This carbon dioxide capture module comprises an absorption part having an amine-based absorbent capable of absorbing carbon dioxide, and a filter part that allows air to pass therethrough and blocks liquid, wherein: the filter part is located between the absorption part and air surrounding the carbon dioxide capture module; and the amine-based absorbent is a polymeric amine having a number average molecular weight of at least 500, or a polymer of an amine monomer and a dicarboxylic acid monomer, the polymer having a number average molecular weight of at least 500.
B01D 53/14 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
In a crystal oscillator 101, hermetic sealing is performed by sandwiching a crystal vibration plate 2, on which first and second excitation electrodes 221, 222 are formed, between first and second sealing members 3, 4 disposed above and below the crystal vibration plate, and joining respective sealing portions thereof. In the first sealing member 3, a fourth through-hole 323 penetrating from a first principal surface 311 side to a second principal surface 312 side is formed, the opening area of an opening 323a on the first principal surface 311 side of the fourth through-hole 323 is formed larger than the opening area of an opening 323b on the second principal surface 312 side, and the width W2 of a sealing surface-side opening peripheral electrode 323c is larger than the width W1 of an outer surface-side opening peripheral electrode 37a in a Z'-axis direction.
A quartz crystal vibration plate 2 comprises an outer frame part 23 and a vibrating part 22 formed to be thinner than the outer frame part 23. A perforation 2a is formed between the outer frame part 23 and the vibrating part 22. The outer frame part 23 and the vibrating part 22 are connected by a holding part 24 formed to be thinner than the outer frame part 23. A connecting portion 25 which is in one main surface of the outer frame part 23 and is connected to the holding part 24 is provided with a flat region 25b formed flush with the holding part 24 and an inclined region 25a inclined with respect to the flat region 25b. At the connecting portion 25-side end 24a of the holding part 24, at least regions 24b, 24c on the penetrating part 2a side are provided contiguous to the flat area 25b.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Provided is a high-quality pressure switch. The present invention comprises: a base substrate 2; a lid substrate 3 that, by being bonded to the base substrate 2, forms an airtight space between the lid substrate 3 and the base substrate 2; a deformable diaphragm 5 that is formed at a position corresponding to the airtight-space of the lid substrate 3; a lid-side movable contact electrode 8 that is disposed on the diaphragm 5 and serves as a movable contact; and a base-side fixed contact electrode 11 that faces the lid-side movable contact electrode 8 with a prescribed gap therebetween and serves as a fixed contact. An electrical connection is toggled by the lid-side movable contact electrode 8 and the base-side fixed contact electrode 11 coming into contact or separating due to deformation of the diaphragm 5. The base substrate 2, the lid substrate, and the diaphragm 5 are each formed from quartz or glass.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
H01H 35/34 - Switches operated by change of fluid pressure, by fluid pressure waves, or by change of fluid flow actuated by diaphragm
This temperature-compensation-type piezoelectric actuator (100) has a rock crystal vibration element (111) in which frequency temperature characteristics change according to at least a tertiary function, a temperature compensation circuit (130) that outputs a tertiary-function electrical signal for compensating for the frequency temperature characteristics of the rock crystal vibration element (111), and an oscillation circuit (112) to which the rock crystal vibration element (111) and a variable-capacitance element are connected and via which an output electrical signal from the temperature compensation circuit (130) is inputted to the variable-capacitance element. The temperature compensation circuit (130): generates a pseudo-tertiary-function electrical signal; and calculates an electrical signal that represents the difference between the pseudo-tertiary-function electrical signal and an ideal tertiary-function electrical signal, in which the pseudo-tertiary-function electrical signal is approximated using a tertiary function. A difference correction electrical signal corresponding to the electrical signal that represents the difference is added to the temperature compensation circuit (130).
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
The present invention comprises a heat collecting device that holds a heating medium heated by sunlight. The heat collecting device holds the heating medium in a space between a module housing body and an exterior body so as surround a housing space in which a carbon dioxide collection module having an absorber is housed. The absorber of the carbon dioxide collection module absorbs carbon dioxide and causes the absorbed carbon dioxide to be desorbed by heating.
B01D 53/14 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
F24S 50/40 - Arrangements for controlling solar heat collectors responsive to temperature
F24S 60/30 - Arrangements for storing heat collected by solar heat collectors storing heat in liquids
F24S 23/74 - Arrangements for concentrating solar rays for solar heat collectors with reflectors with trough-shaped or cylindro-parabolic reflective surfaces
A carbon dioxide capture module comprising an absorption unit having an amine-based absorber capable of absorbing carbon dioxide, and a filter unit that is capable of transmitting air and prevents transmission of the amine-based absorber, the filter unit being positioned between the amine-based absorber and air surrounding the carbon dioxide capture module.
B01D 53/14 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
In an Oven-Controlled Xtal Oscillator (OCXO) in which a core portion (5) is hermetically sealed inside a package (2) for heat insulation: the core portion (5) is configured to include, at least, an oscillation IC (51), a crystal resonator (50), and a heater IC (52); a core board (4) is disposed on a bottom surface of the core portion (5); a bottom surface of the core board (4) is bonded to the core board (4) by means of an electrically non-conductive adhesive (55); the core board (4) is bonded to the package (2) by means of an electrically non-conductive adhesive (7); and an opening (402) is provided in the core board (4), in a region below the core portion (5).
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
9.
METHOD FOR ADJUSTING FREQUENCY OF PIEZOELECTRIC OSCILLATION DEVICE, AND PIEZOELECTRIC OSCILLATION DEVICE
A crystal oscillator (100) has a frequency adjustment metal film (36) comprising a metal underlayer (36a) and a metal layer (36b) formed on the first main surface (301) of a second sealing member (30). In frequency adjustment of the crystal oscillator (100), the frequency adjustment metal film (36) is irradiated with a laser from outside the second sealing member (30) and the metal underlayer (36a) is heated up, whereby at least part of the metal layer (36b) is evaporated by melting and deposited onto a second excitation electrode (112). Irradiation by the beam begins from outside the region of the metal layer (36b). In the scanning direction of the beam, the end portion of the metal layer (36b) is located so as to be on the inside of the end portion of the metal underlayer (36a).
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
In the present invention, a bonding pad for wire bonding is formed on the outer surface of a first sealing plate of a piezoelectric oscillator having the first sealing plate and a second sealing plate, which are joined to the two main surfaces of a piezoelectric oscillation plate. Non-joining regions that are not joined to each other are provided to part of the outer peripheral portion of one sealing plate among the first and second sealing plates and to part of the outer peripheral portion of the piezoelectric oscillation plate. The bonding pad overlaps the non-joining region in plan view.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
Provided is a method for adjusting the frequency of a quartz oscillator (100), wherein: a metal film (36) for frequency adjustment that comprises a base metal layer (36a) and a metal layer (36b) layered thereon is formed on a first principal surface (301) of a second sealing member (30) facing a second excitation electrode (112); and the second sealing member (30) is formed from quartz. Frequency adjustment is performed by: irradiating the metal film (36) for frequency adjustment with a laser from outside the second sealing member (30); and allowing the laser to pass through the interior of the second sealing member (30) to heat the base metal layer (36a) so that at least part of the metal layer (36b) is caused to vaporize, by melting, and adhere to the second excitation electrode (112). At such time, the melting temperature of the base metal layer (36a) is higher than the melting temperature of the metal layer (36b), and the difference between the melting temperatures of the base metal layer (36a) and the metal layer (36b) is at least 1500K.
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
This piezoelectric vibration device comprises: a piezoelectric vibrator including a piezoelectric vibration plate, and first and second sealing plates that hermetically seal a vibrating portion of the piezoelectric vibration plate; a base on which the piezoelectric vibrator is mounted; and a lid body bonded to the base and forming a housing space in which the piezoelectric vibrator mounted on the base is housed. In the piezoelectric vibrator, one of the sealing plates is bonded to the base by means of a bonding material. Only a central region of the one sealing plate is bonded to the base by means of the bonding material.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
A crystal oscillation device (Xtl) with a thermistor comprises: a package (1) including an upper accommodating portion (11A) and a lower accommodating portion (11B); a crystal oscillating plate (2) accommodated in the upper accommodating portion (11A); a thermistor (4) accommodated in the lower accommodating portion (11B); and a lid (3) for hermetically sealing the upper accommodating portion (11A). Excitation electrodes (21, 22) of the crystal oscillating plate (2) comprise a plurality of metal films and have a main layer comprising Au, the thermistor (4) has a single-plate thermistor base plate (40) as a substrate, and working electrodes (41, 42) of the thermistor (4) comprise a plurality of metal films and have a main layer comprising Au.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
14.
TEMPERATURE SENSOR-EQUIPPED CRYSTAL OSCILLATOR DEVICE
A crystal oscillator plate (1) comprises an AT-cut crystal oscillator plate, and as a whole, has a rectangular, plate-like shape. The crystal oscillator plate (1) comprises an oscillating part (11), holding parts (13, 13t) connected to the oscillating part (11), and a frame body section (12) which is connected to the holding parts (13, 13t) and is positioned along the outer periphery of the oscillating part (11). Other than the holding parts (13, 13t), through-holes (14) are formed perimetrically between the oscillating part (11) and the frame body section (12). In addition, a thermistor flat single panel (40) is surface-bonded as a temperature sensor (4) onto a first sealing member (2) via a conductive resin adhesive (R1) and a resin adhesive (R2). The thermal conductivity of the conductive resin adhesive (R1) is greater than the thermal conductivity of the resin adhesive (R2).
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
A thermistor-mounted piezoelectric vibration device (1) is provided with a sand device (2), and a thin-plate thermistor (5) which is mounted on an outside surface of a first sealing member (20) in the sand device (2). The thin-plate thermistor (5) is disposed so as to overlap with at least a portion of a vibration section (13) of the sand device (2) in plan view. Furthermore, a piezoelectric vibration plate (10) in the sand device (2) has the vibration section (13), an outer frame section (14) which encloses the outer periphery of the vibration section (13), and a retention section (15) which retains the vibration section (13) by linking the vibration section (13) and the outer frame section (14). The thin-plate thermistor (5) is disposed so as to overlap the outer frame section (14) on two mutually opposing sides of the sand device (2).
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Provided is a piezoelectric oscillation device that can firmly join to an external substrate at a location as close to the external substrate as possible. Provided is a piezoelectric oscillation device 1 in which at least an oscillator 2 and an integrated circuit element 10 having an oscillation-generating circuit are mounted on a substrate 11 having a wiring pattern that includes a plurality of pads on a first mounting surface 11a, which is one main surface of a pair of main surfaces, the substrate 11 also having an external connection terminal 11d that is electrically connected to a wiring pattern on a second mounting surface 11b, which is the other main surface parallel to the one main surface, and that is electrically connected to an external substrate P. The substrate 11 has a recess 11g in the second mounting surface 11b. The external connection terminal 11d is located within the recess 11g and a gap G is provided between the outer edges of the external connection terminal 11d and the side surfaces 11i of the recess 11g.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H01L 25/04 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
17.
METHOD FOR ADJUSTING FREQUENCY OF PIEZOELECTRIC VIBRATION DEVICE, AND PIEZOELECTRIC VIBRATION DEVICE
In the method for adjusting a frequency of a crystal vibrator (100), a frequency adjustment metal film (36), which is composed of a substrate metal layer (36a) and a metal layer (36b) laminated on the substrate metal layer, is formed on a first main surface (301) opposite to a second excitation electrode (112) of a second sealing member (30), and the second sealing member (30) is made of crystal. Frequency adjustment is performed by: irradiating the frequency adjustment metal film (36) with a laser beam from the outside of the second sealing member (30); transmitting the laser beam through the inside of the second sealing member (30), heating the substrate metal layer (36a), and evaporating at least a portion of the metal layer (36b) through melting thereof; and attaching the metal layer to the second excitation electrode (112).
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
Provided is a piezoelectric vibration device comprising a piezoelectric vibrating reed and a housing including a storing portion storing the piezoelectric vibrating reed, wherein an electrically conductive pad is formed on a mounting surface of the storing portion on which the piezoelectric vibrating reed is mounted, and the piezoelectric vibrating reed is bonded to the electrically conductive pad by means of a metal bump. An outer surface of the housing opposite the mounting surface is recessed toward the mounting surface side, forming a space in a region overlapping the electrically conductive pad in plan view.
H01L 23/04 - Containers; Seals characterised by the shape
H03B 5/30 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/215 - Crystal tuning forks consisting of quartz
Provided is a piezoelectric vibration device that supresses warping of a sealing member during resin molding. A piezoelectric vibration device 1 comprises: a vibrator 2 in which at least a vibrating portion 5 is sealed with a first sealing member 7 and a second sealing member 8 which are sealing members; an integrated circuit element 10 which is at least an electronic component element; a substrate 11 having a mounting surface 11a with the vibrator 2 and the integrated circuit element 10 mounted thereon; and a mold portion 12 covering at least the vibrator 2 with resin. The vibrator 2 includes a protection member 9 covering a part or all of at least one of the first sealing member 7 and the second sealing member 8.
Provided are a piezoelectric vibration device and a method for manufacturing a piezoelectric vibration device that enable filling of the interior of a holding member with nitrogen gas or the like, without increasing tact time. The method comprises: a sealing material-attached member preparation step S110 for preparing a lid member 10 or a holding member 2 of which one has, in a part of a portion thereof that contacts the other, the sealing material configured in a rectangular frame-like shape in plan view, at least one corner portion 11c of the sealing material 11 having an increased-thickness portion thicker than portions thereof other than the corner portion 11c; a lid member mounting step S120 for contacting the increased-thickness portion with the other to mount the lid member 10 to the holding member 2, the molding member 2 having a piezoelectric element 7 bonded thereto; a tacking step S130 for heating the lid member 10 mounted to the holding member 2 to melt a part of the increased-thickness portion to tack the lid member 10 and the holding member 2 to each other; and a sealing step S140 for melting the sealing material 11 including the increased-thickness portion to seal the lid member 10 and the holding member 2.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Provided are a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method by which a plurality of piezoelectric elements can be respectively disposed at predetermined positions in predetermined orientations on a plurality of holding members. The piezoelectric vibration device manufacturing apparatus comprises a suction head moving apparatus 12 for reciprocating a plurality of suction heads 20 simultaneously. The plurality of suction heads 20 respectively suction piezoelectric elements P using suction nozzles 28. At least one of a suction-head horizontal movement mechanism 21, a suction-head vertical movement mechanism 24, and a suction-head rotational movement mechanism 26, on the basis of information about the position of a plurality of piezoelectric elements P respectively suctioned by the plurality of suction nozzles 28 and information about the position of a plurality of holding members H supplied to a holding member supply position Sh, adjusts the position of the suction nozzles 28 each independently and separately so that the piezoelectric elements P respectively being suctioned by the plurality of suction nozzles 28 can be disposed on the corresponding holding members H.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
A crystal oscillation plate (10) is provided with an oscillating portion (11), an outer frame portion (12) surrounding the periphery of the oscillating portion (11), and a holding portion (13) coupling the oscillating portion (11) and the outer frame portion (12). A plurality of crystalline surfaces are formed on a side surface of the outer frame portion (12) and on a side surface of the holding portion (13), the side surfaces connecting to a connection part between the outer frame portion (12) and the holding portion (13). The crystalline surfaces form a plurality of ridge lines. At least one of a first main surface side and a second main surface side of the connection part between the outer frame portion (12) and the holding portion (13) is provided with an intersection-preventing portion that prevents intersection of two or more of the ridge lines at the connection part.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
23.
PIEZOELECTRIC DIAPHRAGM AND PIEZOELECTRIC VIBRATION DEVICE
A crystal diaphragm (10) is provided with a vibration unit (11), an outer frame (12) which surrounds the outer periphery of the vibration unit (11), and a holding unit (13) which links the vibration unit (11) and the outer frame (12), wherein flat sections (13a, 13b) are provided on each of a pair of facing first and second primary surfaces of the holding unit (13), and on one flat section (13b), the width of the holding unit (13) in the width direction is greater than that of the other flat section (13a).
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Provided is a quartz resonator (100), wherein a quartz vibration plate (10) is provided with a vibration part (11) and an outer frame (12) provided to the outer periphery of the vibration part (11), a penetrating part (10a) penetrating in the thickness direction of the quartz vibration plate (10) is provided between the vibration part (11) and the outer frame (12), and an inclined surface (11c) that protrudes in the thickness direction and that is inclined relative to a vibration surface (11b) of the vibration part (11) is provided to a penetrating-part (10a)-side end section of the vibration part (11).
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
In an OCXO (1) having a core section (5) enclosed in a sealed state in the interior of a heat-insulating package (2): the core section (5) is configured to include at least an oscillating IC (51), a crystal oscillator (50), and a heater IC (52); the core section (5) is mounted on a core substrate (4); this core substrate (4) is mechanically bonded to the package (2) with a non-conductive adhesive (7); the core section (5) and the package (2) are electrically bonded by wire bonding; and a space (2d) is provided between the core substrate (4) and a bottom surface of the package (2).
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
In an oven-controlled crystal oscillator (OCXO) (1), a core portion (5) is enclosed in a heat-insulating package (2) in a sealed state. The core portion (5) comprises an oscillating IC (51), a crystal vibrator (50), and a heater IC (52), and is supported on the package (2) with a core substrate (4) therebetween. The OCXO (1) includes a capacitor (9) as an adjustment electronic component which is attached to the package (2) by soldering. The core portion (5) is vacuum-sealed in a sealed space (recessed portion (2a)) of the package (2). The capacitor (9) is disposed outside (recessed portion (2e)) the sealed space.
H01L 23/04 - Containers; Seals characterised by the shape
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
In an oven-controlled crystal oscillator (OCXO) (1), a core portion (5) is enclosed in a heat-insulating package (2) in a sealed state. The core portion (5) comprises an oscillating IC (51), a crystal vibrator (50), and a heating IC (52), and is supported on the package (2) with a core substrate (4) therebetween. The core substrate (4) is mechanically joined to the package (2) by means of a non-electrically conductive adhesive (7). The core portion (5) and the package (2) are electrically connected by wire bonding using a wire (6a, 6b).
H01L 23/04 - Containers; Seals characterised by the shape
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
The piezoelectric oscillation device is equipped with at least a core (5). The core (5) includes: a crystal oscillator (50) which has a three-layer structure and in which an oscillation part (11) is hermetically sealed; and a heater IC (52) that serves as a heating element. The entirety of a second main surface (302) of at least a second sealing member (30) of the crystal oscillator (50) is thermally coupled to the heater IC (52).
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
Provided is a piezoelectric vibration device in which a crystal vibrating plate (10) has a cut-out portion (10a) provided between a vibrating portion (11) and an outer frame portion (12). A metal film (28) is formed on a first major surface (201) of a first sealing member (20). The metal film (28) is electrically connected to an external electrode terminal (32) formed on a second major surface (302) of a second sealing member (30) on a side not facing the internal space, via a first internal wire (105) formed on an inner wall surface (105) of the outer frame portion (12).
Provided is a thermostatic-bath-type piezoelectric oscillator in which the amount of heat emitted by a heater for maintaining the temperature of a core part can be kept as small as possible. A thermostatic-bath-type piezoelectric oscillator (1) in which a core part (5) having at least an oscillation IC (51), a crystal oscillator (50), and a heater IC (52) is enclosed in a sealed state inside a heat insulation package (2), wherein the core part (5) is supported on the package (2) with a core substrate (4) interposed therebetween, and, as seen in plan view, the core substrate (4) is connected to the package (2) outside the region in which the core part (5) is provided.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
This piezoelectric vibration device comprises: a piezoelectric vibration plate having first and second excitation electrodes on the two main surfaces and first and second metal films respectively connected to the first and second excitation electrodes; and first and second sealing members joined to the main surfaces of the piezoelectric vibration plate so as to cover the first and second excitation electrodes of the piezoelectric vibration plate. At least one of the first and second sealing members is a resin film, and in the resin film, a remaining region other than a joined region that is joined to the corresponding main surface of the piezoelectric vibration plate is joined to a part of an inner surface which is contiguous to the main surface to which the resin film is joined.
H01L 23/10 - Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Provided is a thermostatic bath-type piezoelectric oscillator capable of stabilizing an oscillation frequency. In a thermostatic bath-type piezoelectric oscillator (1) in which a core part (5) is encapsulated inside a heat insulating package (2) in a seated state, the core part (5) is supported by the package (2) via a core substrate (4), and the core part (5) is configured so that at least an oscillation IC (51), a crystal oscillator (50), and a heater IC (52) are stacked in this order.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
33.
CONSTANT TEMPERATURE BATH-TYPE PIEZOELECTRIC OSCILLATOR
[Problem] To provide a constant temperature bath-type piezoelectric oscillator with which it is possible to reduce cost while highly accurately controlling both the temperature of a heating element and the piezoelectric vibration of a piezoelectric vibrator. [Solution] In a constant temperature bath-type piezoelectric oscillator 1 comprising a core part 5 that has a heater IC 52, an oscillator IC 51, and a crystal vibrator 50, the core part 5 is supported by a package 2 via an interposer 4 and is hermetically sealed in the package 2.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
34.
THIN-FILM HEATER, METHOD OF PRODUCING THIN-FILM HEATER, AND THERMOSTATIC OVEN PIEZOELECTRIC OSCILLATOR
A thin-film heater (10) has a metal wiring (12) that has been patterned between two terminals, over an insulating substrate (11). The metal wiring (12) has a heat-generating layer (12A) formed of a material where recrystallization occurs at a temperature of 200°C or below, the resistance value between the two terminals being 10Ω or below. The heat-generating layer (12A) is formed through: a film-forming step for forming a metal film by vacuum deposition in a state where the insulating substrate (11) is preheated to 200°C or above; and a patterning step for patterning the formed metal film by etching.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
H05B 3/16 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
35.
PIEZOELECTRIC VIBRATION DEVICE AND MANUFACTURING METHOD THEREFOR
In this invention, a first and second mounting terminals, which are connected to metal films for the first and second mounting terminals formed on both end portions of a piezoelectric vibration plate that sandwich a vibration part, are each formed on the outer surface of a film bonded to the piezoelectric vibration plate. Consequently, even if the sizes of the metal films for the first and second mounting terminals on both sides of the vibration part are reduced in order to enlarge the vibration part, it is possible to secure a bonding region for mounting of each of the first and second mounting terminals formed on the outer surface of a resin film.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
36.
PIEZOELECTRIC VIBRATION PLATE, PIEZOELECTRIC VIBRATION DEVICE, AND METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATION DEVICE
Comprised are first and second excitation electrodes formed on both main surfaces of a piezoelectric substrate, and first and second mounting terminals respectively connected to the first and second excitation electrodes, wherein the first and second mounting terminals have a metal film for mounting that includes a solder resistant metal film formed on the piezoelectric substrate, and a metal film for excitation that configures the first and second excitation electrodes formed to respectively be continuous with the first and second excitation electrodes on this metal film for mounting.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
37.
LID MATERIAL FOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING LID MATERIAL, AND LIGHT-EMITTING DEVICE
A light-emitting device (10) houses an LED chip (13) in a cavity (111) of a ceramic package (11) and seals an opening of the cavity (111) with a crystal lid (12). A lid material (20) before being sealed is obtained by using the crystal lid (12) as a lid body and forming a first metallization film (41) on a sealing surface of the crystal lid (12). The first metallization film (41) includes: a first metal layer (411) that is formed directly on the crystal lid (12); and an alloy layer (43) that contains a brazing material (Au-Sn) on the first metal layer (411). The first metal layer (411) has a single-layer structure that is formed from a Ti film having a film thickness of 20-700 nm.
H01L 23/08 - Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
38.
LID MATERIAL FOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING LID MATERIAL
A light-emitting device (10) stores an LED chip (13) inside a cavity (111) of a ceramic package (11), and an opening of the cavity (111) is sealed with a crystal lid (12). A lid material (20) before sealing has the crystal lid (12) as a lid body and has a first metallized film (41) formed on a sealing face of the crystal lid (12) as an undercoat film. The first metallized film (41) includes a first metal layer (411) directly formed on the crystal lid (12), and a second metal layer (412) formed on the first metal layer (411). The first metal layer (411) has a single layer structure comprising a Ti film having a thickness of 20 to 700 nm. The second metal layer (412) has a layered structure in which a Ni-Ti film (4121) and an Au film (4122) are layered in order from the side near the first metal layer (411).
[Problem] To reduce spurious signals and improve electrical characteristics in a piezoelectric vibration plate with a frame, in which a vibration unit and an outer frame are linked by a holding unit, and in a piezoelectric vibration device provided with such a piezoelectric vibration plate. [Solution] This quartz vibration plate 10 is provided with a vibration unit 11, an outer frame 12 which encloses the outer periphery of the vibration unit 11, and a holding unit 13 which links the vibration unit 11 and the outer frame 12. A first excitation electrode 111 is formed on one primary surface of the vibration unit 11, and a second excitation electrode 112 is formed on the other primary surface of the vibration unit 11. The second excitation electrode 112 has parallel sides 112e, 112g parallel to each other. The first excitation electrode 111 has projections 111c, 111d which, seen in planar view, project outside of the area between the parallel sides 112e, 112g of the second excitation electrode 112, and the protrusions 111c, 111d have an outer edge shape not along the parallel sides 112e, 112g in planar view.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Mounting electrodes other than a pair of mounting electrodes connected to exciting electrodes are each provided with a wire pattern connecting an external connection terminal with an IC mounting terminal. The wire pattern includes a constricted portion with a reduced width to prevent transfer of heat.
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01L 23/58 - Structural electrical arrangements for semiconductor devices not otherwise provided for
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
According to the present invention, on both ends of an AT-cut crystal diaphragm, first and second castellations that connect first mounting terminals to each other and connect second mounting terminals to each other on both main surfaces are formed. First and second notched sections of the first and second castellations each have an end surface extending along the Z' axis of the crystal and located on the -X axis side, each end surface having a first inclined surface that is inclined so as to project from one main surface toward the -X axis side, and a second inclined surface that is inclined so as to project from the other main surface toward -X axis side. The first inclined surface and the second inclined surface form an obtuse angle.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
A piezoelectric vibrating device of the present invention is provided with: a piezoelectric vibration plate that has first and second excitation electrodes respectively formed on both main surfaces, and has first and second mounting terminals respectively connected to the first and second excitation electrodes; and first and second sealing members respectively joined to both main surfaces of the piezoelectric vibration plate so as to respectively cover the first and second excitation electrodes of the piezoelectric vibration plate. At least one of the first and second sealing members is a film made of resin.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
This piezoelectric vibration device is provided with an inner space in which a vibrating section (11) of a crystal diaphragm (10) that includes a first excitation electrode (111) and a second excitation electrode (112) is hermetically sealed by joining a first sealing member (20) to the crystal diaphragm (10) and by joining a second sealing member (30) to the crystal diaphragm (10). A through-hole (33) is formed in the second sealing member (30), and formed on the inner wall face of the through-hole (33) is a through-electrode (331) for electrically connecting an electrode (34) formed on a first main face (301) to an external electrode terminal (32) formed on a second main face (302). The through-electrode (331) is provided with a structure which is corrosion-resistant to solder (120), and the through-electrode (331) electrically connects the electrode (34) of the first main face (301) to the external electrode terminal (32) of the second main face (302) by means of an electrically conductive metal other than silver (Au).
H01L 23/04 - Containers; Seals characterised by the shape
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
Provided is a piezoelectric vibrating device in which a first seal member (20) and a crystal vibrating plate (10) are joined, and a second seal member (30) and the crystal vibrating plate (10) are joined to provide an internal space (C1) in which a vibrating portion (11) of the crystal vibrating plate (10) including a first excitation electrode (111) and a second excitation electrode (112) is sealed in an air-tight manner. A seal path (115,116) sealing the vibrating portion (11) of the crystal vibrating plate (10) in an air-tight manner is formed in an annular shape in plan view. A plurality of external electrode terminals (32) for electrical connection to an external circuit board are formed on a second major surface (302) of the second seal member (30). The external electrode terminals (32) are disposed along an outer frame portion (W1) surrounding the internal space (C1) in plan view.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
A quartz oscillator (101), wherein a quartz vibration plate (2), a first sealing member (3) covering a first excitation electrode of the quartz vibration plate (2), and a second sealing member (4) covering a second excitation electrode of the quartz vibration plate (2) are bonded by a bonding pattern layer, and an internal space, in which a vibration part (22) of the quartz vibration plate (2) including the first excitation electrode and the second excitation electrode is hermetically sealed, is formed. The bonding pattern layer includes: a sealing pattern layer (e.g., vibration-side first bonding pattern (251)), which is formed in an annular shape so as to enclose the vibration part (22) in plan view, thereby hermetically sealing the internal space; and an electroconductive pattern layer (e.g., connection bonding patterns (253)) for electrically connecting wiring and the electrodes. The electroconductive pattern layer is disposed in a closed space surrounded by the sealing pattern layer. The sealing pattern layer is imparted with a GND potential when the quartz oscillator (101) operates.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
This piezoelectric vibration device is provided with: a piezoelectric vibrator including a plurality of external connection terminals and a plurality of mounting electrodes; and an integrated circuit element which includes a plurality of mounting terminals connected to the plurality of mounting electrodes and is mounted on the piezoelectric vibrator. At least one of the mounting electrodes connected to the external connection terminals has a wiring pattern which, in a mounting region for the integrated circuit element, extends to the inside of the mounting terminals of the integrated circuit element.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
A through hole formed in an AT cut crystal sheet has an inclined surface (72) from a surrounding part toward a through bore (71) in a center part. The inclined surface (72) has: a first crystal surface S1 that extends in the -Z' direction and the +X direction from the through bore (71) to the surrounding part of the through hole; a second crystal surface S2 that extends in the -Z' direction and the +X direction from the through bore (71) to the surrounding part of the through hole, and contacts the first crystal surface S1 in the +Z' direction and the +X direction; and a third crystal surface S3 that contacts the second crystal surface S2 in the +X direction, and contacts the main surface of the AT cut crystal sheet. A compensation surface Sc is formed between the three crystal surfaces S1-S3 and the main surface of the AT cut crystal sheet, the compensation surface Sc preventing a first ridgeline L1 and a second ridgeline L2 from reaching the main surface of the AT cut crystal sheet.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
On the inner surface of a package in which two piezoelectric filter elements are housed, a shield electrode facing both electrodes of an input electrode and an output electrode of a piezoelectric substrate of each of the piezoelectric filter elements is formed. A gap between both the electrodes of the piezoelectric substrate and the shield electrode on the inner surface of the package is set to 100 μm or more.
In this crystal oscillation plate (2), a holding part (24) extends in the –Z' direction to an outer frame part (23) from only a single corner section located in the +X direction and the –Z' direction of an oscillation part (22). In addition, at least a portion of the oscillation part (22) and the holding part (24) is provided as an etched region (Eg) having a smaller thickness than the outer frame part (23), a step is formed on a boundary of the etched region (Eg), and a first lead-out wire (223) is formed from the holding part (24) to the outer frame part (23) so as to overlap with the step. At least a portion of the step in the portion overlapping with the first lead-out wire (223) is formed so as not to be parallel to the X-axis when viewed in a plan view.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
50.
TUNING FORK-TYPE PIEZOELECTRIC VIBRATION PIECE, AND TUNING FORK-TYPE PIEZOELECTRIC VIBRATOR USING SAID TUNING FORK-TYPE PIEZOELECTRIC VIBRATION PIECE
Both main surface electrodes on the front and back of respective vibration arms are respectively electrically connected via respective through-electrodes penetrating through the front and back surfaces of a base portion. One main surface electrode of both main surface electrodes on the front and back of the respective vibration arms is electrically connected to a side surface electrode via a routing wire formed to pass through a fork portion between the vibration arms, and is electrically connected to the other main surface electrode of both main surface electrodes via the side surface electrode.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/215 - Crystal tuning forks consisting of quartz
From the base of a package, a pillow part protrudes which contacts a contact part, which is a part of an arm of a tuning fork-type vibration piece other than the tip. The contact part of the arm that contacts the pillow part is a non-electrode region in which no electrode is formed, and contact with the pillow part prevents frequency variation due to the scraping of an electrode.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/215 - Crystal tuning forks consisting of quartz
52.
TUNING FORK-TYPE VIBRATOR AND TUNING FORK-TYPE VIBRATOR MANUFACTURING METHOD
When an arm part of this tuning fork-type vibrator flexes towards the lid of a package due to an external impact, by allowing a frequency adjustment metal film, from which a portion has been removed, to contact the inner surface of the lid, chipping due to contact of the tip of the arm part against the inner surface of the lid is prevented.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
In this AT-cut quartz oscillation plate wafer, two corners of each of a plurality of base parts which project, toward quartz oscillation plates, from a support part extending along the arrangement direction of the quartz oscillation plates are respectively connected to two corners of the corresponding quartz oscillation plate. Each of the crystal vibration plates is supported by two base parts adjacent to each other in the arrangement direction.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Protruding portions which are formed at the time of frequency coarse adjustment that is performed by irradiating a thick frequency adjustment metal film of a tuning fork-type vibrating reed with a beam in a wafer state, and which protrude in a fine split state from an end of the frequency adjustment metal film are crushed by application of pressure, thereby preventing the protruding portions from partially broken by impact, and suppressing frequency fluctuations.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
55.
