Abstract

According to an embodiment of the present invention, an organic EL display device (100) has: an organic EL element (3) that is formed on a flexible substrate (1); and a thin film sealing structure (10) that is formed on the organic EL element (3). The thin film sealing structure (10) has: a first inorganic barrier layer (12); an organic barrier layer (14) in contact with the inorganic barrier layer (12); and a second inorganic barrier layer (16) in contact with the organic barrier layer (14). The organic barrier layer (14) is present at least on a part of a planar portion, and the surface of the organic barrier layer (14) is oxidized. According to an embodiment of the present invention, a method for manufacturing the organic EL display device (100) includes a step for ashing the organic barrier layer.

IPC Classes  ?

• H05B 33/04 - Sealing arrangements
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

The present invention provides: a vapor deposition mask whereby adhesion is increased between a vapor deposition substrate and an open peripheral edge section of the vapor deposition mask during vapor deposition, film blurring or shadows during vapor deposition are suppressed, and high-precision patterning is possible; a method for manufacturing the same; and a vapor deposition method which uses the vapor deposition mask. A vapor deposition mask (1) includes a resin film (11) having a pattern of openings (12) for forming a thin-film pattern by vapor deposition on a vapor deposition substrate (2). In the vapor deposition mask (1), a magnetic metal film (13a) is provided to the surface of the resin film (11) in contact with the vapor deposition substrate (2), at least in peripheral edge sections of the openings (12) in the resin film (11), adhesion is increased between the vapor deposition substrate (2) and the peripheral edge sections of the openings (12) in the vapor deposition mask (1) during vapor deposition, and film blurring or shadows during vapor deposition are suppressed.

IPC Classes  ?

• C23C 14/24 - Vacuum evaporation
• C23C 14/04 - Coating on selected surface areas, e.g. using masks

Abstract

Provided are a manufacturing method and a manufacturing device for a deposition mask for which manufacturing is possible using the same direction or placement method when using a hybrid-type deposition mask provided with a resin frame layer and a metal film layer. A deposition mask material in which a resin film layer 51 is arranged on one surface of a metal film layer 52, on which one or a plurality of openings 52a are formed, is welded to a metal frame 53 in a state with a prescribed tensile force applied in a prescribed direction so that the resin film layer 51 is on the outside; the metal frame 53 is held by a base 2; a taper-forming member/material 3 such as a reflecting surface 3c is arranged so as to face opposite the metal film layer 52 on the inside of the metal frame 53; laser beams 7 are irradiated from above the resin film layer 51; a through hole 51a is formed on the resin film layer 51; laser beams that passed through the through hole 51a are reflected by the taper-forming member/material 3; and a taper 51b is thereby formed around the through hole 51a.

IPC Classes  ?

• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• C23C 14/24 - Vacuum evaporation
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)

Abstract

Provided are: a vapor deposition method allowing vapor deposition of a film in such a manner that a pattern is accurately and uniformly formed thereon, as a result of forming a gap between a vapor deposition mask and a substrate to be subjected to vapor deposition when a vapor deposition material is to be vapor-deposited; and a vapor deposition device therefor. A vapor deposition mask (1) is placed horizontally with a peripheral portion thereof being held by a frame (12). A substrate (2) to be subjected to vapor deposition on which a vapor deposition film is to be formed is placed on the upper surface side of the vapor deposition mask (1). A vapor deposition source (5) is placed below the vapor deposition mask (1). A vapor deposition material (51) is vaporized from the vapor deposition source (5). As a result, a vapor deposition film is formed on the substrate (2) to be subjected to vapor deposition. The present invention is characterized in that vapor deposition is performed while the substrate (2) to be subjected to vapor deposition is pushed from a position on the upper surface of the substrate (2) to be subjected to vapor deposition, in the vertical direction through a center portion of a warp of the vapor deposition mask (1), in such a manner that the substrate (2) to be subjected to vapor deposition has a length corresponding to a length (length in a cross-section along one side of the vapor deposition mask) of the vapor deposition mask (1) which has been stretched by warping of the vapor deposition mask (1).

IPC Classes  ?

• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

The deposition mask (100) according to the present invention is provided with: a resin layer (10) including a plurality of openings (11); a magnetic metal layer (20) which is disposed so as to overlap with the resin layer (10), and which has a mask section (20a) having a shape that allows the plurality of openings to be exposed, and a peripheral section (20b) disposed so as to encircle the mask section; and a frame (30) which is fixed to the peripheral section of the magnetic metal layer. The resin layer is not joined to the magnetic metal layer in the area of the mask section, but is joined to the magnetic metal layer at least at a portion of the peripheral section.

IPC Classes  ?

• C23C 14/24 - Vacuum evaporation
• C23C 14/04 - Coating on selected surface areas, e.g. using masks

Abstract

A vapor deposition mask (100A) includes: a base film (10A) which has a plurality of first openings (13a) and which contains a polymer; a composite magnetic layer (20A) formed over the base film (10A) and having solid sections (22A) and non-solid sections (23A); and a frame (40A) which is joined to a peripheral section of the base film (10A). The plurality of first openings (13A) are formed in regions that correspond to the non-solid sections (23A), and the composite magnetic layer (20A) includes a resin and a soft ferrite powder having an average particle diameter of less than 500 nm.

IPC Classes  ?

• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• C23C 14/24 - Vacuum evaporation
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

Provided are: a deposition mask whereby a resin film in openings can be completely removed; a method for manufacturing the deposition mask; and a mask member for the deposition mask. On one side of a resin film (11), an irradiation source of laser light for forming a pattern of openings (11a) is disposed, and on the other side of the resin film (11), a reflecting film (30) for reflecting light is provided, said light having a wavelength of the laser light to be irradiated from the irradiation source of the laser light, and the laser light reflected by the reflecting film (30) is used for the purpose of forming the pattern of the openings (11a) in the resin film (11).

IPC Classes  ?

• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• B23K 26/36 - Removing material

Abstract

Provided is a method for manufacturing a flexible electronic device, which is capable of manufacturing a flexible electronic device without increasing manufacturing steps, and wherein a glass substrate is able to be reused and a flexible electronic device separated from the glass substrate has less possibility of being damaged or dog-eared. On a resin film substrate 11 that is formed on a glass substrate 10, an electronic device structure 2 is additionally formed and a device formation region 3 is irradiated with first laser light 41 having a long wavelength in a rectangular shape with the four corners being rounded off or chamfered, so that a flexible electronic device 1 comprising the electronic device structure 2 formed in the device formation region 3 is separated from the resin film substrate 11. Subsequently, the entire surface of the resin film substrate 11 is irradiated with second laser light 42 having a short wavelength from the back side of the glass substrate 10, so that the interface between the glass substrate 10 and the resin film substrate 11 is transformed, thereby making it easier to separate the resin film substrate 11 from the glass substrate 10.

IPC Classes  ?

• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/02 - Electroluminescent light sources - Details

Abstract

Provided are: a deposition method whereby a deposition mask can be uniformly and reliably separated in a short time after a deposition material is deposited; a deposition mask; and a deposition device. The present invention includes: a step (S1) for forming a deposition mask (1) having, as at least a part thereof, a metal layer (metal supporting layer) formed of a ferromagnetic material; a step (S2) for magnetizing the metal layer by applying an electromagnetic field to the metal layer of the deposition mask (1); a step (S3) for aligning a substrate (2) to be subjected to deposition, and the deposition mask (1) with each other, then, attracting the deposition mask (1) to an electromagnet (3) by having the substrate (2) therebetween; a step (S4) for disposing a deposition source (5) on the side facing the deposition mask (1), vaporizing a deposition material from the deposition source (5), and depositing the deposition material on the substrate (2); and a step (S5) for separating the electromagnet (3) and the substrate (2) from the deposition mask (1) by generating, in the electromagnet (3), a magnetic field that repels the deposition mask (1).

IPC Classes  ?

• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• C23C 14/50 - Substrate holders
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

Provided is a focus-free projector that projects an image onto an object, wherein the projector is provided with a transmissive spatial light modulator (20) that forms a two-dimensional pattern defining an image, and a laser light source (10) that irradiates the spatial light modulator (20) with laser light (30). The spatial light modulator (20) generates, from the laser light (30), a plurality of light beam (300) fluxes that has a spatial intensity distribution forming a two-dimensional pattern.

IPC Classes  ?

• G03B 21/14 - Projectors or projection-type viewers; Accessories therefor - Details
• G03B 21/00 - Projectors or projection-type viewers; Accessories therefor
• H01S 5/022 - Mountings; Housings
• H04N 5/74 - Projection arrangements for image reproduction, e.g. using eidophor

Abstract

Provided are: a vapor deposition mask capable of limiting misregistration between the layouts of openings in a vapor deposition-receiving substrate and a vapor deposition mask during vapor deposition and of performing high precision patterning; and a manufacturing method therefor. The vapor deposition mask (1) comprises a resin film (2) with a pattern of openings (4) for forming a thin film pattern by vapor deposition on a vapor deposition-receiving substrate. The vapor deposition mask (1) is provided a low emissivity film (5) with a lower emissivity than the resin film (2) on at least a portion of the surface of the resin film (2) that faces the vapor deposition source and limits the temperature elevation of the resin film (2) due to radiant heat from the vapor deposition source.

IPC Classes  ?

• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

A method for manufacturing a vapor deposition mask (100) provided with a resin layer (10) and a magnetic metal layer (20) formed on the resin layer (10) includes (A) a step for preparing a substrate, (B) a step for forming the resin layer by applying a solution containing a resin material or a precursor solution of a resin material on a surface of the substrate and then performing heat treatment, (C) a step for forming, on the resin layer (10), a magnetic metal layer (20) having a masking section (20a) comprising solid areas (20a(1)) in which there is a metal film and a non-solid area (20a(2)) in which there is no metal film and a surrounding section (20b) disposed so as to surround the masking section (20a), (D) a step for forming multiple openings (13) in the resin layer (10) in regions located in the non-solid area of the masking section (20a), and (E) a step after step (D) for peeling the resin layer (10) from the substrate.

IPC Classes  ?

• C23C 14/24 - Vacuum evaporation
• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

Provided is a vehicular image display system and a vehicle in which the image display system is mounted, the system displaying exterior information necessary for the driver to more safely drive a vehicle, such as an image of a blind area, on an image display device screen. The vehicular image display system is provided with: a plurality of imaging devices 11a, 11b disposed at predetermined positions on an exterior portion of a vehicle; a plurality of image display devices 14a to 14h disposed on an interior portion of the vehicle; a line of sight detection device 18 which detects the position of the eye or the direction of line of sight of the driver; and an image control device 19 which captures an image of a predetermined area using the imaging device positioned in the direction of the driver's line of sight, and which causes the image display device 14a or 14b to display the captured image corresponding to the imaging device 11a or 11b.

IPC Classes  ?

• B60R 1/00 - Optical viewing arrangements; Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles
• G08G 1/16 - Anti-collision systems

Abstract

Provided is a vapor deposition mask used to form a thin film pattern on a substrate, whereby it becomes possible to: prevent the generation by a retaining member of a shadow part (vapor deposition shadow) in which a vapor deposition substance does not adhere; form a more high definition thin film pattern; and furthermore, make it possible to be strongly sucked and held so as to be closely adhered to a surface of a transparent substrate by a magnet with the substrate retained by a substrate holder therebetween. A vapor deposition mask 1 is constituted of a unit of a resin film layer 2 or of the resin film layer 2 and a retaining member 7 which is a thin plate-like frame body of a substantially rectangular shape, and a magnetic metal powder 4 is contained in the resin layer film 2 in which a plurality of through-openings 3 are formed. When the retaining member 7 is included, formed in the retaining member 7 is a single rectangular opening 8 including the portion of the resin layer film 2 in which the plurality of through-openings 3 have been formed.

IPC Classes  ?

• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

A method of providing a conducting structure over a substrate, which comprises: disposing a lower sub-layer over a substrate, the lower sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and zinc content in the bottom sub-layer substantially defines a first indium to zinc content ratio; performing a first hydrogen treatment over an exposed surface of the lower sub-layer for introducing hydrogen content therein; disposing a middle sub-layer over the lower sub-layer, the middle sub-layer comprising a metal material; disposing an upper sub-layer over the middle sub-layer, the upper sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and the zinc content in the upper sub-layer substantially defines a second indium to zinc content ratio smaller than the first indium to zinc content ratio; and patterning the multi-layered conductive structure to generate a composite lateral etch profile.

IPC Classes  ?

• H01L 21/336 - Field-effect transistors with an insulated gate
• H01L 29/786 - Thin-film transistors

Abstract

A semiconductor device comprises a multi-layered structure disposed over a substrate (101) and defining a composite lateral etch profile. The multi-layered structure includes a lower sub-layer (105-1) disposed over the substrate (101) and comprising a metal oxide material that includes indium and zinc, the indium and zinc content in the lower sub-layer (105-1) substantially defining a first indium to zinc content ratio; a middle sub-layer (105-2) disposed over the lower sub-layer (105-1) and comprising a metal material; an upper sub-layer (105-3) disposed over the middle sub-layer (105-2) and comprising a metal oxide material that includes indium and zinc, the indium to zinc content in the upper sub-layer (105-3) substantially defining a second indium to zinc content ratio smaller than the first indium to zinc content ratio; and a lateral byproduct layer formed over the lateral etched surface, comprising substantially an metal oxide of the metal material in the middle sub-layer (105-2).

IPC Classes  ?

• G02F 1/1362 - Active matrix addressed cells
• H01L 29/786 - Thin-film transistors

Abstract

A thin film transistor array panel includes a first conductive layer (102) including a gate electrode; a channel layer (104) disposed over the gate; and a second conductive layer (105) disposed over the channel layer (104). The second conductive layer (105) includes a multi-layered portion defining a source electrode (105a) and a drain electrode (105b), which includes a first sub-layer (105-1), a second sub-layer (105-2), and a third sub-layer (105-3) sequentially disposed one over another. Both the third and the first sub-layers (105-3, 105-1) include indium and zinc oxide materials. An indium to zinc content ratio in the first sub-layer (105-1) is greater than that in the third sub-layer (105-3). The content ratio differentiation between the first and the third sub-layers (105-1, 105-3) affects a lateral etch profile associated with a gap (106) generated in the second conductive layer (105) between the source and the drain electrodes (105a, 105b), where the associated gap (106) width in the third sub-layer (105-3) is wider than that in the first sub-layer (105-1).

IPC Classes  ?

• H01L 29/12 - Semiconductor bodies characterised by the materials of which they are formed
• H01L 21/77 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate

Abstract

A conductive layer for a thin film transistor (TFT) array panel includes a multi-layered portion defining a source electrode and a drain electrode of a TFT device, and includes a first sub-layer, a second sub-layer, a third sub-layer, and at least one additional sub-layer. The third and the first sub-layers include indium and zinc oxide materials. An indium to zinc content ratio in the first sub-layer is greater than that in the third sub-layer. An indium to zinc content ratio in the additional sub-layer is formulated between that in the first and the third sub-layers. The content ratio differentiation between the first and the third sub-layers affects a lateral etch profile associated with a gap generated in the second conductive layer between the source and the drain electrodes, where the associated gap width in the third sub-layer is wider than that in the first sub-layer.

IPC Classes  ?

• H01L 29/786 - Thin-film transistors
• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
• G02F 1/136 - Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit

Abstract

Provided are: a vapor deposition mask with which, even when vapor-depositing a vapor deposition material on only intended sites of the bottom of a vapor deposition-receiving substrate that has recesses and protrusions on the surface, there is no gap between the vapor deposition mask and the vapor deposition-receiving substrate and vapor deposition on only the intended sites is possible; and a manufacturing method therefor. A dummy substrate with recesses and protrusions corresponding to the form of the surface of the vapor deposition-receiving substrate is manufactured (S1). A resin coating film is formed by coating a liquid resin material on the uneven surface of the dummy substrate (S2). A baked resin film is formed by raising the temperature of the resin coating film and baking the resin coating film (S3). Next, a resin film with an intended pattern of openings is formed by forming the intended pattern of openings on the baked resin film adhering to the dummy substrate (S4). Then, the resin film is peeled from the dummy substrate and used as a vapor deposition mask (S6).

IPC Classes  ?

• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• C23C 14/12 - Organic material
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• H05B 33/12 - Light sources with substantially two-dimensional radiating surfaces

Abstract

To peel a resin film from a supporting substrate easily without using light irradiation, and furthermore, without damaging the resin film or the like. In the present invention, preparation is made to separate a supporting substrate into a first portion and a second portion, said supporting substrate having a resin film that is formed by being adhered to one surface (S3), and in a state wherein the resin film is adhered to the one surface of the second portion of the supporting substrate, the first portion of the supporting substrate and at least a second portion end on the first portion side are relatively moved such that the first portion and the second portion end are separated from each other in the direction perpendicular to the one surface of the first portion, and the first portion and/or the second portion is freely moved or forcibly moved in the direction parallel to the one surface of the first portion (S4).

IPC Classes  ?

• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• B65H 41/00 - Machines for separating superposed webs
• G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/02 - Electroluminescent light sources - Details
• H05B 33/04 - Sealing arrangements

Abstract

To provide a resin film peeling method whereby a resin film formed on a supporting substrate can be mechanically peeled easily, without irradiating the resin film with laser light, and without having in the method a troublesome step for forming an adhesive layer or a peeling layer on a part. In the present invention, preparation for separation is made for the purpose of separating a supporting substrate into a first portion and a second portion (S3). In a state wherein a resin film is adhered to one surface of the second portion of the supporting substrate, the first portion of the supporting substrate and at least a second portion end on the first portion side are relatively moved such that the first portion and the second portion end are separated from each other in the direction perpendicular to the one surface (S4). Then, a spray force due to a gas or a liquid is applied , in the direction parallel to the supporting substrate at constant pressure in the resin film width direction , by means of a spray tool to an end portion of an adhesion surface between the resin film and the first portion of the supporting substrate, said end portion being exposed due to the partial peeling of the resin film (S5).

IPC Classes  ?

• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• B65H 41/00 - Machines for separating superposed webs
• G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/02 - Electroluminescent light sources - Details
• H05B 33/04 - Sealing arrangements

Abstract

According to an embodiment of the present invention, a method for manufacturing an organic EL display device includes: a step (a) for forming a polymer film (14) on a supporting substrate (12); a step (b) for forming a plurality of organic EL display panel sections (20) on the polymer film (14); and a step (c) for relatively moving a line beam (100L) and the supporting substrate (12), while irradiating at least an interface between the polymer film (14) and the supporting substrate (12) with the line beam (100L) from the supporting substrate (12) side by having the organic EL display panel sections (20) face a stage (200S) on the stage (200S), said step being performed in a state wherein the organic EL display panel sections (20) are substantially thermally insulated from the stage (200S).

IPC Classes  ?

• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• B23K 26/36 - Removing material
• G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/02 - Electroluminescent light sources - Details

Abstract

A line beam irradiation device (1000) is provided with: a work stage (200); a line beam light source (100) which irradiates a workpiece (300) placed on the work stage (200) with a line beam; and a transport device (250) which moves the work stage (200) and/or the line beam light source (100) so as to move the position at which the line beam is irradiated onto the workpiece in a direction intersecting the line beam. The line beam light source includes a plurality of semiconductor laser elements, and a support member supporting the plurality of semiconductor laser elements. The plurality of semiconductor laser elements are arranged along an identical line extending in a fast-axis direction, wherein laser light emitted from respective light-emitting regions of the semiconductor laser elements expands parallel to the identical line and forms the line beam.

IPC Classes  ?

• H01S 5/022 - Mountings; Housings
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/073 - Shaping the laser spot
• B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
• H01S 5/062 - Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
• H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups

Abstract

A vapor deposition mask (100) is provided with: a resin layer (10) with a first main surface (11) and a second main surface (12) and comprising multiple openings (13); and a metal layer (20) with a third main surface (21) and a fourth main surface (22) and provided on the first main surface of the resin layer so that the fourth main surface is located on the resin layer side, the metal layer having a form that exposes the multiple openings. Portions of the first main surface of the resin layer that are in contact with the metal layer, portions that are not in contact with the metal layer , and the third main surface of the metal layer each comprise rough surface regions that have asperities.

IPC Classes  ?

• C23C 14/24 - Vacuum evaporation
• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

A high-performance TFT substrate (100) for a flat panel display includes a substrate (110), a first conductive layer (130) on the substrate (110), a semiconductor layer (103) positioned on the first conductive layer (130), and a second conductive layer (150) positioned on the semiconductor layer (103). The first conductive layer (130) defines a gate electrode (101). The second conductive layer (150) defines a source electrode (105) and a drain electrode (106) spaced apart from the source electrode (105). The second conductive layer (150) includes a first layer (151) on the semiconductor layer (103) and a second layer (152) positioned on the first layer (151). The first layer (151) can be made of metal oxide. The second layer (152) can be made of aluminum or aluminum alloy.

IPC Classes  ?

• H01L 29/786 - Thin-film transistors
• H01L 21/336 - Field-effect transistors with an insulated gate

Abstract

Provided are: a method for producing a resin film which is formed of a resin material and which has a fine pattern that is accurately formed as in a vapor deposition mask or an optical element; a method for producing an organic EL display device; a base film for forming a fine pattern; and a resin film provided with a support member. A liquid resin material is applied onto a support member to form a resin-coated film (S1), and the temperature of the resin-coated film is increased to a temperature at which the resin material is cured, to form a baked resin film (S2). Thereafter, a base film in which the baked resin film is attached to the support member is processed by irradiation with laser light, to form a support member-provided resin film (1b) having a desired fine pattern (S3). Thereafter, the baked resin film on which the fine pattern is formed is peeled from the support member, so that the resin film having the fine pattern is obtained (S5).

IPC Classes  ?

• C23C 14/04 - Coating on selected surface areas, e.g. using masks
• H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
• H05B 33/10 - Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

The invention relates to a display system comprising an electrically connected display device and TV stick. The display device comprises a first transmission interface, a first control module and a power source module; and the TV stick comprises a second transmission interface and a second control module. The first and second transmission interfaces comprise a plurality of transmission pins, and are correspondingly electrically connected. The first control module detects a voltage of one of the transmission pins to obtain a matching state of the display device and the TV stick, and correspondingly outputs an enable signal. If the display device and the TV stick match, the enable signal controls the power source module to transmit a power source signal to the second control module via the first and second transmission interfaces to provide power thereto. If the display device and the TV stick do not match, the power source signal is not provided to the second control module.

IPC Classes  ?

• H04N 21/41 - Structure of client; Structure of client peripherals
• H04N 5/765 - Interface circuits between an apparatus for recording and another apparatus

Abstract

A file download abnormality processing system and method for multipoint synchronous storage are applied in an application server. The application server is connected to at least one terminal device and a plurality of file servers. The method comprises the steps of: receiving a file download request from a terminal device; looking up a file server nearest to the terminal device as a first file server, and downloading a file from the first file server; when the terminal device does not successfully download a file needed by a user from the first file server, looking up all remote file servers which store the file from a file storage configuration table; selecting one of the remote file servers as a second file server for downloading the file, and downloading the file from the second file server; and when the terminal device successfully downloads the file needed by the user from the second file server, synchronously storing the file in the second file server to the first file server to automatically repair a file with errors in the first file server.

IPC Classes  ?

• H04L 29/06 - Communication control; Communication processing characterised by a protocol

Abstract

A patent rejection process display system and method. The method comprises the following steps: obtaining from a storage of an electronic device all office action documents of a patent application, and reading specific content of each office action document; parsing each office action document to extract a rejected claim in each office action document, and establishing rejection information corresponding to the rejected claim; establishing a node of each office action document according to a preset rule; and when a node corresponding to an office action document is selected, displaying on a display device of the electronic device rejection information corresponding to a rejected claim in said office action document. By means of the present invention, patent rejection information can be automatically extracted from all office action documents of a patent application, and a patent rejection process is presented according to a preset rule.

IPC Classes  ?

• G06Q 50/18 - Legal services; Handling legal documents

Abstract

The present invention provides a file synchronization system. The synchronization system receives a file transmitted via an access portal by a client, specifies multiple storage paths in a distributed storage system for the file, and stores the file to multiple corresponding storage units according to the specified storage paths. After that, the synchronization system generates a unit file log on each storage unit, generates a system file log at the access portal, regularly collects unit file logs stored by the storage units, and stores the collected unit file logs to a preset storage location. When a file stored in a storage unit needs to be repaired, the synchronization system compares the collected unit file logs and the system file log to determine the file originally stored in the storage unit and another storage unit storing the same file as the storage unit, and copies the file from the other storage unit to the storage unit. The present invention also provides a file synchronization method.

IPC Classes  ?

• G06F 17/30 - Information retrieval; Database structures therefor

Abstract

A virtual machine management system and method. The method includes steps of: receiving an upgrade or downgrade operation of a first virtual machine selected by a user; searching for an entity machine in a data centre; generating a second virtual machine the specification of which is designated by the user in the found entity machine; copying the data of the first virtual machine to the second virtual machine at a first time point; controlling the first virtual machine and the second virtual machine to run for some time in parallel until all the data of the first virtual machine is copied to the second virtual machine; stopping the parallel operation of the first virtual machine and the second virtual machine at a second time point; and when the parallel operation of the first virtual machine and the second virtual machine stops, stopping the running of the first virtual machine, and releasing the cloud computing resources occupied by the first virtual machine. The present invention can be applied to automatically completing the upgrade and downgrade of virtual machines.

IPC Classes  ?

• G06F 9/455 - Emulation; Interpretation; Software simulation, e.g. virtualisation or emulation of application or operating system execution engines

Abstract

An electrical connector (100) for engaging with a mating connector (200) includes an insulative housing (10), a plurality of contacts (20) in the housing and a metallic shell (30) covering the insulative housing. The metallic shell comprises a frame with at least one tab (313) arranged at the front edge of the frame, so as to properly guide the mating connector to prevent contact misalignment or short-circuit during the mating process. A spacer (40) is mounted at a rear end of the housing to prevent the contacts from contacting with the shell. The mating connector includes an mating portion defining a pair of concavities on two surface thereof to receiving corresponding shells of the connector (100) when mating so as to minimize size.

IPC Classes  ?

• H01R 13/629 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure