One or more embodiments of the disclosure may be an oven-controlled crystal oscillator that may include a core section hermetically encapsulated inside a thermal insulation package. The core section includes at least: an oscillation IC; a crystal resonator; and a heater IC. The core section is mounted on a core substrate that is mechanically connected to the package by a non-conductive adhesive. The core section and the package are electrically connected to each other by wire bonding. A space is provided between the core substrate and a bottom surface of the package.
H03B 5/36 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
H03B 5/04 - Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
An oven-controlled crystal oscillator according to one or more embodiments may include including a core section hermetically encapsulated in a package for thermal insulation, wherein the core section is supported by the package via a core substrate, and the core section has a layered structure in which at least an oscillation IC, a crystal resonator and a heater IC are laminated in sequence.
H03B 5/04 - Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H03L 1/02 - Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
H03L 1/04 - Constructional details for maintaining temperature constant
An OCXO according to one or more embodiments may include a core section hermetically encapsulated in a heat insulation package. The core section includes: an oscillation IC; a crystal resonator; and a heater IC. The core section is supported by the package via a core substrate. The OCXO further includes a capacitor as an electronic component for adjustment, which is attached to the package by soldering. The core section is vacuum-sealed in a sealed space of the package, while the capacitor is disposed in a space other than the sealed space.
H03B 5/04 - Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
An OCXO according to one or more embodiments may include a core section hermetically encapsulated inside a heat insulation package. The core section includes: an oscillation IC; a crystal resonator; and a heater IC, and furthermore is supported by the package via a core substrate. The core substrate is mechanically connected to the package by a non-conductive adhesive. The core section and the package are electrically connected to each other by wire bonding using wires.
H03B 5/04 - Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
A piezoelectric resonator device according to one or more embodiments may be provided, in which a crystal resonator plate includes a cutout part between a vibrating part and an external frame part, and a metal film formed on a first main surface of a first sealing member is electrically connected to an external electrode terminal formed on a second main surface, which does not face an internal space, of a second sealing member via a first internal wiring formed on an inner wall surface of the external frame part.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
An oven-controlled crystal oscillator according to one or more embodiments includes a core section having at least an oscillation IC, a crystal resonator, and a heater IC. The core section is hermetically encapsulated in a heat-insulating package. The core section is supported by the package via a core substrate. The core substrate is connected to the package outside a region where the core section is provided in plan view.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H03L 1/04 - Constructional details for maintaining temperature constant
7.
THIN-FILM HEATER, METHOD OF PRODUCING THIN-FILM HEATER, AND THERMOSTATIC OVEN PIEZOELECTRIC OSCILLATOR
A thin-film heater according to one or more embodiments may include an insulated substrate and metal wiring patterned thereon to extend between both terminals of the metal wiring. The metal wiring has a resistance of 10Ω or less between the terminals. The metal wiring includes a heat-generating layer made of a material that recrystallizes at a temperature of 200° C. or lower.
H05B 3/34 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
8.
PIEZOELECTRIC VIBRATION PLATE, PIEZOELECTRIC VIBRATION DEVICE, AND MANUFACTURING METHOD FOR PIEZOELECTRIC VIBRATION DEVICE
The piezoelectric vibration plate includes a piezoelectric substrate, a first driving electrode and a second driving electrode formed on main surfaces on both sides of the piezoelectric substrate, and a first mounting terminal and a second mounting terminal respectively connected to the first driving electrode and the second driving electrode. The first and second mounting terminals each have a metal film for mounting purpose formed on the piezoelectric substrate and a metal film for driving purpose formed on the metal film for mounting purpose. The metal films for mounting purpose each include a solder-resistant metal film. The metal films for driving purpose are formed in continuity with the first and second driving electrodes and constitute the first and second driving electrodes.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
9.
PIEZOELECTRIC VIBRATION DEVICE AND MANUFACTURING METHOD THEREFOR
Metal films for first and second mounting terminals are formed at ends on both sides of a piezoelectric vibration plate across a vibrating portion, and first and second mounting terminals connected to these metal films are formed on outer surfaces of resin films adhered to the piezoelectric vibration plate. In case the metal films for first and second mounting terminals on both sides of the vibrating portion are desirably reduced in size in order to enlarge the vibrating portion, an adequate joining area for mounting purpose is still secured for the first and second mounting terminals formed on the outer surfaces of the resin films.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
An oven-controlled crystal oscillator according to one or more embodiments may include a core section having a crystal resonator, an oscillator IC and a heating IC, wherein the core section is supported by a package via an interposer, and furthermore the core section is hermetically encapsulated in the package.
H03B 5/04 - Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
11.