PIEZOELECTRIC VIBRATION DEVICE AND SIP MODULE INCLUDING SAME
This crystal oscillator (101) is provided with: a piezoelectric vibration plate (2), in which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) for covering the first excitation electrode of the piezoelectric vibration plate (2); and a second sealing member (4) for covering the second excitation electrode of the piezoelectric vibration plate (2), wherein the first sealing member (3) and the piezoelectric vibration plate (2) are joined, and the second sealing member (4) and the piezoelectric vibration plate (2) are joined, thereby forming an internal space (13) in which a vibration part, of the piezoelectric vibration plate (2) having the first excitation electrode and the second excitation electrode, is tightly sealed. On the outer surface (one main surface (311)) of the first sealing member (3), an electrode pattern (371) including a mounting pad for wire bonding is formed.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H01L 23/04 - Containers; Seals characterised by the shape
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
[Problem] To curb fluctuations in properties caused by changes in the external environment, thereby improving reliability, in a quartz oscillation device comprising a quartz oscillator having a sandwich structure. [Solution] This quartz oscillator 100 is obtained by hermetically sealing a quartz oscillator 101 and an IC chip 102 within a package 103. The quartz oscillator 101 comprises: a quartz oscillator plate 2 having a first excitation electrode 221 formed on one principal surface thereof, and a second excitation electrode 222 forming a pair with the first excitation electrode 221 of the other principal surface; a first sealing member 3 that covers the first excitation electrode 221 of the quartz oscillator plate 2; and a second sealing member 4 that covers the second excitation electrode 222 of the quartz oscillator plate 2. The first sealing member 3 and the quartz oscillator plate 2 are bonded to one another, and the second sealing member 4 and the quartz oscillator plate 2 are bonded to one another, forming a structure in which the oscillating part 22 of the quartz oscillator plate 2 which includes the first excitation electrode 221 and the second excitation electrode 222 is hermetically sealed.
H01L 23/08 - Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
This quartz oscillator (102) comprises a quartz oscillator plate (2) having a first excitation electrode (221) and a second excitation electrode (222) formed thereupon, a first sealing member (3) covering the first oscillation electrode (221) of the crystal oscillator plate (2), and a second sealing member (4) that covers the second oscillation electrode (222) of the quartz oscillator plate (2). The first sealing member (3) and the piezoelectric oscillator plate (2) are bonded to one another, the second sealing member (4) and the piezoelectric oscillator plate (2) are bonded to one another, and an internal space (13) which hermetically seals the oscillating part (22) of the quartz oscillator plate (2) is formed. In the internal space (13), the first excitation electrode (221) and the second excitation electrode (222) are not joined to one another electrically, and first and second shield electrodes (35, 44) connected to a constant potential (a ground potential, for example) are positioned therein.
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
58.
FREQUENCY ADJUSTMENT METHOD FOR PIEZOELECTRIC OSCILLATION DEVICE
[Problem] To provide a frequency adjustment method for a piezoelectric oscillation device, the method responding to microminiaturization and enabling frequency adjustment without decreasing frequency adjustment accuracy. [Solution] A frequency adjustment method for a tuning fork-type quartz oscillator according to the present invention is designed to perform frequency adjustment by reducing the mass of an adjustment metal film W formed in an oscillation arm 31, 32 of a tuning fork-type quartz oscillation piece 1, and comprises: a coarse adjustment step for performing coarse adjustment of frequency by thinning or removing part of the adjustment metal film W; and a fine adjustment step for performing fine adjustment of frequency by thinning or removing at least part of a product W1, W2 from the adjustment metal film W, the product being generated in the coarse adjustment step.
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
According to the present invention, a crystal oscillator (101) is provided with: a piezoelectric diaphragm (2) that is provided with a first excitation electrode and a second excitation electrode; a first sealing member (3) that covers the first excitation electrode of the piezoelectric diaphragm (2); and a second sealing member (4) that covers the second excitation electrode of the piezoelectric diaphragm (2). An internal space (13), in which a vibration part of the piezoelectric diaphragm (2) including the first excitation electrode and the second excitation electrode is hermetically sealed, is formed by bonding the first sealing member (3) and the piezoelectric diaphragm (2) with each other and by bonding the second sealing member (4) and the piezoelectric diaphragm (2) with each other. Plating films (51, 52) are respectively formed on surfaces of the first sealing member (3) and the second sealing member (4), said surfaces being on the reverse side of the surfaces that are bonded with the piezoelectric diaphragm (2).
[Problem] To provide more reliable quartz oscillation plate and quartz oscillation device which have enhanced impact resistance and in which deterioration of electric characteristics is suppressed. [Solution] An AT-cut quartz oscillation plate 2 is provided with: an oscillation part 22 that is rectangular in plan view and has excitation electrodes formed, at the central part, on the main front and back surfaces; a cutout part 21 that is rectangular in plan view and is formed at the outer periphery of the oscillation part; an outer frame part 23 that is rectangular in plan view and is formed at the outer periphery of the cutout part; and one connection part 24 that connects the oscillation part and the outer frame part and extends, along a Z'-axis direction of the oscillation part, from one end portion of a side along an X-axis direction of the oscillation part. Wide parts 24a, 24b, having widths gradually increasing toward only the outer frame part, are formed at the connection part.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
[Problem] To provide an optical filter that can sufficiently suppress transmission of red components. [Solution] An optical filter 10 has a second filter 30 formed on one surface 20A of a first filter 20 and has a third filter 40 formed on the other surface 20B of the first filter 20. Along with having blocking characteristics in a first band A1 provided from the long wavelength side of the visible light region to the near-infrared light region and a third band A3 provided on the longer wavelength side than the first band, the optical filter has transmission characteristics in a second band A2 provided between the first band A1 and the third band A3. In the first band A1, the bandwidth for the blocked band with transmittance of 5% or less is set to at least 100 nm.
[Problem] To improve the hermeticity of an annular sealing and joining material which seals an oscillating portion. [Solution] In a crystal oscillator 10, an oscillating-side first joining pattern 251 formed in an annular fashion on a crystal oscillating plate 2 is joined to a sealing-side first joining pattern 321 formed in an annular fashion on a first sealing member 3, and an oscillating-side second joining pattern 252 formed in an annular fashion on the crystal oscillating plate 2 is joined to a sealing-side second joining pattern 421 formed in an annular fashion on a second sealing member 4, thereby forming annular joining materials 11a, 11b. An oscillating member 22 which performs piezoelectric oscillation is hermetically sealed by the joining materials 11a, 11b. Inner peripheral edge portions 111a, 111b and outer peripheral edge portions 112a, 112b of the joining materials 11a, 11b are formed more densely than intermediate portions 113a, 113b between the inner peripheral edge portions 111a, 111b and the outer peripheral edge portions 112a, 112b.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
A quartz oscillator (101) is provided with a quartz diaphragm (2), a first sealing member (3) and a second sealing member (4), thereby forming an inner space (13) in which an oscillation part (22) of the quartz diaphragm (2) is hermetically sealed. The quartz diaphragm (2) comprises the oscillation part (22), an outer frame part (23) that surrounds the outer periphery of the oscillation part (22), and a connection part (24) that connects the oscillation part (22) and the outer frame part (23) with each other. A first lead-out electrode (223) led out from a first excitation electrode (221) is formed on one main surface of the connection part (24); and a second lead-out electrode (224) led out from a second excitation electrode (222) is formed on the other main surface. The other main surface (312) of the first sealing member (3) is provided with a wiring pattern (33) that is connected to the first lead-out electrode (223); and at least a part of the wiring pattern (33) is arranged at a position where the part overlaps the space between the oscillation part (22) and the outer frame part (23) when viewed in plan.
[Problem] To provide a piezoelectric vibration device having a sandwich structure, with which demands for size reduction can be easily addressed. [Solution] A crystal oscillator 101 is provided with: a crystal vibration plate 2; a first seal member 3 covering a first excitation electrode 221 of the crystal vibration plate 2; and a second seal member 4 covering a second excitation electrode 222 of the crystal vibration plate 2. The first seal member 3 and the crystal vibration plate 2 are bonded to each other, and the second seal member 4 and the crystal vibration plate 2 are bonded to each other, thereby forming a substantially cuboidal package 12. The package 12 is provided with an internal space 13 in which a vibration portion 23 of the crystal vibration plate 2, including the first excitation electrode 221 and the second excitation electrode 222, is hermetically sealed. A bonding material 11 by means of which the vibration portion 23 of the crystal vibration plate 2 is hermetically sealed is formed in an annular shape in plan, and is provided along the outer peripheral edge of the package 12 in locations other than the four corners of the package 12.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
[Problem] To make it possible to stably bond an external element in a piezoelectric vibration device having a sandwich structure. [Solution] In a piezoelectric vibration device 1, at least a vibrating section 21 of a piezoelectric substrate 2 is sealed by means of a first sealing member 3 and a second sealing member 4. The piezoelectric substrate 2 is provided with the vibrating section 21, and an outer frame section 23, which surrounds the outer periphery of the vibrating section 21, and which is formed thicker than the vibrating section 21. The first sealing member 3 and/or the second sealing member 4 is provided with an external electrode 31 to which an external element 5 is connected, and at least at the outer frame section 23 of the piezoelectric substrate 2, the external element 5 is connected to the external electrode 31.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H01L 23/04 - Containers; Seals characterised by the shape
[Problem] To improve reliability while also ensuring airtightness of an interior space where a vibration section of a piezoelectric diaphragm is sealed off, in a piezoelectric vibration device of a sandwich structure. [Solution] Provided to a crystal oscillator 101 are a crystal diaphragm 2, a first sealing member 3 covering a first excitation electrode 221 of the crystal diaphragm 2, and a second sealing member 4 covering a second excitation electrode 222 of the crystal diaphragm 2. A third through hole 269 penetrating through one main surface 211 and another main surface 212 is formed in the crystal diaphragm 2, and a through electrode 71 of the third through hole 269 is electrically conductive with the first excitation electrode 221. A seventh through hole 350 penetrating between one main surface 311 and another main surface 312 is formed in the first sealing member 3. The through electrode 71 of the third through hole 269 and the through electrode 71 of the seventh through hole 350 are electrically conductive with each other, and the third through hole 269 and the seventh through hole 350 are arranged so as not to overlap as seen in plan view.
An AT-cut type crystal oscillation plate (2) provided with a first excitation electrode (211) formed on one main surface (2a), and a second excitation electrode (212) formed on another main surface (2b), wherein the crystal oscillation plate includes: a substantially rectangular shaped oscillation portion (21) which is caused to exhibit piezoelectric oscillation by a voltage being applied to the first excitation electrode (211) and the second excitation electrode (212); a holding portion (22) which projects out in the AT-cut Z'-axis direction from a corner portion (21a) of the oscillation portion (21); and an outer frame portion (23) which surrounds the outer periphery of the oscillation portion (21) and is held by the holding portion (22).
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
[Problem] To provide a piezoelectric oscillation device having an external connection terminal on which a distinguishable mark with high distinguishability is formed, while accommodating a reduction in size and ensuring a bonding area with an external circuit substrate. [Solution] A crystal oscillator 1 comprises a base 2 provided with a substrate portion 20, a first frame portion 21, and a second frame portion 22, a crystal oscillation element 3 stored in a first depression portion E1, a thermistor 4 stored in a second depression portion E2, and a lid 5 for hermetically sealing the first depression portion E2. L-shaped external connection terminals 9a to 9d are formed at four corners on an upper surface of the second frame portion. Further, between internal edge portions of the external connection terminals at the four corners and an inner circumferential edge 221 of the second frame portion, electrodeless bank areas 9e, 9f, 9g, and 9h are formed. The external connection terminal 9c includes a protrusion portion 92c formed spaced apart from an outer circumferential edge 220 and the inner circumferential edge 221 of the second frame portion.
An optical low pass filter (30) is provided with a perpendicular separation birefringent plate (31), a 45° separation birefringent plate (32), and a 135° separation birefringent plate (33). The 45° separation birefringent plate (32) and 135° separation birefringent plate (33) are disposed so as to be next to each other. The thickness of the 45° separation birefringent plate (32) is roughly equal to that of the 135° separation birefringent plate (33). The thicknesses of the 45° separation birefringent plate (32) and the 135° separation birefringent plate (33) are both less than that of the perpendicular separation birefringent plate (31). The position (point Pa1) of the incidence of incident light (L) on the perpendicular separation birefringent plate (31) roughly overlaps with the approximate center of a square separation pattern (points P11, P12, P13, and P14) when viewed from the incident light side.
[Problem] To enable the two main surfaces of a second sealing member to be electrically connected via through-holes while minimizing costs in a piezoelectric vibration device for a sandwich structure. [Solution] A crystal oscillator (101), provided with: a crystal vibration plate (2); a first sealing member (3) covering the first excitation electrode (221) of the crystal vibration plate (2); one external electrode terminal (431) covering the second excitation electrode (222) of the crystal vibration plate (2), the one external electrode terminal (431) being connected to the circuit board (61) using an electroconductive joining fluid (62); and the second sealing member (4), in which another external electrode terminal (432) is formed. A second through hole (441) and a third through hole (442) penetrating between one main surface (411) and the other main surface (412) are formed in the second sealing member (4). The one external electrode terminal (431) and the other external electrode terminal (432) are formed on the other main surface (412). Each of the second through hole (441) and the third through hole (442) has a penetrating portion (72), and has a through electrode (71) for electrically connecting electrodes formed on the one main surface (411) and the other main surface (412).
H01L 23/08 - Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
[Problem] To provide a piezoelectric oscillation device of a sandwich structure, which can be free from gas generation and is able to be reduced in height and size. [Solution] A crystal oscillator (101) is provided with a crystal diaphragm (2), a first sealing member (3) and a second sealing member (4). The first sealing member (3) is provided with a sealing-side first bonding pattern (321) to be bonded with the crystal diaphragm (2), and the second sealing member (4) is provided with a sealing-side second bonding pattern (421) to be bonded with the crystal diaphragm (2). One main surface (211) of the crystal diaphragm (2) is provided with an oscillation-side first bonding pattern (251) to be bonded with the first sealing member (3), and the other surface (212) of the crystal diaphragm (2) is provided with an oscillation-side second bonding pattern (252) to be bonded with the second sealing member (4). The sealing-side first bonding pattern (321) and the oscillation-side first bonding pattern (251) are diffusion bonded with each other, and the sealing-side second bonding pattern (421) and the oscillation-side second bonding pattern (252) are diffusion bonded with each other.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
72.
ELECTRONIC COMPONENT-USE PACKAGE AND PIEZOELECTRIC DEVICE
The present invention is an electronic component-use package comprising a base which holds an electronic component element. Terminal electrodes (16 and 17) on a base bottom comprise chamfered portions (161 to 164, and 171 to 174) facing corners of the base bottom. For each of the chamfered portions (161 to 164, and 171 to 174), a chamfer angle (θ) is within ±10°, where the chamfer angle is formed by a chamfered portion and a respective reference line (L8), which is a perpendicular line with respect to a straight line (L1) that connects a respective corner of the base bottom with a center portion (O1) of one side of a side that is adjacent to a central point of the base bottom of the respective terminal electrode (16 or 17), and which passes through the respective chamfered portion (161 to 164, and 171 to 174).
This piezoelectric wafer has: a piezoelectric vibration piece; a frame section that supports the piezoelectric vibration piece; and a connecting section that connects the frame section and the piezoelectric vibration piece to each other. At the connecting section in the piezoelectric wafer, a crystal vibration piece is broken and taken from the frame section. In both the front and rear surfaces of the connecting section, groove-like slits that extend in the width direction of the connecting section are formed, respectively, excluding a connecting section part in the width direction of the connecting section. An electrode on the front and/or rear surface of the piezoelectric vibration piece is led out to the frame section side via the connecting section part in the width direction of the connecting section.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
This piezoelectric wafer has: a piezoelectric vibration piece; a frame section that supports the piezoelectric vibration piece; and a connecting section that connects the piezoelectric vibration piece to the frame section. A pair of first and second metal bumps are provided in parallel to each other on the piezoelectric vibration piece. In the connecting section, a slit that extends in the width direction of the connecting section is formed except in a bridge, i.e., a connecting section part in the width direction of the connecting section. A bridge end in the width direction of the bridge is spaced apart from both the metal bumps in the direction perpendicular to the width direction of the connecting section, and not overlapping both the metal bumps.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
PIEZOELECTRIC VIBRATION ELEMENT, PIEZOELECTRIC DEVICE USING PIEZOELECTRIC VIBRATION ELEMENT, METHOD FOR MANUFACTURING PIEZOELECTIC VIBRATION ELEMENT, AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE USING PIEZOELECTRIC VIBRATION ELEMENT
[Problem] To provide a highly reliable piezoelectric vibration element for which a reduction in the electrode dimensions can be minimized when the frequency is adjusted, and which has excellent weather resistance and heat resistance; and to provide a piezoelectric device that uses this piezoelectric vibration element, a method for manufacturing this piezoelectric vibration element, and a method for manufacturing a piezoelectric device that uses this piezoelectric vibration element. [Solution] Vibration electrodes (23a, 23b) are formed on the front and back principal surfaces of a liquid crystal vibration plate of a liquid crystal vibration element (2). The vibration electrodes are configured from a ternary alloy having silver as the primary component and including a first additive which is a metallic element that has a lower sputtering rate than silver and is not easily corroded by etching solution, and a second additive which is an element that forms a solid solution with silver. The outer peripheral part of the vibration electrodes forms a first-additive-rich region (9) that is rich in the first additive.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
76.
