II-VI Delaware, Inc.

United States of America

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G02B 6/42 - Coupling light guides with opto-electronic elements 199
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication 157
G02B 6/36 - Mechanical coupling means 113
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1.

MONITIOR WINDOW IN ASE INJECTION SEED

      
Application Number 18177544
Status Pending
Filing Date 2023-03-02
First Publication Date 2024-04-25
Owner II-VI Delaware, Inc. (USA)
Inventor Cai, Shaohua

Abstract

A reconfigurable optical add/drop multiplexer using a wavelength selective switch (WSS) component to multiplex wavelength channels into a wavelength division multiplexed (WDM) signal. When a given channel is dropped, an amplified spontaneous emission (ASE) injection signal is multiplexed as a ghost channel into the WDM signal. The ASE injection channel can mitigate polarization hole burning and can provide a fuller power spectrum density. However, the ASE injection channel also defines a monitoring window. As an optical channel monitor (OCM) monitors the WDM signal, the OCM can detect, within the monitoring window, any underlying characteristic of the given wavelength channel. In this instance in response to the detected characteristic, the WSS component switches from multiplexing the ghost channel into the WDM signal to multiplexing the given wavelength channel into the WDM signal.

IPC Classes  ?

  • H04J 14/02 - Wavelength-division multiplex systems
  • H04B 10/25 - Arrangements specific to fibre transmission
  • H04B 10/294 - Signal power control in a multiwavelength system, e.g. gain equalisation

2.

MULTI-WAVELENGTH VCSEL ARRAY AND METHOD OF FABRICATION

      
Application Number 18536603
Status Pending
Filing Date 2023-12-12
First Publication Date 2024-04-25
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Pissis, Antoine Philippe
  • Zibik, Evgeny

Abstract

A vertical cavity surface emitting laser (VCSEL) array fabricated to produce multiple wavelengths. A first distributed Bragg reflector (DBR) is formed on a substrate, and an optical cavity having an active region and a cavity layer is formed on the first DBR, and a second DBR is formed on the optical cavity. The cavity layer is selectively etched to form wavelength-specific regions having different filling factors. As a result, the wavelength-specific regions have different optical thicknesses (e.g., different refractive indexes and/or physical thicknesses) and generate different Fabry Perot wavelengths.

IPC Classes  ?

  • H01S 5/42 - Arrays of surface emitting lasers
  • H01S 5/02 - Structural details or components not essential to laser action
  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
  • H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups

3.

Device and Method for Optical Coherence Tomography In Laser Material Processing

      
Application Number 18073156
Status Pending
Filing Date 2022-12-01
First Publication Date 2024-04-25
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Kozak, Marcin
  • Barbarossa, Giovanni

Abstract

A device for monitoring a process in laser material processing, comprising a laser generating a light beam, wherein the light beam may impinge on a lens matrix disposed between the light source and a beam splitter. The lens matrix may comprise microlenses, operable to generate a matrix of light beams from the impinging light beam. Part of the matrix of light beams may be directed to a mirror in a reference arm and part may be directed to an unknown surface in a measuring arm. The reflection of these beams may be used to generate an interference signal to be evaluated.

IPC Classes  ?

  • G01N 21/45 - Refractivity; Phase-affecting properties, e.g. optical path length using Schlieren methods
  • B23K 26/03 - Observing, e.g. monitoring, the workpiece
  • G02B 3/00 - Simple or compound lenses
  • G02B 27/14 - Beam splitting or combining systems operating by reflection only

4.

VCSEL POLARIZATION CONTROL WITH STRUCTURAL BIREFRINGENT CAVITY

      
Application Number 18312967
Status Pending
Filing Date 2023-05-04
First Publication Date 2024-04-25
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Pissis, Antoine
  • Tirelli, Stefano
  • Zibik, Evgeny

Abstract

This disclosure describes a method of forming a VCSEL with a structural birefringent cavity. This method comprises growing a bottom distributed Bragg reflector (DBR) and a first part of a cavity on a substrate to form a bottom structure comprising a plurality of layers. One or more anisotropic features are etched on a upper layer of the bottom structure to produce a patterned growth interface. A remaining part of the cavity and a top DBR on the patterned growth interface are overgrown to form an epitaxial structure. One or more oxide apertures are formed in the epitaxial structure.

IPC Classes  ?

  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
  • H01S 5/028 - Coatings
  • H01S 5/34 - Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers

5.

REDUCED THICKNESS OPTICAL ISOLATOR AND METHOD OF USE THEREOF IN A LASER OPTIC SYSTEM

      
Application Number 17962751
Status Pending
Filing Date 2022-10-10
First Publication Date 2024-04-11
Owner II-VI Delaware, Inc. (USA)
Inventor Sundaram, Ramesh

Abstract

An optical isolator includes a polarizer for receiving and passing an optical signal received from an optical signal source to a garnet which rotates a polarization of the optical signal by an angle of 45°−θ1°, where 5°≤θ1°<42°, and outputs at least a part of this polarization rotated optical signal to an analyzer, having a polarization optical axis at 45°+θ2°, where 5°≤θ2°<42°. The analyzer outputs at least a part of the polarization rotated optical signal to an external optical circuit which reflects at least a part of the polarization rotated optical signal back to the garnet via the analyzer. The garnet rotates a polarization of the reflected optical signal by an angle of 45°−θ1° and outputs this latter polarization rotated optical signal to the polarizer which at least partially blocks it from the optical signal source.

IPC Classes  ?

  • H04B 10/2507 - Arrangements specific to fibre transmission for the reduction or elimination of distortion or dispersion

6.

PHOTONIC OPTOELECTRONIC MODULE PACKAGING

      
Application Number 18543648
Status Pending
Filing Date 2023-12-18
First Publication Date 2024-04-11
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Denoyer, Gilles P.
  • Mahgerefteh, Daniel
  • Bhatt, Vipul
  • Lin, Shiyun
  • Kim, Brian

Abstract

In one example, an optoelectronic module may include a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, an interposer electrically and mechanically coupled to the stack assembly, and an optical connector to optically couple the optical integrated circuit with an array of optical fibers.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
  • H01L 23/498 - Leads on insulating substrates

7.

COMPUTER-CONTROLLED PROCESSING USING NEURAL NETWORK-BASED SELECTION OF OPTIMUM PROCESS ALGORITHM

      
Application Number 17960221
Status Pending
Filing Date 2022-10-05
First Publication Date 2024-04-11
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Kallenbach, Eric
  • Kuehl, Patrick

Abstract

A methodology is presented for using neural network (NN) techniques to evaluate input data presented to a computer-controlled processing system. An initial evaluation is used to determine if the input data represents a valid product that is intended to be processed by one or more algorithms within the computer system. If the input data is determined to be invalid, the operation of the algorithm on the product is not initiated (or halted if previously started). Presuming a valid input is ascertained by the NN-based evaluation system, further classification and identifications may be performed to properly match the presented data with a particular system process, as well as select an optimum algorithm for preforming a given task from a set of possible algorithms that may be used for that task.

IPC Classes  ?

8.

Fiber Span Characterization Utilizing Paired Optical Time Domain Reflectometers

      
Application Number 18530940
Status Pending
Filing Date 2023-12-06
First Publication Date 2024-04-04
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Cahill, Michael J.
  • Mcclean, Ian Peter

Abstract

A system for providing advanced characterization of an optical fiber span is based upon the use of a pair of optical time domain reflectometers (OTDRs), located at opposing end terminations of the span being characterized. Each OTDR performs standard reflectometry measurements and transmits the resulting OTDR trace to monitoring equipment in a typical manner. The pair of OTDR traces is thereafter combined in a particular manner (“stitched together”) to create an OTDR trace of the entire fiber span (essentially doubling the operational range of prior art OTDR measurement capabilities). The transmit portion of one OTDR may be paired with the receive portion of the other OTDR, with time-of-light measurements (or signal loss measurements) used to determine optical path length and/or optical signal loss of the span. Using a multi-wavelength light source in the paired transmit/receive arrangement allows for a characterization of chromatic dispersion of the span.

IPC Classes  ?

  • G01M 11/00 - Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
  • H04B 10/071 - Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using a reflected signal, e.g. using optical time domain reflectometers [OTDR]

9.

MODULAR ASSEMBLY FOR OPTO-ELECTRONIC SYSTEMS

      
Application Number 18534211
Status Pending
Filing Date 2023-12-08
First Publication Date 2024-03-28
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Dong, Po
  • Basak, Juthika
  • Chen, Jiashu

Abstract

A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

IPC Classes  ?

  • G02B 6/30 - Optical coupling means for use between fibre and thin-film device
  • G02B 6/42 - Coupling light guides with opto-electronic elements

10.

METHOD FOR MANUFACTURING A GRID

      
Application Number 18526516
Status Pending
Filing Date 2023-12-01
First Publication Date 2024-03-28
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Schoner, Adolf
  • Reshanov, Sergey
  • Thierry-Jebali, Nicolas
  • Elahipanah, Hossein

Abstract

A grid is manufactured with a combination of ion implant and epitaxy growth. The grid structure is made in a SiC semiconductor material with the steps of a) providing a substrate comprising a doped semiconductor SiC material, said substrate comprising a first layer (n1), b) by epitaxial growth adding at least one doped semiconductor SiC material to form separated second regions (p2) on the first layer (n1), if necessary with aid of removing parts of the added semiconductor material to form separated second regions (p2) on the first layer (n1), and c) by ion implantation at least once at a stage selected from the group consisting of directly after step a), and directly after step b); implanting ions in the first layer (n1) to form first regions (p1). It is possible to manufacture a grid with rounded corners as well as an upper part with a high doping level. It is possible to manufacture a component with efficient voltage blocking, high current conduction, low total resistance, high surge current capability, and fast switching.

IPC Classes  ?

  • H01L 29/40 - Electrodes
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/265 - Bombardment with wave or particle radiation with high-energy radiation producing ion implantation
  • H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
  • H01L 21/3065 - Plasma etching; Reactive-ion etching
  • H01L 21/324 - Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

11.

Double-Sided Coating for Electrochemical Device Applications

      
Application Number 18472494
Status Pending
Filing Date 2023-09-22
First Publication Date 2024-03-28
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Lu, Xinyu
  • Xu, Wen-Qing
  • Gao, Zan

Abstract

A double-sided coating may include a substrate having a first side and an opposing second side, a first coating forming a first electrode arranged on the first side, and a second coating forming a second electrode arranged on the second side. Each of the first coating and the second coating have a thickness of at least 30 μm and a surface roughness (Ra) of less than 10 μm and are formed from a slurry including a liquid carrier suspending solid particles. The slurry includes a binder, an active material, and a conductive material.

IPC Classes  ?

  • H01M 4/139 - Processes of manufacture
  • H01G 11/38 - Carbon pastes or blends; Binders or additives therein
  • H01M 4/04 - Processes of manufacture in general
  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01M 4/66 - Selection of materials
  • H01M 4/74 - Meshes or woven material; Expanded metal
  • H01M 4/80 - Porous plates, e.g. sintered carriers
  • H01M 10/052 - Li-accumulators
  • H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators

12.

HIGH POWER LASER ARRAY DEVICES AND METHODS

      
Application Number 18478921
Status Pending
Filing Date 2023-09-29
First Publication Date 2024-03-28
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Lin, Shiyun
  • Sudo, Tsurugi

Abstract

In one example, an optoelectronic assembly may include a laser array, an amplifier array, and a multimode interference coupler optically coupling the laser array and the amplifier array. The laser array may include at least one primary laser and at least one spare laser configured to be activated if the primary laser fails. The amplifier array may include at least two amplifiers configured to amplify optical signals received from the laser array.

IPC Classes  ?

  • H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
  • H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers

13.

Process Monitor for Laser Processing Head

      
Application Number 17933807
Status Pending
Filing Date 2022-09-20
First Publication Date 2024-03-21
Owner II-VI Delaware, Inc. (USA)
Inventor Chan, Danny

Abstract

A laser processing head conducts laser energy to process a workpiece. A fiber input emits the laser energy, and internal optics focus the laser energy as a laser beam to a focus spot relative to an output on the head. A relay between the fiber input and the internal optics directs a portion of process light, which has returned from the process through the internal optics to the relay. The effects of the internal optics form the returned process light as a hollow converging cone toward the fiber input. The relay is located in an angular space situated an extent outside the diverging cone of the emitted laser energy from the fiber input, such as at a numerical aperture that is about 10 percent greater than the numerical aperture of the fiber input. A sensor detects the portion of the process light directed to it.

IPC Classes  ?

  • B23K 26/70 - Auxiliary operations or equipment
  • B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K 26/073 - Shaping the laser spot
  • B23K 26/38 - Removing material by boring or cutting

14.

STREAMLINED PROCESS FOR PRODUCING ALUMINUM-SCANDIUM ALLOY

      
Application Number 18177429
Status Pending
Filing Date 2023-03-02
First Publication Date 2024-03-21
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Nazari, Ghazaleh
  • Abrenica, Gomer
  • Reyes, Anne Marie

Abstract

An alloy product is produced by an aluminothermic reduction process and an alloying process with one or more other metals or master alloy, where the reduction process and the alloying process are performed in a single stage. The final alloy product may have a scandium concentration that is greater than 0% and less than about 2%. According to another aspect of the present disclosure, a first melt is produced at a first melt temperature, a melting and alloying step is performed at a second melt temperature, less than the first melt temperature, and the temperature of the first melt is not substantially less than the second melt temperature before the melting and alloying step.

IPC Classes  ?

  • C22C 21/00 - Alloys based on aluminium
  • C22C 1/02 - Making non-ferrous alloys by melting
  • C22C 1/057 - Making hard metals based on borides, carbides, nitrides, oxides or silicides; Preparation of the powder mixture used as the starting material therefor with in situ formation of phases other than hard compounds by solid state reaction sintering, e.g. metal phase formed by reduction reaction

15.

METHODS AND DEVICES FOR LASER BEAM PARAMETERS SENSING AND CONTROL WITH FIBER-TIP INTEGRATED SYSTEMS

      
Application Number 18472836
Status Pending
Filing Date 2023-09-22
First Publication Date 2024-03-14
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Vorontsov, Mikhail A.
  • Ovchinnikov, Vladimir

Abstract

A sensing method for in-situ non-perturbing measurement of characteristics of laser beams at the exit of the laser beam delivery fiber tips include measuring power of a laser beam transmitted through delivery fiber tip in fiber-optics systems. A sensing devices for in-situ non-perturbing sensing and control of multiple characteristics of laser light transmitted through light delivery fiber tips includes a fiber-tip coupler comprised of a shell with enclosed delivery fiber having a specially designed angle-cleaved endcap and one or several tap fibers that are specially arranged and assembled at back side of the endcap and other variations. Methods and system architectures for in-situ non-perturbing control of characteristics of laser beams at the exit of the laser beam delivery fiber tips include fiber-tip couplers and sensing modules that receive laser light from tap fibers, and systems for optical processing to enhance light characteristics suitable for in-situ measurement.

IPC Classes  ?

  • H01S 3/10 - Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
  • H01S 3/067 - Fibre lasers
  • H01S 3/13 - Stabilisation of laser output parameters, e.g. frequency or amplitude
  • H01S 3/23 - Arrangement of two or more lasers not provided for in groups , e.g. tandem arrangement of separate active media

16.

Device For Monitoring The State of Optical Elements of A Device For Laser Material Processing

      
Application Number 18368414
Status Pending
Filing Date 2023-09-14
First Publication Date 2024-03-14
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Labahn, Daniel
  • Chan, Danny
  • Kuhl, Patrick
  • Chakrabarti, Romon
  • Ziemann, Andreas
  • Noack, Hannes

Abstract

The disclosure relates to a system and a method for monitoring the state of optical elements of a device for laser material processing. According to the present disclosure a detailed monitoring of the state of optical elements of a device for laser material processing takes place by monitoring properties of laser radiation in the direction of an optical fiber or laser radiation entering a laser processing head connected to the laser source and these measurements, which can be performed during the processing process. The device according to the present disclosure has optical sensors for measuring the intensity and respective current laser power.

IPC Classes  ?

  • B23K 26/70 - Auxiliary operations or equipment
  • B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing

17.

MICRO-OPTICS ON VCSEL-BASED FLOOD ILLUMINATOR

      
Application Number 17931834
Status Pending
Filing Date 2022-09-13
First Publication Date 2024-03-14
Owner II-VI Delaware, Inc. (USA)
Inventor
  • O'Daniel, Jason
  • Cai, Pei-Song
  • Liu, Hong-Zhi
  • Schiattone, Francesco

Abstract

A laser assembly, such as a flood illuminator, has laser (e.g., VCSEL) emitters on a substrate configured to emit optical signals. An optic structure of optically transparent material, such as a polymer, is formed directly on the substrate, and micro-optic elements are nano-imprinted on the optic structure. The micro-optic elements are arranged in optical communication with the optical signals emitted from the laser emitters to perform field mapping or other optical functions. The laser emitters are on the same surface of the substrate as the optic structure along with electrical contacts so forming the optic structure involves covering the electrical contacts with a protective layer, dispensing a polymer for the optic structure, cutting away portions of the optic structure, removing the remaining protective layer, and exposing the electrical contacts.

IPC Classes  ?

  • H01S 5/42 - Arrays of surface emitting lasers
  • H01S 5/00 - Semiconductor lasers
  • H01S 5/02253 - Out-coupling of light using lenses
  • H01S 5/02345 - Wire-bonding
  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

18.

Fabrication Technique For Wire Grid Polarizer

      
Application Number 18236975
Status Pending
Filing Date 2023-08-23
First Publication Date 2024-03-07
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Yao, Junjie
  • Zhang, Jianying
  • Zhou, Xiaolian
  • Jia, Xu
  • Lin, Lei
  • Yu, Guanglong

Abstract

A proposed fabrication technique for a polarization-absorbing wire grid polarizer avoids the need to etch through the multilayer stack of materials to form the grid structure. Initial reflective metal and dielectric buffer layers are patterned and etched in a conventional manner to create the desired grid topology. A small-angle coating process is then used to complete the fabrication process by first coating the top surface of the patterned dielectric with a polarization-absorbing metal. A second coating process is used to cover the created metal coating with a dielectric cladding material. Maintaining a small angle of incidence between the coating source and the wire grid structure ensures that top portions of the grid are suitably covered to create the desired multilayer wire configuration.

IPC Classes  ?

  • C03C 17/36 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
  • C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching

19.

TEMPERATURE CONTROL FOR COILED GAIN FIBER IN FIBER AMPLIFIER

      
Application Number 17901749
Status Pending
Filing Date 2022-09-01
First Publication Date 2024-03-07
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Green, Eric T.
  • Gurusami, Aravanan
  • Mangano, Joseph
  • Seifert, Martin

Abstract

A temperature controller is used for a gain fiber of a fiber amplifier. The controller includes a heat transfer structure and one or more temperature sinks, such as cooling plates. The heat transfer structure supports the gain fiber and is disposed in thermal contact with it. Portions of the temperature sink(s) are disposed in different thermal conductivity with sections of the heat transfer structure. For example, the sinks may have different material properties and/or material thicknesses. Also, portions of the temperature sink(s) can have different cooling rates. The different thermal conductivities conduct the heat from parts of the gain fiber differently from one another. In the end, an onset of Stimulated Brillouin Scattering (SBS) on the laser light path can be mitigated by conducting heat from the gain fiber with the different thermal conductivities.

IPC Classes  ?

20.

REINFORCED METAL MATRIX COMPOSITES AND METHODS OF MAKING THE SAME

      
Application Number 17823704
Status Pending
Filing Date 2022-08-31
First Publication Date 2024-02-29
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Barbarossa, Giovanni
  • Mccormick, Allyn
  • Salamone, Sam
  • Mcanany, Sean
  • Aghajanian, Michael

Abstract

Reinforced metal matrix composites are described including a porous ceramic reinforcement and a metal matrix in interstitial contact with the ceramic reinforcement. Methods of forming reinforced metal matrix composites are described including contacting a porous ceramic reinforcement with a liquid metal matrix and solidifying the liquid metal matrix.

IPC Classes  ?

21.

Pluggable Optical Time Domain Reflectometer

      
Application Number 17895339
Status Pending
Filing Date 2022-08-25
First Publication Date 2024-02-29
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Mcclean, Ian Peter
  • Fleischer, Siegfried

Abstract

A pluggable OTDR is disclosed that is utilizes a specific architecture that separates its passive optical elements from the remaining active optical and electrical elements. The set of active elements (i.e., laser, photodetector, and control/processing electronics) can arranged in a manner similar to a small form-factor pluggable (SFP) optical transceiver and assembled within a housing that meets these requirements. The passive optics may be incorporated into a separate optical fiber pigtailed component that is attached between the active OTDR module and a fiber span under test.

IPC Classes  ?

  • G01M 11/00 - Testing of optical apparatus; Testing structures by optical methods not otherwise provided for

22.

LIGHT SOURCES WITH CHIP-LEVEL INTEGRATED DIFFUSERS

      
Application Number 18496096
Status Pending
Filing Date 2023-10-27
First Publication Date 2024-02-29
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Tatum, Jimmy A.
  • Guenter, James K.

Abstract

An embodiment includes a light source. The light source may include a substrate and a diffuser. The substrate may include a first surface and a second surface. The second surface may be opposite the first surface. The diffuser may be carried by the substrate. The diffuser may be configured to receive an optical signal from the substrate after the optical signal propagates through the substrate and to control a particular profile of a resultant beam of the optical signal over two axes after the optical signal propagates through the integrated diffuser.

IPC Classes  ?

  • G02B 5/02 - Diffusing elements; Afocal elements
  • G02B 3/00 - Simple or compound lenses
  • G02B 27/09 - Beam shaping, e.g. changing the cross-sectioned area, not otherwise provided for
  • H01S 5/0236 - Fixing laser chips on mounts using an adhesive
  • H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
  • H01S 5/42 - Arrays of surface emitting lasers

23.

METHOD FOR PRE-CALCULATING AND APPLYING OPTIMIZED PHASE PATTERNS TO LCOS SWITCH PANEL OF WSS MODULE

      
Application Number 17822306
Status Pending
Filing Date 2022-08-25
First Publication Date 2024-02-29
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Fennema, Alan A.
  • Yuan, Haijun
  • Nanita, Wilfredo C.
  • Correya, Oswald
  • Kelly, Jack R
  • Schwartz, Thomas J.

Abstract

Advanced hologram techniques pre-calculate holograms to be displayed on an LCoS switch panel of a wavelength selective switch (WSS) module. The holograms are generated offline and are then stored on the WSS module for later retrieval. Each of the holograms is associated with a defined parameter, such as an attenuation level, and each of the holograms is configured to create a reconfigurable phase grating profile or pattern of the pixels of the LCoS switch panel. Each phase pattern selectively directs desired diffraction orders of optical channels from the LCoS switch panel for output to selected ports and selectively directs undesired diffraction orders away from the ports and at a desired attenuation level. During operation, the WSS module can retrieve the stored holograms. Interpolation can determine intermediate holograms between parameter values, and a ramp function can be added to the pattern to account for steering adjustments.

IPC Classes  ?

  • H04Q 11/00 - Selecting arrangements for multiplex systems
  • G02B 5/32 - Holograms used as optical elements

24.

Under display illuminator with increased transmission efficiency and method of use thereof

      
Application Number 18094840
Grant Number 11914183
Status In Force
Filing Date 2023-01-09
First Publication Date 2024-02-27
Grant Date 2024-02-27
Owner II-VI Delaware, Inc. (USA)
Inventor
  • O'Daniel, Jason
  • Cai, Pei-Song
  • Schiattone, Francesco

Abstract

A display includes a stack that includes, from top to bottom: a display layer including an array of spaced pixels and/or spaced subpixels and an array of spaced transmission spaces, wherein each transmission space is defined by a spacing between a subset of the spaced pixels and/or spaced subpixels; a micro-lens array (MLA) layer including an array of micro-lenses, wherein each micro-lens includes a curved surface in alignment with a corresponding one of the transmission spaces; and a laser light emitting (LLE) layer including an array laser diodes, wherein each laser diode is positioned in alignment with one micro-lens of the MLA layer and the corresponding one of the transmission spaces of the display layer and the curved surfaces of the micro-lenses face the LLE layer.

IPC Classes  ?

  • F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
  • G06V 10/145 - Illumination specially adapted for pattern recognition, e.g. using gratings
  • H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

25.

Protecting Circuitry Under Laser Programmable Fuses

      
Application Number 17821294
Status Pending
Filing Date 2022-08-22
First Publication Date 2024-02-22
Owner II-VI Delaware, Inc. (USA)
Inventor Mclellan, Scott W.

Abstract

An integrated circuit has fuses that are selectively configurable by laser light having a wavelength incident on the fuses. A substrate of the integrated circuit has circuitry thereon. Fuses are disposed vertically above at least a portion of the circuitry. A dielectric reflector is disposed vertically above and laterally covers at least a portion of the circuitry. The dielectric reflector has a plurality of alternating dielectric layers of different refractive indices and is disposed adjacent to the fuses. The dielectric reflector is configured to reflect at least a portion of the laser light at the wavelength incident thereto.

IPC Classes  ?

  • H01L 23/525 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
  • H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials

26.

Laser System with Harmonics - Generation in the Visible and UV Spectral Range

      
Application Number 18234677
Status Pending
Filing Date 2023-08-16
First Publication Date 2024-02-22
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Ter-Mikirtychev, Valeri V.
  • Kearns, Nicholas Matthew
  • Cheeney, Joseph Earl
  • Kalinowski, Matthew Nicholas
  • Schumacher, Jens
  • Loiacono, Dominic Nicholas

Abstract

A laser system includes one or more harmonic generator blocks or elements including one or more crystals for converting a first wavelength (λ1) laser beam into second, third and/or fourth wavelength (λ2, λ3 and/or λ4) laser beams that may be output, with or without the first wavelength (λ1) laser beam, on different beam paths. One or more of the first, second, third and/or fourth wavelength laser beams may travel or traverse in a crystal in one or multiple directions.

IPC Classes  ?

  • H01S 3/109 - Frequency multiplication, e.g. harmonic generation
  • H01S 3/08 - Construction or shape of optical resonators or components thereof
  • G02F 1/355 - Non-linear optics characterised by the materials used
  • G02F 1/35 - Non-linear optics

27.

FOLDED HYBRID ASSEMBLY FOR DOPED FIBER AMPLIFIER

      
Application Number 18149512
Status Pending
Filing Date 2023-01-03
First Publication Date 2024-02-15
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Wu, Yuping
  • Jia, Chunyan
  • Chen, Han
  • Su, Xu
  • Huang, Xuchen

Abstract

An assembly is used with an amplifier that amplifies light using source light, pump light, and a doped fiber. The assembly has a plurality of ports, including a first port for input of the source light, a second port for input of the pump light, a third port for output to the doped fiber, a fourth port for input from the doped fiber, and a fifth port for amplified output. A birefringent device in optical communication with each of the ports is configured to refract o-light and e-light components of the light passing therethrough with different refractive indices. For the first and fourth ports, a first half-wave plate in optical communication through the birefringent device is configured to rotate polarization of the light passing therethrough with a first rotation. For the second port, a second half-wave plate in optical communication through the birefringent device is configured to rotate polarization of the light passing therethrough with a second rotation different from the first polarization. A lens is used to focus the light, and an optical filter in optical communication with the lens is configured to reflect the pump light back to the lens and being configured to pass the source light. A rotator in optical communication with the lens is configured to rotate polarization of the light passing therethrough with a third rotation. The third rotation is half of the first rotation, and the first rotation is half of the second rotation. Finally, a wedge reflector in optical communication with the rotator is configured to reflect the light incident thereto. The source light and the pump light are combined and communicated from the second port for output to the doped fiber. Meanwhile, amplified light from the doped fiber is received at the fourth port and is communicated to the amplified output. Reverse light from the amplified output can be isolated from reaching the doped fiber, and reverse source light from the doped fiber can be isolated from reaching the source port.

IPC Classes  ?

28.

VARIABLE RADIUS MIRROR

      
Application Number 18492346
Status Pending
Filing Date 2023-10-23
First Publication Date 2024-02-15
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Branigan, Kyle
  • Davis, Gregg E.
  • Schnur, Scott

Abstract

A variable radius mirror includes a mirror element having a deformable face with an outer surface incorporating a reflective element. The deformable face is deformable in response to a pressure applied by a pressure medium acting on an inner surface of the deformable face. A ring extends around a perimeter of the deformable face and protrudes from the inner surface of the deformable face. The mirror element further includes at least one of a plurality of steps recessed at different depths into the inner surface of the deformable face, a cooling cavity having a pair of manifolds between the outer surface and the inner surface of the deformable face, and a sidewall of the ring having a curved inner surface and a curved outer surface.

IPC Classes  ?

  • G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
  • G02B 26/06 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the phase of light

29.

CADMIUM REMOVAL IN LITHIUM-ION BATTERY RECYCLING

      
Application Number 18496481
Status Pending
Filing Date 2023-10-27
First Publication Date 2024-02-15
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Nazari, Ghazaleh
  • Abrenica, Gomer M.
  • Gluck, Eugen
  • Grimaldo, Mary Loisse
  • Pagulayan, Jolina
  • Gerona, Joseph Holden

Abstract

A battery recycling method removes impurities to ensure production of battery-grade materials. The method includes removing cadmium (Cd) from a pregnant leach solution before recovering valuable battery metals such as nickel (Ni), manganese (Mn), cobalt (Co), and lithium (Li). The removal of the Cd may be performed by precipitating an insoluble organo-complex by adding an organic compound material to the pregnant leach solution. The organic compound material may include one or more of organosulfur, organothiophosphate, benzothiazole compounds or derivatives, such as dithiophosphinate, dithiophosphate, and mercaptobenzothiazole, respectively.

IPC Classes  ?

  • C22B 3/00 - Extraction of metal compounds from ores or concentrates by wet processes
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 3/42 - Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction

30.

BANDWITH ENHANCED DFB+R LITE LASER

      
Application Number 17817394
Status Pending
Filing Date 2022-08-04
First Publication Date 2024-02-08
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Matsui, Yasuhiro
  • Verma, Ashish
  • Kwakernaak, Martin

Abstract

A distributed feedback plus reflection (DFB+R) laser includes an active section, a passive section, a low reflection (LR) mirror, and an etalon. The active section includes a distributed feedback (DFB) grating and is configured to operate in a lasing mode. The passive section is coupled end to end with the active section. The LR mirror is formed on or in the passive section. The etalon includes a portion of the DFB grating, the passive section, and the LR mirror. The lasing mode of the active section is aligned to a long-wavelength edge of a reflection peak of the etalon.

IPC Classes  ?

  • H01S 5/042 - Electrical excitation
  • H01S 5/125 - Distributed Bragg reflector [DBR] lasers
  • H01S 5/0625 - Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes in multi-section lasers
  • H01S 5/028 - Coatings
  • H01S 5/10 - Construction or shape of the optical resonator

31.

SHORT-WAVEBAND ACTIVE OPTICAL COMPONENT BASED ON VERTICAL EMITTING LASER AND MULTI-MODE OPTICAL FIBER

      
Application Number 18480455
Status Pending
Filing Date 2023-10-03
First Publication Date 2024-02-01
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Yu, Guanglong
  • Huang, Hong
  • Wang, Zihang

Abstract

A short-waveband active optical component based on a vertical emitting laser and a multi-mode optical fiber has an emitting end and a receiving end. In the emitting end, multiple VCSELs generate multiple optical signals of different wavelengths, and multiple photodiodes in the receiving end receive the optical signals emitted by the VCSELs. Both ends use a focusing lens array to collimate and focus the optical signals A Z-block-shaped prism performs a light combining function at the emitting end, while another Z-block-shaped prism performs a light splitting function at the receiving end. Both ends use a focusing lens for collimating and focusing the optical signals at ends of a multi-mode optical fiber, which is used for transmitting the optical signals generated by the VCSELs. The short-waveband active optical component has a small size and a high transmission rate.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
  • G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
  • H04B 10/2581 - Multimode transmission
  • H04B 10/50 - Transmitters
  • H04B 10/66 - Non-coherent receivers, e.g. using direct detection
  • H04J 14/02 - Wavelength-division multiplex systems
  • H04B 10/25 - Arrangements specific to fibre transmission

32.

MEMS OPTICAL SWITCH HAVING LOW INSERTION SWITCH LOSS

      
Application Number 18169112
Status Pending
Filing Date 2023-02-14
First Publication Date 2024-02-01
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Li, Yang
  • Chen, Lixun
  • Bai, Tianguo
  • Tang, Wade
  • Xu, Yunbing
  • Xue, Tingyu

Abstract

An optical switch includes an array of optical fibers to conduct optical signals. A biconvex lens has a front convex surface facing the fibers' tips and has a back convex surface facing a microelectromechanical (MEMS) mirror. The MEMS mirror can be selectively oriented to reflect the optical signals incident to the MEMS mirror so the optical signal input from one fiber can be selectively routed to another of the fibers.

IPC Classes  ?

  • G02B 6/35 - Optical coupling means having switching means
  • G02B 6/32 - Optical coupling means having lens focusing means
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)

33.

METHODS FOR ABERRATION CORRECTION IN HIGH NUMERICAL APERTURE OPTICAL SYSTEMS

      
Application Number 18350511
Status Pending
Filing Date 2023-07-11
First Publication Date 2024-01-25
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Plumridge, Jonathan
  • Stewart, Luke
  • Baxter, Glenn

Abstract

Described herein is a wavelength dispersive optical system (10). The system (10) comprises at least one optical input (12, 14, 16) for projecting an input optical beam comprising a plurality of individual wavelength components and at least one optical output (18) for receiving one or more output optical beams. The system (10) also includes a diffractive optical element (DOE) (1) including a substrate (2) and an array of physical diffraction elements (3). The diffraction elements (3) have a predefined spacing and/or curvature across a length of the DOE (1) and are collectively adapted to: i) spatially separate the individual wavelength components within the input optical beam to be formed into the one or more output optical beams; ii) impose predefined phase changes to the wavelength components to at least partially correct for optical aberrations to the input optical beam; and iii) impose predefined phase changes to the wavelength components to apply a wavelength dependent optical focusing to at least some of the wavelength components. The system (10) further includes an optical focusing element (5) having optical focusing properties complementary to the DOE (1) to modify the wavelength-dependent optical focusing of the wavelength components by the DOE (1).

IPC Classes  ?

34.

BOTTOM EMITTING VCSEL

      
Application Number 18480067
Status Pending
Filing Date 2023-10-03
First Publication Date 2024-01-25
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Guenter, James K.
  • Chen, Hao

Abstract

A VC SEL can include: a substrate that passes light therethrough; a phase matching layer over a top mirror stack; a first metal layer over the phase matching layer; and an end metal region over the first metal layer. The phase matching layer and first metal layer have a cooperative thickness to provide reflectivity of at least a predetermined reflectivity threshold for the emission wavelength. A method of making a VCSEL can include: providing a substrate; forming a first mirror stack above the substrate; forming an active region above the first mirror stack; and forming a reflective end above the active region, the reflective end having a phase matching layer and a first metal layer. The phase matching layer and first metal layer have a combined thickness for the reflective end to have a reflectivity of at least a predetermined reflectivity threshold for an emission wavelength of the VCSEL.

IPC Classes  ?

  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
  • H01S 5/343 - Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser

35.

LASERS WITH A COMPOSITE CAVITY OF TWO SEMICONDUCTORS

      
Application Number 18221242
Status Pending
Filing Date 2023-07-12
First Publication Date 2024-01-18
Owner II-VI Delaware, Inc. (USA)
Inventor Chen, Young-Kai

Abstract

A laser may include a lower semiconductor structure and an upper semiconductor structure. The lower semiconductor structure may include a lower waveguide along a top side of the lower semiconductor structure. The upper semiconductor structure may include an upper waveguide along a bottom side of the upper semiconductor structure. The upper semiconductor structure may be positioned over the top side of the lower semiconductor structure such that a first portion of the upper waveguide vertically overlaps a second portion of the lower waveguide. A coupler between the upper waveguide and the lower waveguide may couple optical energy of the upper waveguide to the lower waveguide. The lower waveguide may comprise semiconductor material having a wider bandgap than semiconductor material of the upper waveguide.

IPC Classes  ?

  • H01S 5/10 - Construction or shape of the optical resonator
  • H01S 5/125 - Distributed Bragg reflector [DBR] lasers

36.

PLANAR BURIED OPTICAL WAVEGUIDES IN SEMICONDUCTOR SUBSTRATE AND METHODS OF FORMING

      
Application Number 18221281
Status Pending
Filing Date 2023-07-12
First Publication Date 2024-01-18
Owner II-VI Delaware, Inc. (USA)
Inventor Chen, Young-Kai

Abstract

A method of forming a semiconductor device may include providing semiconductor substrate having a substrate top side and a dielectric layer along the substrate top side and forming a first mask layer over the dielectric layer. The method may include forming a lower cladding wall and an upper cladding wall via a first opening in the first mask layer. The method may also include forming a second mask layer over the dielectric layer and forming side cladding walls via second openings in the second mask layer. Various semiconductor devices having a buried waveguide in formed via the method are also disclosed.

IPC Classes  ?

  • G02B 6/134 - Integrated optical circuits characterised by the manufacturing method by substitution by dopant atoms
  • G02B 6/122 - Basic optical elements, e.g. light-guiding paths

37.

BONDED SUBSTRATE INCLUDING POLYCRYSTALLINE DIAMOND FILM

      
Application Number 18350284
Status Pending
Filing Date 2023-07-11
First Publication Date 2024-01-18
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Xu, Wen-Qing
  • Lan, Di
  • Koeppen, Christopher

Abstract

A wafer has a layer containing silicon, a layer of polycrystalline diamond deposited on the silicon-containing layer, and a bow-compensation layer on the other side of the silicon-containing layer for reducing wafer-bow. A method of making a bonded structure includes an activation process for creating dangling bonds on the surface of one substrate, followed by contact-bonding the surface to a second substrate at low temperature. A bonded structure may include two substrates contact bonded to each other, one substrate including a layer containing silicon, a layer of polycrystalline diamond, a bow-compensation layer for reducing wafer-bow of the first substrate, and the other substrate including gallium nitride, silicon carbide, lithium niobate, lithium tantalate, gallium arsenide, indium phosphide, or another suitable material other than diamond.

IPC Classes  ?

  • B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
  • B32B 38/00 - Ancillary operations in connection with laminating processes
  • B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only

38.

HAIRPIN WELDING AND INSPECTION FOR QUALITY ASSURANCE

      
Application Number 17811436
Status Pending
Filing Date 2022-07-08
First Publication Date 2024-01-11
Owner II-VI Delaware, Inc. (USA)
Inventor Müller, Alexander

Abstract

A method of welding and evaluating welds on stator hairpins includes obtaining first data representative of the ends of a first pair of stator hairpins by capturing image data representative of the ends, and processing the image data to obtain a data set representative of a rectangle which fully encloses the end surfaces of the stator hairpins. After the data set is saved, a laser may be used to form a weld on the end surfaces of the stator hairpins. Then, second data is obtained representative of the weld, and the weld is evaluated by comparing the second data to the data set. A system for welding and evaluating welds on the ends of stator hairpins is also disclosed. A digital camera may be used to capture data, and the laser may be used to form the welds on the stator hairpins.

IPC Classes  ?

  • B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
  • B23K 26/22 - Spot welding
  • B23K 26/03 - Observing, e.g. monitoring, the workpiece
  • H02K 15/00 - Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines

39.

Compact, Surface-Mounted VCSEL Illuminators

      
Application Number 17848843
Status Pending
Filing Date 2022-06-24
First Publication Date 2023-12-28
Owner II-VI Delaware, Inc. (USA)
Inventor
  • O'Daniel, Jason
  • Cai, Pei-Song
  • Liu, Hong-Zhi
  • Schiattone, Francesco

Abstract

VCSEL-based flood illuminators are fabricated to be compact and surface-mounted devices. A substrate is constructed as a panel array having top and bottom electrodes. Individual ones of the VCSEL dies are mounted in electrical communication with pairs of the top electrodes. The VCSEL dies are encased in an encasement disposed on the top surface of the substrate, and a diffuser structure is nano-imprinted adjacent each of the VCSEL dies. The encasement can use a potting resin and a polymer layer. The potting resin encases the VCSEL dies. The polymer layer is softer and is disposed on the potting resin. Nanoimprint lithography forms the diffuser structures in the polymer layer. The panel array is then singulated to form the individual VCSEL-based flood illuminators.

IPC Classes  ?

  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

40.

Oxide Aperture Shaping In Vertical Cavity Surface-Emitting Laser

      
Application Number 18229317
Status Pending
Filing Date 2023-08-02
First Publication Date 2023-12-21
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Hoser, Mirko
  • Jakubowicz, Abram
  • Leinonen, Tomi

Abstract

A mesa structure for a VCSEL device is particularly configured to compensate for variations in the shape of the created oxide aperture that result from anisotropic oxidation. In particular, a suitable mesa shape is derived by determining the shape of an as-created aperture formed by oxidizing a circular mesa structure, and then ascertaining the compensation required to convert the as-created shape into a desired (“target”) shaped aperture opening. The compensation value is then used to modify the shape of the mesa itself such that a following anisotropic oxidation yields a target-shaped oxide aperture.

IPC Classes  ?

  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
  • H01S 5/30 - Structure or shape of the active region; Materials used for the active region
  • H01S 5/20 - Structure or shape of the semiconductor body to guide the optical wave

41.

ADDITIVE MANUFACTURE IN METALS WITH A FIBER ARRAY LASER SOURCE AND ADAPTIVE MULTI-BEAM SHAPING

      
Application Number 18457741
Status Pending
Filing Date 2023-08-29
First Publication Date 2023-12-21
Owner II-VI Delaware, Inc. (USA)
Inventor Vorontsov, Mikhail A.

Abstract

A system that uses a scalable array of individually controllable laser beams that are generated by a fiber array system to process materials into an object. The adaptive control of individual beams may include beam power, focal spot width, centroid position, scanning orientation, amplitude and frequency, piston phase and polarization states of individual beams. Laser beam arrays may be arranged in a two dimensional cluster and configured to provide a pre-defined spatiotemporal laser power density distribution, or may be arranged linearly and configured to provide oscillating focal spots along a wide processing line. These systems may also have a set of material sensors that gather information on a material and environment immediately before, during, and immediately after processing, or a set of thermal management modules that pre-heat and post-heat material to control thermal gradient, or both.

IPC Classes  ?

  • B23K 26/342 - Build-up welding
  • G02B 6/02 - Optical fibres with cladding
  • B23K 26/70 - Auxiliary operations or equipment
  • B29C 64/10 - Processes of additive manufacturing
  • B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
  • B33Y 50/00 - Data acquisition or data processing for additive manufacturing

42.

EDGE RATE (RISE AND FALL TIME) CONTROLLED SEGMENTED LASER DRIVER

      
Application Number 17806987
Status Pending
Filing Date 2022-06-15
First Publication Date 2023-12-21
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Jones, Theron
  • Davis, Richard A.
  • Carey, Brian
  • Yeung, Michael
  • Troyer, Steve
  • Ashbrook, Jonathan

Abstract

An optical driver circuit is described herein having a plurality of drive cells and delay segments between their control signals resulting in the control of the rising and falling edge rates for an optical device driven by the optical driver circuit.

IPC Classes  ?

  • H01S 5/042 - Electrical excitation
  • H03K 5/133 - Arrangements having a single output and transforming input signals into pulses delivered at desired time intervals using a chain of active-delay devices

43.

ELECTRODES WITH CRACKS

      
Application Number 18323952
Status Pending
Filing Date 2023-05-25
First Publication Date 2023-12-07
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Lu, Xinyu
  • Xu, Wen-Qing

Abstract

This disclosure is directed an electrode and methods of making an electrode. The electrode includes a substrate and a body laminated to the substrate. The body includes an active material and an inactive material. A plurality of pores are defined by the body. A plurality of cracks are defined in a first surface of the body and a plurality of islands are defined in the first surface of the body. The plurality of cracks are wholly or partially surrounded by respective cracks of the plurality of cracks.

IPC Classes  ?

  • H01M 4/1391 - Processes of manufacture of electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
  • H01M 4/04 - Processes of manufacture in general
  • H01M 4/131 - Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx

44.

TUNABLE OPTICAL WEDGE FOR REDUCING CROSSTALK IN WAVELENGTH SELECTIVE SWITCH

      
Application Number 17805342
Status Pending
Filing Date 2022-06-03
First Publication Date 2023-12-07
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Chen, Helen
  • Jiang, Guomin
  • Li, Tom
  • Wang, Lawrence
  • Yuan, Jim

Abstract

In a wavelength selective switch, an input port transmits an input beam, and diffraction grating disperses the input beam into optical channels. A liquid-crystal-on-silicon (LCoS) switch assembly has a phase grating profile and has addressable pixels, which are liquid crystal based. The LCoS switch assembly can selectively direct first-order diffracted beams of the optical channels for output to selected output ports. A tunable optical wedge adjacent the LCoS switch assembly can direct higher-order diffraction beams in the space between the output ports to reduce crosstalk. The wedge is a liquid crystal cell having spaced-apart resistive layers and having liquid crystal material disposed between the layers. In the wedge, the liquid crystal material can produce a phase profile in response to bias voltages applied to the resistive layers, and a beam steering angle of the phase profile can direct at least the second-order diffracted beams towards the port spacing between the ports.

IPC Classes  ?

  • G02F 1/29 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
  • G02F 1/313 - Digital deflection devices in an optical waveguide structure
  • H04J 14/02 - Wavelength-division multiplex systems
  • H04Q 11/00 - Selecting arrangements for multiplex systems

45.

OPTOELECTRONIC DEVICE HAVING ATTENUATING LENS BLOCK AND SOURCE MONITORING

      
Application Number 18061356
Status Pending
Filing Date 2022-12-02
First Publication Date 2023-12-07
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Zhang, Mengfei
  • Xie, Yichun
  • Zhang, Ranran
  • Shao, Cuiyan
  • Li, Yang
  • Wu, Wen
  • Yang, Hui

Abstract

An optoelectronic device is used with an optical fiber for data transmission and has a transmitter mounted on a printed circuit board (PCB) to emit light. A collimation lens on a lens block receives the light incident thereto. A microstructure on a reflective surface of the lens block has sections that reflect the light into attenuated portions. A focusing lens on the lens block focuses a first attenuated portion from first sections of the reflective surface to the optical fiber. Meanwhile, second sections of the reflective surface reflect a second attenuated portion to another reflective surface on the lens block. The second attenuated portion passes out of a refractive surface on the lens block to an receiver, which is mounted on the PCB adjacent the transmitter. The second attenuated portion of the light can be used to monitor the optical output of the transmitter.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H01S 5/42 - Arrays of surface emitting lasers

46.

HYDROMETALLURGICAL PROCESS FOR LITHIUM-ION BATTERY WASTE RECYCLING

      
Application Number 17804337
Status Pending
Filing Date 2022-05-27
First Publication Date 2023-11-30
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Nazari, Ghazaleh
  • Abrenica, Gomer

Abstract

Valuable metal compounds and a useful by-product are recovered, with high yield, from lithium-ion battery waste, without otherwise generating effluent. One or more metal sulfate solution may be used to scrub the metals from organic extractants. The sulfates may be produced in one or more evaporation/crystallization units downstream from precipitation and dissolution units. An organic extractant may be used to extract a metal of interest and other metals from feed material, scrub the other metals from the organic extractant, strip the metal of interest from the organic extractant, and recycle the extractant. An evaporation/crystallization unit may be used to output the metal of interest, while a return line transports a metal sulfate mother liquor from the evaporation/crystallization unit (after hydroxide precipitation and dissolution for purification) for use in scrubbing the other metals from the organic extractant after pH and metal concentration adjustment.

IPC Classes  ?

  • C22B 3/26 - Treatment or purification of solutions, e.g. obtained by leaching by liquid-liquid extraction using organic compounds
  • C22B 26/12 - Obtaining lithium
  • C22B 3/00 - Extraction of metal compounds from ores or concentrates by wet processes

47.

CURRENT LOAD-CONTROLLED LASER DRIVER

      
Application Number 17804792
Status Pending
Filing Date 2022-05-31
First Publication Date 2023-11-30
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Jones, Theron
  • Davis, Richard
  • Carey, Brian
  • Yeung, Michael

Abstract

Laser circuits are disclosed herein that include, in one example, a proxy laser drive cell and a proxy comparator circuit for deriving a laser driver bias control using one or more constant current supplies. Comparator circuits are disclosed that are adapted to generate an output based on a proxy voltage having first and second voltage components wherein one of the voltage components is developed based on one or more constant current supplies indicative of laser control current.

IPC Classes  ?

  • H01S 5/042 - Electrical excitation
  • H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

48.

Laser Beam Brilliance Enhancing Beam Splitting for Laser Welding/Brazing

      
Application Number 17827905
Status Pending
Filing Date 2022-05-30
First Publication Date 2023-11-30
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Jonkers, Jeroen
  • Koehler, Gunnar
  • Sonntag, Paul

Abstract

A laser processing head can be used for joining (e.g., welding, brazing, soldering, etc.) workpieces. A collimator collimates laser light, which passes to a beam splitter. The beam splitter has anti-reflective and high-reflective coatings on peripheral and inner areas of the beam splitter. The beam splitter splits the collimated light into central or inner light from the inner area and peripheral light from the peripheral area. A main output in communication with the beam splitter directs at least the peripheral light into a main beam toward the workpieces. For example, a cable can feed a brazing wire adjacent the main beam for brazing the workpieces together. Meanwhile, a secondary output in communication with the beam splitter directs at least the central light into a secondary beam, which can be used to pre-heat the workpiece, post-heat the workpiece, or remove any surface coating from the workpiece.

IPC Classes  ?

  • B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K 1/005 - Soldering by means of radiant energy
  • B23K 26/073 - Shaping the laser spot

49.

STREAMLINED LITHIUM-ION BATTERY WASTE RECYCLING

      
Application Number 18323631
Status Pending
Filing Date 2023-05-25
First Publication Date 2023-11-30
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Nazari, Ghazaleh
  • Abrenica, Gomer

Abstract

A process for recovering and purifying nickel (Ni), manganese (Mn), cobalt (Co), and lithium (Li) from black mass obtained from recycling of lithium-ion batteries to produce high purity products. The process may include reductive acid leaching, impurity removal, precipitation of valuable metals such as Ni, Co, Mn, and Li. The process may also include recycling of Li compounds as hydroxide or carbonate as a source of alkaline reagent for impurity removal and/or precipitation of the valuable metals.

IPC Classes  ?

  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators
  • C22B 47/00 - Obtaining manganese
  • C22B 3/00 - Extraction of metal compounds from ores or concentrates by wet processes
  • C22B 26/12 - Obtaining lithium
  • C22B 3/42 - Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof

50.

WAVELENGTH-TUNED SLED USED AS OPTICAL SOURCE FOR ULTRA-WIDEBAND WAVELENGTH REFERENCE

      
Application Number 17826523
Status Pending
Filing Date 2022-05-27
First Publication Date 2023-11-30
Owner II-VI Delaware, Inc. (USA)
Inventor Cahill, Michael John Laurence

Abstract

A wavelength reference device can be used to self-calibrate an optical channel monitor. The device includes a broadband source, a thermal source, and an optical filter, which can include one or more filters. A housing can house each of these components or can house at least the broadband source and thermal source. The broadband source emits an optical signal along an optical path. The thermal source in thermal communication with the broadband source can adjust the operating temperature of the broadband source within a temperature range. The temperature range is configured to shift optical power of the broadband source with respect to a multi-band wavelength division multiplexing (WDM) range such that the optical power meets a minimum power level towards lower and higher frequencies of the range. The optical filter(s) positioned in the optical path can filter the optical signal to create a spectral shape for use in wavelength referencing.

IPC Classes  ?

  • H04J 14/02 - Wavelength-division multiplex systems
  • H04B 10/079 - Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal

51.

Wavelength Reference Having Repeating Spectral Features and Unique Spectral Features

      
Application Number 17826608
Status Pending
Filing Date 2022-05-27
First Publication Date 2023-11-30
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Cahill, Michael John Laurence
  • Bartolini, Glenn D.

Abstract

A wavelength reference device includes a broadband optical source, a repeating filter, and a wavelength-specific filter. The source, which can be a super-luminescent light-emitting diode (SLED), emits optical power. The repeating filter, which can be a Fabray-Perot etalon, filters the optical power into a repeating spectral response, and the wavelength-specific filter attenuates the optical power of at least one predefined wavelength response within the wavelength band. The repeating filter and the wavelength-specific filter output a wavelength reference signal having the repeating spectral response attenuated at the at least one predefined wavelength response. The predefined wavelength response reduces the ambiguity that can occur in the repeating frequency locations found in the repeating spectral response. In this way, an absolute wavelength reference is intrinsically provided in the wavelength reference that removes the location ambiguity caused by the repeating spectral response.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H04J 14/02 - Wavelength-division multiplex systems
  • G02B 6/02 - Optical fibres with cladding
  • G02B 5/28 - Interference filters
  • H04B 10/67 - Optical arrangements in the receiver

52.

REACTION-BONDED SILICON-CARBIDE WITH IN-SITU FORMED SILICON LAYER FOR OPTICAL FINISHING

      
Application Number 17663956
Status Pending
Filing Date 2022-05-18
First Publication Date 2023-11-23
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Wang, Jiwen
  • Aghajanian, Mike
  • Coombs, Nicholas
  • Coppola, Jonathan
  • Corona, Kayano

Abstract

A mirror device includes a multi-phase substrate and a single-phase layer. The multi-phase layer is formed of reaction-bonded silicon-carbide (RB-SiC, or Si/SiC) material. The single-phase layer is formed of elemental silicon. The single-phase layer is formed in-situ, that is, contemporaneously with, the formation of RB-SiC material. The single-phase layer is integrally bonded, as one piece, to silicon of the multi-phase substrate. Methods of making a multi-layer device, such as a mirror device, are also described. One such method includes providing a porous mass of silicon carbide and carbon, causing molten elemental silicon to infiltrate the porous mass to form RB-SiC material, simultaneously causing the silicon to flow into a cavity to form a single-phase layer of polishable silicon, integrally bonding silicon in the cavity to the RB-SiC material, and, if desired, polishing a surface of the single-phase layer.

IPC Classes  ?

  • C04B 41/45 - Coating or impregnating
  • G02B 1/02 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semiconductors
  • G02B 5/08 - Mirrors
  • B24B 13/00 - Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
  • C04B 35/573 - Fine ceramics obtained by reaction sintering
  • C04B 41/00 - After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
  • C04B 41/91 - After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching

53.

ICE FORMATION

      
Application Number 18358599
Status Pending
Filing Date 2023-07-25
First Publication Date 2023-11-16
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Moczygemba, Joshua
  • Mefford, Jason

Abstract

A frozen substance maker may include a heat pump, a cold plate, a mold base, a mold top, and an agitator. The cold plate may be in thermal communication with the heat pump. The mold base may be positioned o the cold plate. The mold base and the cold plate may define a seed crystal chamber. The mold top may be positioned on the mold base. The mold base and the mold top may define a mold cavity in fluid communication with the seed crystal chamber. The mold top may define an overflow reservoir in fluid communication with the mold chamber. The agitator may be located at least partially within the overflow reservoir.

IPC Classes  ?

  • F25C 1/20 - Producing ice of a particular transparency or translucency, e.g. by injecting air by agitation
  • F25C 1/04 - Producing ice by using stationary moulds
  • F25C 5/08 - Apparatus for disintegrating, removing or harvesting ice without the use of saws by heating bodies in contact with the ice

54.

OPTICAL FIBER FILTER WITH ULTRA-WIDE TUNING RANGE

      
Application Number 18360640
Status Pending
Filing Date 2023-07-27
First Publication Date 2023-11-16
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Hu, Yongkang
  • Tan, Ketang

Abstract

An optical fiber filter has an ultra-wide tuning range and includes a two-dimensional mechanical rotating mirror, a collimating and beam expanding system, and two grating. An input fiber emits a multi-wavelength optical signal into the rotating mirror, which reflects the signal to the system to form collimated beams. In turn, the collimated beams are incident on the gratings that disperse the light of different wavelengths to different angles. Lights of different diffraction angles are input into an output fiber by adjusting the rotating mirror. The rotating mirror can be used to switch between gratings of different wavebands to tune optical wavelengths in an ultra-wide range.

IPC Classes  ?

  • G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means

55.

Composite Extractant-Enhanced Polymer Resin, Method of Making the Same, and Its Usage for Extraction of Valuable Metal(s)

      
Application Number 17248839
Status Pending
Filing Date 2021-02-10
First Publication Date 2023-11-09
Owner II-VI Delaware, Inc (USA)
Inventor
  • Xu, Wen-Qing
  • Mattera, Jr., Vincent D.
  • Abella, Marie Ysabel
  • Abrenica, Gomer M.
  • Patkar, Shailesh

Abstract

A composite extractant-enhanced polymer resist comprising an extractant and a polymer resin for direct extraction of valuable metals such as rare earth metals, and more specifically, scandium, Born an acid-leaching slurry and/or acid-leaching solution in which ferric ions are not required to be reduced into ferrous ions. The extractant may be cationic, non-ionic, or anionic. More specifically, the extractant di(2-ethylhexyl)phosphoric acid may be used. The polymer resin may be non-functional or have functional groups of sulfonic acid, carboxylic acid, iminodiacetic acid, phosphoric acid, or amines. The composite extractant-enhanced polymer resin may be used for extraction of rare earth metals from acid-leaching slurries or solutions.

IPC Classes  ?

  • B01J 39/05 - Processes using organic exchangers in the strongly acidic form
  • C22B 59/00 - Obtaining rare earth metals
  • B01J 49/06 - Regeneration or reactivation of ion-exchangers; Apparatus therefor of fixed beds containing cationic exchangers
  • C22B 3/38 - Treatment or purification of solutions, e.g. obtained by leaching by liquid-liquid extraction using organic compounds containing phosphorus
  • B01J 39/16 - Organic material
  • B01J 49/53 - Regeneration or reactivation of ion-exchangers; Apparatus therefor characterised by the regeneration reagents for cationic exchangers
  • B01J 20/32 - Impregnating or coating
  • B01J 20/22 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising organic material
  • C01F 17/10 - Preparation or treatment, e.g. separation or purification
  • B01J 47/016 - Modification or after-treatment of ion-exchangers
  • B01J 47/011 - Ion-exchange processes in general; Apparatus therefor using batch processes
  • B01J 39/18 - Macromolecular compounds
  • B01J 47/02 - Column or bed processes
  • C22B 3/42 - Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction

56.

TUNABLE SEMICONDUCTOR LASER DEVICE

      
Application Number 18307429
Status Pending
Filing Date 2023-04-26
First Publication Date 2023-11-09
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Wesstroem, Jan-Olof
  • Granestrand, Per

Abstract

A laser device includes front and back DBRs and an interferometer. The front DBR is coupled to a front DBR electrode. The front DBR forms a first tunable multi-peak lasing filter. The back DBR is coupled to a back DBR electrode. The back DBR forms a second tunable multi-peak lasing filter. The interferometer part is coupled between the front DBR and the back DBR. The interferometer part includes first and second waveguide combiners and first and second interferometer waveguides coupled therebetween. The first waveguide combiner couples the interferometer part to the back DBR. The second waveguide combiner couples the interferometer part to the front DBR. The first interferometer waveguide is coupled to an interferometer electrode. The interferometer forms a third tunable multi-peak lasing filter.

IPC Classes  ?

  • G01S 7/481 - Constructional features, e.g. arrangements of optical elements
  • H01S 5/125 - Distributed Bragg reflector [DBR] lasers
  • H01S 5/12 - Construction or shape of the optical resonator the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
  • H01S 5/50 - Amplifier structures not provided for in groups
  • H01S 5/068 - Stabilisation of laser output parameters

57.

BLIND PUMP LASER DETECTION

      
Application Number 18311379
Status Pending
Filing Date 2023-05-03
First Publication Date 2023-11-09
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Zhu, Zhiqian
  • Mcclean, Ian Peter
  • Fu, Yongjun
  • Gu, Yongshi

Abstract

An EDFA may include an input photodiode configured to generate a control signal based on an input signal. The EDFA may include a blind stage configured to generate an amplified signal based on the control signal and the input signal. The EDFA may include a non-blind stage configured to generate an output signal based on the amplified signal within the blind stage, the control signal, and a feedback signal. The EDFA may include a filter configured to generate a filtered signal based on the output signal. The EDFA may include an output photodiode configured to generate the feedback signal based on the filtered signal. The EDFA may include an alarm device. A signal within the non-blind stage may be generated based on the feedback signal and the control signal. The alarm device may be configured to generate an alarm signal when the signal exceeds a threshold value.

IPC Classes  ?

  • H01S 3/13 - Stabilisation of laser output parameters, e.g. frequency or amplitude
  • G01R 19/165 - Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
  • H01S 3/067 - Fibre lasers
  • H01S 3/16 - Solid materials
  • H01S 3/10 - Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
  • H01S 3/094 - Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light

58.

DUAL GRATING-COUPLED LASERS

      
Application Number 18355103
Status Pending
Filing Date 2023-07-19
First Publication Date 2023-11-09
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Lin, Shiyun
  • Mahgerefteh, Daniel

Abstract

In an example embodiment, a system includes a first grating-coupled laser (GCL) that includes a first laser cavity optically coupled to a first transmit grating coupler configured to redirect horizontally-propagating first light, received from the first laser cavity, vertically downward and out of the first GCL. The system also includes a second GCL that includes a second laser cavity optically coupled to a second transmit grating coupler configured to transmit second light vertically downward and out of the second GCL. The system also includes a photonic integrated circuit (PIC) that includes a first receive grating coupler optically coupled to a first waveguide and configured to receive the first light and couple the first light into the first waveguide. The PIC also includes a second receive grating coupler optically coupled to a second waveguide and configured to receive the second light and couple the second light into the second waveguide.

IPC Classes  ?

  • H01S 5/187 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL] using Bragg reflection
  • G02B 6/124 - Geodesic lenses or integrated gratings
  • G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
  • G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
  • H01S 5/10 - Construction or shape of the optical resonator
  • H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
  • H01S 5/00 - Semiconductor lasers

59.

Doped Fiber Amplifier Having Pass-Through Pump Laser

      
Application Number 18344389
Status Pending
Filing Date 2023-06-29
First Publication Date 2023-11-02
Owner II-VI Delaware, Inc (USA)
Inventor
  • Mcclean, Ian Peter
  • Zayer, Nadhum Kadhum
  • Williams, Martin Richard

Abstract

An amplifier operable with an electric drive signal can amplify signal light having a signal wavelength. A laser diode has an active section with input and output facets. The facets are in optical communication with the signal light and are configured to pass the signal light through the laser diode. The active section is configured to generate pump light in response to injection of the electrical drive signal into the active section. The pump light has a pump wavelength different from the signal wavelength. A doped fiber doped with an active dopant is in optical communication with the signal light and is in optical communication with at least a portion of the pump light from the laser diode. The pump wavelength of the pump light is configured to interact with the active dopant of the fiber and thereby amplify the signal light.

IPC Classes  ?

  • H01S 3/0941 - Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a semiconductor laser, e.g. of a laser diode
  • H01S 3/067 - Fibre lasers
  • H01S 3/16 - Solid materials
  • H01S 3/094 - Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
  • H01S 5/50 - Amplifier structures not provided for in groups

60.

OPTICAL LINK TIME-OF-FLIGHT AND TRAFFIC LATENCY DETERMINATION USING OPTICAL TRANSCEIVER

      
Application Number 18350353
Status Pending
Filing Date 2023-07-11
First Publication Date 2023-11-02
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Deandrea, John J.
  • Di Blasio, Massimo

Abstract

A method for determining timing information in an optical communication link includes transmitting a falling edge from a transceiver positioned at a near end of the optical communication link and simultaneously starting a first timer at the transceiver positioned at the near end of the link. The transmitted falling edge is received at a transceiver positioned at a far end of the link. A falling edge is transmitted from the transceiver positioned at the far end of the link after a response delay. The transmitted falling edge is received at the transceiver positioned at the near end of the link while the first timer is simultaneously terminated at the transceiver positioned at the near end of the link and the elapsed time is recorded. The total link delay is determined based on the elapsed time.

IPC Classes  ?

  • H04B 10/077 - Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal using a supervisory or additional signal
  • H04L 43/0852 - Delays
  • H04B 10/079 - Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal

61.

IMMOBILIZED CHALCOGEN AND USE THEREOF IN A RECHARGEABLE BATTERY

      
Application Number 18344221
Status Pending
Filing Date 2023-06-29
First Publication Date 2023-10-26
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Xu, Wen-Qing
  • Eissler, Elgin E.
  • Li, Xiaoming
  • Xu, Chengkun
  • Moore, Colin
  • Patkar, Shailesh
  • Koeppen, Christopher S.

Abstract

An immobilized chalcogen system or body includes a mixture or combination of chalcogen and carbon. The carbon can be in the form of a carbon skeleton. The chalcogen can include oxygen, sulfur, selenium, or tellurium, or a combination of any two or more of oxygen, sulfur, selenium, and tellurium. The activation energy for chalcogen to escape the immobilized chalcogen system or body is ≥96 kJ/mole.

IPC Classes  ?

  • H01M 4/58 - Selection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys
  • H01M 10/0566 - Liquid materials
  • H01M 50/109 - Primary casings, jackets or wrappings of a single cell or a single battery characterised by their shape or physical structure of button or coin shape
  • H01M 50/105 - Pouches or flexible bags
  • C01B 32/05 - Preparation or purification of carbon not covered by groups , , ,

62.

POLARIZATION-MAINTAINING WAVELENGTH SELECTIVE SWITCH FOR FREE-SPACE OPTICAL COMMUNICATION

      
Application Number 18335779
Status Pending
Filing Date 2023-06-15
First Publication Date 2023-10-26
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Clarke, Ian G.
  • Di Blasio, Massimo

Abstract

A free-space optical communication system has a conversion assembly, a fiber array, and a wavelength selective switch (WSS) assembly. The conversion assembly converts circular polarization states of incoming optical signals to linear polarization states and converts linear polarization states to circular polarization states for outgoing optical signals. The fiber array has polarization-maintaining (PM) optical fibers arranged in optical communication between the conversion assembly and the WSS assembly to preserve the linear polarization states of the optical signals. The WSS assembly has free-space optics, such as dispersion element and beam-steering element, with optical axes arranged relative to the PM optical fibers. The WSS assembly selectively switches WDM channels of the optical signals relative to the PM optical fibers. Fast and slow axes of the PM optical fibers are aligned to the optical axes of the free-space optics.

IPC Classes  ?

  • H04J 14/02 - Wavelength-division multiplex systems
  • H04B 10/11 - Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
  • H04B 10/2507 - Arrangements specific to fibre transmission for the reduction or elimination of distortion or dispersion

63.

MEMS-BASED VARIABLE OPTICAL ATTENUATOR ARRAY

      
Application Number 18344015
Status Pending
Filing Date 2023-06-29
First Publication Date 2023-10-26
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Jia, Chunyan
  • Xiao, Peng
  • Song, Zhihua
  • Liu, Yingying
  • Hua, Jin'E

Abstract

The present disclosure provides a MEMS -based variable optical attenuator (VOA) array, sequentially including an optical fiber array, a micro-lens array, and a MEMS-based micro-reflector array to form a VOA array having several optical attenuation units. The MEMS-based micro-reflectors can change the propagation direction of a beam, causing a misalignment coupling loss to the beam and thereby achieving optical attenuation, with a broad range of dynamic attenuation, low polarization dependent loss and wavelength dependent loss, good repeatability, short response time (at the millisecond level), etc. Arrayed device elements are used as assembly units of the present disclosure, and the assembly of arrayed elements facilitates tuning in batches. Accordingly, automation levels are improved, and the production costs are reduced.

IPC Classes  ?

  • G02B 6/35 - Optical coupling means having switching means
  • G02B 6/26 - Optical coupling means

64.

ADDITIVE MANUFACTURING IN METALS WITH A FIBER ARRAY LASER SOURCE AND ADAPTIVE MULTI-BEAM SHAPING

      
Application Number 18345801
Status Pending
Filing Date 2023-06-30
First Publication Date 2023-10-26
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Vorontsov, Mikhail A.
  • Ataei, Abtin

Abstract

A system that uses a scalable array of individually controllable laser beams that are generated by a fiber array system to process materials into an object. The adaptive control of individual beams may include beam power, focal spot width, centroid position, scanning orientation, amplitude and frequency, of individual beams. Laser beam micro scanner modules (MSMs) are arranged into 2D arrays or matrices. During operation of the MSMs, a fiber tip that projects the laser beam is displaced along the x and y-axis in order to scan the focal spot. Each MSM within a matrix can process a corresponding cell (e.g., one square centimeter) during focal spot scanning, and the plurality of MSMs may be operated in parallel to process a plurality of corresponding cells (e.g., with a 10×10 matrix of MSM, 100 cm2) without rastering or otherwise repositioning the assembly over the build surface.

IPC Classes  ?

  • B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
  • B29C 64/153 - Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
  • B29C 64/236 - Driving means for motion in a direction within the plane of a layer
  • B29C 64/268 - Arrangements for irradiation using electron beams [EB]
  • B23K 26/08 - Devices involving relative movement between laser beam and workpiece
  • B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
  • B29C 64/245 - Platforms or substrates

65.

CONTINUOUS REPLENISHMENT CRYSTAL GROWTH

      
Application Number 18340462
Status Pending
Filing Date 2023-06-23
First Publication Date 2023-10-19
Owner II-VI Delaware, Inc. (USA)
Inventor Stoddard, Nathan

Abstract

An apparatus for growing a crystal includes a growth chamber and a melt chamber thermally isolated from the growth chamber. The growth chamber includes: a growth crucible configured to contain a liquid melt; and a die located in the growth crucible, the die having a die opening and one or more capillaries extending from within the growth crucible toward the die opening. The melt chamber includes: a melt crucible configured to receive feedstock material; and at least one heating element positioned within the melt chamber relative to the melt crucible to melt the feedstock material within the melt crucible to form the liquid melt. The apparatus also includes at least one capillary conveyor in fluid communication with the melt crucible and the growth crucible to transport the liquid melt from the melt crucible to the growth crucible.

IPC Classes  ?

  • C30B 35/00 - Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
  • C30B 15/10 - Crucibles or containers for supporting the melt
  • C30B 15/14 - Heating of the melt or the crystallised materials

66.

PARTIALLY ETCHED REFLECTION-MODIFICATION LAYER

      
Application Number 18316881
Status Pending
Filing Date 2023-05-12
First Publication Date 2023-10-19
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Iazikov, Dmitri
  • Mossberg, Thomas W.
  • Greiner, Christoph M.
  • Alavi, David S.

Abstract

An optical element includes a transmissive layer arranged on a substrate and made up of discrete volumes of first and second optical media. The layer is between the substrate and another optical medium. The volumes are arranged so that, averaged over a wavelength’s distance of an incident optical signal, the effective reflectivities of the two surfaces of the transmissive layer and the effective double-pass phase delay through the transmissive layer are substantially constant across the transmissive layer. The reflectivities and phase delay result in net power reflectivity that differs from that of the substrate in direct contact with the other optical medium. The transmissive layer can be arranged as an anti-reflection layer.

IPC Classes  ?

67.

LASER-ROUGHENED REACTION-BONDED SILICON CARBIDE FOR WAFER CONTACT SURFACE

      
Application Number 17656481
Status Pending
Filing Date 2022-03-25
First Publication Date 2023-10-12
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Coombs, Nicholas
  • Coppola, Jon
  • Aghajanian, Mike
  • Chriss, Aaron

Abstract

A method of making a ceramic device with a controlled roughness includes using a defocused laser beam to roughen a surface of a ceramic substrate, and removing one or more portions of the roughened surface without removing all of the roughened surface. If desired, the ceramic device may include reaction-bonded silicon carbide, and an opening may be formed in the device so that the device can be used to apply a clamping suction to a wafer surface. A ceramic surface with a controlled roughness is also disclosed. The defocused laser beam may be used to make the surface rough enough to prevent it from sticking to a mating element, and to have adequate wear resistance, but not so rough as to prevent the formation of sufficient suction to clamp the surface to a mating element.

IPC Classes  ?

  • B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
  • B25J 15/06 - Gripping heads with vacuum or magnetic holding means
  • B23K 26/352 - Working by laser beam, e.g. welding, cutting or boring for surface treatment

68.

ARTICULATING DOME GIMBAL ASSEMBLY

      
Application Number 17658749
Status Pending
Filing Date 2022-04-11
First Publication Date 2023-10-12
Owner II-VI Delaware, Inc. (USA)
Inventor Canzian, Blaise J.

Abstract

A dome protects an articulating gimbal that orients a line-of-sight of a laser beam. The dome is mounted on a host and encloses the articulating gimbal. The dome has first and second shells. The first shell is rotatable about a first axis relative to the host, and the second shell is disposed on the first shell and is rotatable about a second axis relative to the first shell. A first actuator is coupled to the first shell and is configured to rotate the first shell about the first axis relative to the host. A second actuator is coupled to the second shell and is configured to rotate the second shell about the second axis relative to the first shell. A controller is coupled to the first and second actuators and is configured to match the rotation of the first and second shells to the line-of-sight of the laser beam.

IPC Classes  ?

  • F21V 14/00 - Controlling the distribution of the light emitted by adjustment of elements
  • F21V 3/00 - Globes; Bowls; Cover glasses
  • F21V 21/30 - Pivoted housings or frames

69.

SILVER-DOPED SULFUR CATHODE MATERIAL FOR RECHARGEABLE LITHIUM BATTERY

      
Application Number 17658533
Status Pending
Filing Date 2022-04-08
First Publication Date 2023-10-12
Owner II-VI Delaware, Inc. (USA)
Inventor Nazari, Ghazaleh

Abstract

An active cathode material is doped with silver to effectively improve the cathode's electrical conductivity. The active material may be sulfur, and the silver may be in the form of silver, silver sulfide, or both. If desired, the cathode material includes a matrix of conductive nano-particles which include elemental sulfur, silver and or silver sulfide. The present disclosure may be applicable to other battery materials as well, such as, for example, lithium iron phosphate.

IPC Classes  ?

  • H01M 4/58 - Selection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries

70.

Spatial light modulator incorporating aberration correction

      
Application Number 17658922
Grant Number 11940686
Status In Force
Filing Date 2022-04-12
First Publication Date 2023-10-12
Grant Date 2024-03-26
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Stewart, Luke
  • Baxter, Glen W
  • Bolger, Jeremy

Abstract

A spatial light modulator (100) comprises a liquid crystal material (104), first and second electrodes (106, 108) disposed on opposing sides of the liquid crystal material (104), and a diffractive optical element (120) disposed between the electrodes (106, 108) and extending laterally across the modulator (100). The diffractive optical element (120) comprises an array of diffracting formations (122) formed from sub-wavelength structures. The array of diffracting formations (122) defines a phase profile adapted to modify the incident wavefront of light reflected off the second electrode and to apply a position-dependent wavefront correction to the incident wavefront of light.

IPC Classes  ?

  • G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
  • G02B 5/18 - Diffracting gratings
  • G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
  • G02F 1/1343 - Electrodes

71.

Electrically Conductive Substrate for an Electrochemical Device

      
Application Number 18121383
Status Pending
Filing Date 2023-03-14
First Publication Date 2023-10-05
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Xu, Wen-Qing
  • Hill, Linze Du
  • Xu, Chengkun
  • Gao, Zan
  • Lu, Xinyu
  • Koeppen, Christopher S.

Abstract

An electrochemical device includes a first electrode having 50 wt.% to 99 wt.% immobilized sulfur, 1 wt. % to 12 wt.% binder, and 0.2 wt.% to 12 wt.% porous composition. The porous composition includes 0.0001 wt.% to 40 wt.% of a first porous material having an average pore size less of than 2 nm and 0.05 wt.% to 40 wt.% of a second porous material having an average pore size of 2 nm to 100 nm. The electrochemical device further includes a second electrode opposed from the first electrode and an electrolyte positioned between the first electrode and the second electrode.

IPC Classes  ?

  • H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
  • H01M 4/133 - Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
  • H01M 4/136 - Electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy

72.

SPECTRAL BEAM COMBINING OPTICAL ASSEMBLY AND METHOD OF FABRICATION

      
Application Number 18178410
Status Pending
Filing Date 2023-03-03
First Publication Date 2023-09-28
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Hostetler, John Louis
  • Seifert, Martin
  • Gaertner, Jared Howard

Abstract

An apparatus is used for spectral beam combining laser wavelengths into a combined beam. The apparatus has an integrated, sealed optical assembly that can be installed and replaced in the field. The optical assembly has a housing composed of a material, such as fused silica, transparent to the laser wavelengths. Transmissive gratings are disposed on ends of the housing and have their datums facing the sealed interior. V-grooves on a shelf at one end of the housing are disposed at an angle relative to the first grating. Fiber ends of a fiber array have end caps affixed in the V-grooves and aligned to the datums of the first grating. The fiber ends transmit the laser wavelengths in an array of beams toward the first grating, which diffracts the laser wavelengths to the second grating. In turn, the second grating transmits the laser wavelengths as a combined beam from the second end of the housing.

IPC Classes  ?

  • G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means

73.

WAVELENGTH REFERENCE DEVICE

      
Application Number 18301871
Status Pending
Filing Date 2023-04-17
First Publication Date 2023-09-14
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Cahill, Michael John Laurence
  • Li, Yang

Abstract

Described herein is a wavelength reference device comprising a housing defining an internal environment having a known temperature. A broadband optical source is disposed within the housing and configured to emit an optical signal along an optical path. The optical signal has optical power within a wavelength band of interest. An optical etalon is also disposed within the housing and positioned in the optical path to filter the optical signal to define a filtered optical signal that includes one or more reference spectral features having a known wavelength at the known temperature. The device also includes an optical output for outputting the filtered optical signal.

IPC Classes  ?

  • G01J 3/02 - Spectrometry; Spectrophotometry; Monochromators; Measuring colours - Details
  • H04B 10/25 - Arrangements specific to fibre transmission
  • G01J 3/45 - Interferometric spectrometry

74.

TRIMMING OF OPTICAL RESPONSE FOR TUNABLE PHOTONIC DEVICES

      
Application Number 17654282
Status Pending
Filing Date 2022-03-10
First Publication Date 2023-09-14
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Dong, Po
  • Melikyan, Argishti

Abstract

An optoelectronic circuit used with signal light comprises photonic devices disposed on a platform. The photonic devices are configured to condition the signal light and are fabricated with an optical characteristic being electronically tunable. A fabricated performance of the optical characteristic can be varied from a target performance due to a difference (e.g., alteration, change, error, or discrepancy) in the process used to fabricate the device. A ground bus, a power bus, and banks of electronic components are disposed on the platform in electrical communication with the photonic devices. The electronic components in a given bank are selectively configurable to tune the optical characteristic of the associated device so a variance can be diminished between the fabrication and target performances of the device's optical characteristic due to the difference in the fabrication process.

IPC Classes  ?

  • G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
  • G02B 6/13 - Integrated optical circuits characterised by the manufacturing method

75.

WAFER LEVEL TESTING OF OPTICAL COMPONENTS

      
Application Number 18316722
Status Pending
Filing Date 2023-05-12
First Publication Date 2023-09-07
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Lin, Shiyun
  • Mahgerefteh, Daniel
  • Park, Bryan
  • Lee, Jin-Hyoung

Abstract

A system may include a wafer that includes ICs and defines cavities. Each cavity may be formed in a BEOL layer of the wafer and proximate a different IC. The system may also include an interposer that includes a transparent layer configured to permit optical signals to pass through. The interposer may also include at least one waveguide located proximate the transparent layer. The at least one waveguide may be configured to adiabatically couple at least one optical signal out of the multiple ICs. Further, the interposer may include a redirecting element optically coupled to the at least one the waveguide. The redirecting element may be located proximate the transparent layer and may be configured to receive the at least one optical signal from the at least one waveguide. The redirecting element may also be configured to vertically redirect the at least one optical signal towards the transparent layer.

IPC Classes  ?

  • H01L 21/66 - Testing or measuring during manufacture or treatment
  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
  • G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
  • G01R 31/311 - Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
  • G02B 1/11 - Anti-reflection coatings

76.

ELECTRODE DEFINED RESONATOR

      
Application Number 18298221
Status Pending
Filing Date 2023-04-10
First Publication Date 2023-08-24
Owner II-VI Delaware, Inc (USA)
Inventor
  • Lan, Di
  • Xu, Wen-Qing
  • Barbarossa, Giovanni

Abstract

A bulk acoustic resonator operable in a bulk acoustic mode includes a resonator body mounted to a separate carrier that is not part of the resonator body. The resonator body includes a piezoelectric layer, a device layer, and a top conductive layer on the piezoelectric layer opposite the device layer. A surface of the device layer opposite the piezoelectric layer is for mounting the resonator body to the carrier.

IPC Classes  ?

  • H03H 9/05 - Holders or supports
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator

77.

Thin Material Handling Carrier

      
Application Number 18133574
Status Pending
Filing Date 2023-04-12
First Publication Date 2023-08-10
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Stayt, Jr., John W.
  • Barrie, Thomas
  • Persaud, Raven
  • Korpinen, Garrett
  • Hale, Geoffrey Robert

Abstract

A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.

IPC Classes  ?

  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
  • H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

78.

Polarization-maintaining wavelength selective switch for free-space optical communication

      
Application Number 17658053
Grant Number 11722236
Status In Force
Filing Date 2022-04-05
First Publication Date 2023-08-08
Grant Date 2023-08-08
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Clarke, Ian G.
  • Di Blasio, Massimo

Abstract

A free-space optical communication system has a conversion assembly, a fiber array, and a wavelength selective switch (WSS) assembly. The conversion assembly converts circular polarization states of incoming optical signals to linear polarization states and converts linear polarization states to circular polarization states for outgoing optical signals. The fiber array has polarization-maintaining (PM) optical fibers arranged in optical communication between the conversion assembly and the WSS assembly to preserve the linear polarization states of the optical signals. The WSS assembly has free-space optics, such as dispersion element and beam-steering element, with optical axes arranged relative to the PM optical fibers. The WSS assembly selectively switches WDM channels of the optical signals relative to the PM optical fibers. Fast and slow axes of the PM optical fibers are aligned to the optical axes of the free-space optics.

IPC Classes  ?

  • H04J 14/02 - Wavelength-division multiplex systems
  • H04B 10/11 - Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
  • H04B 10/2507 - Arrangements specific to fibre transmission for the reduction or elimination of distortion or dispersion

79.

CROSS-JET NOZZLE FOR LASER PROCESSING HEAD

      
Application Number 18159012
Status Pending
Filing Date 2023-01-24
First Publication Date 2023-08-03
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Jonkers, Jeroen
  • Schmidt, Georg
  • Koehler, Gunnar

Abstract

A laser material processing head, such as a remote welding head, has an output with a protective optic configured to pass an emitted laser to a working area. The protective optic, such as a cover slide of the output, protects other optics inside the head and is a replaceable, spare part. To prevent at least some debris expelled from the working area from reaching the protective optic, a nozzle is mounted to the head adjacent to the protective optic. The nozzle has an inlet and an outlet for the gas. The outlet has a curvilinear profile configured to fan a cross-jet of the gas in the plane between the protective optic and the working area. The profile of the nozzle reduces the amount of gas needed to divert the debris from the protective optic.

IPC Classes  ?

  • B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
  • B23K 26/142 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products

80.

OPTICAL COMMUNICATION DEVICE

      
Application Number 18295720
Status Pending
Filing Date 2023-04-04
First Publication Date 2023-08-03
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Kaikkonen, Andrei
  • Chen, Simon
  • Lewen, Robert
  • Mizuhara, Osamu

Abstract

An optical communication device may include a driver component, arranged to achieve a driving voltage, and a modulator component, including a laser or arranged to receive light from a laser. The modulator component may be arranged to achieve a modulated light signal modulated based on the driving voltage. The device may include a transmission line arranged to transfer the driving voltage between the driver component and the modulator component. The transmission line may not impedance matched to the driver component, the transmission line may have an impedance which is at least 20% lower than an output impedance of the driver component, and the transmission line may be impedance matched with respect to signal reflections to the modulator component.

IPC Classes  ?

  • G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
  • H04B 10/516 - Transmitters - Details of coding or modulation
  • G02F 1/21 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour by interference

81.

WSS UTILIZING LCOS ARRAYS COMPRISING RECTANGULAR PIXELS

      
Application Number 18295769
Status Pending
Filing Date 2023-04-04
First Publication Date 2023-08-03
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Armstrong, Julian
  • Stewart, Luke
  • Baxter, Glen W.
  • Plumridge, Jonathan

Abstract

A liquid crystal on silicon (LCOS) device includes a silicon substrate and a pair of electrodes including an upper and a lower electrode. The lower electrode is mounted to the silicon substrate and includes a two dimensional array of pixels extending in both a first and second dimension. LCOS device also includes a liquid crystal layer disposed between the upper and lower electrodes and configured to be driveable into a plurality of electrical states by drive signals provided to the pixels of the lower electrode. The pixels are rectangular in profile having longer sides in the first dimension than in the second dimension. Further, the two dimensional array includes a pixel pitch that is greater in the first dimension than in the second dimension.

IPC Classes  ?

82.

ELECTRODE-DEFINED UNSUSPENDED ACOUSTIC RESONATOR

      
Application Number 18298267
Status Pending
Filing Date 2023-04-10
First Publication Date 2023-08-03
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Xu, Wen-Qing
  • Lan, Di
  • Koeppen, Christopher S.

Abstract

A bulk acoustic resonator operable in a bulk acoustic mode includes a resonator body mounted to a separate carrier that is not part of the resonator body. The resonator body includes a piezoelectric layer, a device layer, and a top conductive layer on the piezoelectric layer opposite the device layer. The piezoelectric layer is a single crystal of LiNbO3 cut at an angle of 130°±30°. A surface of the device layer opposite the piezoelectric layer is for mounting the resonator body to the carrier.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials

83.

Wavelength-Division-Multiplexing Optical Circuit Implemented in Photonic Integrated Circuit for Optical Transmitter

      
Application Number 17590959
Status Pending
Filing Date 2022-02-02
First Publication Date 2023-08-03
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Dong, Po
  • Melikyan, Argishti

Abstract

An optical circuit is used with continuous wave signals having different wavelengths at a channel spacing from one another. A portion of the optical circuit is implemented in a photonic integrated circuit. Modulators in a modulation stage modulate the continuous wave signals to produce modulated signals. A multiplexing stage, which can have multiplexing filters, power combiners, or power couplers, multiplexes the continuous wave or modulated signals to produce multiplexed signals. The multiplexing stage may be placed either before or after the modulation stage. One or more polarization rotator and combiner (PRC) devices in a final stage combines the multiplexed signals into an output signal. The output signal has a first set of the different wavelengths at a first polarization and has a second separate set of the different wavelengths at a second polarization orthogonal to the first polarization.

IPC Classes  ?

84.

DUAL OUTPUT LASER DIODE

      
Application Number 18298254
Status Pending
Filing Date 2023-04-10
First Publication Date 2023-08-03
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Zayer, Nadhum Kadhum
  • Jakubowicz, Abram
  • Teissier, Jean Axel Edmond
  • Pawlik, Susanne

Abstract

A dual output laser diode may include first and second end facets and an active section. The first and second end facets have low reflectivity. The active section is positioned between the first end facet and the second end facet. The active section is configured to generate light that propagates toward each of the first and second end facets. The first end facet is configured to transmit a majority of the light that reaches the first end facet through the first end facet. The second end facet is configured to transmit a majority of the light that reaches the second end facet through the second end facet.

IPC Classes  ?

  • H01S 5/10 - Construction or shape of the optical resonator
  • H01S 5/50 - Amplifier structures not provided for in groups
  • H01S 5/04 - Processes or apparatus for excitation, e.g. pumping
  • H01S 5/028 - Coatings

85.

POLYCRYSTALLINE DIAMOND (PCD) LASER LAPPING MACHINE

      
Application Number 18158661
Status Pending
Filing Date 2023-01-24
First Publication Date 2023-07-27
Owner II-VI Delaware, Inc. (USA)
Inventor Wu, Xiquan

Abstract

A laser lapping machine has a platform for supporting and rotating a product, and a laser device for transmitting a laser beam onto the surface of the product. The product may contain polycrystalline diamond, and the platform and the laser device may be configured to move a cutting point along a spiral path across the product surface. A process for removing material, such as polycrystalline diamond material, from a surface of a product is also described. The process includes transmitting a laser beam onto the product surface to remove the material at a cutting point, rotating the product surface relative to the laser beam, and causing the cutting point to move in a radial direction. According to one aspect of the present disclosure, rotation of the platform and radial movement of the laser beam cause the cutting point to move along a spiral path across the product surface.

IPC Classes  ?

  • B23K 26/08 - Devices involving relative movement between laser beam and workpiece
  • B23K 26/36 - Removing material

86.

OPTICAL FIBER ARRAY COLLIMATOR APPLIED TO MULTI-LINE LiDAR

      
Application Number 18149335
Status Pending
Filing Date 2023-01-03
First Publication Date 2023-07-20
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Jia, Xu
  • Bao, Lingdong
  • Lin, Lei
  • Yu, Guanglong

Abstract

An optical fiber array collimator is disclosed for use in a multi-line LiDAR application. The collimator includes an optical fiber array assembly, a collimating lens assembly and a housing. The optical fiber array assembly and a collimating lens assembly are positioned, assembled, and fixed in the housing. The light output surface of the optical fiber array assembly is installed near the focal plane of the collimating lens assembly. By adjusting the distance between the optical fiber array and the collimating lens, the high-precision collimated output beams from multiple optical fibers can be realized simultaneously. The fiber array can be packed and assembled with dozens or hundreds of fibers with high density. The fiber arrangement has the characteristics of adjustable density, high precision spacing and high reliability. An optical fiber array collimator is disclosed for use in a multi-line LiDAR application. The collimator includes an optical fiber array assembly, a collimating lens assembly and a housing. The optical fiber array assembly and a collimating lens assembly are positioned, assembled, and fixed in the housing. The light output surface of the optical fiber array assembly is installed near the focal plane of the collimating lens assembly. By adjusting the distance between the optical fiber array and the collimating lens, the high-precision collimated output beams from multiple optical fibers can be realized simultaneously. The fiber array can be packed and assembled with dozens or hundreds of fibers with high density. The fiber arrangement has the characteristics of adjustable density, high precision spacing and high reliability. The collimating lens includes at least one spherical or aspherical lens, which can achieve minimal aberration in different fields of view through optical design optimization. The laser spot after collimating has the characteristics of high beam quality, small wavefront distortion and small far-field divergence angle, which can achieve accurate detection of distant targets. In this collimator, due to the fiber location at vertical direction from different channels of the fiber array having different height with respect to the main optical axis of the collimating lens, the output collimating beam will have different emergence angle, which have different viewing angles. By designing and adjusting the fiber locations(height) in the fiber array with respect to the main optical axis, we can realize the accurate control of the field angle; by controlling the density and interval of the fiber distribution in optical fiber array, the density distribution of multiple collimating laser beams at different field angles can be realized. An optical fiber array collimator is disclosed for use in a multi-line LiDAR application. The collimator includes an optical fiber array assembly, a collimating lens assembly and a housing. The optical fiber array assembly and a collimating lens assembly are positioned, assembled, and fixed in the housing. The light output surface of the optical fiber array assembly is installed near the focal plane of the collimating lens assembly. By adjusting the distance between the optical fiber array and the collimating lens, the high-precision collimated output beams from multiple optical fibers can be realized simultaneously. The fiber array can be packed and assembled with dozens or hundreds of fibers with high density. The fiber arrangement has the characteristics of adjustable density, high precision spacing and high reliability. The collimating lens includes at least one spherical or aspherical lens, which can achieve minimal aberration in different fields of view through optical design optimization. The laser spot after collimating has the characteristics of high beam quality, small wavefront distortion and small far-field divergence angle, which can achieve accurate detection of distant targets. In this collimator, due to the fiber location at vertical direction from different channels of the fiber array having different height with respect to the main optical axis of the collimating lens, the output collimating beam will have different emergence angle, which have different viewing angles. By designing and adjusting the fiber locations(height) in the fiber array with respect to the main optical axis, we can realize the accurate control of the field angle; by controlling the density and interval of the fiber distribution in optical fiber array, the density distribution of multiple collimating laser beams at different field angles can be realized. The disclosure can be widely used for multi-line LiDAR. Because the fiber is very fine, it can be assembled and arranged on the fiber array with high density, which greatly improves the density of the light spot, and then greatly improves the angular resolution of the multi-line LiDAR in vertical space. At the same time, according to the design requirements of multi-line LiDAR, by adjusting the density distribution of optical fibers on the fiber array, it can meet the differential application requirements for LiDAR in different vertical fields of view. An optical fiber array collimator is disclosed for use in a multi-line LiDAR application. The collimator includes an optical fiber array assembly, a collimating lens assembly and a housing. The optical fiber array assembly and a collimating lens assembly are positioned, assembled, and fixed in the housing. The light output surface of the optical fiber array assembly is installed near the focal plane of the collimating lens assembly. By adjusting the distance between the optical fiber array and the collimating lens, the high-precision collimated output beams from multiple optical fibers can be realized simultaneously. The fiber array can be packed and assembled with dozens or hundreds of fibers with high density. The fiber arrangement has the characteristics of adjustable density, high precision spacing and high reliability. The collimating lens includes at least one spherical or aspherical lens, which can achieve minimal aberration in different fields of view through optical design optimization. The laser spot after collimating has the characteristics of high beam quality, small wavefront distortion and small far-field divergence angle, which can achieve accurate detection of distant targets. In this collimator, due to the fiber location at vertical direction from different channels of the fiber array having different height with respect to the main optical axis of the collimating lens, the output collimating beam will have different emergence angle, which have different viewing angles. By designing and adjusting the fiber locations(height) in the fiber array with respect to the main optical axis, we can realize the accurate control of the field angle; by controlling the density and interval of the fiber distribution in optical fiber array, the density distribution of multiple collimating laser beams at different field angles can be realized. The disclosure can be widely used for multi-line LiDAR. Because the fiber is very fine, it can be assembled and arranged on the fiber array with high density, which greatly improves the density of the light spot, and then greatly improves the angular resolution of the multi-line LiDAR in vertical space. At the same time, according to the design requirements of multi-line LiDAR, by adjusting the density distribution of optical fibers on the fiber array, it can meet the differential application requirements for LiDAR in different vertical fields of view. The disclosure of the collimator has N (N≥2) optical fiber input and can be connected with 1xN optical splitter components (including fiber coupler, optical fiber splitter, optical switch, etc.), which can achieve one beam from one laser source split into N beam and then N beam are collimated, which can greatly reduce the number of laser source and cut the cost of LiDAR, and reduce the volume of the device. An optical fiber array collimator is disclosed for use in a multi-line LiDAR application. The collimator includes an optical fiber array assembly, a collimating lens assembly and a housing. The optical fiber array assembly and a collimating lens assembly are positioned, assembled, and fixed in the housing. The light output surface of the optical fiber array assembly is installed near the focal plane of the collimating lens assembly. By adjusting the distance between the optical fiber array and the collimating lens, the high-precision collimated output beams from multiple optical fibers can be realized simultaneously. The fiber array can be packed and assembled with dozens or hundreds of fibers with high density. The fiber arrangement has the characteristics of adjustable density, high precision spacing and high reliability. The collimating lens includes at least one spherical or aspherical lens, which can achieve minimal aberration in different fields of view through optical design optimization. The laser spot after collimating has the characteristics of high beam quality, small wavefront distortion and small far-field divergence angle, which can achieve accurate detection of distant targets. In this collimator, due to the fiber location at vertical direction from different channels of the fiber array having different height with respect to the main optical axis of the collimating lens, the output collimating beam will have different emergence angle, which have different viewing angles. By designing and adjusting the fiber locations(height) in the fiber array with respect to the main optical axis, we can realize the accurate control of the field angle; by controlling the density and interval of the fiber distribution in optical fiber array, the density distribution of multiple collimating laser beams at different field angles can be realized. The disclosure can be widely used for multi-line LiDAR. Because the fiber is very fine, it can be assembled and arranged on the fiber array with high density, which greatly improves the density of the light spot, and then greatly improves the angular resolution of the multi-line LiDAR in vertical space. At the same time, according to the design requirements of multi-line LiDAR, by adjusting the density distribution of optical fibers on the fiber array, it can meet the differential application requirements for LiDAR in different vertical fields of view. The disclosure of the collimator has N (N≥2) optical fiber input and can be connected with 1xN optical splitter components (including fiber coupler, optical fiber splitter, optical switch, etc.), which can achieve one beam from one laser source split into N beam and then N beam are collimated, which can greatly reduce the number of laser source and cut the cost of LiDAR, and reduce the volume of the device. The disclosure has the advantages of simple overall structure, easy adjustment and assembly, small volume, easy for mass production, low cost and high reliability, which can not only meet the huge demand of the future market for LiDAR, especially multi-line LiDAR, but also meet the high standard and stringent environmental reliability requirements of the automobile industry.

IPC Classes  ?

87.

LASER PROCESSING HEAD HAVING WIDE RANGE ZOOM

      
Application Number 17579917
Status Pending
Filing Date 2022-01-20
First Publication Date 2023-07-20
Owner II-VI Delaware, Inc. (USA)
Inventor Heinrici, Axel

Abstract

A laser processing head directs laser energy along an optical axis from a fiber to perform brazing or welding operations. A collimating stage collimates a diverging beam of the laser energy from the fiber into a collimated beam, and a focusing stage focuses the collimated beam into a converging beam to a focus spot for the desired operation. At least one of the stages has a changeable effective focal length for zoom functionality. A freeform refractive optic can be positioned in at least one of the diverging and collimated beams. For example, a freeform refractive optic in a first position is placed out of the diverging beam. However, the freeform refractive optic in a second position placed in the diverging beam can field map or intensity map the diverging beam to produce the mapped diverging beam, which increases an image of the fiber tip to the collimating stage.

IPC Classes  ?

88.

MINIATURIZED MASTER OSCILLATOR POWER-AMPLIFIER STRUCTURE DIODE-PUMPED SOLID-STATE LASER

      
Application Number 18067392
Status Pending
Filing Date 2022-12-16
First Publication Date 2023-07-20
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Yu, Guanglong
  • Jia, Xu
  • Zhao, Ming
  • Ding, Jian
  • Tan, Hao
  • Lin, Lei

Abstract

The present disclosure discloses a miniaturized MOPA structure DPSSL (Diode Pumped Solid State Laser), which comprises a laser oscillator module and a laser amplifier module. The laser oscillator module consists of a seed laser and its collimating system, and the laser amplifier module consists of a laser pump module and a laser gain element. The seed laser with high beam quality is collimated by collimation system, then input into the gain element; the pump laser is pumped into the gain element via end pump or side pump mode. The seed laser beam transmits into the gain medium and is reflected by the interface several times with the “Zigzag” path, which makes the seed laser fully gained and amplified, finally achieving high power and high beam quality laser output. The present disclosure discloses a miniaturized MOPA structure DPSSL (Diode Pumped Solid State Laser), which comprises a laser oscillator module and a laser amplifier module. The laser oscillator module consists of a seed laser and its collimating system, and the laser amplifier module consists of a laser pump module and a laser gain element. The seed laser with high beam quality is collimated by collimation system, then input into the gain element; the pump laser is pumped into the gain element via end pump or side pump mode. The seed laser beam transmits into the gain medium and is reflected by the interface several times with the “Zigzag” path, which makes the seed laser fully gained and amplified, finally achieving high power and high beam quality laser output. In this present disclosure, the laser gain material is doped with different rare-earth ion concentrations and processed into different shapes. Some polishing surfaces of the gain material are deposited with different coatings including HR coating and AR coating, on the one hand, to improve the absorption efficiency of the pump laser, on the other hand, to make the seeds laser in the gain element achieve longer transmission distance by Zigzag transmission path, so that the energy in the gain medium can be fully extracted. And finally, achieve high power laser output. The present disclosure discloses a miniaturized MOPA structure DPSSL (Diode Pumped Solid State Laser), which comprises a laser oscillator module and a laser amplifier module. The laser oscillator module consists of a seed laser and its collimating system, and the laser amplifier module consists of a laser pump module and a laser gain element. The seed laser with high beam quality is collimated by collimation system, then input into the gain element; the pump laser is pumped into the gain element via end pump or side pump mode. The seed laser beam transmits into the gain medium and is reflected by the interface several times with the “Zigzag” path, which makes the seed laser fully gained and amplified, finally achieving high power and high beam quality laser output. In this present disclosure, the laser gain material is doped with different rare-earth ion concentrations and processed into different shapes. Some polishing surfaces of the gain material are deposited with different coatings including HR coating and AR coating, on the one hand, to improve the absorption efficiency of the pump laser, on the other hand, to make the seeds laser in the gain element achieve longer transmission distance by Zigzag transmission path, so that the energy in the gain medium can be fully extracted. And finally, achieve high power laser output. The present disclosure can adopt the host material doped at least at the same time with Er and Yb elements as the laser gain medium, adopt high-quality 1.55-micron or other medium emission peak band seed laser source as well as end or side pump mode, and can realize the laser output with high power and high beam quality. The present disclosure discloses a miniaturized MOPA structure DPSSL (Diode Pumped Solid State Laser), which comprises a laser oscillator module and a laser amplifier module. The laser oscillator module consists of a seed laser and its collimating system, and the laser amplifier module consists of a laser pump module and a laser gain element. The seed laser with high beam quality is collimated by collimation system, then input into the gain element; the pump laser is pumped into the gain element via end pump or side pump mode. The seed laser beam transmits into the gain medium and is reflected by the interface several times with the “Zigzag” path, which makes the seed laser fully gained and amplified, finally achieving high power and high beam quality laser output. In this present disclosure, the laser gain material is doped with different rare-earth ion concentrations and processed into different shapes. Some polishing surfaces of the gain material are deposited with different coatings including HR coating and AR coating, on the one hand, to improve the absorption efficiency of the pump laser, on the other hand, to make the seeds laser in the gain element achieve longer transmission distance by Zigzag transmission path, so that the energy in the gain medium can be fully extracted. And finally, achieve high power laser output. The present disclosure can adopt the host material doped at least at the same time with Er and Yb elements as the laser gain medium, adopt high-quality 1.55-micron or other medium emission peak band seed laser source as well as end or side pump mode, and can realize the laser output with high power and high beam quality. Compared with the MOPA laser of the prior art, the present disclosure has the advantages of simple structure, small volume, and low cost.

IPC Classes  ?

  • H01S 5/04 - Processes or apparatus for excitation, e.g. pumping
  • H01S 5/50 - Amplifier structures not provided for in groups

89.

Miniaturized Multichannel Wavelength Division Multiplexing Optical Module

      
Application Number 18149528
Status Pending
Filing Date 2023-01-03
First Publication Date 2023-07-20
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Jia, Xu
  • Chen, Junjie
  • Wu, Vincy
  • Chen, Jin
  • Lin, Lei
  • Yu, Guanglong

Abstract

An optical assembly is used for communicating laser light from a plurality of laser sources into channels for an optical network. The optical assembly comprises an optical substrate, an input optic, at least one Z-block, filters, at least one fiber collimator, and at least one delivery fiber. The input optic is disposed on the optical substrate and is configured to receive the laser light from the laser sources. The input optic is configured to collimate the laser light into a plurality of collimated laser beams. The at least one Z-block is disposed on the substrate and has an input surface and an output surface. The input surface has a plurality of filters disposed thereon, and the input surface is disposed at an angle of incidence relative to the collimated beams from the input optic. The output surface is disposed parallel to the input surface and can have at least one isolator. The at least one Z-block is configured to multiplex the collimated laser beams into at least one output signal having a plurality of the channels. At least one fiber collimator disposed on the substrate has an input and an output. The input is disposed in optical communication with the at least one Z-block and is configured to receive the output signal. The at least one delivery fiber is optically coupled to the output of the at least one fiber collimator and is configured to conduct the optical signal to a receptacle.

IPC Classes  ?

90.

Apparatus and method for coherent optical multiplexing 1+1 protection

      
Application Number 18187510
Grant Number 11870552
Status In Force
Filing Date 2023-03-21
First Publication Date 2023-07-13
Grant Date 2024-01-09
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Hu, Peigang
  • Wang, Yajun

Abstract

Coherent optical multiplexing 1+1 protection disclosed herein uses multiplexers, each having multiplexing and demultiplexing sub-units. Relay ports of a node are connected with the multiplexers, and each relay port is configured to input and output optical signals with the corresponding multiplexer. Two transmission ports of the node are connected with disjoint paths and are configured to input and output optical signals therewith. The node includes: a first optical splitter having input ports connected with the relay ports and two output ports connected with the two transmission ports; an optical switch connected with the transmission ports respectively via two input interfaces; a second optical splitter, which is a 1×N optical splitter, having one input port connected with an output interface of the optical switch and having output ports connected with the relay ports. The solution is reliable in implementation, has low insertion loss, and has good transmission performance.

IPC Classes  ?

  • G02F 1/00 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
  • H04J 14/02 - Wavelength-division multiplex systems
  • G02B 27/10 - Beam splitting or combining systems
  • H04B 10/291 - Repeaters in which processing or amplification is carried out without conversion of the main signal from optical form
  • H04B 10/61 - Coherent receivers

91.

LAYERED PULSE GENERATION FOR LASER DRIVER APPLICATION IN 3D SENSING

      
Application Number 17647378
Status Pending
Filing Date 2022-01-07
First Publication Date 2023-07-13
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Ashbrook, Jonathan
  • Troyer, Steve
  • Dybsetter, Gerald
  • Carey, Brian
  • Jones, Theron

Abstract

A layered pulse generator for a vertical-cavity surface-emitting laser (“VCSEL”) driver is disclosed consisting of three elements: a low-speed pulse generator, a high-speed pulse generator, and a pulse generator selector, all of which are on-chip with the VCSEL driver. By providing these elements on-chip, overall system power and complexity are reduced while allowing for significantly higher pulse train frequencies compared with known systems. The high-speed pulse generator is capable of generating pulses faster and with higher resolution than that of the low-speed pulse generator. The high-speed pulse generator uses multiple clock outputs, phase shifted, and synthesized into a single pulse waveform capable of wide-ranging frequencies, duty cycles and pulse counts.

IPC Classes  ?

92.

PHOTONIC INTEGRATED CIRCUIT HAVING ARRAY OF PHOTONIC DEVICES

      
Application Number 17647423
Status Pending
Filing Date 2022-01-07
First Publication Date 2023-07-13
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Melikyan, Argishti
  • Dong, Po
  • Chen, Jiashu

Abstract

A photonic integrated circuit (PIC) device has photonic devices arranged in an array with respect to control and common conductors. Each of the photonic devices has a photonic component (e.g., photodiode, thermo-optic phase shifter, etc.) and a switching diode connected in series with one another between a control connection and a common connection. The photonic component has at least one optical port, which can be coupled to a waveguide in the PIC device. The switching diode is configured to switch between reverse and forward bias in response to the electrical signals. In this way, control circuitry for providing control and monitoring signals to the conductors can be greatly simplified, and the PIC device can be more compact.

IPC Classes  ?

  • G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
  • G02B 6/42 - Coupling light guides with opto-electronic elements

93.

Electro-optic modulator utilizing copper-tungsten electrodes for improved thermal stability and method of forming the same

      
Application Number 18121739
Grant Number 11809028
Status In Force
Filing Date 2023-03-15
First Publication Date 2023-07-13
Grant Date 2023-11-07
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Davis, Ryan
  • Xu, Wen-Qing
  • Eissler, Elgin
  • Kropf, Fred

Abstract

A high-power electro-optic modulator (EOM) is formed to use specialized electrodes of a material selected to have a CTE that matches the CTE of the modulator's crystal. Providing CTE matching reduces the presence of stress-induced birefringence, which is known to cause unwanted modulation of the propagating optical signal. The specialized electrodes are preferably formed of a CuW metal matrix composite having a W/Cu ratio selected to create the matching CTE value. Advantageously, the CuW-based electrodes also exhibit a thermal conductivity about an order of magnitude greater than conventional electrode material (brass, Kovar) and thus provide additional thermal stability to the EOM's performance.

IPC Classes  ?

  • G02F 1/1362 - Active matrix addressed cells
  • G02F 1/03 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels or Kerr effect
  • G02F 1/01 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour

94.

MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABLE TREATMENT TOOL

      
Application Number 18183404
Status Pending
Filing Date 2023-03-14
First Publication Date 2023-07-06
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Gratrix, Edward J.
  • Monti, Brian J.

Abstract

A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variables simultaneously, the controllable variables selected from the group consisting of (i) velocity, (ii) rotation, and (iii) dither of the treatment tool, and (iv) pressure of the treatment tool against the surface. The machine can move the treatment tool with six degrees of freedom.

IPC Classes  ?

  • B24B 37/005 - Control means for lapping machines or devices
  • B24B 27/00 - Other grinding machines or devices
  • B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
  • B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
  • B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain

95.

IMMOBILIZED SELENIUM IN A POROUS CARBON WITH THE PRESENCE OF OXYGEN, A METHOD OF MAKING, AND USES OF IMMOBILIZED SELENIUM IN A RECHARGEABLE BATTERY

      
Application Number 18149766
Status Pending
Filing Date 2023-01-04
First Publication Date 2023-07-06
Owner
  • II-VI Delaware, Inc. (USA)
  • CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS (CSIC) (Spain)
Inventor
  • Xu, Wen-Qing
  • Li, Xiaoming
  • Patkar, Shailesh
  • Eissler, Elgin E.
  • Solis, Marta Sevilla
  • Arias, Antonio Benito Fuertes

Abstract

In a method of preparing an immobilized selenium system or body, a selenium — carbon — oxygen mixture is formed. The mixture is then heated to a temperature above the melting temperature of selenium and the heated mixture is then cooled to ambient or room temperature, thereby forming the immobilized selenium system or body.

IPC Classes  ?

  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
  • H01M 4/38 - Selection of substances as active materials, active masses, active liquids of elements or alloys
  • C01B 32/336 - Preparation characterised by gaseous activating agents
  • C01B 32/348 - Metallic compounds
  • H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals

96.

TAILORING OF HIGH POWER VCSEL ARRAYS

      
Application Number 18110120
Status Pending
Filing Date 2023-02-15
First Publication Date 2023-06-29
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Tandoi, Giuseppe
  • Lichtenstein, Norbert
  • Mutter, Lukas
  • Bisig, Andre

Abstract

Modification of the topology of selected regions of individual VCSEL devices during fabrication is utilized to provide an array output beam with specific characteristics (e.g., “uniform” output power across the array). These physical features include at least the width of the metal aperture, the width of the oxide aperture, and/or the geometry of the contact ring structure on the top of the VCSEL device. The modifications may also function to adjust the numerical apertures (NAs) of the devices, the beam waist, wallplug efficiency, and the like.

IPC Classes  ?

  • H01S 5/0683 - Stabilisation of laser output parameters by monitoring the optical output parameters
  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
  • H01S 5/42 - Arrays of surface emitting lasers

97.

OPTICS FOR LASER ARRAYS

      
Application Number 18176872
Status Pending
Filing Date 2023-03-01
First Publication Date 2023-06-29
Owner II-VI Delaware, Inc. (USA)
Inventor O'Daniel, Jason

Abstract

In one example, a laser assembly may include a substrate, a lens array, and a laser array. The lens array may be positioned on a first side of the substrate. The laser array may be positioned on a second side of the substrate opposite the first side. Lasers of the laser array may be oriented to generate optical signals through the substrate to corresponding lenses of the lens array. The lens array may include at least one concave lens and at least one convex lens. The concave and convex lenses may map the irradiance of the lasers to a common target irradiance profile, resulting in an alignment tolerant laser assembly.

IPC Classes  ?

  • H01S 5/42 - Arrays of surface emitting lasers
  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
  • H01S 5/0234 - Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
  • H01S 5/02253 - Out-coupling of light using lenses
  • H01S 5/042 - Electrical excitation

98.

SEMICONDUCTOR LASER DIODE INCLUDING INVERTED P-N JUNCTION

      
Application Number 17560445
Status Pending
Filing Date 2021-12-23
First Publication Date 2023-06-29
Owner II-VI Delaware, Inc. (USA)
Inventor
  • Zibik, Evgeny
  • Maineult, Wilfried

Abstract

An edge-emitting GaAs-based semiconductor laser uses a tunnel junction in combination with an inverted p-n junction to address oxidation problems associated with the use of a high aluminum content p-type cladding arrangement. In particular, a tunnel junction is formed on an n-type GaAs substrate, with p-type cladding and waveguiding layers formed over the tunnel junction. N-type waveguiding and cladding layers are thereafter grown on top of the active region. Since the p-type layers are positioned below the active region and not exposed to air during processing, a relative high aluminum content may be used, which improves the thermal and electrical properties of the device. Since the n-type material does not require a high aluminum content, it may be further processed to form a ridge structure without introducing any substantial oxidation of the structure.

IPC Classes  ?

  • H01S 5/323 - Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- hetero-structures in AIIIBV compounds, e.g. AlGaAs-laser
  • H01S 5/125 - Distributed Bragg reflector [DBR] lasers
  • H01S 5/32 - Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- hetero-structures
  • H01S 5/22 - Structure or shape of the semiconductor body to guide the optical wave having a ridge or a stripe structure

99.

LIGHT SOURCE WITH INTEGRATED MONITOR PHOTODETECTOR AND DIFFUSER

      
Application Number 18177294
Status Pending
Filing Date 2023-03-02
First Publication Date 2023-06-29
Owner II-VI Delaware, Inc. (USA)
Inventor Chen, Hao

Abstract

A light source includes a substrate with a first surface and an opposite second surface. An epitaxial layer is positioned on the first surface of the substrate. The light source also includes at least one light generator in the epitaxial layer positioned such that an optical signal transmitted thereby is directed toward the substrate. A diffuser is positioned on the second surface of the substrate, and at least one monitor photodetector is positioned in the epitaxial layer in an arrangement configured to receive a portion of the optical signal which is reflected by the diffuser. In one form, the light generator may include a vertical cavity surface emitting laser (VCSEL).

IPC Classes  ?

  • H01S 5/026 - Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
  • H01S 5/42 - Arrays of surface emitting lasers

100.

OPTICALLY-FINISHED THIN DIAMOND SUBSTRATE OR WINDOW OF HIGH ASPECT RATIO AND A METHOD OF PRODUCTION THEREOF

      
Application Number 18172668
Status Pending
Filing Date 2023-02-22
First Publication Date 2023-06-22
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Xu, Wen-Qing
  • Anderson, Thomas E.
  • Barbarossa, Giovanni
  • Eissler, Elgin E.
  • Liu, Chao
  • Tanner, Charles D.

Abstract

In a method of forming a diamond film, substrate, or window, a substrate is provided and the diamond film, substrate, or window is CVD grown on a surface of the substrate. The grown diamond film, substrate, or window has a thickness between 150-999 microns and an aspect ratio≥100, wherein the aspect ratio is a ratio of a largest dimension of the diamond film, substrate or window divided by a thickness of the diamond film. The substrate can optionally be removed or separated from the grown diamond film, substrate, or window.

IPC Classes  ?

  • C23C 16/27 - Diamond only
  • C23C 16/01 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes on temporary substrates, e.g. on substrates subsequently removed by etching
  • C23C 16/56 - After-treatment
  • C23C 16/511 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating using electric discharges using microwave discharges
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