PIEZOELECTRIC RESONATOR PLATE AND PIEZOELECTRIC RESONATOR DEVICE
A crystal resonator plate according to one or more embodiments may include: a vibrating part; an external frame part surrounding the outer periphery of the vibrating part; and a support part connecting the vibrating part to the external frame part. A first excitation electrode is formed on a first main surface of the vibrating part. A second excitation electrode is formed on a second main surface of the vibrating part. The second excitation electrode includes a pair of parallel sides parallel to each other. The first excitation electrode includes protruding parts that protrude outward from a part between the parallel sides the second excitation electrode in plan view. The protruding parts each have an outer edge shape that is not along the parallel sides in plan view.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
When a thick frequency adjustment metal film of a tuning fork-type vibration piece is irradiated with a beam on a wafer for frequency coarse adjustment, projections are possibly formed on a roughened end of the frequency adjustment metal film. Such projections are pressurized and pushed down not to chip off under any impact, so that the risk of frequency fluctuations is suppressed.
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Among a plurality of electrodes for mounting purpose, all of the electrodes for mounting purpose but two paired ones of the electrodes for mounting purpose that are connected to driving electrodes each have a wiring pattern for use in electrical connection between terminals for external connection and mounting terminals of IC. These wiring patterns each have a constricted portion smaller in width than the other portions that prevents the conduction of heat.
H03B 5/36 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
An AT-cut crystal vibration plate has, at its both ends, first and second castellations that interconnect first mounting terminals and also interconnect second mounting terminals formed on main surfaces on both sides of this plate. The first and second castellations respectively have first and second cutouts, and these cutouts each have an end surface extending along Z′ axis of crystal and located on a −X-axis side. The end surfaces each include a first inclined face inclined in a manner that protrudes from one of the main surfaces toward the −X-axis side, and a second inclined face inclined in a manner that protrudes from the other main surface toward the −X-axis side. The angle made by the first inclined face and the second inclined face is an obtuse angle.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
A piezoelectric vibrating device according to the present invention is provided with: a piezoelectric vibration plate having first and second driving electrodes respectively formed on main surfaces on both sides thereof, the piezoelectric vibration plate further having first and second mounting terminals that are respectively connected to the first and second driving electrodes. The piezoelectric vibrating device is also provided with first and second sealing members respectively joined to the main surfaces on both sides of the piezoelectric vibration plate in a manner that the first and second driving electrodes of the piezoelectric vibration plate are covered with these sealing members. At least one of the first and second sealing members includes a film made of a resin.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
In a piezoelectric resonator device according to one or more embodiments, an internal space for hermetically sealing a vibrating part including a first excitation electrode and a second excitation electrode of a crystal resonator plate is formed by bonding a first sealing member and a second sealing member respectively to the crystal resonator plate. A through hole is formed in the second sealing member. A through electrode is formed along an inner wall surface of the through hole to establish conduction between an electrode formed on a first main surface and an external electrode terminal formed on a second main surface. A corrosion resistance structure to solder is formed on the through electrode that establishes conduction between the electrode and the external electrode terminal with a conductive metal other than Au.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/125 - Driving means, e.g. electrodes, coils
In a piezoelectric resonator device according to an embodiment, an internal space is formed by bonding a first sealing member to a crystal resonator plate and bonding a second sealing member to the crystal resonator plate. The internal space hermetically seals a vibrating part including a first excitation electrode and a second excitation electrode of the crystal resonator plate. Seal paths that hermetically seal the vibrating part of the crystal resonator plate are formed to have an annular shape in plan view. A plurality of external electrode terminals is formed on a second main surface of the second sealing member to be electrically connected to an external circuit board. The external electrode terminals are respectively disposed on and along an external frame part surrounding the internal space in plan view.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
In a crystal oscillator accordance to an embodiment, a crystal resonator plate is bonded to, via laminated bonding patterns, a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. An internal space is formed, which hermetically seals a vibrating part including the first and second excitation electrodes of the crystal resonator plate. The laminated bonding patterns include a laminated sealing pattern annularly formed to surround the vibrating part in plan view so as to hermetically seal the internal space, and a laminated conductive pattern establishing conduction between wiring and electrodes. The laminated conductive pattern is disposed within a closed space surrounded by the laminated sealing pattern. To the laminated sealing pattern, GND potential is applied when the crystal oscillator operates.
H01L 41/053 - Mounts, supports, enclosures or casings
H01L 41/083 - Piezo-electric or electrostrictive elements having a stacked or multilayer structure
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
H03B 5/34 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being vacuum tube
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
A through hole formed in an AT-cut crystal plate includes an inclined surface (72) that extends from a peripheral area toward a penetrating part (71) in a center part of the through hole. The inclined surface (72) includes: a first crystal surface S1 that extends from the penetrating part (71) toward the peripheral area of the through hole in a −Z′ and a +X directions; a second crystal surface S2 that extends from the penetrating part (71) toward the peripheral area of the through hole in the −Z′ and the +X directions and that contacts with the first crystal surface S1 in the +Z′ and the +X directions of the first crystal surface S1; and a third crystal surface S3 that contacts with the second crystal surface S2 in the +X direction of the second crystal surface S2 and that contacts with the main surface of the AT-cut crystal plate. A compensation surface Sc is formed between the main surface of the AT-cut crystal plate and the three crystal surfaces Si to S3 to prevent first and second ridge lines L1 and L2 from reaching the main surface of the AT-cut crystal plate.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
The piezoelectric vibration device disclosed herein includes: a piezoelectric vibrator including a plurality of terminals for external connection and a plurality of electrodes for mounting purpose; and an integrated circuit element mountable to the piezoelectric vibrator and including a plurality of mounting terminals connectable to the plurality of electrodes for mounting purpose. At least one of the electrodes for mounting purpose connected to the terminals for external connection has a wiring pattern extending more inward in a mounting region where the integrated circuit element is mounted than the mounting terminals of the integrated circuit element.
A tuning fork-type vibration piece is provided, in which a cushioning portion is formed on the base of a package and allowed to contact parts for contact of arm portions which are any parts but their edges, and the parts for contact of the arm portions that contact the cushioning portion are electrodeless regions, which prevents the risk of frequency fluctuations caused by any electrode being chipped off by contact with the cushioning portion.
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
22.
Crystal resonator plate and crystal resonator device
In a crystal resonator plate (2), a support part (24) extends from only one corner part positioned in the +X direction and in the −Z′ direction of a vibrating part (22) to an external frame part (23) in the −Z′ direction. The vibrating part (22) and at least part of the support part (24) form an etching region (Eg) having a thickness thinner than a thickness of the external frame part (23). A stepped part is formed at a boundary of the etching region (Eg), and a first lead-out wiring (223) is formed over the support part (24) to the external frame part (23) so as to overlap with the stepped part. At least part of the stepped part that is superimposed on the first lead-out wiring (223) is formed so as not to be parallel to the X axis in plan view.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
A tuning fork-type vibration piece is provided, in which a cushioning portion is formed on the base of a package to make contact with abutting portions of arm portions which are any parts but their edges, and the abutting portions of the arm portions allowed to contact the cushioning portion are electrodeless regions including no electrode, which prevents the risk of frequency fluctuations that may occur in case an electrode is chipped off by possible contact with the cushioning portion.
When a thick frequency adjustment metal film of a tuning fork-type vibration piece is irradiated with a beam on a wafer for frequency coarse adjustment, projections are possibly formed on a roughened end of the frequency adjustment metal film. Such projections are pressurized and pushed down not to chip off under any impact, so that the risk of frequency fluctuations is suppressed.
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
A crystal oscillator includes: a crystal resonator plate having a first excitation electrode and a second excitation electrode. A first sealing member covers the first excitation electrode of the crystal resonator plate. A second sealing member covers the second excitation electrode of the crystal resonator plate. An internal space is formed by bonding the first sealing member to the crystal resonator plate and the second sealing member to the crystal resonator plate, and seals a vibrating part of the crystal resonator plate. First and second shield electrodes are connected to a fixed potential (e.g. GND potential) in the internal space.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
26.
Tuning fork-type piezoelectric vibration piece and tuning fork-type piezoelectric vibrator using the vibration piece
Main surface electrodes formed on main surfaces on front and back sides of vibrating arms are electrically coupled via through electrodes formed in a stem portion so as to penetrate through front and back surfaces thereof. One of the main surface electrodes of the vibrating arm is electrically coupled to side surface electrodes through a routing wiring formed by way of a crotch part between roots of the vibrating arms, and the one of the main surface electrodes is further electrically coupled to the other one of the main surface electrodes through the side surface electrodes.
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
G04C 3/12 - Electromechanical clocks or watches independent of other time-pieces and in which the movement is maintained by electric means wherein movement is regulated by a mechanical oscillator other than a pendulum or balance, e.g. by a tuning fork driven by magnetostrictive means
A crystal resonator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) that covers the first excitation electrode of the piezoelectric resonator plate (2); and a second sealing member (4) that covers the second excitation electrode of the piezoelectric resonator plate (2). The first sealing member (3) is bonded to the piezoelectric resonator plate (2) while the second sealing member (4) is bonded to the piezoelectric resonator plate (2) so that an internal space (13), which hermetically seals a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2), is formed. Plating films (51, 52) are formed respectively on both the first sealing member (3) and the second sealing member (4), on respective surfaces opposite to surfaces to be bonded to the piezoelectric resonator plate (2).
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03B 5/36 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
28.
Piezoelectric resonator device and system-in-package module including the same
A crystal oscillator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) covering the first excitation electrode of the piezoelectric resonator plate (2); a second sealing member (4) covering the second excitation electrode of the piezoelectric resonator plate (2); and an internal space (13) formed by bonding the first sealing member (3) to the piezoelectric resonator plate (2) and by bonding the second sealing member (4) to the piezoelectric resonator plate (2), so as to hermetically seal a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2). An electrode pattern (371) including a mounting pad for wire bonding is formed on an outer surface (first main surface (311)) of the first sealing member (3).
H10N 30/071 - Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H01L 23/04 - Containers; Seals characterised by the shape
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
In a crystal oscillator, a crystal resonator and an IC chip are hermetically sealed in a package. The crystal resonator includes: a crystal resonator plate including a first excitation electrode formed on a first main surface, and a second excitation electrode, which makes a pair with the first excitation electrode, formed on a second main surface; a first sealing member covering the first excitation electrode of the crystal resonator plate; and a second sealing member covering the second excitation electrode of the crystal resonator plate. A vibrating part including the first excitation electrode and the second excitation electrode of the crystal resonator plate is hermetically sealed by bonding the first sealing member to the crystal resonator plate, and the second sealing member to the crystal resonator plate.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H01L 23/08 - Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
H03B 5/36 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
30.
Frequency adjustment method for piezoelectric resonator device
An object is to provide a frequency adjustment method for a piezoelectric resonator device that is applicable to a microminiaturized device and that can adjust the frequency without deteriorating the accuracy of frequency adjustment. A frequency adjustment method for a tuning-fork quartz resonator is applicable to a tuning-fork quartz resonator that includes a tuning-fork quartz resonator piece having a pair of resonator arms 31, 32 and metallic adjustment films W formed on the resonator arms. The frequency adjustment method adjusts the frequency by reduction of a mass of the metallic adjustment films W. The frequency adjustment method includes: a rough adjustment step for roughly adjusting the frequency by partially thinning or removing the metallic adjustment films W; and a fine adjustment step for finely adjusting the frequency by at least partially thinning or removing products W1, W2 derived from the metallic adjustment film W during the rough adjustment step.
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An AT-cut crystal resonator plate includes: a vibrating part having a rectangular shape in plan view that is disposed on a center of the AT-cut crystal resonator plate and that has excitation electrodes respectively formed on a first and a second main surfaces; a cut-out part having a rectangular shape in plan view that is formed along an outer periphery of the vibrating part; an external frame part having a rectangular shape in plan view that is formed along an outer periphery of the cut-out part; and a connecting part that connects the vibrating part to the external frame part and that extends, in a Z′ axis direction of the vibrating part, from one end part of a side of the vibrating part along an X axis direction. The connecting part includes wide parts whose widths gradually increase only toward the external frame part.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
A crystal resonator (101) includes: a crystal resonator plate (2); a first sealing member (3); a second sealing member (4); and an internal space (13) hermetically sealing a vibrating part (22) of the crystal resonator plate (2). The crystal resonator plate (2) includes: the vibrating part (22); an external frame part (23) surrounding an outer periphery of the vibrating part (22); and a connecting part (24) connecting the vibrating part (22) to the external frame part (23). A first extraction electrode (223) drawn from a first excitation electrode (221) is formed on a first main surface of the connecting part (24) while a second extraction electrode (224) drawn from a second excitation electrode (222) is formed on a second main surface thereof. A wiring pattern (33) connected to the first extraction electrode (223) is formed on a second main surface (312) of the first sealing member (3). At least part of the wiring pattern (33) is disposed to be superimposed to a space between the vibrating part (22) and the external frame part (23) in plan view.
H01L 41/053 - Mounts, supports, enclosures or casings
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
A piezoelectric resonator device having a sandwich structure is provided. A crystal oscillator includes: a crystal resonator plate; a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. A parallelepiped shaped package is formed by bonding: the first sealing member to the crystal resonator plate; and the second sealing member to the crystal resonator plate. The package includes an internal space in which is hermetically sealed a vibrating part of the crystal resonator plate including the first excitation electrode and the second excitation electrode. A bonding material hermetically sealing the vibrating part of the crystal resonator plate is formed to have an annular shape in plan view, and is disposed along an outer peripheral edge of the package.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
A piezoelectric resonator device having a sandwich structure is provided, which is stably bonded to an external element. In the piezoelectric resonator device 1, at least a vibrating part 21 of a piezoelectric substrate 2 is sealed by a first sealing member 3 and a second sealing member 4. The piezoelectric substrate 2 includes: the vibrating part 21; and an external frame part 23 that is thicker than the vibrating part 21 and that surrounds the outer periphery of the vibrating part 21. External electrodes 31 to be connected to an external element 5 are provided on at least one of the first sealing member 3 and the second sealing member 4. The external element 5 is connected to the external electrodes 31 at least on the external frame part 23 of the piezoelectric substrate 2.
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
H01L 41/319 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
A third through hole is formed in a crystal resonator plate of a crystal resonator to penetrate between a first main surface and a second main surface. A through electrode of the third through hole is conducted to a first excitation electrode. A seventh through hole is formed in a first sealing member of the crystal resonator to penetrate between a first main surface and a second main surface. The through electrode of the third through hole is conducted to the through electrode of the seventh through hole. The third through hole is not superimposed to the seventh through hole in plan view.
H01L 41/316 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
37.
Crystal resonator plate and crystal resonator device
a) of the vibrating part (21) in a Z′ axis direction of the AT-cut crystal; and an external frame part (23) configured to surround an external circumference of the vibrating part (21) and to hold the holding part (22).
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
An electronic component-use package includes a base that holds an electronic component element, and terminal electrodes formed on a bottom surface of the base. The terminal electrodes have chamfered parts facing corner parts of the base bottom surface and having angles of chamfer ranging in ±10 degrees to a reference line. The reference line is a perpendicular line to a straight line that connects the corner parts of the base bottom surface to a central part on one side of the terminal electrode in proximity to a center point of the base bottom surface, the reference line L8 passing through the chamfered parts.
A piezoelectric device has an insulated container including a frame portion. Four external connection terminals to be solder-bonded to an external substrate each have a shape with a bent portion in plan view in which the external connection terminal is extending from one of the four corners on a bottom surface of the frame portion in a long-side direction and a short-side direction of an outer peripheral edge of the frame portion. The four external connection terminals are spaced from an opening end of a recess with an electrode-absent region interposed therebetween. The four external connection terminals each have a plurality of angular parts in plan view, and at least one of the plurality of angular parts is in proximity to the inner peripheral edge of the frame portion in an arc shape or a chamfered shape at each of the four corners thereof.
A crystal resonator includes: a crystal resonator plate; a first sealing member that covers a first excitation electrode of the crystal resonator plate; and a second sealing member that covers a second excitation electrode of the crystal resonator plate and includes a first external electrode terminal and a second external electrode terminal to be bonded to a circuit board using a flowable conductive bonding material. The second sealing member includes a second through hole and a third through hole that pass through between a first main surface and a second main surface on which the first external electrode terminal and the second external electrode terminal are formed. The second through hole and the third through hole include: respective through electrodes for conduction between electrodes formed on the first main surface and the second main surface; and respective through parts.
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
H01L 41/31 - Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base
A tuning-fork type crystal resonator plate includes a base portion and a pair of leg portions protruding from the base portion in one direction. A groove and a bank portion are formed on at least one of main surfaces of each of the leg portions. The bank portion is formed accompanied by the formation of the groove, and a width of the bank portion differs along a width direction. The bank portion is constituted by a thick portion having a large width and a thin portion having a small width.
This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. A pair of first and second metal bumps is formed in juxtaposition on the piezoelectric vibration piece. The coupling portion has slits extending in its width direction except in a bridge, i.e., a part of the coupling portion in its width direction. An end in the width direction of the bridge is distantly spaced from the first and second metal bumps both in a direction perpendicular to the width direction of the coupling portion with no overlap with these metal bumps.
H01L 41/22 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Piezoelectric resonator element, piezoelectric device using the piezoelectric resonator element, method for producing the piezoelectric resonator element, and method for producing the piezoelectric device using the piezoelectric resonator element
b formed on front and back main surfaces of a crystal resonator plate. Each of the excitation electrodes is made of a ternary alloy containing silver as a major component, a first additive, and a second additive. The first additive is a metal element having a lower sputtering yield than silver and being resistant to corrosion in an etching liquid. The second additive is an element for forming a solid solution with silver. Outer peripheries of the excitation electrodes are first additive-rich regions 9 in which the first additive is rich.
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
H01L 41/053 - Mounts, supports, enclosures or casings
H01L 41/29 - Forming electrodes, leads or terminal arrangements
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
46.
Piezoelectric wafer, piezoelectric vibration piece, and piezoelectric vibrator
This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. The piezoelectric vibration piece is broken off at the coupling portion and separated from the piezoelectric wafer. On front and back surfaces of the coupling portion, grooved slits extending along a width direction of the coupling portion are formed except for parts of the coupling portion in the width direction. An electrode on at least one of front and back surfaces of the piezoelectric vibration piece is extracted to a frame-portion side of the piezoelectric wafer by way of the part of the coupling portion in the width direction.
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/22 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
A piezoelectric vibration piece has an inverted mesa-type structure, comprising a thinned portion serving as a vibration region at a central part of a piezoelectric plate; and a thickened portion formed all along or partly along perimeter of the thinned portion to reinforce the thinned portion. In the piezoelectric vibration piece, contact metals including a large number of discrete metallic thin films are provided on the whole surfaces of the piezoelectric plate. A piezoelectric vibration device comprises the piezoelectric vibration piece which is housed in a package, wherein extraction electrodes of the piezoelectric vibration piece are connected to internal terminals of the package through a conductive adhesive. These structural and technical advantages prevent undesirable flowage of the conductive adhesive before thermal curing. As a result, the piezoelectric vibration piece and the piezoelectric vibration device comprising the same successfully attain excellent vibration characteristics.
