II-VI Delaware, Inc.

United States of America

Back to Profile

1-11 of 11 for II-VI Delaware, Inc. Sort by
Query
Patent
World - WIPO
Aggregations Reset Report
Date
2024 March 1
2024 (YTD) 1
2023 2
2020 2
2019 5
See more
IPC Class
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components 2
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping 2
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries 2
H01M 4/136 - Electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy 2
H01M 4/1397 - Processes of manufacture of electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy 2
See more
Found results for  patents

1.

LITHIUM ION COMPLEXES AND THE USE IN ELECTROCHEMICAL DEVICES CONTAINING THE SAME

      
Application Number US2023073654
Publication Number 2024/054920
Status In Force
Filing Date 2023-09-07
Publication Date 2024-03-14
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Xu, Wen-Qing
  • Gao, Zan
  • Du Hill, Linze
  • Lu, Xinyu
  • Masarapu, Charan
  • Xu, Chengkun

Abstract

A new Li-complexing derivative electrolyte for use in an electrochemical device, method of manufacturing said electrolyte, and an electrochemical device is disclosed. The electrolyte includes a Li-ion complex associated with one or more coordinating ligands. The ratio of the Li-ion complex to coordinating ligands is less than and equal to 1.52, and the association of the Li ion complex and the one or more coordinating ligands has an apparent coordination number (ACN) of 3 to 5. An inactive solvent may also be incorporated.

IPC Classes  ?

2.

ELECTRICALLY CONDUCTIVE SUBSTRATE FOR AN ELECTROCHEMICAL DEVICE

      
Application Number US2023015287
Publication Number 2023/177733
Status In Force
Filing Date 2023-03-15
Publication Date 2023-09-21
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Xu, Wen-Qing
  • Hill, Linze, Du
  • Xu, Chengkun
  • Gao, Zan
  • Lu, Xinyu
  • Koeppen, Christopher, S.

Abstract

An electrochemical device includes a first electrode having 50 wt.% to 99 wt.% immobilized sulfur, 1 wt. % to 12 wt.% binder, and 0.2 wt.% to 12 wt.% porous composition. The porous composition includes 0.0001 wt.% to 40 wt.% of a first porous material having an average pore size less of than 2 nm and 0.05 wt.% to 40 wt.% of a second porous material having an average pore size of 2 nm to 100 nm. The electrochemical device further includes a second electrode opposed from the first electrode and an electrolyte positioned between the first electrode and the second electrode.

IPC Classes  ?

  • H01M 4/136 - Electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
  • H01M 4/1397 - Processes of manufacture of electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
  • H01M 4/02 - Electrodes composed of, or comprising, active material
  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
  • H01M 4/96 - Carbon-based electrodes
  • H01M 50/417 - Polyolefins

3.

OPTICAL TRANSCEIVER WITH INTEGRATED DISPERSION COMPENSATION FOR HIGH BIT RATE APPLICATIONS

      
Application Number US2023014681
Publication Number 2023/172536
Status In Force
Filing Date 2023-03-07
Publication Date 2023-09-14
Owner II-VI DELAWARE, INC, (USA)
Inventor Barbarossa, Giovanni

Abstract

An optical configuration for providing chromatic dispersion compensation in a high data rate communication system is based upon using optical dispersion compensation in the receive signal path prior to performing an O/E conversion. The performance of chromatic dispersion compensation in the optical domain thus presents a "corrected" optical signal as an input to the photodetecting device. The inclusion of optical-based chromatic dispersion compensation allows for a higher data rate to be used without introducing an unacceptable bit error rate; alternatively, the use of optical-based dispersion correction allows for the reach of a data communications network to be increased.

IPC Classes  ?

  • H04B 10/61 - Coherent receivers
  • H04B 10/2513 - Arrangements specific to fibre transmission for the reduction or elimination of distortion or dispersion due to chromatic dispersion
  • G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means

4.

IMMOBILIZED SELENIUM IN A POROUS CARBON WITH THE PRESENCE OF OXYGEN, AND USES IN A RECHARGEABLE BATTERY

      
Application Number US2020017509
Publication Number 2020/163864
Status In Force
Filing Date 2020-02-10
Publication Date 2020-08-13
Owner
  • II-VI DELAWARE, INC. (USA)
  • CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS (CSIC) (Spain)
Inventor
  • Xu, Wen-Qing
  • Li, Xiaoming
  • Patkar, Shailesh
  • Eissler, Elgin E.
  • Arias, Antonio, Benito Fuertes
  • Solis, Marta, Sevilla

Abstract

In a method of preparing an immobilized selenium system or body, a selenium - carbon - oxygen mixture is formed. The mixture is then heated to a temperature above the melting temperature of selenium and the heated mixture is then cooled to ambient or room temperature, thereby forming the immobilized selenium system or body.

IPC Classes  ?

  • H01M 4/133 - Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
  • H01M 4/136 - Electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
  • H01M 4/1393 - Processes of manufacture of electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
  • H01M 4/1397 - Processes of manufacture of electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries

5.

IMMOBILIZED CHALCOGEN AND USE THEREOF IN A RECHARGEABLE BATTERY

      
Application Number US2020017516
Publication Number 2020/163869
Status In Force
Filing Date 2020-02-10
Publication Date 2020-08-13
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Xu, Wen-Qing
  • Li, Xiaoming
  • Patkar, Shailesh
  • Eissler, Elgin, E.
  • Xu, Chengkun
  • Moore, Colin
  • Koeppen, Christopher, S.

Abstract

An immobilized chalcogen system or body includes a mixture or combination of chalcogen and carbon. The carbon can be in the form of a carbon skeleton. The chalcogen can include oxygen, sulfur, selenium, or tellurium, or a combination of any two or more of oxygen, sulfur, selenium, and tellurium. The activation energy for chalcogen to escape the immobilized chalcogen system or body is ≥ 96 kJ/mole.

IPC Classes  ?

  • C01B 31/04 - Graphite
  • F16L 59/02 - Shape or form of insulating materials, with or without coverings integral with the insulating materials
  • H01B 1/04 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon, or silicon

6.

THERMOELECTRIC CONTRAST THERAPY DEVICE

      
Application Number US2019038050
Publication Number 2019/246306
Status In Force
Filing Date 2019-06-19
Publication Date 2019-12-26
Owner II-VI DELAWARE, INC. (USA)
Inventor Moczygemba, Joshua, Edward

Abstract

This disclosure provides an apparatus for a thermoelectric (TE) contrast therapy device and related methods. The thermoelectric contrast therapy device includes a control node (610) and a plurality of thermoelectric nodes (605). The control node electrically and mechanically connected to the plurality of thermoelectric nodes, the control node configured to direct the heating and cooling functions as well as timing functions. Each of thermoelectric nodes includes a thermoelectric module (105) structured with a supply side (115) and a waste side (120), a phase change material (110), a reservoir (725), a thermal sink (320), a spreader (125) and a controller (1010). The thermoelectric contrast therapy device pre-charges (1105) the PCM contained in the reservoir; provides (910) opposite heating and cooling functions using the supply side and the waste side of the thermoelectric module; and directs, using the controller, the heating and cooling functions as well as timing functions.

IPC Classes  ?

  • A61F 7/00 - Heating or cooling appliances for medical or therapeutic treatment of the human body

7.

WAFER FIXTURE FOR TESTING AND TRANSPORT

      
Application Number US2019032608
Publication Number 2019/226453
Status In Force
Filing Date 2019-05-16
Publication Date 2019-11-28
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Persaud, Raven
  • Larkin, Liam
  • Barrie, Thomas
  • Korpinen, Garrett
  • Stayt, John W., Jr.
  • Jain, Rajat
  • Martin, Christopher T.
  • Harris, George E.

Abstract

A wafer handling fixture is used to transport a finished semiconductor wafer from one post-fabrication procedure to another (e.g., testing, inspection, cleaning, dicing, or shipping) in a manner that maintains the wafer in its "flattened" form and eliminates the possibility for a wafer to later spring back into a bowed form. The wafer handling fixture includes a surface stiction film to which the wafer will naturally adhere, and uses a wafer release mechanism included in a bottom support plate to permit for the "controlled" transfer of the wafer from the handling fixture to testing/inspection equipment.

IPC Classes  ?

  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

8.

APPARATUS FOR SUPPORTING THINNED SEMICONDUCTOR WAFERS

      
Application Number US2019033072
Publication Number 2019/226525
Status In Force
Filing Date 2019-05-20
Publication Date 2019-11-28
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Persaud, Raven
  • Stayt, John W.
  • Harris, George E.

Abstract

A vacuum chuck is configured so that a wafer handling fixture (including the supported wafer) may be loaded into a central recessed area of the chuck. The depth of the central recessed area with respect to the surrounding portion of the wafer chuck is controlled such that the exposed surface of the thinned wafer slightly protrudes above the vacuum chuck. The vacuum force of the chuck functions to hold the wafer handling fixture securely in place. Thus, a thinned wafer remains completely supported by the handling fixture during a film application process, and will not bow and allow no gaps to form between the wafer and the film during the application process.

IPC Classes  ?

  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
  • H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
  • H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

9.

TAILORING OF HIGH POWER VCSEL ARRAYS

      
Application Number US2019018143
Publication Number 2019/164755
Status In Force
Filing Date 2019-02-15
Publication Date 2019-08-29
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Tandoi, Giuseppe
  • Lichtenstein, Norbert
  • Mutter, Lukas
  • Bisig, Andre

Abstract

Modification of the topology of selected regions of individual VCSEL devices during fabrication is utilized to provide an array output beam with specific characteristics (e.g., "uniform" output power across the array). These physical features include the width of the metal aperture, the width of the modal filter, and/or the geometry of the contact ring structure on the top of the VCSEL device. The modifications may also function to adjust the numerical apertures (NAs) of the devices, the beam waist, wallplug efficiency, and the like.

IPC Classes  ?

  • H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

10.

SELECTIVE RECOVERY OF RARE EARTH METALS FROM AN ACIDIC SLURRY OR ACIDIC SOLUTION

      
Application Number US2018061561
Publication Number 2019/099859
Status In Force
Filing Date 2018-11-16
Publication Date 2019-05-23
Owner II-VI DELAWARE, INC. (USA)
Inventor
  • Xu, Wen-Qing
  • Patkar, Shailesh
  • Bedes, Louie, I.
  • Abella, Marie Ysabel, R.
  • Abrenica, Gomer, M.
  • Mattera, Vincent, D.

Abstract

A method for extracting rare earth metals from an acidic slurry or an acidic solution. The method includes providing an acidic slurry or acidic solution; adding a composite comprising an extractant and a polymer resin; mixing the composite with the acidic slurry or acidic solution to form a mixture slurry or solution; and separating the mixture slurry or solution into a rare-earth-metal-loaded composite and a raffinate slurry or solution. The acidic slurry or acidic solution comprises at least one rare earth metal and at least one early transition metal and/or at least one actinide metal.

IPC Classes  ?

  • C22B 59/00 - Obtaining rare earth metals
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof

11.

INTEGRATED WDM OPTICAL TRANSCEIVER

      
Application Number US2018036536
Publication Number 2018/227005
Status In Force
Filing Date 2018-06-07
Publication Date 2018-12-13
Owner II-VI DELAWARE, INC. (USA)
Inventor Barbarossa, Giovanni

Abstract

An integrated wavelength division multiplexing (WDM) optical transceiver comprises the following elements: (1) a light source; (2) an array of photodiodes responsive to a plurality of optical signals and forming a plurality of electrical received information signals therefrom; and (3) a photonics integrated module (PIM) including transmission components and receiving components necessary to provide transceiver functionality. The transmission components include a demultiplexer, an electro-optic modulator array, and a multiplexer for combining a plurality of modulated optical signals onto a single output signal path as the transceiver output. The receiving components include a demultiplexer responsive to an incoming WDM signal for separating each wavelength component and creating a plurality of received optical signals.

IPC Classes  ?