A coating composition for a lubricating coating film includes: (A) a phenolic resin; (B) an epoxy resin having an epoxy equivalent weight of 600 to 4000; and (C) at least one type of solid lubricant. The epoxy equivalent weight is generally defined by the number average molecular weight per the number of epoxy groups in a single molecule. The coating composition has a weight ratio of component (A) to the total weight of component (A) and component (B) of at least 50 weight %. A lubricating coating film, formed from the coating composition, has a high level of flexibility on surfaces of various base materials.
C10M 107/38 - Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen
F04B 35/00 - Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
F16J 1/01 - Pistons; Trunk pistons; Plungers characterised by the use of particular materials
F16N 15/00 - Lubrication with substances other than oil or grease; Lubrication characterised by the use of particular lubricants in particular apparatus or conditions
F16J 9/26 - Piston-rings, seats therefor; Ring sealings of similar construction in general characterised by the use of particular materials
F16D 69/00 - Friction linings; Attachment thereof; Selection of coacting friction substances or surfaces
C10M 145/28 - Polyoxyalkylenes of alkylene oxides containing 2 carbon atoms only
C10M 107/00 - Lubricating compositions characterised by the base-material being a macromolecular compound
C10M 107/30 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
C10M 107/32 - Condensation polymers of aldehydes or ketones; Polyesters; Polyethers
C10M 107/40 - Lubricating compositions characterised by the base-material being a macromolecular compound containing nitrogen
C10M 111/04 - Lubricating compositions characterised by the base-material being a mixture of two or more compounds covered by more than one of the main groups , each of these compounds being essential at least one of them being a macromolecular organic compound
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
3 is an alkyl group having from 1 to 12 carbons; and a, b, c, and d are respectively numbers satisfying: 0.01≦a≦0.5, 0≦b≦0.7, 0.01≦c<0.7, 0.1≦d<0.9, and a+b+c+d=1; (B) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group in a molecule; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a hydrosilylation-reaction catalyst. The curable silicone composition has excellent handling/workability and forming a cured product with a high refractive index and low gas permeability when cured.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
3.
Curable silicone composition, cured product thereof, and optical semiconductor device
The present invention relates to a curable silicone composition comprising: (A) a diorganopolysiloxane having at least two alkenyl groups in a molecule, (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition enables the production of an optical semiconductor device in which the marked viscosity elevation of the resulting composition can be inhibited, in which the fluidity and packing properties are outstanding and that has outstanding gas barrier properties when used as a sealant, and in which the device has outstanding initial optical output efficiency even when organopolysiloxane resin is blended in order to form cured product with moderate hardness and strength.
C08K 5/56 - Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
C08L 83/14 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
1 in a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.5; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a cerium-containing organopolysiloxane; and (E) a hydrosilylation reaction catalyst. The curable silicone composition does not develop cracks due to thermal aging and can form a cured product having little yellow discoloration.
C08G 77/398 - Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing boron or metal atoms
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08L 83/14 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
C09K 11/02 - Use of particular materials as binders, particle coatings or suspension media therefor
The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a phosphor; and (E) a hydrosilylation reaction catalyst, to a cured product obtained by curing said composition, and to an optical semiconductor device in which a light emitting element is sealed or coated with a cured product of the aforementioned composition. The curable silicone composition has excellent fluidity and cures to form a cured product in which phosphors are homogeneously dispersed and which has a high refractive index.
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
6.
Drive device, image forming apparatus, and grease composition
A drive device includes a slide bearing; a shaft that passes through the slide bearing; a gear that is fixed to the shaft; and a grease composition that is held in a clearance between the slide bearing and the shaft. At least one of the slide bearing and the shaft is made of a resin. The clearance is in a range of 10 to 110 μm. The grease composition contains a hydrocarbon base oil and lithium soap serving as a thickener. A weight ratio of the hydrocarbon base oil to the lithium soap is in a range of 94.5:5.5 to 96.0:4.0. A consistency of the grease composition is in a range of 360 to 400.
C10M 115/00 - Lubricating compositions characterised by the thickener being a non-macromolecular organic compound other than a carboxylic acid or salt thereof
C10M 117/02 - Lubricating compositions characterised by the thickener being a non-macromolecular carboxylic acid or salt thereof having only one carboxyl group bound to an acyclic carbon atom, cycloaliphatic carbon atom or hydrogen
2/s and an evaporation loss being 1.2 mass % or less in a case where 10 g of a sample of the perfluoropolyether oil is placed in a petri dish having an inner diameter of 41 mm and allowed to stand still at 250° C. for 200 hours and (B) polytetrafluoroethylene.
2H, and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and high reactivity and forms a cured product with low gas permeability.
The present invention relates to a curable silicone composition which is a hydrosilylation reaction curable silicone composition for sealing, coating, or adhering of an optical semiconductor element, and includes at least one type of compound selected from triazole-based compounds with the exception of benzotriazole. The curable silicone composition, for example, includes (A) an organopolysiloxane having at least 2 aliphatic unsaturated hydrocarbon groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, (C) at least one type of compound selected from among triazole-based compounds with the exception of non-substituted benzotriazole, and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having excellent transparency and thermal shock resistance, and the optical semiconductor device utilizing the composition has excellent reliability.
H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
10.
Curable silicone composition, cured product thereof, and optical semiconductor device
2) a branched chain organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a diorganodialkoxysilane represented by a general formula; (D) a straight chain organosiloxane oligomer having at least one silicon-bonded hydroxyl group in a molecule and free of silicon-bonded hydrogen atoms; and (E) a hydrosilylation catalyst, can form a cured product which exhibits excellent initial adhesive properties and transparency and exhibits excellent adhesive durability and retention of transparency under conditions of high temperature and high humidity.
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond
C08K 5/5435 - Silicon-containing compounds containing oxygen containing oxygen in a ring
C08G 77/16 - Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
11.
Curable silicone composition for sealing an optical semiconductor element, method of producing a resin-sealed optical semiconductor element, and resin-sealed optical semiconductor element
1-10 alkyl for the silicon-bonded organic groups therein, and that contains from 0.7 to 1.6 mass % of silicon-bonded hydrogen atoms; and (D) a hydrosilylation reaction catalyst, wherein a viscosity at 25° C. and a viscosity at 100° C. of this composition lacking component (D) reside in a specific relationship, can efficiently perform resin sealing by transfer molding or compression molding while exhibiting an excellent moldability and can provide a cured product that has a low surface tack.
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08F 30/08 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
A curable organopolysiloxane composition can be used as a sealant or a bonding agent for optical semiconductor elements. The composition comprises at least the following components: (A) a multi-constituent, alkenyl-containing organopolysiloxane; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms, and, if necessary, constituent (B-3), an organopolysiloxane; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.
The present invention provides a polyurethane which is non-sticky, exhibits superior handling properties and superior moldability, and has superior adhesive properties with silicones even if a surface activation treatment is not carried out beforehand. The polyurethane of the present invention contains polyol units and organic polyisocyanate units. The polyol units contain an alkenyl group-containing organopolysiloxane structure in an amount ranging from 0.01 to 20% by weight with respect to the weight of the aforementioned polyurethane.
A curable organopolysiloxane composition comprising: (A) a branched-chain organopolysiloxane that contains in one molecule at least three alkenyl groups and at least 30 mole % of all silicon-bonded organic groups in the form of aryl groups; (B) a linear-chain organopolysiloxane that contains aryl groups and has both molecular terminals capped with diorganohydrogensiloxy groups; (C) a branched-chain organopolysiloxane that contains in one molecule at least three diorganohydrogensiloxy groups and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.
G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
H01L 33/56 - Materials, e.g. epoxy or silicone resin
15.
Thremoplastic resin composition and product therefrom
1 is a univalent hydrocarbon group having 1 to 10 carbon atoms, and “a” is a number in the range of 1.95 to 2.05}, and (C) a metal deactivator; and a product molded from the aforementioned composition. The thermoplastic resin composition is suitable for obtaining molded products that are characterized by their ability to suppress development of defects on the product surfaces after long-term outdoor exposure.
1; and “a” is a number that satisfies the following condition: 1.0≦a<4) is a novel adhesion-promoting agent, and a curable organopolysiloxane composition that contains the aforementioned adhesion-promoting agent, has excellent adhesion to various organic-resin substrates and suitable for forming a cured body having high refractive index and high light transmissivity.
The present invention relates to a thermoplastic elastomer composition and a glass panel molding assembly for a vehicle. The thermoplastic elastomer composition comprising a polymer component (1) that comprises a styrene-type thermoplastic elastomer and a polyolefin-type polymer {except for the additives in item (5) below}, a non-aromatic-rubber softener (2), a higher fatty acid derivative (4), and at least one type of an additive (5) selected from (5-a) a vinyl polymer graft-olefin polymer, (5-b) a polyorganosiloxane cross-linked powder; and (5-c) a polyorganosiloxane graft-olefin polymer. And the glass panel molding assembly for a vehicle produced from the aforementioned composition.
An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 μm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.
A lubricating grease composition comprising (A) a base oil, (B) 5 to 10 wt. % of a urea compound, (C) 0.5 to 20 wt. % of at least one phosphorous compound selected from the group consisting of a phosphoric acid salt etc., and (D) 0.5 to 40 wt. % of a fatty acid metal salt. Aforementioned lubricating grease composition allows it to reduce the friction coefficient and prolong the endurance life significantly when it is applied onto surfaces of the sliding pair consisting of metal and plastic (especially glass-fiber-reinforced plastic) parts.
C10M 129/40 - Carboxylic acids; Salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having 8 or more carbon atoms monocarboxylic
C10M 141/02 - Lubricating compositions characterised by the additive being a mixture of two or more compounds covered by more than one of the main groups , each of these compounds being essential at least one of them being an organic oxygen-containing compound
C10M 169/06 - Mixtures of thickeners and additives
20.
Curable organopolysiloxane resin composition and optical part molded therefrom
A curable organopolysiloxane resin composition having a viscosity at 25° C. in the range of 0.001 to 5,000 Pa·s, a total acid number as specified by JIS K 2501 (1992) in the range of 0.0001 to 0.2 mg/g, and light transmittance in a cured state equal to or greater than 80%; an optical part comprised of a cured body of the aforementioned composition. The curable organopolysiloxane resin composition of the invention is characterized by good transparency, low decrease in transmittance when exposed to high temperatures, and excellent adhesion when required.
C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.
A method of manufacturing an optical semiconductor device (16) sealed in a transparent or semitransparent cured silicone body (50) by placing an unsealed optical semiconductor device (16) into a mold (23, 34) and subjecting a transparent or semitransparent curable silicone composition (50) that fills the spaces between the mold and the unsealed device (70) to compression molding; provides the sealed optical semiconductor device that is free of voids, allows control of the coating layer thickness, protects the bonding wires from breakage and accidental contact, reduces concentration of stress on an optical semiconductor element, has long service life with reducing discoloration and disconnection of the sealing resin from the optical semiconductor element (16), and has excellent reliability.
2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
A compressor includes a swash plate, and a shoe connected to an outer periphery of the swash plate. A surface of the swash plate slides upon a flat surface of the shoe. A sliding film is applied to the surface of the swash plate. The sliding film is formed of binder resin which contains a solid lubricant and titanium oxide powder. This allows the surface of the swash plate and the flat surface of the shoe to smoothly slide upon each other.
C10M 177/00 - Special methods of preparation of lubricating compositions; Chemical modification by after-treatment of components or of the whole of a lubricating composition, not covered by other classes
C04B 14/00 - Use of inorganic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of inorganic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
patents