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
A deviation in mounting a temperature sensor unit is eliminated. In a second cavity 47 for mounting a temperature sensor unit 3 of a base 4, exposed electrodes 6 that intersect at least an internal wall surface 474 of a second wall portion 45 are formed so as to be exposed within the second cavity 47. The exposed electrodes 6 include a pair of temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded via a solder 13. The solder 13 is formed so as to cover an entire surface of the exposed electrodes 6 including the temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded.
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
For a tuning-fork type crystal resonator plate, a crystal plate having a crystal orientation is used. The tuning-fork type crystal resonator plate includes: a base portion; and a pair of first and second leg portions protruding from the base portion in one direction. In the first leg portion and the second leg portion, grooves are formed so that each of the grooves is biased relative to a center of the corresponding first or second leg portion in a width direction. A lowermost point of the groove is positioned in a middle of the groove in the width direction (width direction of the first leg portion and the second leg portion) in a state viewed from an end surface of the first and second leg portions in the width direction.
A piezoelectric vibrator according to the invention has a base, an integrated circuit element, and a piezoelectric vibration element. The base has internal terminal pads, and external terminals including an AC output terminal. The base includes rectangular ceramic substrate layers stacked in at least three layers, each of which has castellations formed at four corners. Among the internal terminal pads, internal terminal pads for the integrated circuit element and internal terminal pads for the piezoelectric vibration element are connected to each other by externally exposed wiring patterns formed on upper surfaces of the castellations at the corners of the ceramic substrate constituting a middle layer.
H01L 41/053 - Mounts, supports, enclosures or casings
H03B 5/36 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
A piezoelectric device is provided with a rectangular crystal piece having driving electrodes on front and back main faces thereof, and a base member having two electrode pads near one short side of the crystal piece. The crystal piece is supported on the base member by two support portions near one short side thereof, and by an auxiliary support portion on the other short side thereof. A position of the auxiliary support portion relative to the other short side, where L is a distance between two short sides, and H is a distance from the other short side to a peripheral edge of the auxiliary support portion nearest to the other short side, is set to a position at which the distance H stays in a range of distances in which a maximum tensile stress acting on the auxiliary support portion and a maximum von Mises stress of the crystal piece are within predetermined ranges.
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 41/053 - Mounts, supports, enclosures or casings
A piezoelectric oscillator has an insulating base having a housing portion where internal terminal pads are formed, an integrated circuit (IC) element having rectangular pads bonded to the internal terminal (IT) pads, and a piezoelectric oscillation element (POE) connected to the base and IC element. The IT pads include two opposing first IT pads connected to the POE, two opposing second IT pads, one of which is for AC output, and two opposing third IT pads formed between the first IT pads and the second IT pads. Along a part of perimeter of the first IT pads, the third IT pads and wiring patterns which respectively extend the third IT pads are formed as conductive paths for blocking radiation noise. The first IT pads and the second IT pads are spaced apart with the conductive paths interposed therebetween.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through hole 49 is formed in a base 4 so as to pass through between both main surfaces 42 and 43 of a base material of the base 4. An inner side surface 491 of the through hole 49 includes a curved surface 495 that expands outward in a width direction of the through hole 49.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
55.
Electronic component package and piezoelectric resonator device
In an electronic-component package made up of a laminated-ceramic, cavity-forming base and an electroconductive lid that is hermetically bonded to the base by a heat-melting sealant, contamination of electromagnetic-interference-reducing grounding metallization lines by melted sealant is prevented. A wall-portion grounding metallization line partially embedded in an enclosing wall portion of the base, and partially exposed to the package cavity, electrically connects lid, when sealant-bonded to the wall portion of the base, with a grounding external terminal on the base exterior. An electronic-component grounding metallization line exposed in the bottom of the base is connected to the grounding external terminal. A connecting portion that joins the wall-portion and electronic-component grounding metallization lines is disposed between laminations of the bottom and wall portions of the base, where the connecting portion is unexposed to the package cavity.
H01L 23/10 - Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.
An IR cut filter includes an infrared light absorber to absorb infrared light, and an infrared light reflector to reflect infrared light. The infrared light absorber has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 620 to 670 nm. The infrared light reflector has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 670 to 690 nm. The wavelength with respect to which the infrared light reflector has the 50% transmittance is longer than the wavelength with respect to which the infrared light absorber has the 50% transmittance. A combination of the infrared light absorber and the infrared light reflector provides a light transmission property of 50% transmittance with respect to a wavelength in the 620 to 670 nm wavelength band and less than 5% transmittance with respect to a 700 nm wavelength.
F21V 9/04 - Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for filtering out infrared radiation
A tuning fork-type piezoelectric resonator plate has a resonator blank comprising a pair of vibrating leg portions and a base portion from which the leg portions protrude. The pair of leg portions are arranged in parallel protrudingly from one end face of the base portion, and a pronged portion is formed between the pair of leg portions in an intermediate position in a width direction of the one end face of the base portion. The base portion has a pair of through holes along the one end face of the base portion, and on another end face side opposite to the one end face of the base portion, a joining region that joins to an external portion. The pair of through holes are specially positioned and have special wall surface configurations.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An AT-cut quartz plate having chamfered ridge portions and an almost rectangular shape in planar view, wherein a resonance frequency is equal to or larger than 7 MHz and equal to or smaller than 9 MHz, lengths of long and short sides of the rectangular shape are equal to or larger than 1.5 mm and equal to or smaller than 2.4 mm, and equal to or larger than a frequency difference between primary vibration and sub-vibration is equal to or larger than 975 kHz and equal to or smaller than 1,015 kHz.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
62.
Electronic component package sealing member, electronic component package, and method for manufacturing electronic component package sealing member
An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material.
H03B 1/00 - GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS - Details
63.
Piezoelectric resonator device and manufacturing method therefor
A piezoelectric resonator device in which excitation electrodes of a piezoelectric resonator plate are hermetically sealed, includes a plurality of sealing members that hermetically seal the excitation electrodes of the piezoelectric resonator plate. The plurality of sealing members each have a bonding layer, and at least one of the plurality of sealing members is provided with a bank portion and having the bonding layer formed on a top face of the bank portion. The plurality of sealing members are bonded together with the bonding layers of the sealing members, and a bonding material that contains an intermetallic compound is formed.
There are disposed a sealing member, a pair of electrode pads to electrically couple a piezoelectric resonator, a plurality of connection pads to electrically couple an integrated circuit element and the piezoelectric resonator, and wiring patterns to establish electrical continuity between the pair of electrode pads and the plurality of connection pads, and the piezoelectric resonator and the integrated circuit element are disposed side by side in plan view. An output wiring pattern establishes electrical continuity between one of the connection pads and an alternating current output terminal of an oscillation circuit, and a power source wiring pattern establishs electrical continuity between one of the connection pads and a direct current power source terminal of the oscillation circuit. The electrode pads are disposed closer to the power source wiring pattern than the output wiring pattern.
H03B 5/30 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
H01L 23/055 - Containers; Seals characterised by the shape the container being a hollow construction and having an insulating base as a mounting for the semiconductor body the leads having a passage through the base
65.
Sealing member for piezoelectric resonator device, and piezoelectric resonator device
A sealing member is for a piezoelectric resonator device that includes a piezoelectric resonator piece and a plurality of sealing members hermetically sealing a resonance region of the piezoelectric resonator piece. The sealing member includes a base material having one principal surface and includes a protruding portion on the one principal surface. The base material has another principal surface having a flat surface and a curved surface. The flat surface is a region corresponding to the protruding portion. The curved surface is a region other than the region of the flat surface. The sealing member includes a plurality of external terminals on the flat surface. The plurality of external terminals are to be connected to an external circuit board. The sealing member includes a plurality of inspection terminals on the curved surface. The plurality of inspection terminals is configured to inspect the piezoelectric resonator piece.
A lead type piezoelectric resonator device includes a piezoelectric resonator plate and a lead terminal that supports the piezoelectric resonator plate. The piezoelectric resonator plate is provided with a terminal electrode that is electrically connected to the lead terminal, and the lead terminal is provided with a bonding layer that is electrically connected to the piezoelectric resonator plate. The piezoelectric resonator plate and the lead terminal are electromechanically bonded to each other by the terminal electrode and the bonding layer. A bonding material containing an Sn—Cu alloy is produced from the terminal electrode and the bonding layer by the bonding of the terminal electrode and the bonding layer.
In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed.
A base of an electronic component package holds an electronic component element. The base has a bottom face in a rectangular shape in plan view. The base includes a pair of terminal electrodes having a rectangular shape on the bottom face. The pair of terminal electrodes are to be bonded on an external circuit substrate with a conductive bonding material. The pair of terminal electrodes have mutually symmetrical shapes. Each of the terminal electrodes has a long side adjacent to or on an edge of a long side of the bottom face. The long side of each of the terminal electrodes is disposed parallel to the long side of the bottom face. The long side of each of the terminal electrodes has a length that is more than half a length of the long side of the bottom face.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01L 23/053 - Containers; Seals characterised by the shape the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member
[Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
H01L 41/22 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
H01L 41/311 - Mounting of piezo-electric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An optical filter 13 is provided with a quartz plate 2 and a filter group 3. The filter group 3 is constituted by combining a first filter 33 having transmission characteristics in the visible region and one preset band of the infrared region that is contiguous with the visible region, and a second filter 35 and a third filter 36 each having transmission characteristics in the visible region and another preset band of the infrared region that is removed from the visible region and having blocking characteristics in a band between the visible region and the other band of the infrared region. In the second filter 35 and the third filter 36, each of the bands in which blocking characteristics are obtained is approximately 150 nm or less, and the bands in which blocking characteristics are obtained overlap.
G02B 1/10 - Optical coatings produced by application to, or surface treatment of, optical elements
G02B 23/12 - Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices with means for image conversion or intensification
71.
Tuning-fork type piezoelectric resonator plate comprising leg portions and a bonding portion respectively provided on first and second end faces of a base portion
A tuning-fork type piezoelectric resonator plate includes: at least a plurality of leg portions serving as vibrating portions; a bonding portion bonded to the outside, and a base portion from which the leg portions and the bonding portion protrude. The plurality of leg portions protrude from a first end face of the base portion and are provided side-by-side on the first end face. The bonding portion protrude from a second end face located opposite the first end face of the base portion at a position located opposite a center position of the plurality of leg portions in a width direction of the first end face of the base portion. And, at least a base end portion of the bonding portion is used as a bond region that is bonded to the outside.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
A piezoelectric resonator includes a pair of driving electrodes and a pair of lead electrodes that are formed facing each other on the frontside and backside of a piezoelectric plate that operates in a thickness-shear vibration mode. The front and back driving electrodes are formed such that they each have one or more pairs of parallel sides and have the same shape, and their centers face each other. The parallel sides of one of the front and back driving electrodes are formed parallel with either the X-axis or the Z′-axis of the piezoelectric plate, but the parallel sides of the other driving electrodes are formed without being parallel with the X-axis and Z′-axis thereof.
With a crystal vibrator, a package (housing) is produced by joining a base to a lid, and an internal space is formed within this package. A crystal resonator plate is held on the base in this internal space, and the internal space of the package is sealed airtight. In placing the crystal resonator plate on the base, the +X axial direction of the crystal resonator plate within the internal space is set.
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
A piezoelectric resonator device includes a base holding a piezoelectric resonator element and a lid bonded to the base in order to hermetically seal the piezoelectric resonator element held on the base. In addition, the region of bonding of the base to the lid is composed of at least a nickel-cobalt layer comprising nickel and cobalt, and a metal layer laminated on the nickel-cobalt layer, with the base and lid bonded by heat-melting using a metallic braze material.
A package inner peripheral face 13 of a base 4 is made up of a vertical face 14 and a horizontal face 15, and electrode pads 7 (71 to 78) are formed on the vertical face vertical face 14 of the base 4. The electrode pads 71 to 78 are formed on the vertical face 14 of the base 4 including an intersection line 17 at which the vertical face 14 and the horizontal face 15 intersect; for example, electrode pads 74 and 75 that serve as hetero electrodes are formed adjacently. The distance between the electrode pads 74 and 75 that are adjacent along the intersection line 17 of the vertical face 14 of the base 4 is longer than the shortest distance between the electrode pads 74 and 75 that are adjacent on the vertical face 14 of the base 4.
A crystal resonator comprises an AT-cut crystal vibrating element that is driven by a thickness-shear mode and is in the shape of a rectangular plate. A pair of excitation electrodes is formed, facing front and rear surfaces of the crystal vibrating element. Each of the excitation electrodes is formed in the shape of a quadrangle as viewed from the top, and mass adjustment portions are formed at least two opposite sides of each of the excitation electrodes formed on the front and rear surfaces.
An electronic-component container is provided in which a metal lid is bonded with an insulating package. The container comprises the insulating package having a housing portion for housing an electronic component element having an electrical function, a metallized sealing portion formed around the housing portion and hermetically bonded with the metal lid, and a castellation having a terminal electrode formed at a side end portion thereof, and the metal lid formed in a shape as viewed from the top which is substantially equal to a shape as viewed from the top of the insulating package, wherein a brazing material is formed on a lower surface of the metal lid, and the brazing material is provided with a welding portion which is bonded with the metallized sealing portion inside the castellation when the metal lid is bonded with the insulating package.
A piezoelectric resonator element package has a base that holds a piezoelectric resonator element on which drive electrodes are formed, and a cap. Four electrode pads are formed in corners of an internal bottom surface of the base. Of the four electrode pads, the first electrode pad and second electrode pad have the different potential. The first electrode pad and third electrode pad have the same potential because of a first connecting electrode. The second electrode pad and fourth electrode pad have the same potential because of a second connecting electrode. An avoidance means is provided for avoiding electrical connection between electrode pads that have the different potential (the first electrode pad and second electrode pad) and the other electrode pads that have the same potential (the first electrode pad and third electrode pad, and the second electrode pad and fourth electrode pad).
patents
