g. radiators, condensers of sheet metal
• B21D 53/02 - Making other particular articles heat exchangers, e.g. radiators, condensers
• F28F 3/14 - Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation

Abstract

A configurable leak detection system comprising a leak detection device and at least a leak detection covering comprising a leak detection region having a first and second electrode and at least an attachable region is provided. The first and second electrodes are disposed spaced apart and fixed in firm contact with the covering. The system is attached onto liquid cooling systems, bases, and/or fluid conduits. When liquid is leaked onto the covering, the liquid is absorbed therein, until the dampened region extends over some point on each of the first and second electrodes. An electrical current is conducted, providing a low resistance path therebetween. An impedance change is detected, an alert means is generated, and the leak detection device is reset. More than one configurable leak detection system is attached onto systems, bases and/or fluid conduits via the at least an attachable region, and then electrically coupled together.

IPC Classes  ?

• G08B 21/20 - Status alarms responsive to moisture
• G01M 3/18 - Investigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means for valves
• G08B 7/06 - Signalling systems according to more than one of groups ; Personal calling systems according to more than one of groups using electric transmission

Abstract

A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber comprises an upper and lower casing having an upper and lower chamber surface, respectively. The upper and lower chamber surfaces define a plurality of obstructers farming a plurality of braided channels therearound. When heat from a greater temperature heat source and a lower temperature heat source is applied to respective contact surfaces of the lower casing, via the plurality of obstructers and braided channels, respectively, the working fluid and liquid vapor slugs/bubbles travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28F 3/02 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations

Abstract

A control valve includes a valve body and a valve gate, the valve body has an inner space, first fluid inlets, second fluid inlets, and a fluid outlet, the valve gate is movably located inside the inner space, the first fluid inlets are located at a side of the fluid outlet, the second fluid inlets are located at another side of the fluid outlet, the first fluid inlets and the second fluid inlets are arranged along a radial direction of the valve gate, the valve gate has a main channel having a first inlet end, a second inlet end, and an outlet end, the first inlet end is connected to the first fluid inlets, the second inlet end is connected to the second fluid inlets, and the outlet end is connected to the fluid outlet.

IPC Classes  ?

• F16K 5/10 - Means for additional adjustment of the rate of flow
• F16K 11/076 - Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves; Arrangement of valves and flow lines specially adapted for mixing fluid with all movable sealing faces moving as one unit comprising only sliding valves with pivoted closure members with sealing faces shaped as surfaces of solids of revolution
• F16K 5/04 - Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary with plugs having cylindrical surfaces; Packings therefor
• F04B 49/22 - Control of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for in, or of interest apart from, groups by means of valves
• F16K 5/06 - Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary with plugs having spherical surfaces; Packings therefor
• F16K 3/26 - Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with sealing faces shaped as surfaces of solids of revolution with cylindrical valve members with fluid passages in the valve member
• F16K 5/12 - Arrangements for modifying the way in which the rate of flow varies during the actuation of the valve

Abstract

The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.

IPC Classes  ?

• F28F 7/00 - Elements not covered by group , , or
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A liquid cooling heat exchange apparatus has a water block set and a liquid pump module. The water block set has a heat transfer surface configured to exchange heat with a cooling liquid. The liquid pump module is securely mounted on the water block set and has a flow-directing containment area and pumps. The flow-directing containment area forms flow-directing containment recesses and the pumps correspond to the flow-directing containment recesses. Therefore, pumps are connected in series or parallel so that the pumps can juxtapose with each other, which lessens the entire thickness and allows the liquid cooling heat exchange apparatus to be utilized in a narrow space. Besides, with the connected pumps, an amount and a speed of the flow may be increased and dissipate more heat. Even if part of the pumps malfunctions, the remaining pump(s) can maintain a basic amount and speed of the flow.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids

Abstract

A liquid-cooling heat dissipation device including a base and two pumps. The base has a first inlet and a first outlet. The two pumps are disposed on the base and connected to the first inlet and the first outlet in a parallel arrangement.

IPC Classes  ?

• F04D 29/58 - Cooling; Heating; Diminishing heat transfer
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

IPC Classes  ?

• F28D 15/00 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28F 9/00 - Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
• F28F 9/007 - Auxiliary supports for elements
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups

Abstract

A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28F 1/02 - Tubular elements of cross-section which is non-circular

Abstract

A cooling device includes a fan frame including a bottom plate and a base part disposed on the bottom plate, a stationary pillar coupled to the fan frame, and a fan assembly that is rotatably disposed about the stationary pillar. The fan assembly is supported on the stationary pillar by at least one bearing positioned between the fan assembly and the stationary pillar. The cooling device also includes a decorative plate coupled to the stationary pillar. The decorative plate has an identifying indicia that permits at least some light to pass therethrough. The cooling device further includes a light emitting assembly disposed on the fan frame and configured to emit light that is directed toward the identifying indicia.

IPC Classes  ?

• F04D 29/00 - NON-POSITIVE-DISPLACEMENT PUMPS - Details, component parts, or accessories
• F04D 25/02 - Units comprising pumps and their driving means
• F04D 25/08 - Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
• F04D 29/32 - Rotors specially adapted for elastic fluids for axial-flow pumps
• F04D 29/64 - Mounting; Assembling; Disassembling of axial pumps
• F04D 29/056 - Bearings

Abstract

A cooling device includes a fan frame including a bottom plate and a base part disposed on the bottom plate, a stationary pillar coupled to the fan frame, and a fan assembly that is rotatably disposed about the stationary pillar. The fan assembly is supported on the stationary pillar by at least one bearing positioned between the fan assembly and the stationary pillar. The cooling device also includes a decorative plate coupled to the stationary pillar. The decorative plate has an identifying indicia that permits at least some light to pass therethrough. The cooling device further includes a light emitting assembly disposed on the fan frame and configured to emit light that is directed toward the identifying indicia.

IPC Classes  ?

• F04D 29/00 - NON-POSITIVE-DISPLACEMENT PUMPS - Details, component parts, or accessories
• F04D 25/08 - Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
• F04D 29/52 - Casings; Connections for working fluid for axial pumps
• F04D 29/056 - Bearings
• F04D 29/32 - Rotors specially adapted for elastic fluids for axial-flow pumps
• F04D 19/00 - Axial-flow pumps specially adapted for elastic fluids

Abstract

The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28F 13/08 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups

Abstract

A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

The disclosure provides a magnetically driven pump which including a base, a spacer sleeve, a cover, a stator assembly and a rotor assembly. The base has a first accommodation space. The spacer sleeve is mounted to the base and partially located in the first accommodation space. The spacer sleeve has a second accommodation space not connected to the first accommodation space. The cover has through holes. The cover is mounted to the base, and the through holes are connected to the second accommodation space. The stator assembly is sleeved on the spacer sleeve and located in the first accommodation space. The rotor assembly includes a shaft, an impeller and a magnet assembly. Two ends of the shaft are rotatably disposed on the cover and the spacer sleeve, the shaft is partially located in the second accommodation space, and the impeller and the magnet assembly are fixed on the shaft.

IPC Classes  ?

• F04B 39/14 - Provisions for readily assembling or disassembling
• F04B 17/00 - Pumps characterised by combination with, or adaptation to, specific driving engines or motors
• F04B 39/12 - Casings; Cylinders; Cylinder heads; Fluid connections
• F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven

Abstract

The disclosure provides a liquid storage device configured for storing a working liquid and including a casing and a liquid driving device. The casing includes a reservoir and an accommodation part detachably disposed on the reservoir. The reservoir has a reservoir chamber. The liquid driving device is disposed in the accommodation part and forms a liquid chamber. The liquid driving device includes an impeller located in the liquid chamber and configured to force the working liquid to flow towards the liquid chamber from the reservoir chamber.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• F04D 29/58 - Cooling; Heating; Diminishing heat transfer
• F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven
• F04D 1/04 - Helico-centrifugal pumps

Abstract

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

IPC Classes  ?

• F28F 13/00 - Arrangements for modifying heat transfer, e.g. increasing, decreasing
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups
• H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
• H01L 23/367 - Cooling facilitated by shape of device
• F28F 13/06 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media

Abstract

The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A cooling device includes a frame including a base portion and a barrel portion connected to the base portion, a fan assembly including a hub and a plurality of fan blades connected to the hub, the fan assembly rotatably coupled to the frame via at least one bearing positioned between the barrel part and the hub, a driving assembly disposed on the frame, and a decorative plate having a marking and a column coupled thereto and extending therefrom. The decorative plate is coupled to the base portion using the column and is stationary with respect to the fan assembly. The cooling device further includes a light assembly disposed on the driving assembly and emitting light that illuminates the marking.

IPC Classes  ?

• F04D 29/00 - NON-POSITIVE-DISPLACEMENT PUMPS - Details, component parts, or accessories
• F04D 25/06 - Units comprising pumps and their driving means the pump being electrically driven
• F04D 19/00 - Axial-flow pumps specially adapted for elastic fluids

Abstract

A heat dissipating device that includes a first plate and a second plate opposite the first plate and connected to the first plate by two opposite sidewalls. The first plate and the second plate are connected to each other at longitudinally opposite ends thereof, longitudinally extending ends of the first plate and the second plate are connected to each other by sidewalls, and the first plate, the second plate and the sidewalls enclosing an internal space of the heat dissipating device. The heat dissipating device also includes a first wick structure disposed in the internal space and contacting inner surfaces of at least one of the first plate and the second plate. The first wick structure extends longitudinally between the longitudinally opposite ends of the first plate and the second plate, and the first wick structure at least partially defines a first vapor flow channel of the heat dissipating device

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• B23P 15/26 - Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers

Abstract

A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F24F 1/022 - Self-contained room units for air-conditioning, i.e. with all apparatus for treatment installed in a common casing comprising a compressor cycle

Abstract

The disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin. The disclosure also relates to a method for making the liquid cooling heat exchanger.

IPC Classes  ?

• F28D 9/00 - Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
• F28F 3/02 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28F 21/08 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• B23P 15/26 - Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers
• H01L 23/367 - Cooling facilitated by shape of device

Abstract

This disclosure relates to a manufacturing method of a vapor chamber that includes the following steps. Form a containing space and a flow channel on a first cover. Place a second cover on the first cover, such that the first cover and the second cover together form a chamber at the containing space of the first cover and form a passage at the flow channel of the first cover. Enlarge part of the passage so as to create a circular passage portion and a flat passage portion in the passage. Insert a degassing tube into the circular passage portion of the passage. Draw gas from the chamber and fill working fluid into the chamber via the degassing tube. Seal a joint between the chamber and the flat passage portion by a resistance-welding process. Cut off parts of the first cover and the second cover that surround the passage.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• B23P 15/26 - Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.

IPC Classes  ?

• F28D 15/00 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure

Abstract

This disclosure relates to an external liquid cooling device including at least one radiator, at least one airflow generator, a water block and a mount head module. The at least one airflow generator and the water block are respectively disposed at two adjacent sides of the at least one radiator. The mount head module includes two connectors which are respectively connected to the at least one radiator and the water block via piping. The mount head module and the water block are respectively located at two opposite sides of the at least one radiator.

IPC Classes  ?

• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

The disclosure provides an easy-to-mount leakage detection sleeve configured to be mounted on a tube. The easy-to-mount leakage detection sleeve includes a flexible water absorbing layer, a plurality of electrically conductive wires and a connecting assembly. The plurality of electrically conductive wires are disposed on the flexible water absorbing layer and spaced apart from each other. The connecting assembly includes a first connecting part and a second connecting part. The first connecting part and the second connecting part are respectively disposed on two opposite sides of the flexible water absorbing layer, and the second connecting part is detachably engaged with the first connecting part so that the flexible water absorbing layer forms a tube accommodation space configured for accommodating the tube.

IPC Classes  ?

• G01M 3/16 - Investigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means
• G01M 3/18 - Investigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means for valves
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

This disclosure relates to a fin structure including a main body and at least one minor structure. The main body includes a main plate and two side plates. The main plate has at least one through hole. The two side plates are respectively connected to two opposite sides of the main plate and protrude from the main plate. The at least one minor structure protrudes from the main plate and is located at a side of the main plate. The at least one minor structure is spaced apart from the two side plates. The at least one minor structure partially covers the at least one through hole. The at least one minor structure has a length, in a longitudinal direction of the main plate, less than a length of the at least one through hole of the main plate.

IPC Classes  ?

• F28F 13/12 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation

Abstract

A vapor chamber having a working fluid therein, includes a first and second casing, together forming an evaporator section having a plurality of first support structures therein, a condenser section having a plurality of second support structures therein, and a vapor flow chamber extending from the evaporator section to the condenser section is provided. The evaporator section further includes a plurality of extended heat transfer structures therein, contacting a first inner surface of the evaporator section of the first casing and being perpendicular thereto. The vapor flow chamber includes as least one evaporator vapor flow area. The first inner surface, second inner surface of the first and second casings, plurality of extended heat transfer structures, and at least one of a plurality of first support structures include evenly distributed and substantially the same thickness sintered powdered wick structures thereon. The plurality of first and second support structures supports the first and second casings of the vapor chamber.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

A fan has a fan housing and an impeller mounted in the fan housing. The fan housing has a main case, and a foamed metal plate securely mounted in an air inlet aperture of the main case. Hot air inhaled into the main case is forced to flow through pores in the foamed metal plate. Thus, heat in the hot air is conducted to the foamed metal plate and then to the main case. The heat in the hot air is dissipated to reduce temperature of the hot air in advance. Accordingly, heat dissipation efficiency of the fan is improved. Since the foamed metal plate hinders flow of the hot air, the hot air flowing into the main case is reduced. Therefore, air pressure and flowing speed of the hot air flowing into the main case is reduced, such that noise made by the fan is also reduced.

IPC Classes  ?

• F04D 29/58 - Cooling; Heating; Diminishing heat transfer
• F04D 29/66 - Combating cavitation, whirls, noise, vibration, or the like; Balancing
• F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps

Abstract

The disclosure provides a retainer which is configured to be mounted on and fix heat dissipation module onto chip platform. The retainer includes pressing portion, first and second latching portions. The first latching portion includes flat portion and flexible curved portion, the flexible curved portion is connected between the pressing portion and the flat portion, long side of the flat portion is substantially perpendicular to a long side of the pressing portion. The second latching portion is connected to the pressing portion. A long side of the second latching portion is substantially perpendicular to the long side of the pressing portion. The first portion and the second latching portion are configured to be detachably engaged at two opposite sides of the chip platform so as to deform the flexible curved portion and utilize the flexible curved portion to enhance a pressing force applied to the heat dissipation module.

IPC Classes  ?

• A47B 97/00 - Furniture or accessories for furniture, not provided for in other groups of this subclass
• H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
• F16M 13/02 - Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle

Abstract

An assemblable cooling fin assembly includes a plurality of cooling fins. Each of the cooling fins includes a base plate, a first side plate, a second side plate and a first engaging protrusion. The base plate has a first engaging slot. The first side plate and the second side plate are respectively connected to two opposite sides of the base plate. The first engaging protrusion has a connecting end and a deformable end opposite to each other. The connecting end is connected to the first side plate. In addition, the first engaging protrusion of one of the plurality of cooling fins is disposed through the first engaging slot of another one of the plurality of cooling fins, and the deformable end of the first engaging protrusion is deformed so as to become wider than the first engaging slot.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28F 3/02 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations