An improved dispersion, which is particularly suitable for use in forming a hybrid capacitor, and improved method for forming a hybrid capacitor, and an improved capacitor is provided. The method comprises forming a dispersion comprising a conductive polymer, a dispersing agent, a monomer of the conductive polymer and a molar excess of anionic counterion per mole of conductive polymer and monomer. The dispersion is homogenized to form a homogenized dispersion. A capacitor is formed comprising a conductive layer formed from the homogenized dispersion.
An improved process for forming powder, an anode of the powder and a capacitor comprising the powder is provided. The process comprises forming a dense aggregate comprising a powder and solvent in a pendular, funicular or capillary state and freeze drying the powder comprising high surface area.
H01G 11/24 - Electrodes characterised by the structural features of powders or particles used therefor
H01G 11/26 - Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features
B22F 1/107 - Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
The present invention is related to a polymer dispersion comprising first conductive polymer particles having a positive Z-potential and second conductive polymer particles having a negative Z-potential, a method of forming the polymer dispersion, a method of making a capacitor comprising the polymer dispersion and a capacitor comprising the polymer dispersion.
Provided herein is a capacitor and method of forming a capacitor. The capacitor comprises an anode with an anode wire extending from the anode. A dielectric is on the anode and a conductive polymer is on the dielectric. The anode comprises at least one face comprising a surface area wherein at least 60% of the surface area is a land and no more than 40% of the surface area comprises perturbations.
An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.
Provided herein is a method for forming a capacitor and an improved capacitor formed by the method. The method comprises providing an anode with an anode lead extending therefrom. A dielectric is formed on the anode thereby forming an anodized anode. A cathode layer is formed over the dielectric wherein the cathode layer is formed by applying a conductive polymer solution or dispersion and applying a primer solution or dispersion comprising a monophosphonium or monosulfonium cation.
Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
Provided is an electronic component, and particularly a film capacitor, comprising a working element comprising a dielectric and an encasement with the working element encased in said encasement wherein the encasement comprises a phase change material.
This invention relates to a multilayer ceramic capacitor produced by alternatively stacking the ceramic dielectric layers and internal electrodes mainly comprise base metals. The present dielectric ceramic composition having a main component with a perovskite structure ABO3 formula of: (KxNayLizA1-x-y-z)m(NbuTavBw)O3 wherein: A is at least one selected from the alkaline earth element group of Ca, Sr, and Ba; B is at least one selected from the group of Ti, Zr, Hf and Sn; and wherein: x, y, z, u, v, and w are molar fractions of respective elements, and m is the molar ratio of A-site and B-site elements. They are in the following respective range: 0.95.m.1.05; 0.05.X.0.90; 0.05.y.0.90; 0.00.z.0.12; 0
C04B 35/468 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
C04B 35/47 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on strontium titanates
C04B 35/495 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
10.
DIELECTRIC CERAMIC COMPOSITION AND CERAMIC CAPACITOR USING THE SAME
1-xxs1-sm1-yyuvw31-xxs1-s1-yyuvww)]. They are in the following respective range: 0.93<=m<=1.07; 0.7<=s<=1.0; 0<=x<=0.05; 0<=y<=0.65; 0.7<=u<=1.0; 0<=v<=0.3; 0.001<=w<=0.100.
C04B 35/468 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
C04B 35/47 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on strontium titanates
C04B 35/495 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
11.
CONDUCTIVE POLYMER DISPERSION FOR IMPROVED RELIABILITY
An improved capacitor is provided wherein the capacitor comprising an anode foil; and a conductive polymer layer on the anode foil. The conductive polymer layer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and the polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns. The second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
Provided is a process for providing a flake powder characterized by a particle size of -40 mesh to +200 mesh; a Scott density of at least 1.458 g/cm3; and a flow of at least 1 g/s. The process includes introducing a milled flake powder in a solvent to a first dryer; removing the solvent at a temperature below a melting point of the solvent under a reduced atmosphere to obtain a partially dry flake powder; and introducing the partially dry flake powder to a second dryer to form flake powder wherein particles of partially dry flake powder are heated and simultaneously subjected to an uncorrelated motion relative to adjacent particles.
B22F 9/04 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using physical processes starting from solid material, e.g. by crushing, grinding or milling
Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.
C04B 35/468 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
C04B 35/49 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates
C04B 35/46 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates
Provided is a capacitor, and more preferably a hybrid capacitor, and a method of making the capacitor. The capacitor comprises an anode, with a dielectric on the anode, and a cathode with a barrier layer on the cathode. A separator, conductive polymer, liquid electrolyte and stabilizer are between the anode and
The invention is related to an improved capacitor and an improved process for forming a capacitor. The process comprises forming an anode comprising a dielectric on the anode. A cathode layer is then formed on the dielectric wherein the cathode layer comprises a self-doped conductive polymer and a cross-linker wherein a weight ratio of crosslinker to self-doped conductive polymer is at least 0.01 to no more than 2.
Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
H01G 11/18 - Arrangements or processes for adjusting or protecting hybrid or EDL capacitors against thermal overloads, e.g. heating, cooling or ventilating
H01G 11/26 - Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features
H01G 11/28 - Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features arranged or disposed on a current collector; Layers or phases between electrodes and current collectors, e.g. adhesives
Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.
Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.
H01G 4/38 - Multiple capacitors, i.e. structural combinations of fixed capacitors
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
An improved capacitor is provided. The capacitor comprises a working element wherein the working element comprises an anode comprising a first dielectric on the anode, a cathode and a conductive separator between the first dielectric and cathode. The conductive separator comprises a separator and a first conductive polymer wherein the first conductive polymer at least partially encapsulates the separator. A second conductive polymer at least partially encapsulates the first conductive polymer and wherein the first conductive polymer has a higher conductivity than the second conductive polymer. An anode lead is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
H01G 11/00 - Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
21.
PACKAGES FOR POWER MODULES WITH INTEGRATED PASSIVES
Provided herein is a module for packaging semiconductors comprising: at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein the paraelectric dielectric has a permittivity above 10 to no more than 300; and wherein the PDC forms a capacitor couple with at least one semiconductor.
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
22.
GATE DRIVE INTERPOSER WITH INTEGRATED PASSIVES FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
An improved electronic assembly is provided. The electronic assembly comprises a ceramic interposer comprising multiple layers. The active layers of the multiple layers form an embedded capacitor comprising parallel electrodes with a dielectric between adjacent electrodes wherein adjacent electrodes have opposite polarity. A wide band gap device is also on the multilayered ceramic interposer.
Provided is an improved overvoltage protection element. The overvoltage protection device comprises at least one BSD protection couple comprising discharge electrodes in a plane, a gap insulator between the discharge electrodes, an overvoltage protection element parallel to the planar discharge electrodes wherein the overvoltage protection element comprises a conductor and an secondary material. The overvoltage protection element also comprises a primary insulator layer between the discharge electrodes and overvoltage protection element.
Provided is an improved capacitor formed by a process comprising: providing an anode comprising a dielectric thereon wherein the anode comprises a sintered powder wherein the powder has a powder charge of at least 45,000 μFV/g; and forming a first conductive polymer layer encasing at least a portion of the dielectric by applying a first slurry wherein the first slurry comprises a polyanion and a conductive polymer and wherein the polyanion and conductive polymer are in a weight ratio of greater than 3 wherein the conductive polymer and polyanion forms conductive particles with an average particle size of no more than 20 nm.
An improved capacitor is described wherein the capacitor comprises a working element. The working element comprises a first dielectric and an anode conductive polymer layer on the first dielectric. The working element also comprises a cathode and a separator between the anode conductive polymer layer and the cathode wherein the separator comprises a separator conductive polymer layer wherein at least one of the anode conductive polymer layer or the separator conductive polymer layer is crosslinked. The working element also comprises a liquid electrolyte.
An improved capacitor, and method of manufacturing the improved capacitor, is provided. The method includes deoxygenating and leaching the anode wire to produce a capacitor comprising an anode having a surface area of at least 4.0 m2/g or a charge density of at least 200,000 CV/g with the anode wire having an equivalent diameter of less than 0.30 mm extending from said anode. A dielectric is on the anode and a cathode is on the dielectric.
An improved capacitor is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm
An improved high density multi-component package is provided. The package comprising at least two electronic components. Each electronic component comprises a first external termination and a second external termination. At least one electrical connection is between adjacent first external terminations of adjacent electronic components. At least one mechanical connection is between adjacent electronic components. At least two adjacent electronic components are connected serially.
H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
H01L 21/8224 - Bipolar technology comprising a combination of vertical and lateral transistors
H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
H01G 4/38 - Multiple capacitors, i.e. structural combinations of fixed capacitors
An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
C03B 19/06 - Other methods of shaping glass by sintering
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H01L 35/08 - Structural details of the junction; Connections of leads non-detachable, e.g. cemented, sintered, soldered
30.
INCREASED OPERATIONAL TEMPERATURE OF BOPP BASED CAPACITORS BY FLUORINATION OF FILM
An improved film capacitor which is suitable for use at higher operating temperatures is described. The capacitor has a first fluorinated biaxially oriented polypropylene film and a conductive coating on at least one side of the first fluorinated biaxially oriented polypropylene film.
Provided is an electronic module comprising at least one electronic component. A thermoelectric cooler is in thermal contact with the electronic component. A temperature controller is capable of determining a device temperature of the electronic component is provided and capable of providing current to the thermoelectric cooler proportional to a deviation of the device temperature from an optimal temperature range.
H01G 9/004 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture - Details
H01L 35/02 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details
H01L 35/32 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof operating with Peltier or Seebeck effect only characterised by the structure or configuration of the cell or thermocouple forming the device
32.
MULTILAYER CERAMIC CAPACITOR STRUCTURES FOR USE AT HIGH POWER
An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.
An electronic component with a self-damping MLCC is provided. The electronic component comprising a pulse signal generator and a substrate comprising first traces and second traces. An MLCC is provided comprising a first capacitive couple between two first external terminations and a second capacitive couple between two second external terminations wherein each first external termination is in electrical contact with a different first trace and each second external termination is in electrical contact with a different second trace. The pulse signal generator provides a first pulse to the first traces and a second pulse to the second traces wherein the first pulse and second pulse are not in phase.
H03K 3/335 - Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of semiconductor devices with more than two electrodes and exhibiting avalanche effect
An improved capacitor is provided wherein the capacitor has an improved bond between the anode and anode wire. The anode comprises a pressed anode powder comprising a first density region and a second density region wherein the second density region has a higher density than the first density region. An anode wire extends into the second density region wherein the anode wire in the second density region is distorted by compression. This allows for better utilization of the metal powder surface area by allowing a lower bulk press density and lower sinter temperature while still achieving the necessary wire pull strength. In addition, this invention when utilized with deoxidation steps, results in sufficient wire pull strengths not possible otherwise.
An multilayered ceramic capacitor is provided with mitigated microphonic noise propagation. The multilayered ceramic capacitor comprising a body comprising at least one face wherein the face has a body length. Parallel internal electrodes of alternating polarity are in the body wherein each internal electrode has a tab integral thereto wherein adjacent tabs are not in registration and alternate tabs are in registration. A dielectric is between adjacent internal electrodes. External terminations wherein a first external termination are in electrical contact with first tabs in registration and a second external termination is in electrical contact with second tabs in registration wherein the first external termination and second external termination are on the face and separated by a termination separation. A ratio of the termination separation to the body length is no more than 0.6 and the body comprises an extended portion beyond the external terminations.
A61N 1/375 - Constructional arrangements, e.g. casings
B05D 3/08 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by flames
B05D 3/12 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H01B 19/00 - Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support
An MLCC with an identification mark consisting of non-active internal electrodes which can be used to determine chip orientation for mounting or reeling. This allows an MLCC with substantially similar width and thickness to be oriented with the electrodes in a preferred direction (either vertical or horizontal with respect to the board) that results in the minimum noise and vibration compared to other orientations. The presence of an identification mark can also allow for a means of preferentially orienting an MLCC which has an active area that is offset from the geometric center of the part.
An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.
A capacitor and a method of making a capacitor, is provided with improved reliability performance. The capacitor comprises an anode; a dielectric on the anode; and a cathode on the dielectric wherein the cathode comprises a conductive polymer and a polyanion wherein the polyanion is a copolymer comprising groups A, B and C represented by Formula AxByCz as described herein.
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ
39.
HYBRID CAPACITOR AND METHOD OF MANUFACTURING A CAPACITOR
The capacitor comprises a working element (402, 44) wherein the working element (402, 44) comprises an anode comprising a dielectric thereon and an anode conductive polymer layer (212) on the dielectric. The capacitor also includes a cathode (114) comprising a cathode conductive polymer layer (214) and a conductive separator (16) between the anode and said cathode (114). An anode lead (20) is in electrical contact with the anode and a cathode lead (22) is in electrical contact with the cathode (114).
An improved process for forming an electrolytic capacitor is provided. The process comprises: providing an anode with an anode wire extending from the anode body; forming a dielectric on the anode to form an anodized anode; applying a first slurry wherein the first slurry comprises conducting polymer and polyanion, wherein the polyanion and conducting polymer are in a first weight ratio thereby forming a first slurry layer; and applying a second slurry on the first slurry layer wherein the second slurry comprises the conducting polymer and said polyanion and wherein the polyanion and the conducting polymer are in a second weight ratio wherein the second weight ratio is lower than the first weight ratio.
An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. An encapsulant at least partially encases the capacitive element wherein the encapsulant comprises at least one membrane between the capacitive element and an external surface of the encapsulant.
Provided is a module comprising a carrier material, comprising a first conductive portion and a second conductive portion, and a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first longitudinal edge of a first electronic component is connected to the first conductive portion by a first interconnect; and a second longitudinal edge of the first electronic component is connected to the second conductive portion by a second interconnect.
H01G 4/38 - Multiple capacitors, i.e. structural combinations of fixed capacitors
H01G 13/00 - Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups
A method for forming a high aspect ratio sintered powder anode with low warpage, an anode made thereby and a cathode comprising the anode are provided. The method comprises placing a multiplicity of anode precursors on a forming substrate in a common plane wherein no more than 10% of the anode precursors are out of the common plane. A second substrate is then placed over the forming substrate with the anode precursors between the forming substrate and the second substrate thereby forming a sandwiched assembly. The sandwiched assembly is heated to a sintering temperature of the anode precursors thereby forming the sintered powder anodes. The and sintered powder anodes are removed from between the forming substrate and the second substrate.
An improved capacitor (10) and a method for forming an improved capacitor (10) is detailed. The method comprises forming a tantalum anode (11) from a tantalum powder with a powder charge of no more than 40,000 μθ^; forming a dielectric (12) on the anode by anodization at a formation voltage of no more than 100 V; and forming a conductive polymeric cathode (13) on the dielectric (12) wherein the capacitor (10) has a breakdown voltage higher than the formation voltage.
A capacitor, and method for making the capacitor, is provided with improved charging characteristics. The capacitor has an anode, a cathode comprising a conductive polymer layer and a work function modifier layer adjacent the conductive polymer layer and a dielectric layer between the anode and the cathode.
An electronic component is provided with improved thermal stability. The electronic component comprises at least one capacitive element wherein the capacitive element comprises internal electrodes of alternating polarity separated by a dielectric. External terminations with a first external termination of the external terminations are in electrical contact with internal electrodes of a first polarity and a second external termination of the external terminations are in electrical contact with internal electrodes of a second polarity. A first external lead frame is in electrical contact with the first external termination with a conductive bond there between wherein the first external lead frame comprises at least one feature selected from the group consisting of a perforation, a protrusion and an edge indentation.
A capacitor with improved electronic properties is described. The capacitor has an anode, a dielectric on said anode and a cathode on the dielectric. The cathode has a conductive polymer defined as -(CR1R2CR3R4-)X- wherein at least one of R1, R2, R3 or R4 comprises a group selected from thiophene, pyrrole or aniline with the proviso that none of R1, R2, R3 or R4 contain -SOOH or COOH; a organofunctional silane; and an organic compound with at least two functional groups selected from the group consisting of carboxylic acid and epoxy.
An improved process for forming a capacitor, and improved capacitor formed thereby is described. The process includes: providing an anode comprising a dielectric thereon; applying a first layer of an intrinsically conducting polymer on the dielectric to form a capacitor precursor; applying at least one subsequent layer of an intrinsically conducting polymer on the first layer from a dispersion; and treating the capacitor precursor at a temperature of at least 50°C no more than 200°C at a relative humidity of at least 25 % up to 100%, or fusing the layered structure by swelling the layered structure with a liquid and at least partially removing the liquid.
Provided is a method for forming a capacitor. The method includes: providing an anode with a dielectric thereon and a conductive node in electrical contact with the anode; applying a conductive seed layer on the dielectric; forming a conductive bridge between the conductive seed layer and the conductive node; applying voltage to the anode; electrochemically polymerizing a monomer thereby forming an electrically conducting polymer of monomer on the conductive seed layer; plating a metal layer on said conductive polymer; and disrupting the conductive bridge between the conductive seed layer and the conductive node.
A method for increasing surface area of a valve metal particle is provided as is an improved valve metal particle provided thereby. The method includes charging a mill apparatus with a valve metal powder and a media wherein the media has an average diameter of at least 0.01 cm to no more than 0.3175 cm. The valve metal powder is then milled at an average kinetic energy of no more than 3,000 ergs per media particle to obtain a milled powder.
B22F 9/04 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using physical processes starting from solid material, e.g. by crushing, grinding or milling
An improved capacitor is provided wherein the improved capacitor has improved ESR. The capacitor has a fluted anode and an anode wire extending from the fluted anode. A dielectric is on the fluted anode. A conformal cathode is on the dielectric and a plated metal layer is on the carbon layer.
A method of forming a capacitor is described as is an improved capacitor formed with a one-sided capacitor foil. The method includes: providing a foil comprising a conductive core and a high surface area on each side of a first side and a second side of the core; removing at least a portion of the high surface area on the first side of the core; and forming a conductive layer on the dielectric.
An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.
An improved capacitor is provided with at least one anode having a dielectric on the anode and an anode lead extending from the anode. A conductive cathode layer is on the dielectric. An anode leadframe is electrically connected to the anode and a cathode leadframe is electrically connected to the cathode. An encapsulant encases the anode, a portion of the anode leadframe and a portion of the cathode leadframe such that the anode leadframe extends from the encapsulant to form an external anode leadframe and the cathode leadframe extends from the encapsulant to form an external cathode leadframe. At least one secondary electrical connection is provided wherein the secondary electrical connection is in electrical contact with the cathode and extends through the encapsulant to the external cathode leadframe or the secondary electrical contact is in electrical contact with the anode and extends through the encapsulant to the external anode leadframe.
Provided herein is an improved capacitor and a method for forming an improved capacitor. The method includes providing an anode and forming a dielectric on the anode. A linear-hyperbranched polymer is formed and a conductive polymer dispersion is prepared comprising at least one conducting polymer, one polyanion and the linear-hyperbranched polymer. A layer of the conductive polymer dispersion if formed wherein said dielectric is between the anode and the layer.
A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
A solid electrolytic capacitor and method for forming a solid electrolytic capacitor with high temperature leakage stability is described. The solid electrolytic capacitor has improved leakage current and is especially well suited for high temperature environments such as down-hole applications.
An improved capacitor is described. The capacitor has an anode with an anode lead wire extending from a first face of the anode. A dielectric layer is on the anode and a cathode is on the dielectric. An anode lead with an anode base and a cavernous anode protrusion extending from the base is provided wherein the anode lead wire is in electrical contact with the anode protrusion. A cathode lead with a cathode base is provided wherein the cathode base is in electrical contact with the cathode on a side face wherein the side face is adjacent the first face and the cathode base and said anode base are coplanar.
A capacitor with improved ESR and improved volumetric efficiency. The capacitor has an anode body wherein the anode body comprises a face and an inward offset which is inset from the face by a distance. An anode wire extends from a front side of the anode body wherein the front side is adjacent the face. A dielectric is on the anode body and a conductive cathode layer is on the dielectric. A cathode lead is in the inward offset and in electrical contact with the conductive cathode layer wherein the conductive cathode layer is between the cathode lead and the inward offset.
A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.
An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
An improved multi-layered ceramic capacitor, and method of making the multi-layered ceramic capacitor, is described. The capacitor has an active area comprising first layers and second layers in alternating parallel arrangement with dielectric there between. The first layer comprises a first active electrode and a first floating electrode in a common plane and the second layer comprises a second active electrode and a second floating electrode in a second common plane. At least one shield layer is adjacent to an outermost first layer of the first layers wherein the shield layer has a first projection and the first layers have a second projection wherein the first projection and the second projection are different.
H01G 11/08 - Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
H01G 11/26 - Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features
63.
POLYMERIZATION METHOD FOR PREPARING CONDUCTIVE POLYMER
A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.
C08G 73/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups
C08G 75/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
C08L 79/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups
An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
An improved capacitor and method of making an improved capacitor is set forth. The capacitor has planer anodes with each anode comprising a fusion end and a separated end and the anodes are in parallel arrangement with each anode in direct electrical contact with all adjacent anodes at the fusion end. A dielectric is on the said separated end of each anode wherein the dielectric covers at least an active area of the capacitor. Spacers separate adjacent dielectrics and the interstitial space between the adjacent dielectrics and spacers has a conductive material in therein.
An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.
C04B 35/01 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides
An improved overvoltage protection component is provided. The overvoltage protection component has a first internal electrode contained within a dielectric material. The first internal electrode is electrically connected to a first termination and a second internal electrode contained within the ceramic dielectric material is electrically connected to a second termination.
H01C 7/10 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
A capacitor with an anode and a dielectric over the anode. A first conductive polymer layer is over the dielectric wherein the first conductive polymer layer comprises a polyanion and a first binder. A second conductive polymer layer is over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder and wherein the first binder is more hydrophilic than the second binder.
A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer. Coverage enhancing catalyst is removed after coating and curing.
A process for preparing a solid electrolytic capacitor comprising application of a non-ionic polyol prior to application of a conducting polymer layer.
A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.
Provided is a method for forming a capacitor. The method includes: providing an anode with a dielectric thereon and a conductive node in electrical contact with the anode; applying a conductive seed layer on the dielectric; forming a conductive bridge between the conductive seed layer and the conductive node; applying voltage to the anode; electrochemically polymerizing a monomer thereby forming an electrically conducting polymer of monomer on the conductive seed layer; and disrupting the conductive bridge between the conductive seed layer and the conductive node.
A process for forming a solid electrolytic capacitor and an electrolytic capacitor formed by the process. The process includes: providing an anode wherein the anode comprises a porous body and an anode wire extending from the porous body; applying a thin polymer layer onto the dielectric, and forming a dielectric on the porous body to form an anodized anode; applying a first slurry to the anodized anode to form a blocking layer wherein the first slurry comprises a first conducting polymer with an median particle size of at least 0.05 µm forming a layer of crosslinker on the blocking layer; and applying a layer of a second conducting polymer on the layer of crosslinker.
C08L 37/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen; Compositions of derivatives of such polymers
74.
METHOD OF IMPROVING ELECTROMECHANICAL INTEGRITY OF CATHODE COATING TO CATHODE TERMINATION INTERFACES IN SOLID ELECTROLYTIC CAPACITORS
A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on said dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.
A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
76.
SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURE
An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.
A capacitor combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor results in a resistive failure when the fuse opens during an overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.
An improved capacitor, and method for making the capacitor, is described. The capacitor has an anode and a dielectric on the anode. A cathode layer is on the dielectric wherein the cathode layer comprises at least one conductive layer and an insulative adhesion enhancing layer.
New designs for multilayer ceramic capacitors are described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area, and subsequently capacitance, is lowered in this case.
A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A transition layer is on the cathode wherein the transition layer has a blocking layer. A plated layer is on the transition layer. The cathode is electrically connected to a cathode termination sition layer.
A capacitor, and method of making a capacitor, is provided wherein the capacitor has exceptionally high break down voltage. The capacitor has a tantalum anode with an anode wire attached thereto. A dielectric film is on the tantalum anode. A conductive polymer is on the dielectric film. An anode lead is in electrical contact with the anode wire. A cathode lead is in electrical contact with the conductive polymer and the capacitor has a break down voltage of at least 60 V.
A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.
A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures.
A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
A method for treating anodes of refractory valve metals by deoxidizing the anodes using Mg in an oven, prior to sintering. The process limits free oxygen in the metal compact and improves performance of a capacitor, especially with regards to rated voltage.
A capacitor with first plates and second plates. A dielectric is between the first plates and the second plates. A first external termination is in electrical contact with the first plates and a second external termination is in electrical contact with the second plates. A first lead terminal is in electrical contact with the first external termination and the first lead terminal has a first foot below the first external termination and a first solder stop coated on the first foot between the first foot and the first external termination. A second lead terminal is in electrical contact with the second external termination wherein the second lead terminal comprises a second foot below the second external termination and a second solder stop is coated on the second foot between the second foot and the second external termination.
A method of forming a capacitor includes the steps of: forming an anode with an anode wire extending there from; forming a dielectric on the anode; forming a cathode layer on the dielectric; providing a substrate comprising at least one via and at least two connectors; inserting the anode wire into a first via; forming an electrical connection between the anode wire and a first connector of the connectors; and forming an electrical connection between the cathode layer and a second connector.
A process for forming a capacitor. The process includes providing an anode; providing a dielectric on the anode; exposing the anode to a polymer precursor solution comprising monomer, conjugated oligomer and optionally solvent and polymerizing the polymer precursor. The ratio between monomer and conjugated oligomer ranges from 99.9/0.1 to 75/25 by weight. The solvent content in the polymer precursor solution is from 0 to 99 % by weight.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
90.
ABRASIVE PROCESS FOR MODIFYING CORNERS, EDGES, AND SURFACES OF CAPACITOR ANODE BODIES
Porous sintered anode bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelepiped shapes are used as they were pressed, cathode coverage at the sharp corners and edges is non-uniform and failures occur at those locations. Treating pressed anode bodies with an abrasive process alters the sharpness of corners and edges, creating rounded transitions between primary surfaces, and removes surface imperfections resultant from the pressing process, both of which enhance cathode layer uniformity.
Porous sintered anode bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelepiped shapes are used, cathode coverage at the edges and corners is non-uniform and failures occur at those locations. Rectangular prisms, obround prisms and cylindrical prisms are formed with transition surfaces at edges and corners, such as chamfers and curves, to enhance cathode layer uniformity. The transition surface greatly enhances the application of polymer slurries.
A method for maintaining quality of monomer during a coating process for intrinsically conductive polymer which suppresses unwanted by-products. A neutralization process using a base or anion exchange resin is used batch-wise or continuous.
High capacitance value capacitors are formed using bimetal foils (120, 130) of an aluminum layer (124, 134) attached to a copper layer (122, 132). The copper side of a bimetallic copper/aluminum foil or a monometallic aluminum foil is temporarily protected using aluminum or other materials, to form a sandwich. The exposed aluminum is treated to increase the surface area of the aluminum by at least one order of magnitude, while not attacking any portion of the protected metal. When the sandwich is separated, the treated bimetal foil (120 or 130) is formed into a capacitor, where the copper layer (122 or 132) is one electrode of the capacitor and the treated aluminum layer (124 and 324 or 134 and 334) is in intimate contact with a dielectric layer (540) of the capacitor.
An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.
A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
An electrical component with a substrate having a planar surface. A capacitor is provided having a plurality of first plates and second plates wherein the first plates and second plates are non-contacting and in common planes. A plurality of third plates is parallel to the first plates and the second plates and interleaved between the planes. A first external termination is in electrical contact with the plurality of first plates and a second external termination is in electrical contact with the plurality of second plates. The capacitor is mounted on the substrate with the first plates, the second plates and the third plates perpendicular to the planar surface.
An improved conductive adhesive and capacitor formed using the improved conductive adhesive. The conductive adhesive has: 60-95 wt% conductor; 5-40 wt% resin; wherein the resin has: 55-98.9 wt% monomer defined by Structure A; 0.1-15 wt% catalyst; 1-30 wt% accelerant defined by Structure B; and 0-15 wt% filler.
A capacitor array with a multiplicity of capacitors with terminations of alternating polarity wherein the terminations are arranged in M columns and N rows. A circuit is provided with terminations in a grid of L columns and K rows wherein the terminations are of alternating polarity with the proviso that a first terminal with L = aM has the same polarity as a second terminal with L = aM +1 wherein a is an integer.
A process for forming a capacitive couple. The process includes forming a highly porous body of a conducting material with interior struts and voids in electrical contact. A dielectric layer is formed in the voids on the struts with a material having a dielectric constant above 100. An insulating layer is formed on the struts not covered by the dielectric layer. A conductive layer is formed on the dielectric layer and on the insulating layer.
An improved capacitor with an anode (11) with an anode wire and an oxide layer (12) on the surface of the anode (11). A cathode layer is exterior to the oxide layer. A carbon conductive layer (14) is exterior to the cathode layer wherein the cathode layer comprises 5-75 wt% resin and 25-95 wt% conductor. The conductor has carbon nanotubes. An anode lead is in electrical contact with the anode wire and a cathode lead is in electrical contact with the carbon conductive layer (14).
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