TUNING FORK-TYPE PIEZOELECTRIC VIBRATOR PART AND TUNING FORK-TYPE PIEZOELECTRIC VIBRATOR
Provided is a tuning fork-type piezoelectric vibrator part (2), in which a piezoelectric vibration base sheet is configured from a base part (25) having a bonding region which bonds externally, and a pair of leg parts (21, 22) which protrude from one end face of the base part. The pair of leg parts further comprise vibration parts (212, 222) having excitation electrodes, broad weight parts (211, 221) which are formed in the leading ends of the vibration parts, and connection parts (213, 223) between the vibration parts and the weight parts. The connection parts further comprise amplifier parts which exponentially amplify the dimension in the width direction from the vibration parts to the weight parts. The amplifier parts are formed with the dimension in the length direction longer than the dimension in the width direction. The weight parts further comprise width portions wherein the dimension in the width direction is constant from coupling locations with the connection parts, and do not form the excitation electrodes.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/215 - Crystal tuning forks consisting of quartz
[Problem] To provide an optical device which is capable of effectively preventing the occurrence of a white clouding phenomenon even if left in a high-temperature high-humidity environment. [Solution] This optical device is provided with an anti-reflection film (3) for preventing reflection of visible light on the surface of an infrared absorbing glass (2). The anti-reflection film is configured by laminating at least two refractive index layers (3a-3c) having different refractive indexes, and at least one layer other than the refractive index layer(s) having a low refractive index among the at least two refractive index layers contains at least Al2O3, ZrO2 or a mixture thereof. The average particle diameter of the particles in the upper surface of the anti-reflection film is less than 25 nm.
G02B 1/02 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semiconductors
A tuning-fork-type crystal oscillator provided with a base and a pair of legs projecting in one direction from the base. A groove and a bank are formed on at least one main face of each leg. The banks are molded by the formation of the grooves, and the width of the banks varies along the thickness direction. The banks are composed of a thick section that is wide, and a thin section that is narrow.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/215 - Crystal tuning forks consisting of quartz
79.
SCINTILLATOR, RADIATION DETECTOR, RADIOLOGICAL INSPECTION DEVICE, Α-RAY DETECTOR, AND PRODUCTION METHOD FOR SCINTILLATOR
This scintillator is provided, on at least one principal surface of a substrate, with a light-emitting layer for emitting light in response to impinging radiation. The light-emitting layer includes a zinc oxide single crystal in which the m-plane constitutes the light-emitting face, the zinc oxide single crystal constituting the light-emitting layer being doped with the element sulfur. This scintillator is provided to a radiation detector, a radiological inspection device, or an α-ray detector.
G01T 1/202 - Measuring radiation intensity with scintillation detectors the detector being a crystal
C09K 11/00 - Luminescent, e.g. electroluminescent, chemiluminescent, materials
C09K 11/54 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing inorganic luminescent materials containing zinc or cadmium
G01T 1/20 - Measuring radiation intensity with scintillation detectors
G21K 4/00 - Conversion screens for the conversion of the spatial distribution of particles or ionising radiation into visible images, e.g. fluoroscopic screens
This tuning-fork-type quartz vibrating piece comprises a quartz piece having a crystal orientation. The tuning-fork-type quartz vibrating piece is provided with a base part and a pair of first and second leg parts protruding in one direction from the base part. Each of the first and second leg parts has a groove part formed so as to be off center in the widthwise direction of the first or second leg parts. Furthermore, the groove parts are such that, in a shape viewed from the end faces of the first and second legs in the widthwise direction, the lowermost point of the groove parts is positioned in the widthwise center of the groove parts (in the width direction of the first and second leg parts).
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H03H 9/215 - Crystal tuning forks consisting of quartz
In order to prevent slippage in the installation of a temperature sensor unit, in a second cavity (47) in which a base (4) temperature sensor unit (3) is installed, an exposed electrode (6) that at least intersects with the inner wall surface (474) of a second wall section (45) is formed so as to be exposed in the second cavity (47). The exposed electrode (6) comprises a pair of temperature sensor electrode pads (621, 622) that are joined to the temperature sensor unit (3) by means of solder (13). The solder (13) is formed on the entire surface of the exposed electrode (6) comprising the pair of temperature sensor electrode pads (621, 622) to which the temperature sensor unit (3) is joined.
A piezoelectric vibration piece is an inverted mesa-type having: a thin-walled portion formed as a vibration region at the central portion of a piezoelectric plate; and a thick-walled portion formed in the entire periphery of or a part of the thin-walled portion and reinforcing the thin-walled portion. In the piezoelectric vibration piece, a contact metal consisting of a large number of separated metal thin films is provided on the entire surface of the piezoelectric plate. This piezoelectric vibration device is formed such that the piezoelectric vibration piece is housed in a package and a lead-out electrode of the piezoelectric vibration piece is connected to an internal terminal thereof by a conductive adhesive. This prevents the conductive adhesive before being thermally cured from flowing out, resulting in a piezoelectric vibration piece having excellent vibration characteristics and a piezoelectric vibration device using the piezoelectric vibration piece.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
A piezoelectric vibrator of the present invention has a base (1), an integrated circuit element (2), and a piezoelectric vibration element (3). The base (1) has external terminals that include an alternating current output terminal, and internal terminal pads. The base (1) is configured by laminating three or more rectangular ceramic substrate layers, each of which has castellation structures (C1-C4) formed at the four corners. Among the internal terminal pads, internal terminal pads (NT1, NT2) for the integrated circuit element, and the internal terminal pads (NT7, NT8) for the piezoelectric vibration element are connected to each other by means of wiring patterns (H9, H10) exposed to the outside, said wiring patterns being formed on the upper surfaces of the castellation structures (C3, C4) at the corners of the ceramic substrate of an intermediate layer.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/08 - Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
This piezoelectric device is provided with a rectangular crystal piece provided with oscillation electrodes on front and back principal faces, and a base member having two electrode pads on one short side of the crystal piece. The crystal piece is supported on the base member by first and second support parts on one short side, and by an auxiliary support part on the other short side. In the positioning of the auxiliary support part from the other short side, the distance between both short sides is designated as L, and the distance from the other short side to the nearest outer edge of the auxiliary support part is designated as H. The distance H is the distance at which the maximum tensile stress acting on the auxiliary support part and the maximum center von Mises stress of the crystal piece are within predetermined stress ranges. In the range of distance H, with the distance H at which both stresses are at maximum being H2, the position of the auxiliary support part is set so that the value of (H2 + D)/L is 20% or less, and impact resistance is thereby enhanced.
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
This piezoelectric oscillator is provided with an insulating base (1) which has a holding unit in which internal terminal pads are formed, an integrated circuit element (2) having pads which are bump-bonded in a rectangular shape, and a piezoelectric oscillating element (3) which is connected to the base (1) and the integrated circuit element (2). The internal terminal pads have two opposing first internal terminal pads that are connected with the piezoelectric oscillating element, two opposing second internal terminal pads for which one becomes an AC output, and two opposing third internal terminal pads that are formed between the first internal terminal pads and the second internal terminal pads. Along a portion of the perimeter of the first internal terminal pads, the third internal terminal pads and wiring patterns which extend the third internal terminal pads are formed as radiation noise blocking conductive paths. With the conductive paths in between, the first internal terminal pads and the second internal terminal pads are formed so as to be spaced apart.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
ELECTRONIC COMPONENT PACKAGE, SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE
The inventions relate to an electronic component package, a sealing member for an electronic component package, and a method for manufacturing the sealing member for an electronic component package. A through-hole (49) is formed in a base (4) so as to penetrate through both main surfaces (42, 43) of the base. The inner surface (491) of the through-hole (49) includes a curved surface (495) expanding outward in the width direction of the through-hole (49).
H01L 23/04 - Containers; Seals characterised by the shape
H01L 23/08 - Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
An electronic-part package has a base and lid sealed air-tightly via a sealing member, said base comprising a bottom section and a wall section extending from the bottom section, and said lid comprising conductive material. The electronic-part package also has electronic-part elements mounted within a cavity surrounded by the wall section. The electronic-part package also has, provided on the base, electrode pads, wiring patterns that comprise a wall-section GND wiring pattern formed on the wall section and electronic-part element GND wiring patterns formed on one main face of the base within the cavity, and external terminals including a GND terminal for grounding. In this electronic-part package, malfunctioning of the electronic-part elements caused by spreading of wetting by the sealing member is prevented by providing connecting sections, which connect the wall-section GND wiring pattern and the electronic part GND wiring patterns, between the bottom section and the wall section so as not to be exposed to the cavity in planar view of the base.
H01L 23/04 - Containers; Seals characterised by the shape
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
88.
ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE
The external peripheral edge part of one principal surface of a second seal member is molded in a tapered shape, and a tapered region is configured on at least a portion of the external peripheral edge part. A flat region adjacent to the tapered region is configured on a least a portion of the flat part provided inward from the external peripheral edge part of the one principal surface of the second seal member. A first region that corresponds to the tapered region and a second region that corresponds to the flat region are configured adjacent to each other on the one principal surface of a first seal member on which an electronic component element is to be mounted. The width W2 of the second region is 0.66 to 1.2 times the width W4 of the flat region. A first joining layer is formed on the first region and the second region, a second joining layer is formed on the tapered region and the flat region, and the first joining layer and the second joining layer are heated and fused together to join the first seal member and the second seal member together.
At least one pair of excitation electrodes (291, 292) and at least one pair of lead-out electrodes (293, 294) are formed on a piezoelectric vibrating reed (2), the at least one pair of lead-out electrodes (293, 294) being led out of the pair of excitation electrodes (291, 292) in order to electromechanically connect the pair of excitation electrodes (291, 292) to an external electrode (32). The respective leading edge parts of the pair of lead-out electrodes (293, 294) have connection electrodes (295, 296) that are lead out close to an end section of a primary face (235) of the piezoelectric vibrating reed (2). A first metal film (M1) to be connected to the external electrode (32) is formed on the top surface of each connection electrode (295, 296). The first metal film (M1) has, on the top surface, two or more convex parts (T), the surface of the first metal film (M1) being rougher, and the area being smaller, than those of each connecting electrode (295, 296). The cross-section of the convex part (T) is curved.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
H01L 41/22 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
A tuning-fork type piezoelectric vibrating reed comprises a piezoelectric vibration element plate provided with a pair of legs functioning as a vibration unit, and a base from which the legs project. The pair of legs projects from one end surface of the base so that the legs are juxtaposed, and, a forked part is formed between the legs at the intermediate position of the one end surface of the base in the width direction. The base has a pair of through holes formed along the one end surface, and has a connecting area for connecting to an exterior portion on the side of the other end surface opposite to the one end surface of the base. The pair of through holes is formed at the position which is closer to the centerline of the base than base end portions of the legs in the width direction, so that the through holes are not in contact with each other. The plane area of the through hole gradually decreases from the opposite ends of the through hole defined on the front and back surfaces of the piezoelectric vibration element plate toward the inner part of the piezoelectric vibration element plate, and, the wall surface of the through hole is formed spirally.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
H03H 9/215 - Crystal tuning forks consisting of quartz
A plurality of filters is disposed in an optical filter module which is disposed in an image capture device. The plurality of filters comprises a first filter which transmits visible light and blocks at least infrared, and a second filter which allows only infrared to pass. The first filter and the second filter are positioned to be selectively switchable.
A scintillator material comprising zinc oxide monocrystals grown on the +C- or -C-plane of plate-like zinc oxide seed crystals, said seed crystals having the C-plane as the main plane, wherein said zinc oxide monocrystals contain In and Li. At radiation incidence, the scintillator material emits a fluorescence having a fluorescence lifetime shorter than 20 ps.
Disclosed is an infrared blocking filter which is capable of blocking light having a wavelength more than 700 nm, while sufficiently transmitting red visible light having a wavelength of 600-700 nm and suppressing occurrence of ghosting. Specifically disclosed is an infrared blocking filter (1) which is configured of an infrared absorber (2) and an infrared reflector (3). The infrared absorber (2) has such light transmission characteristics that the transmittance at wavelengths within the wavelength range of 620-670 nm is 50%, and the infrared reflector (3) has such light transmission characteristics that the transmittance at wavelengths within the wavelength range of 670-690 nm is 50%. The wavelengths at which the infrared reflector (3) has a transmittance of 50% are longer than the wavelengths at which the infrared absorber (2) has a transmittance of 50%. By combining the infrared absorber (2) and the infrared reflector (3), the infrared blocking filter (1) has such light transmission characteristics that the transmittance at wavelengths within the wavelength range of 620-670 nm is 50% and the transmittance at a wavelength of 700 nm is less than 5%.
In the disclosed oscillator, a wiring pattern that conducts with a pair of electrode pads, which electrically connect a piezoelectric vibrating reed, and a plurality of connection pads, which electrically connect the aforementioned piezoelectric vibrating reed and an integrated circuit element, is formed on a sealed member. The aforementioned piezoelectric vibrating reed and the aforementioned integrated circuit element are disposed in a row in a plan view. The aforementioned wiring pattern contains: an output wiring pattern that conducts one of the aforementioned connection pads to the AC output terminal of an oscillating circuit; and a power source wiring pattern that conducts one of the aforementioned connection pads to a DC power source terminal of the aforementioned oscillation circuit. The aforementioned electrode pads and the aforementioned connection pads are formed on one primary surface of a substrate that configures the aforementioned sealed member, and the aforementioned wiring pattern is formed on at least one primary surface of the substrate that configures the aforementioned sealed member. On the aforementioned one primary surface, the aforementioned electrode pads are disposed closer to the aforementioned power source wiring pattern than the aforementioned output wiring pattern is.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
Disclosed are a plurality of members for sealing a piezoelectric vibration device wherein the vibrating region of a piezoelectric vibrating piece is hermetically sealed using the sealing members. A protruding section is formed on one main surface of a base material that constitutes the sealing member. The other main surface of the base material has a flat surface in a region that corresponds to the protruding section, and a bent surface in the region other than the region having the flat surface. In the sealing member, a plurality of external terminals for connecting to an external circuit board are formed on the flat surface, and a plurality of inspection terminals for inspecting the piezoelectric vibrating piece are formed on the bent surface.
H03B 5/32 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
96.
BASE OF SURFACE-MOUNT-TYPE ELECTRONIC COMPONENT-USE PACKAGE, AND SURFACE-MOUNT-TYPE ELECTRONIC COMPONENT-USE PACKAGE
Disclosed is a base of a surface-mount-type electronic component-use package which holds an electronic component element and which is mounted upon a circuit substrate using a conductive bonding agent, wherein, upon the base, an exterior connection terminal for electrically connecting to the circuit substrate is formed upon a main surface thereof. Upon the exterior connection terminal, a bulb which is smaller than the exterior connection terminal is formed. Furthermore, upon assuming a distance d to be the distance from the outer circumferential edge of the exterior connection terminal, along the stress attenuation direction wherein stress upon the exterior connection terminal which is generated when the base is mounted upon the circuit substrate is attenuated, to the outer circumferential edge of the bump, then the distance d is set to be greater than 0.00 mm and less than or equal to 0.45 mm.
Disclosed is an electronic component packaging base which holds an electronic component, said base having a rectangular shape in planar view. A pair of rectangular terminal electrodes bonded to an external circuit board using a conductive bonding material are formed on the underside of the base. The pair of terminal electrodes are positioned so as to be symmetrical with respect to one another. A long side of each terminal electrode is formed so as to be proximate to or in contact with an end of a long side of the underside of the base. Further, the long side of each terminal electrode and the long side of the underside of the base are disposed parallel to one another, and the length of the long side of each terminal electrode is more than half the length of the long side of the underside of the base.
Disclosed is an electronic component package, wherein a stable conduction state is ensured at a penetration hole provided in a sealing member, and the inside of the electronic component package can be sufficiently sealed. An electronic component package comprises: a first sealing member (electronic component package sealing member) (4) and a second sealing member (6) which are disposed facing each other and hermetically seal electrodes (31, 32) of an electronic component element (2); an inner electrode (55) which is formed on a surface (42) that is on a base of the first sealing member (4) and faces the second sealing member (6), and an outer electrode (56) which is formed on a surface (43) that is on the base of the first sealing member (4) and faces the surface (42); a penetration hole (49) which penetrates the base of the first sealing member (4); and a penetration electrode (57) which is formed inside the penetration hole (49) through which the inner electrode (55) and the outer electrode (56) are electrically connected. At least one open surface of the penetration hole (49) is sealed by a resin material (58).
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
99.
PIEZOELECTRIC VIBRATION DEVICE AND PROCESS FOR PRODUCING SAME
Disclosed is a piezoelectric vibration device in which the excitation electrodes of a piezoelectric vibration piece are hermetically sealed, the piezoelectric vibration device including a plurality of sealing members which hermetically seal the excitation electrodes of the piezoelectric vibration piece. Each sealing member has a joining layer formed thereon. At least one sealing member is provided with a bank section, and the joining layer is formed on the top surface of the bank section. The sealing members are joined by means of the respective joining layers, and a joining material containing an intermetallic compound is formed.
H01L 23/10 - Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Disclosed is a lead type piezoelectric oscillation device provided with a piezoelectric oscillation piece and lead terminals for supporting the piezoelectric oscillation piece. On a piezoelectric oscillation piece, terminal electrodes electrically connected to lead terminals are formed, and on the lead terminals, bonding layers electrically connected to the piezoelectric oscillation piece are formed. The piezoelectric oscillation piece and the lead terminals are electromechanically bonded by the terminal electrodes and the bonding layers. As a result of the bonding between the terminal electrodes and the bonding layers, bonds comprising an Sn-Cu alloy are formed from the terminal electrodes and the bonding layers.
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
H01L 41/18 - Selection of materials for piezo-electric or electrostrictive elements
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
patents
