A device embedded substrate provided with first and second connecting terminals on different surfaces, the substrate including: an electrically conductive metal block having one surface connected to the first connecting terminal, and having a dimension in a lateral direction larger than that of the electronic device; an intermediate connecting portion juxtaposed to the electronic device, including first insulation layer and wiring layers, whereby the first wiring layer is connected to the one surface of the metal block via a first conductive via; a second insulation layer which accommodates the metal block; and a third insulation layer stacked on the second insulation layer to embed the electronic device and whereon a second wiring layer is stacked, wherein the second wiring layer is connected to the first wiring layer via a second conductive via and connected to the second connecting terminal of the electronic device via a third conductive via.
A soldering system (1) comprises: a display image creation function (2) that reads an actual substrate and creates a display image of the substrate; an object creation function (3) that creates an object, which is an image when the display image is mounted on an actual soldering jig; and a program creation function (4) that creates a program in which a soldering position, soldering attribute, and soldering route are specified for the object, wherein the display image creation function includes an image reading unit and an inclination correction unit, the object creation function includes an imposition information acquisition unit, and the program creation function includes a soldering position acquisition unit, a soldering attribute acquisition unit, and a route display unit.
G05B 19/4093 - Commande numérique (CN), c.à d. machines fonctionnant automatiquement, en particulier machines-outils, p.ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'u caractérisée par la programmation de pièce, p.ex. introduction d'une information géométrique dérivée d'un dessin technique, combinaison de cette information avec l'information d'usinage et de matériau pour obtenir une information de commande, appelée
The present invention provides a component mounting substrate (1) on which an electronic component (12) is to be mounted, and which is provided with: a wiring layer (10) that is provided with a copper pad (10p) at a position which corresponds to an electrode terminal (12B, 12C) of the electronic component (12); a surface pad (13) that is formed in a part of the surface of the copper pad (10p) and is formed of a surface treated material for soldering; and a solder (14) that connects the electrode terminal (12B, 12C) to the surface pad (13). With respect to this component mounting substrate (1), the peripheral edge of the surface pad (13) is apart from the copper pad (10p).
A memory device includes: a wiring substrate including a multilevel wiring layer and first and second surfaces at opposite sides; a control element embedded in the wiring substrate and having first and second element surfaces at opposite sides, with multiple electrode pads connected to the multilevel wiring layer at the first element surface; a first heat dissipation member at a region of the first surface overlapping the control element; a heat dissipation structure facing the second element surface and exposed at the second surface; and at least one memory element connected with the multilevel wiring layer at a first surface region not overlapping the control element. The multilevel wiring layer includes a signal pattern electrically connecting the control element with the memory element or the external connection terminal, and a heat dissipation conductor pattern forming a heat dissipation path between the control element and the first heat dissipation member.
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
A component mounting substrate (10) on which an electronic component (12) is mounted comprises: a wiring layer (10) provided with a copper pad (10p) at a position corresponding to an electrode terminal (12B, 12C) of the electronic component (12); a surface pad (13) formed in a part of a surface of the copper pad (10p) and made of a surface treated material for soldering; and a solder (14) which connects the electrode terminal (12B, 12C) to the surface pad (13), wherein the solder (14) extends from the surface pad (13) to the copper pad (10p).
A planar antenna board (1) comprises a dielectric (2), an antenna layer (3) formed as a conductor for a signal line on one surface of the dielectric (2), and a ground layer (4) formed as a ground conductor on the other surface of the dielectric (2). The dielectric (2) has: a low-dielectric layer (2a) arranged on the antenna-layer (3) side; an intermediate layer (2b) for which the dielectric constant is higher than that of the low-dielectric layer (2a); and an adhesive layer (2c) for which the glass transition point is higher than that of the intermediate layer (2b), and the water absorption rate is higher than that of the low-dielectric layer (2a). The low-dielectric layer (2a) is arranged on the antenna-layer (3) side with respect to the intermediate layer (2b), and the adhesive layer (2c) is arranged on the ground-layer (4) side with respect to the intermediate layer (2b).
A substrate (1) having lands for soldering comprises: metallic bottom plates (4); metallic peripheral walls (5) erected from a peripheral edge of the bottom plates (4), respectively; solder accommodating spaces (6) each of which is formed by the peripheral wall (5) and the bottom plate (4), and in which a solder for electrical connection to a terminal of an electronic component is to be accommodated; lands (3) for soldering each of which includes the solder accommodating space (6) and is formed by the bottom plate (4) and the peripheral wall (5); and a substrate body (2) on which the lands (3) for soldering are placed, and which is electrically connected to the lands (3) for soldering.
This storage device comprises: a wiring board that has a first surface, a second surface opposite to the first surface and a multilayered wiring layer; a control element that is embedded in the wiring board and that has a first element surface on which multiple electrode pads connected to the multilayered wiring layer are located and a second element surface opposite to the first element surface; a first heat dissipation member that is located in a region overlapping the control element in the first surface of the wiring board; a heat dissipation structure that is opposed to the second element surface of the control element and that is exposed from the second surface of the wiring board; and at least one memory element that is located in a region not overlapping the control element in the first surface of the wiring board and that is connected to the multilayered wiring layer. The multilayered wiring layer has: a signal pattern that electrically connects the control element to the memory element or to an external connection terminal; and a heat dissipation conductor pattern that forms a heat dissipation path between the control element and the first heat dissipation member.
H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
H01L 25/04 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés
9.
BOARD WITH BUILT-IN COMPONENT, AND METHOD FOR MANUFACTURING SAME
A board (1) with a built-in component, which has a built-in electronic component (2) that is provided on one surface with a first connecting terminal (2a) and on another surface with a second connecting terminal (2b), includes a metal block (3) which is electrically conductive and has heat transfer properties, one surface of which is connected to the first connecting terminal (2a), and a dimension of which in a planar direction is greater than that of the electronic component (2), intermediate connecting portions (4) which are provided to the side of the electronic component (2) in a row and each of which includes a first insulating layer (R1) and a first wiring layer (W1) that is connected to said one surface of the metal block (3) by way of a first conducting via (V1), a second insulating layer (R2) accommodating the metal block (3), and a third insulating layer (R3) which is stacked on the second insulating layer (R2) in such a way as to embed the electronic component (2), and on which a second wiring layer (W2) is stacked, wherein the second wiring layer (W2) is connected to the first wiring layer (W1) by way of second conducting vias (V2), and is connected to the second connecting terminal (2b) of the electronic component (2) by way of third conducting vias (V3).
H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p.ex. dissipateurs de chaleur
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
The printed board has a plurality of through-holes (11) that pass through a board (10) aligned in certain regions, wherein: the shapes of openings (11a) of the through-holes (11) on the board surface are polygons (equilateral triangles); and the plurality of through-holes (11) are aligned so that each side of the opening of each polygon (equilateral triangle) of a through-hole (11) parallelly faces one side of the opening of the polygon (equilateral triangle) of an adjacent through-hole (11).
Provided is a method for manufacturing a wiring pattern, the method including: a mask forming step for forming an insulating mask pattern (3) on an insulating substrate (1) having a conductive layer (2) provided on a surface thereof; a plating step for forming a wiring pattern (4) with a conductor plating on a non-mask section (3a) of the conductive layer (2); an electro-deposition step for forming an electro-deposition film (5) composed of a resin material on an exposed surface of the wiring pattern (4); a mask peeling step for peeling off the mask pattern (3); an etching step for etching the conductive layer (2) using the electro-deposition film (5) as an etching resist; and an electro-deposition film peeling step for peeling off the electro-deposition film (5), wherein in the plating step, the thickness of the mask pattern (3) is made to be equal to or greater than the thickness of the wiring pattern (4), whereby the wiring pattern (4) is formed so as to assume a shape that includes a main body (4a) that has a predetermined first wiring width (L1) and a head section (4b) that has a second wiring width (L2) that is greater than the first wiring width (L1) and is provided on an upper surface of the main body (4a).
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
This thin temperature sensor (1) comprises: an insulating substrate (2); an electrode layer (3) formed form a thin platinum film formed on the surface of the insulating substrate (2), the electrode layer (3) including a pattern region (3a) and a pair of substantially rectangular pad regions (3b) extending from the pattern region (3a); a pair of electrode terminals (4) formed by metal plating on portions of the pad regions (3b); and a glass protective film (5) that covers the pattern region (3a) as well as corner sections (3c) of the pad regions (3b).
H01C 1/028 - Boîtiers; Enveloppes; Enrobage; Remplissage de boîtier ou d'enveloppe l'élément résistif étant enrobé dans un matériau isolant pourvu d'une gaine extérieure
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistances; Dispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtements; Résistances fixes constituées de matériau conducteur en poudre ou de matériau semi-conducteur en poudre avec ou sans matériau isolant à coefficient de température positif
G01K 1/12 - Dispositifs de protection, p.ex. étuis pour prévenir les dommages dus aux surcharges thermiques
G01K 7/16 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs
13.
SUBSTRATE WITH INSULATING HEAT DISSIPATION BLOCK AND METHOD FOR PRODUCING SAME
This substrate (1) with an insulating heat dissipation block is provided with: an insulating layer (2) that is formed of an insulating resin material; conductive layers (3) that are arranged on both surfaces of the insulating layer (2); a substrate main body (4) that is composed of the conductive layers (3) and the insulating layer (2); an electronic component (6) that is arranged on one surface of or within the substrate main body (4), said electronic component generating heat; a heat dissipation path (7) that is thermally connected with the electronic component (6) and extends toward the other surface of the substrate main body (4); a heat dissipation region (8) that is defined by the outermost edge of the heat dissipation path (7); and an insulating heat dissipation block (5) which has insulating properties and is fitted to the other surface of the substrate main body (4) so that the outer edge thereof is outside the heat dissipation region (8), while being inside the edge of the substrate main body (4).
A heat-radiating member (2) comprises: a heat-absorbing surface (2a) which is one surface of a columnar-shaped body (2) that is to be embedded in a substrate (1) where a heat-generating member is disposed, and which is a surface on the side where the heat-generating member is disposed; a heat-radiating surface (2b) which is a surface on the side opposite the heat-absorbing body (2a); and a tapered section (11) which is tapered and which is formed on a side surface of the columnar-shaped body (2). Due to the foregoing, it is possible to prevent the heat-radiating member (2) from falling out from a through hole (6) even when stress is applied in one direction of the substrate (1), in particular, stress pulling toward the heat-generating member side.
A circuit board production method of the present invention comprises: a through-hole formation step in which a substrate 40 is prepared, and a through-hole 16, that penetrates from a first face 10 of the substrate 40 to a second face 12 on a side opposite of the first face 10, is formed; a conductivity-imparting treatment step in which at least an inner wall face of the through-hole 16 is subjected to a conductivity-imparting treatment; a base plating step in which a base plating layer 24 is formed on at least the inner wall face of the through-hole which has been subjected to the conductivity-imparting treatment; a resist layer formation step in which a plated resist layer is formed on the surfaces of the first face and the second face, the plated resist layer having, at a position corresponding to the through-hole, a small diameter through-hole having a smaller diameter than that of the through-hole and coaxial with the through-hole; an in-hole plating step in which an in-hole plating 28 layer is formed on the base plating layer 24 of the inner wall face of the through-hole 16; and a resist layer removal step in which the plated resist layer is removed.
This IVH multilayer substrate (1) comprises: a multilayer body (4) in which a plurality of conductive layers (2) are laminated with insulating layers (3) therebetween; a blind via hole (5) extending from the front surface on one side of the multilayer body (4) to the rear surface on the other side; a plating film (7) formed on the wall surface of the blind via hole (5); a filler (8) filled into the inner side of the plating film (7); a protrusion (8a) formed by the filler (8) and protruding toward the rear surface of the multilayer body (4) beyond the distal end of the blind via hole (5); and solder resist (9) which covers the protrusion (8a) and is disposed toward the rear surface of the multilayer body (4) from the distal end of the blind via hole (5).
A planar antenna board (1) comprises a dielectric (2), an antenna layer (3) formed as a conductor for a signal line on one surface of the dielectric (2), and a ground layer (4) formed as a ground conductor on the other surface of the dielectric (2). The dielectric (2) has: a low-dielectric layer (2a) arranged on the antenna-layer (3) side; an intermediate layer (2b) for which the dielectric constant is higher than that of the low-dielectric layer (2a); and an adhesive layer (2c) for which the glass transition point is higher than that of the intermediate layer (2b), and the water absorption rate is higher than that of the low-dielectric layer (2a). The low-dielectric layer (2a) is arranged on the antenna-layer (3) side with respect to the intermediate layer (2b), and the adhesive layer (2c) is arranged on the ground-layer (4) side with respect to the intermediate layer (2b).
A heat dissipation substrate (1) is provided with: a substrate body (3) which comprises a core material (4) and an insulating layer (5); a heat dissipation member (2) which is housed within a cavity (6) formed so as to penetrate the substrate body (3), and which is fixed to the cavity (6) via the insulating layer (5); and an outer layer plating (8) which is formed so as to cover both surfaces of the substrate body (3). The outer layer plating (8) comprises a heat dissipation section (8a) that is disposed at positions corresponding to both surfaces of the heat dissipation member (2), and a plating section (8b) other than said heat dissipation section (8a). The front surface of the heat dissipation section (8a) is positioned closer to the substrate body (3) side in comparison to the front surface of the plating section (8b).
An interposer mounted substrate (1) is provided with: a mother board (2); an interposer (4) electrically connected to the mother board (2) via a plurality of first connection terminals (3); an IC (6) electrically connected to the interposer (4) via a plurality of second connection terminals (5); a plurality of wire paths (7) passing through the inside of the interposer (4); and a capacitor (8) incorporated in the interposer (4). The interposer (4) has a multi-layer plate structure comprising a plurality of conductive layers (10) and a plurality of insulation layers (9) having inter-layer connection parts (11). In each of the insulation layers (9), the number of the inter-layer connection parts (11) included in one of the wire paths (7) is only one.
This heat dissipation substrate 1 for mounting a heat-generating component 2 having, on a mounting surface thereof, an electrode terminal 2a, is equipped with: an wiring substrate 10 which has formed therein a through-hole TH having a circular cross-section; and a heat-transfer member 20 which is composed of an electrically conductive material and which constitutes a heat-dissipating path that extends to both surfaces of the wiring substrate 10 in the through-hole TH. The heat-transfer member 20 is formed integrally from: an embedded portion 21 that is fitted inside the through-hole TH; and a plate-like exposed portion 22 that is provided along a surface of the wiring substrate 10. The exposed portion 22 has a shape substantially identical with that of the electrode terminal 2a of the heat-generating component 2.
A high-density multilayer substrate 1, which replaces a multilayer substrate 2 having through-vias including an interstitial via hole (IVH), is provided with: a multilayer wiring board 10 in which a plurality of insulating layers R1 to R5 and a plurality of wiring layers L1 to L6 are stacked alternately; a chip component 20 which has a first electrode terminal 22 and a second electrode terminal 23 on both ends and is embedded in an insulating layer R3 in an orientation such that the electrode terminals are spaced apart from each other in a direction perpendicular to a stacking direction of the multilayer wiring board 10; and a stack via 30 which provides electrical continuity between each of the wiring layers L1 and L6 formed on both sides of the multilayer wiring board 10 and at least one of the first electrode terminal 22 and the second electrode terminal 23, and which is formed of a plurality of laser vias stacked upon one another.
This substrate 1 with a built-in component is provided with: a first partial substrate 10 in which a through hole 15 is formed; a metal tab 16 which is fixed in the through hole 15; an electronic component 20 which has a first surface 21 on which a first electrode terminal 22 contacting the metal tab 16 is provided, and a second surface 23, opposite of the first surface, on which a second electrode terminal 24 is provided; and a second partial substrate 40 which includes a second insulation layer 41 that embeds the electronic component 20.
H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p.ex. dissipateurs de chaleur
H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
The present invention has: a first insulator (11); a first outer layer wiring pattern (13) formed on a first surface of the first insulator; an inner layer wiring pattern (15) formed on a second surface on the opposite side of the first insulator from the first surface; a second insulator (12) laminated on the first insulator and contacting the inner layer wiring pattern; a second outer wiring pattern (14) formed on the surface positioned on the opposite side of the second insulator from the surface contacting the inner layer wiring pattern; an electronic component (16) embedded in the second insulator; an insulating adhesive part (18) that fixes the electronic component to the second surface side of the first insulator; and a laser via that passes through the second insulator and electrically connects the second outer layer wiring pattern and the electronic component, wherein the inner layer wiring pattern is arranged between the first insulator and the insulating adhesive part, and includes a dummy wire that is electrically disconnected from the outside.
[Problem] To improve connection reliability between electronic components and conductor layers in a board with embedded components in which a plurality of electronic components connected to different conductor layers are embedded. [Solution] The present invention provides a method for manufacturing a board 1 with embedded components in which a first electronic component 2 and a second electronic component 3 are embedded in an insulating layer 5 sandwiched between a first conductive layer L1 and a second conductive layer L2, the method comprising: a preparation step for preparing the first conductive layer L1; an adhesive-application step for applying a first adhesive 6 and a second adhesive 7 onto the first conductive layer L1; a component-mounting step for mounting the first electronic component 2 and the second adhesive 7 on the first conductive layer L1; a component embedding step for forming the insulating layer 5 in which the first electronic component 2 and the second electronic component 3 are embedded; and a laser via-forming step for connecting the first conductive layer L1 and the first electronic component 2 and connecting the second conductive layer L2 and the second electronic component 3, wherein the second adhesive 7 is applied thicker than the first adhesive 6 in the adhesive-application step.
[Problem] To provide a press device and a press method with which the protrusion of a heat transfer member embedded in a circuit substrate can be prevented. [Solution] A press device 1 for embedding a heat transfer member 11 in a through-hole 12 provided in a circuit substrate 10, said press device comprising: a base portion 3 on which the circuit substrate 10 is placed; an ascending/descending unit 4 that is provided so as to be capable of ascending/descending with respect to the base portion 3, and that makes contact with and presses the heat transfer member 11 during pressing; and a spring structure 5 for pressing the circuit substrate 10 against the base portion 3 before the ascending/descending unit 4 makes contact with the heat transfer member.
B21D 39/00 - Utilisation de procédés permettant d'assembler des objets ou des parties d'objets, p.ex. revêtement par des tôles, autrement que par placage; Dispositifs de mandrinage des tubes
H01L 23/12 - Supports, p.ex. substrats isolants non amovibles
Provided is a substrate production method comprising: a substrate mounting step in which a support plate a portion of the surface of which protrudes due to a protruding section, and a substrate having a through hole formed therein are prepared, and the substrate is mounted on the support plate; a metal piece fixing step in which a metal piece made of a metal is plastically deformed by being pressed into the through hole, whereby a first stepped section is formed around the protruding section and the metal piece is fixed to the through hole; and a component mounting step in which a component thermally connected to the metal piece is mounted on the substrate.
A metal mask (1) comprises: a substantially plate-shaped metal member (2) placed on a substrate (5) that is provided with a pad (6) and surface insulating layer (11) formed on a surface of a base insulating layer (10), a boundary region (7) formed in the vicinity of a boundary with the pad (6), and a printing region (8) in which a symbol mark (9) is formed; a through-hole (3) formed in the same pattern shape as the pad (6); a guide piece (4) extending toward the substrate (5) along an edge of the through-hole (3); and a distal end surface (12) of the guide piece (4). The distal end surface (12) has a shape that adheres to the boundary region (7), and the metal member (2) corresponds to a position that covers the printing region (8).
B41N 1/24 - Stencils; Matériaux pour stencils; Supports à cet effet
B41C 1/14 - Préparation de la forme ou du cliché pour l'impression au stencil ou à l'écran de soie
G03F 7/00 - Production par voie photomécanique, p.ex. photolithographique, de surfaces texturées, p.ex. surfaces imprimées; Matériaux à cet effet, p.ex. comportant des photoréserves; Appareillages spécialement adaptés à cet effet
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
This inlay board inspecting method of determining an abnormal press-fit in an inlay board formed by press-fitting a heat transfer member 3 into a through hole 24 provided in a circuit board 2, includes: a press step in which the heat transfer member 3 is inserted into the through hole 24, and a press-fit jig 13 is brought into contact with the heat transfer member 3 and moved in the press-fit direction to thereby press-fit the heat transfer member 3; a load measuring step in which a load W applied to the press-fit jig 13 is measured; a brake control step for performing a brake control for stopping the movement of the press-fit jig 13 in the press-fit direction of the press-fit jig 13 under the condition that the load W applied to the press-fit jig 13 has reached a predetermined set load Ws; and a determination step in which, after the brake control, when the load W applied to the press-fit jig 13, in a state in which the movement of the press-fit jig 13 is stopped while the press-fit jig 13 and the heat transfer member 3 contact each other, is equal to or greater than a predetermined threshold Wth, the heat transfer member 3 is determined to be abnormally press-fitted.
A three-dimensional wiring board comprises: a three-dimensional resin film (1) which has a dynamic viscoelastic property with a storage elastic modulus of not more than 2 × 107 Pa in a saturation region of a glass transition temperature or above, and which has a breaking elongation of not less than 50%; a first metal film (5) which is formed on a surface of the resin film, and which has a desired pattern; and a second metal film (21) formed on the first metal film. The resin film has a plurality of irregularities on a surface thereof on which the first metal film is formed, and the first metal film has a film thickness adjusted so as to form a porous structure comprising a particulate deposition of a metal.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
30.
Encapsulated circuit module, and production method therefor
To provide a technique of preventing, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, the shield layer from falling off.
In manufacturing encapsulated circuit modules, first, a substrate 100 is covered with a first resin 400 containing filler together with an electronic component 200. Next, a surface of the first resin 400 is covered with a second resin 500 containing no filler. Subsequently, a ground electrode 110 in the substrate 100 is exposed by snicking and then a shield layer 600 that covers the entire surface of the substrate 100 is formed by electroless plating. Thereafter, snipping is performed to obtain a number of encapsulated circuit modules.
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
H01L 23/552 - Protection contre les radiations, p.ex. la lumière
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 23/29 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par le matériau
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
H01L 23/556 - Protection contre les radiations, p.ex. la lumière contre les rayons alpha
A substrate (1) is provided with: a laminated wiring board (3) which has formed therein a plurality of conductive layers (2) composed of a conductive material; a through-hole (6) formed so as to penetrate the laminated wiring board (3); a metal piece (10) disposed inside the through-hole (6) so as to extend over the entire length of the through-hole (6); a bulging portion (8) that is formed so as to bulge outward from an outer edge of the through-hole (6) and is cut out along the entire length of the through-hole (6) in the longitudinal direction; a bulge hole (9) that is formed by being surrounded by the surfaces of the bulging portion (8) and the metal piece (10) that is exposed inside the bulging portion (8); and a plating film (13) that covers the inner wall of the bulge hole (9).
Disclosed is a metal core substrate having: a laminated body (7) configured from a plurality of metal plates (3, 5), and a plurality of insulating resin layers (2, 4, 6), which separate the metal plates from each other, and among which the metal plates are embedded, while having the metal plates face each other; and a through hole (8), which penetrates the laminated body, and which electrically connects the front and rear surfaces of the laminated body to each other. Each of the metal plates is provided with at least one machined hole (21) in the vicinity of the through hole.
A substrate of the present invention is provided with: a laminated wiring board wherein a conductive layer is formed; a through hole penetrating the laminated wiring board; a through hole plating (7) electrically connected to the conductive layer; and a metal piece (10) disposed on the inner side of the through hole plating (7). In the side surface of the metal piece (10), a protruding section (8) directly in contact with the through hole plating (7), and a separated section (9) at a position separated from the through hole plating (7) are formed, and a space surrounded by the separated section (9) and the through hole plating (7) is covered with a metal plating film (13), and the inside of the plating film (13) is filled with a filling material (14).
The present invention has: an insulating layer (5) containing an insulating resin material; an IC component (4), which is provided with a first copper terminal (4b) on a first surface, and a second copper terminal (4d) on a second surface on the reverse side of the first surface, and which is embedded in the insulating layer; a first outer layer wiring pattern (23) formed on the first surface of the insulating layer; a second outer layer wiring pattern (24) formed on the second surface of the insulating layer, said second surface being on the reverse side of the first surface; a first copper connection section (15) that electrically connects the first copper terminal and the first outer layer wiring pattern to each other; and a second copper connection section (17) that electrically connects the second copper terminal and the second outer layer wiring pattern to each other. The first copper terminal, the first copper connection section, and a connection surface are positioned conforming to the surface shape of the first copper terminal, and the second copper terminal, the second copper connection section, and the connection surface are positioned conforming to the surface shape of the second copper terminal.
A substrate (1) is provided with: a laminated wiring board (3) on which a plurality of conductive layers (2) are formed; a through hole (6) formed by penetrating the laminated wiring board (3); a through hole plating (7), which covers the inner wall of the through hole (6), and is electrically connected to the conductive layers (2); a metal piece (10), which is disposed on the inner side of the through hole plating (7), and is configured from a core section (8), and a film section (9) covering the whole surface of the core section (8); and an alloy film (11), which is disposed between the film section (9) and the through hole plating (7), and is formed of metals which the film section (9) and the through hole plating (7) are respectively formed of.
A component embedded substrate (30) has: a first insulator (13) containing an insulating resin material; an IC component (4), which has a first terminal that is provided on the first surface side, and a second terminal that is provided on the second surface side having a structure more fragile than the first surface side, and which is embedded in the first insulator; a first terminal wiring pattern (9) that electrically connects the first terminal of the IC component and outside of the first insulator to each other; a second terminal wiring pattern (18), which is provided with a metal layer (15) formed on the surface of the first insulator, said metal layer being provided with through holes (19), and conducting vias (17) penetrating the first insulator, said conducting vias electrically connecting the second terminal and the metal layer to each other, and which electrically connects the second terminal of the IC component and the outside of the first insulator to each other; and an insulating resin material-containing second insulator (23) applied to the through holes around the conducting vias.
A print curing method comprises a print curing step of forming a print film by moving an inkjet head (5) and an ultraviolet irradiating device (6) together relative to an article (2) to be printed in a main scanning direction (A) and applying ultraviolet curing ink (4) to part of a surface (2a) to be printed on the article to be printed while irradiating the ink with ultraviolet light, and a repeating step of moving the inkjet head and the ultraviolet irradiating device together relative to the article to be printed in a secondary scanning direction and performing the print curing step on at least part of the remaining part of the surface to be printed, wherein the nozzle width of the inkjet head and the ultraviolet irradiation width of the ultraviolet irradiating device are set so as to be substantially identical in a range wherein the angle of contact, surface tension, and wetting properties of the print film on the surface are uniform.
B05D 1/26 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par application de liquides ou d'autres matériaux fluides, à partir d'un orifice en contact ou presque en contact avec la surface
B05C 5/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage
B05C 9/12 - Appareillages ou installations pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par des moyens non prévus dans l'un des groupes , ou dans lesquels le moyen pour déposer le liquide ou autre matériau fluide n'est pas important pour appliquer un liquide ou autre matériau fluide et exécuter une opération auxiliaire l'opération auxiliaire étant exécutée après l'application
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H05K 3/28 - Application de revêtements de protection non métalliques
38.
SUBSTRATE DETECTING SENSOR AND SUBSTRATE SUCTION-ATTACHMENT PAD EMPLOYING SAME
This substrate detecting sensor (1) is provided with a coil (2) forming an LC circuit, an oscillator circuit (4) which supplies an electric current to the coil (2), a detecting circuit (3) which detects variations in the inductance of the coil (2), and a CPU (6) which, on the basis of results from the detecting circuit (3), analyzes count information relating to the number of substrates in close proximity to the coil (2). The detecting circuit (5) detects, as variations in the inductance, resonant frequency variations which arise when a high-frequency magnetic flux generated as a result of the electric current flowing through the coil (2) varies. The CPU (6) stores in advance the inductance of the coil (2), as reference values corresponding to the number of substrates, and analyzes the substrate count information by comparing the inductance of the coil (2) as detected by the detecting circuit (5) with the reference values.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
B25J 15/06 - Têtes de préhension avec moyens de retenue magnétiques ou fonctionnant par succion
Provided is a three-dimensional wiring board production method comprising: a preparation step in which a resin film (1) having a breaking elongation of 50% or more is prepared; a first metal film formation step in which a first metal film (3) is formed on the surface of the resin film; a pattern formation step in which the first metal film is subjected to patterning in order to form a desired pattern; a three-dimensional molding step in which three-dimensional molding is performed by heating and pressurizing the resin film; and a second metal film formation step in which a second metal film (21) is formed on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited as particles in order to form the first metal film in a porous state.
Provided is a three-dimensional wiring board production method comprising: a preparation step in which a thermoplastic resin film (1) is prepared; a first metal film formation step in which a first metal film (3) is formed on the surface of the thermoplastic resin film; a pattern formation step in which the first metal film is subjected to patterning in order to form a desired pattern; a three-dimensional molding step in which three-dimensional molding is performed by heating and pressurizing the thermoplastic resin film; and a second metal film formation step in which a second metal film (21) is formed on the first metal film having the pattern formed thereon. In the first metal film formation step, metal is deposited as particles in order to form the first metal film in a porous state.
Provided is a three-dimensional molded component production method comprising: a three-dimensional molded product preparation step in which a three-dimensional molded product comprising a wiring pattern formed on the surface of a resin substrate is prepared; a protective film preparation step in which a flat protective film that comprises an adhesive and a resin film having a breaking elongation of 50% or more is prepared; an opening formation step in which an opening corresponding to an area in which the wiring pattern is to be exposed is formed in the flat protective film; a three-dimensional molding step in which the flat protective film is three-dimensionally molded so as to correspond to a formation surface of the wiring pattern of the three-dimensional molded product that has been three-dimensionally molded; and a covering step in which the opening is made to face the area in which the wiring pattern is to be exposed while the adhesive is attached to the formation surface of the wiring pattern of the three-dimensional molded product and the three-dimensional molded product is covered with the protective film. In the opening formation step, the position, shape, and size of the opening are designed with consideration to the shape of the resin substrate during patterning of the wiring pattern.
A three-dimensional wiring board is provided with a three-dimensional shape and comprises a resin film (2) having a breaking elongation of 50% or more and a wiring pattern (3) that is formed on the surface of the resin film (2) and that is provided with a desired pattern. The resin film (2) comprises rigid sections (1a, 1b) provided with a three-dimensional shape and a flexible section (1c) that is flexible and that extends in a desired direction from the ends of the rigid sections.
Provided is a three-dimensional molded component production method comprising: a three-dimensional molded product preparation step in which a three-dimensional molded product comprising a wiring pattern formed on the surface of a resin substrate is prepared; a protective film formation step in which a protective film is formed on at least the surface of the three-dimensional molded product by spray coating the three-dimensional molded product with a photosensitive material; an exposure mask film preparation step in which an exposure mask film that is three-dimensionally molded so as to correspond to the three-dimensional molded product is prepared; an exposure mask film arrangement step in which the exposure mask film is arranged so as to cover the protective film; a vacuum air removal step in which the three-dimensional molded product having the exposure mask film arranged thereon is inserted into a bag for vacuum air removal, the air is removed by vacuum, and the exposure mask film is made to adhere to the protective film; an exposure step in which the three-dimensional molded product is irradiated with light and thereby exposed while inserted in the bag for vacuum air removal; and an opening formation step in which the three-dimensional molded product is removed from the bag for vacuum air removal, development treatment is carried out, and a desired opening is formed in the protective film.
The invention comprises: a preparation step of preparing a layered body (1) containing a substrate material layer (2) and a conductor layer (3); a photoresist film forming step of coating a negative resist material in liquid form onto a surface of the conductor layer and forming a photoresist film (4) of 15 μm or less in thickness; an exposing step of using a direct drawing device to irradiate a laser light onto the photoresist film and forming a laser light irradiated region (5) of a desired shape; a development step of forming openings by removing the regions not irradiated by the laser light, and performing patterning on the photoresist film; an etching step of etching the conductor layer with the patterned photoresist film as an etching mask; and a removal step of removing the patterned photoresist film. The negative resist material contains a developable resin, a photosensitive resin, an organic solvent, a leuco dye, and a photopolymerization initiator whereof the sensitivity in the laser light wavelength region is higher than the sensitivity in other wavelength regions.
A printed wiring board (1) having a component mounted thereto using solder and having: a laminate (2) comprising a laminated structure having laminated therein a substrate material layer (5) and a conductor layer (6) patterned upon the surface of the substrate material layer; a coating layer (3) covering the non-soldered section of the surface of the laminate and having openings (16) formed therein that comprise an opening shape corresponding to prescribed information for the component; and symbol sections (17) filling the openings and indicating prescribed information for the component.
A printed wiring board (1) to which a component is mounted using solder, having: a laminate (2) comprising a laminated structure having laminated therein a substrate material layer (5) and a conductor layer (6) patterned upon the surface of the substrate material layer; and a coating layer (3) covering the unsoldered sections of the surface of the laminate. The coating layer comprises: a first insulating film (11) formed upon the surface of the laminate; and a second insulating film (12) formed upon the first insulating film. An opening (16) is formed in the second insulating film, said opening exposing the first insulating film and showing prescribed information about the component.
A printed wiring board (1) having components mounted thereto, using solder, and having: a laminate (2) comprising a laminated structure having laminated therein a substrate material layer (5) and a conductor layer (6) patterned upon the surface of the substrate material layer; and a non-conductive coating layer (3) covering the non-soldered section of the surface of the laminate. The coating layer comprises: a base section (11) formed upon the surface of the laminate so as to surround at least the perimeter of the conductor layer; dam sections (12) formed upon the base section, surrounding the perimeter of the conductor layer, and following the rim of the base section; and a symbol section (13) formed upon the base section and indicating prescribed information for the components. The dam sections and the symbol section comprise the same insulating material.
The present invention comprises: a preparation step for preparing a laminate (2) having a structure in which a patterned conductive layer (4) is laminated on the surface of an insulating layer (3); a first protective film forming step for forming a first protective film (11) by applying an insulating material (10) by means of an inkjet system onto a first print region (17) which is on a surface of the laminate and which surrounds at least a part of the conductive layer in an exposed manner; and a second protective film forming step for forming a second protective film (12) by applying the insulating material (10) by means of an inkjet system onto a second print region (19) covering at least a part of the laminate which is exposed on the surface of the first protective film and in the region inside the first protective film. In the second protective film forming step, inkjet drawing is performed with a resolution higher than that in the first protective film forming step.
This substrate suction device (1), for sucking an internal gas to suction a substrate (31) in contact therewith, is provided with: a suctioning unit (2) which contacts the substrate and is provided with multiple suction holes; a suction hole connecting unit (3) which, in conjunction with the suctioning unit, forms a shared internal space connected to the suction holes and which is provided with a suction port (15b) for sucking the internal gas from the shared internal space; and a plate-shape suction hole opening and closing unit (4) which is provided inside of the suctioning unit and which comprises multiple valve bodies (21) for opening and closing the suction holes. The valve bodies are provided with a closing plate (22) which closes the suction holes by contacting the inner surface (8a) of the suctioning unit exposed by the suction holes, and with an elastic support plate (23) which supports the closing plate so as to enable displacement in the extension direction of the suction hole.
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
B25J 15/06 - Têtes de préhension avec moyens de retenue magnétiques ou fonctionnant par succion
50.
SUBSTRATE SUCTIONING DEVICE AND SUBSTRATE SUCTIONING METHOD
This substrate suction device is provided with: a suctioning unit (2) which contacts a substrate (31) and is provided with multiple suction holes; a suction hole connecting unit (3) which is provided with a suction port (15b) for sucking the internal gas from the shared internal space formed in conjunction with the suctioning unit; and a plate-shape suction hole opening and closing unit (4) which is provided inside of the suctioning unit and which comprises multiple valve bodies (21) for opening and closing the suction holes. The valve bodies are provided with a closing plate (22) which closes the suction holes by contacting the inner surface (8a) of the suctioning unit exposed by the suction holes, and with an elastic support plate (23) which supports the closing plate so as to enable displacement in the extension direction of the suction hole. The aforementioned elastic support plate includes an annular unit (24) formed concentrically about the closing plate, an opening unit (27) positioned between the closing plate and the annular unit, and a linking unit (26) linking the closing plate and the annular unit, wherein the closing plate moves from the state before suctioning the substrate in a parallel manner towards the inside surface, closing the suction holes.
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
B25J 15/06 - Têtes de préhension avec moyens de retenue magnétiques ou fonctionnant par succion
51.
MOULDED CIRCUIT MODULE, AND PRODUCTION METHOD THEREFOR
The purpose of the present invention is to further reduce the thickness of a moulded circuit module. A production method for a moulded circuit module includes: a first coating step in which the entirety of one surface of a substrate, which has, provided to the one surface, a plurality of virtual compartments disposed next to each other, has at least one electronic component mounted to each of the compartments of the one surface, and is provided with grounding electrodes, is coated with a first resin including a filler, such that all of the electronic components are coated therewith, and the first resin is cured; a first resin moulding step in which the surface of the cured first resin is shaved such that the surface becomes parallel with the one surface of the substrate; and a full cutting step in which a plurality of moulded circuit modules based on each of the compartments are obtained by cutting the substrate at the boundaries of the compartments, and separating each of the compartments.
The purpose of the present invention is to improve the electromagnetic-wave-blocking performance of a metal shield layer covering the surface of a resin layer including a filler, in a moulded circuit module provided with said shield layer. In this moulded circuit module, a substrate (100) having electronic components mounted thereto is covered with a first resin (400). The surface of the first resin (400) is covered with a shield layer (600) which includes: a first metal coating layer (610) made from copper or iron; and a second metal coating layer (620) made from nickel. The first metal coating layer (610) and the second metal coating layer (620) are both thicker than 5 µm.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/28 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 23/29 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par le matériau
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
53.
MOULDED CIRCUIT MODULE, AND PRODUCTION METHOD THEREFOR
Provided is a technique which inhibits detachment of a metal shield layer covering the surface of a resin layer including a filler, in a moulded circuit module provided with said shield layer. When producing this moulded circuit module, firstly a substrate (100) is covered with a first resin (400) including a filler, such that all electronic components (200) are covered therewith. The surface of the first resin (400) is subsequently covered with a second resin (500) which does not include a filler. Half-cutting processing is performed thereafter to expose grounding electrodes (110) in the substrate (100), and electroless plating is subsequently used to form a shield layer (600) covering the whole of the surface side of the substrate (100). Full cutting is performed thereafter to obtain a plurality of the moulded circuit modules.
Provided is a technique which inhibits detachment of a metal shield layer covering the surface of a resin layer including a filler, in a moulded circuit module provided with said shield layer. When producing this moulded circuit module, firstly a substrate (100) is covered with a first resin (400) including a filler, such that all electronic components (200) are covered therewith. The surface of the first resin (400) is subsequently covered with a second resin (500) which does not include a filler. Half-cutting processing is performed thereafter to expose grounding electrodes (110) in the substrate (100), and electroless plating is subsequently used to form a shield layer (600) covering the whole of the surface side of the substrate (100). Full cutting is performed thereafter to obtain a plurality of the moulded circuit modules.
The purpose of the present invention is to improve a moulded circuit module, which includes a communication unit among the electronic components mounted to a substrate thereof, and which is provided with a shield layer, such that communication using the communication unit is not hindered. This moulded circuit module is provided with a substrate (100) having, mounted thereto, electronic components (200) including an electronic component (200C), i.e. a communication unit. In the substrate (100), all of the electronic components (200) are covered by a first resin (400). The upper surface of the first resin (400) is covered by a second resin (500). The upper surface of the second resin (500) and the side surfaces of the first resin (400) are covered by a shield layer (600) made from plating which blocks electromagnetic waves. An opening (630) in the shield layer (600) is provided directly above the electronic component (200C), i.e. the communication unit.
The purpose of the present invention is to reduce the reciprocal effect exhibited in cases when electronic components which affect each other as a result of electromagnetic waves are present in one moulded circuit module. This moulded circuit module is provided with a substrate (100) having a plurality of electronic components (200) mounted thereto. One electronic component (200A) is a high-frequency oscillator. A metal partition side wall part (320) is provided to the substrate (100). One surface of the substrate (100) is coated with a first resin (400) such that the electronic components (200) and the side wall part (320) are coated therewith. The electronic component (200A) and the first resin (400) are covered with a shield layer (600) made from an electromagnetic-wave-blocking metal. The electronic component (200A) is surrounded by the side wall part (320) and the shield layer (600).
The purpose of the present invention is to reduce the reciprocal effect exhibited in cases when electronic components which affect each other as a result of electromagnetic waves are present in one moulded circuit module. This moulded circuit module (M) is provided with a substrate (100) having a plurality of electronic components (200) mounted thereto. One electronic component (200A) is a high-frequency oscillator. A metal partition side wall part (320) is provided to the substrate (100). One surface of the substrate (100) is coated with a first resin (400) such that the electronic components (200) and the side wall part (320) are coated therewith. The first resin (400) is covered by a shield layer (600) made from an electromagnetic-wave-blocking metal. The electronic component (200A) is surrounded by the side wall part (320) and the shield layer (600).
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/28 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
A method of fabricating a heat dissipating board according to the present invention, includes: a substrate intermediate forming step of forming a substrate intermediate with an insulating layer made of an insulating resin material and a conducting layer made of a conductive material formed on the insulating layer; a through hole forming step of forming a through hole having an approximately cylindrical shape, the through hole penetrating through the substrate intermediate; an inserting step of inserting a heat conducting member to be disposed in the through hole, the heat conducting member being made of a metal and having an approximately cylindrical shape; and a plastically deforming step of plastically deforming the heat conducting member to be secured in the through hole. Prior to the inserting step, an annealing step of annealing the heat conducting member is performed.
This manufacturing method for a component-embedded substrate comprises: a multilayer body forming step for forming a multilayer body (50) by stacking a first prepreg (42), an unclad board (44), a second prepreg (46) and a second two-sided circuit substrate (14) on a first two-sided circuit substrate (12) on which a large-sized electronic component (24) is mounted; a pressing step for pressing the second two-sided circuit substrate (14) against a top part (72) of the large-sized electronic component (24), which is accommodated inside a through hole (64) that penetrates through the first prepreg (42), the unclad board (44) and the second prepreg (46), so as to cause the top part (72) and the second two-sided circuit substrate (14) to contact each other; an electronic component burying step for burying the large-sized electronic component (24) using resin of the first prepreg (42) and the second prepreg (46); and a removing step for removing part of the second two-sided circuit substrate (14), the part being located above the large-sized electronic component (24), so as to expose the top part (72) of the large-sized electronic component (24).
In a method for manufacturing a device embedded substrate, a conductive via that penetrates a first insulating layer and a second insulating layer from an outer metal layer to reach a second terminal of an IC device is formed after forming the outer metal layer.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 23/29 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par le matériau
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
Provided is a method for manufacturing a metal mask by which one screen printing plate frame can be used collectively for a plurality of metal masks (2) that are each provided with a metal plate (11), and by which metal masks that are integrally formed with a conventional frame can be reused. A metal plate on which a patterned portion has been already formed is cut out from a conventional frame, for example, and prepared. Next, a metal plate (11) is used to cover an opening (12) of a metal panel (10) that is formed by the arrangement of panel segments (10a, 10b, 10c, 10d), and an overlap portion (13) between the metal plate and the metal panel is formed. The metal plate is bonded to the metal panel in the overlap portion (13), thereby forming the metal mask (2).
A printed wiring board includes: an inner layer structure body containing at least an inner layer insulative base material composed of a glass cloth and resin which covers the glass cloth and not containing a resin insulative base material composed only of resin; outer layer wiring formed on a first face of the inner layer structure body; and a solder resist layer formed on a surface of the outer layer wiring, wherein in the inner layer structure body, an opening part is formed, and the solder resist layer is composed of a first ink part covering at least the outer layer wiring that is formed on a partial region of the first face which corresponds to the opening part and a second ink part interposing both ends of the first ink part and being lower in flexibility than the first ink part.
This multilayer-circuit-board manufacturing method includes the following steps: a core-circuit-board formation step in which a patterned first conductive layer is formed on at least one surface of a flat core substrate, yielding a core circuit board; a layering step in which insulating substrates each comprising an insulating material are provided on both sides of the core circuit board and metal films are provided on the outsides of said insulating substrates; a pressing step in which vacuum pressure is used to press the core circuit board, the insulating substrates, and the metal films against each other; and a pattern formation step in which the metal films are patterned so as to form second conductive layers. In the pressing step, the core circuit board is warped at a plurality of points so as to give said core circuit board an undulating cross-section.
This printed wiring board (1) on which an electronic component is mounted comprises: a laminate (18) including an insulating body (17), at least one inner-layer circuit pattern (12) embedded in the insulating body, and outer-layer circuit patterns (13, 16) formed respectively on the front and back surfaces of the insulating body; and a non-penetrating end-surface through hole (2) that extends, in a side surface of the laminate, from the outer-layer circuit pattern formed on the opposite side of the electronic component mounting surface toward the inner-layer circuit pattern. The end-surface through hole has a structure in which: one end thereof that is located in an inner layer of the laminate is curved and projects toward the mounting surface side; and a conductor film (22) is formed from the surface on the opposite side of the electronic component mounting surface and over the surface of said one end.
A circuit board production method according to the present invention includes: an through hole forming step in which a through hole (62) is formed in a multilayered wiring board (20) that includes a pad layer (26) and inner conductor layers (50, 52, 54, 56); a preparation step in which a metal pin (64) is inserted in the through hole (62), and the metal pin (64) is contacted to a target inner conductor layer (54), which is a target amongst the inner conductor layers; and a non-through hole forming step, in which a drill machine (10) is used to press a drill blade (12), which drives through the multilayered wiring board (20), and advance drill processing, the drill blade (12) and the target inner conductor layer (54) are contacted, and when the conduction thereof is detected via the metal pin (64), the drive of the drill blade (12) is stopped and a non-through hole (68) that extends from an external conductor layer (24) to the target inner conductor layer (54) is formed.
A rigid-flex substrate (1) with an embedded component (2). Said rigid-flex substrate (1), which has a rigid section (3) in which the component (2) is embedded and a flexible section (4), contains the following: a flexible substrate (10) that comprises an insulating layer (11) with copper foils (12, 13) laminated thereto and has, in the region thereof corresponding to the rigid section (3), an opening (17) that can accommodate the component (2); and a prepreg (20) that is provided so as to cover at least part of one or both surfaces of the flexible substrate (4) and, with the component (2) accommodated inside the opening (17), fills the interior of said opening (17).
This printed circuit board contains the following: a conductor-bearing insulator (14) comprising a first insulating layer (11) and first and second conductor layers (12 and 13, respectively) formed on the top and bottom surfaces, respectively, of the first insulating layer; a second insulating layer (15) laminated to the first conductor layer; a third conductor layer (16) laminated to the second insulating layer; and a cavity (2) that extends, from the side where the third conductor layer is formed, to the first conductor layer. The first conductor layer comprises the following: embedded pattern wiring (28) sandwiched between the first insulating layer and the second insulating layer; pads (3) located at the bottom of the cavity; and a protective film (27) located along the sides of the cavity, at least part of said protective film (27) being exposed at the bottom of the cavity.
A bending-back method for a rigid printed wiring board comprising a flexible portion comprises: a preparation step, which forms preliminary boards, in which conducting layers, comprising conducting material, are disposed on the surface of a pre-preg, comprising thermosetting resin; a stacking step, which stacks a plurality of layers of the preliminary boards; a thermosetting step, which presses together the plurality of layers of the preliminary boards that have been stacked in the stacking step while heating the same, and heat-cures the thermosetting resin so as to integrate the same into an intermediate board; a machining step, which cuts an insulating layer, which has been formed by heat-curing of the thermosetting resin in the thermosetting step, in the stacking direction of the preliminary boards, and forms a flexible portion, which is formed to be thin across and between both edges of the intermediate board that face each other, so as to create a finished board; a bending step, which bends the flexible portion; and a bending-back step, which bends back the flexible portion which has been bent in the bending step. A dehydration step, which raises the temperature of the flexible portion in the bent state, is performed prior to the bending-back step.
The present invention provides a manufacturing method of a device embedded substrate, including: forming a bonding layer of an insulation material on a metal layer formed on a support plate; and mounting an electric or electronic device on the bonding layer, wherein the device is formed of a device main body and a protruding terminal; the bonding layer includes a first bonding body bonded with the metal layer and a second bonding body bonded with the device; the first bonding body is formed along the outer edge of the device; the second bonding body is formed in an area equal or smaller than the area defined by the outer edge of the terminal; and, in the bonding layer forming step, the second bonding body is formed on the first bonding body after the first bonding body is cured.
H01L 21/44 - Fabrication des électrodes sur les corps semi-conducteurs par emploi de procédés ou d'appareils non couverts par les groupes
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
70.
PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
A printed wiring board (1) is provided with an insulating layer (2) comprising an insulating material (5) in which glass cloth (6) is embedded, conducting layers (3) placed on surfaces of the insulating layer (2), a substrate main body (4) comprising the insulating layer (2) and the conducting layers (3), and a through-hole (7) which extends through the substrate main body (4). The substrate main body (4) additionally comprises an insulating resin body (9) which does not contain the glass cloth (6), the insulating resin body (9) is disposed extending between both surfaces of the substrate main body (4), and the through-hole (7) extends through the insulating resin body (9).
A method for manufacturing a printed wiring board comprises: a base formation step for forming a metal foil (12) as a base on a support plate (11); a mask formation step for coating a resist (13) on the metal foil (12) and patterning the resist (13) so as to form a resist mask (15); a conducting layer formation step for electroplating apertures (14) in the resist mask (15) so as to form conducting layers (16) which at least fill the apertures (14); an application step for applying an insulating base material (18) on the side on which the resist mask (15) and the conducting layers (16) are formed, in a state in which the resist mask (15) remains; and a removal step for removing the support plate (11).
H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
A printed wiring board (10) has: an inner layer structure (20) which contains at least an inner layer insulating substrate (31) consisting of a glass cloth (31a) and a resin (31b) coating the glass cloth (31a), but does not contain a resin insulating substrate consisting solely of resin; an outer layer wiring (21) formed on a first surface (20a) of the inner layer structure (20); and a solder resist layer (23) formed on the surface of the outer layer wiring (21). An opening (11) is formed in the inner layer structure (20). The solder resist layer (23) comprises of first ink portions (23a) coating at least the outer layer wiring (21) formed on a region of one portion of the first surface (20a) corresponding to the opening (11), and second ink portions (23b) sandwiching both ends of the first ink portions (23a) and having less flexibility than the first ink portions (23a).
A heat dissipation substrate is provided with a substrate main body comprising an insulating layer and a conducting layer, a through-hole (5) extending through the substrate main body, a thermally conductive body (7) comprising thermally conductive material and housed within the through-hole (5), a gap portion (8) which exists as an interval between the through-hole (5) and the thermally conductive body (7), and a fixed plated portion formed by way of a plating process in the gap portion (8) in order to secure the thermally conductive body (7) to the through-hole (5). For the gap portion (8), an interval between the outer peripheral surface of the thermally conductive body (7) and the inner wall surface of the through-hole (5) facing the same is formed as non-uniform and has minimum portions (24) which are of a minimum interval and maximum portions (23) which are of a maximum interval.
A printed wiring board has: an insulator (5) with copper foil, comprising a first insulator substrate (3), consisting of resin, and copper foil (4) formed on the surface of the first insulator substrate; and a laminate (17), in which a plurality of copper foils (6 to 11), and a plurality of second insulating substrates (12 to 16) comprising glass cloth (21) and resin (22) covered by the glass cloth, are alternatingly stacked upon the first insulating substrate, and an aperture portion (2) is formed toward the interior from the surface of the side opposite the surface of contact with the insulator with copper foil. In the area between the bottom of the aperture portion and the copper foil upon the insulating resin body with copper foil, only one sheet of the glass cloth and resin configuring a plurality of the second insulating substrates exist, and the distance from the bottom of the aperture portion to the surface of the copper foil upon the insulating resin body with copper foil is greater than or equal to 170 μm and less than or equal to 230 μm.
This inspection jig (2) is an inspection jig which is included in a printed board inspection apparatus (4) for carrying out electrical inspection of a printed board (8) having a first surface (30) and a second surface (32) on the opposite side from the first surface (30), and which is provided with a first retaining assembly (26) for supporting the first surface side of the printed board (8), and a second retaining assembly (28) for supporting the second surface side of the printed board (8). The first retaining assembly (26) includes a first probe pin retainer (36) for retaining a multitude of first probe pins (34), and a first heating plate (54) which can maintain the printed board (8) at a desired set temperature. The second retaining assembly (28) includes a second probe pin retainer (84) for retaining a multitude of second probe pins (34), and a second heating plate (86) which can maintain the printed board (8) at a desired set temperature.
G01R 31/02 - Essai des appareils, des lignes ou des composants électriques pour y déceler la présence de courts-circuits, de discontinuités, de fuites ou de connexions incorrectes de lignes
G01R 31/28 - Test de circuits électroniques, p.ex. à l'aide d'un traceur de signaux
76.
METHOD FOR FORMING THIN FILM AND APPARATUS FOR FORMING THIN FILM
Ridge-shaped damming structures (14) are formed on the surface of a substrate (10) along the edges (12) of a region (11) where a thin-film pattern is to be formed. After the formation of the damming structures (14), a liquid photocurable thin-film material is converted into droplets and made to land in the region (11). The thin-film material which has landed in the region (11) is irradiated with a beam of light for temporary curing, and thereby temporarily cured into a film constituent (15A). A liquid photocurable thin-film material is applied on the film constituent (15A) to form a liquid coating (16). The liquid coating (16) and the film component (15A) are irradiated with a beam of light which is for curing and which has an optical intensity higher than that of the beam of light for temporary curing. Thus, the liquid coating (16) is cured, and the degree of curing of the film constituent (15A) is enhanced.
B05D 3/06 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliqués; Traitement ultérieur des revêtements appliqués, p.ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par exposition à des rayonnements
B05C 5/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage
B05C 9/06 - Appareillages ou installations pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par des moyens non prévus dans l'un des groupes , ou dans lesquels le moyen pour déposer le liquide ou autre matériau fluide n'est pas important pour appliquer deux liquides ou autres matériaux fluides différents, ou le même liquide ou matériau fluide deux fois, sur le même côté de l'ouvrage
B05C 9/10 - Appareillages ou installations pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par des moyens non prévus dans l'un des groupes , ou dans lesquels le moyen pour déposer le liquide ou autre matériau fluide n'est pas important pour appliquer un liquide ou autre matériau fluide et exécuter une opération auxiliaire l'opération auxiliaire étant exécutée avant l'application
B05C 9/12 - Appareillages ou installations pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par des moyens non prévus dans l'un des groupes , ou dans lesquels le moyen pour déposer le liquide ou autre matériau fluide n'est pas important pour appliquer un liquide ou autre matériau fluide et exécuter une opération auxiliaire l'opération auxiliaire étant exécutée après l'application
B05D 1/26 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par application de liquides ou d'autres matériaux fluides, à partir d'un orifice en contact ou presque en contact avec la surface
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
H05K 3/28 - Application de revêtements de protection non métalliques
77.
MANUFACTURING METHOD FOR HEAT-DISSIPATING SUBSTRATE
This manufacturing method for a heat-dissipating substrate is provided with: a substrate intermediate formation step in which a substrate intermediate is formed having a conductive layer comprising a conductive material formed on an insulating layer comprising an insulating resin material; a through hole formation step in which a substantially tubular through hole is formed penetrating through the substrate intermediate; an insertion step in which a metallic, substantially columnar thermally conductive member is inserted and placed in the through hole; and a plastic deformation step in which the thermally conductive member is elastically deformed so as to be fixed in the through hole. An annealing step, in which the thermally conductive member is annealed, is carried out before the insertion step.
The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.
H05K 1/11 - Eléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p.ex. marques de repérage, schémas de test
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A component-embedded substrate (1) has: an insulating layer (3); a first metal layer (4) and second metal layers (5) which are formed so as to sandwich the insulating layer (3); a component (2) which is embedded within the insulating layer (3), and for which a non-connection-terminal-formed surface (2c), on which connection terminals (2a) have not been formed, is positioned on a side that neighbors the first metal layer (4); an adhesion layer (6) which is positioned upon the non-connection-terminal-formed surface (2c) of the component (2); and conductive vias (7), which electrically connect the second metal layers (5) with the respective connection terminals (2a) of the component (2). The area of the surface side of the adhesion layer (6) in contact with the component (2) is less than the area of the non-connection-terminal-formed surface (2c) of the component (2).
In a method for manufacturing a component-embedded substrate (20), a through via (16) is formed after forming an outer metal layer (14), said through via penetrating a first insulating layer (5) and a second insulating layer (11) from the outer metal layer (14), and reaching a second terminal (4b) of an IC component (4).
A component-embedded substrate (10) has an insulating substrate (1), a metal layer (3) formed upon the surface of the insulating substrate (1), a through-hole (2) passing through the insulating substrate (1), and a thermally conductive body (20) which fills the through-hole (2). The thermally conductive body (20) is provided with a shape in which a graphite sheet (4) that has been coated with an adhesive (5) on the surface is wound into a roll shape.
A component-embedded substrate (20) has: an insulating layer (6) including an insulating resin material; at least one IC component (4) embodied upon the insulating layer (6); wiring patterns (16) which electrically connect connection terminals (4a and 4b) of an IC component (4) with the outside of the insulating layer (6); and at least one protection component (5) which is of taller height than the IC component (4) and for which electrical functioning does not occur.
This heat-dissipating substrate (1) comprises: an insulating layer (4) made of an insulating resin material; an electroconductive layer (5) made of an electroconductive material; a substrate body (2) including said insulating layer (4) and said electroconductive layer (5); a through hole (6) that penetrates said substrate body (2); a heat-dissipating body (3) that is made of a heat-transferring material and that is housed inside said through hole (6); and a plating part (8) formed by executing a plating treatment in a state where said heat-dissipating body (3) is arranged inside said through hole (6). The plating part (8) is interposed between said heat-dissipating body (3) and said through hole (6), holds said heat-dissipating body (3) inside said through hole (6), and covers the entire surface of said heat-dissipating body (3).
A substrate with built-in component (15) is provided with an insulating layer (12) which includes an insulating resin material, an electric or electronic component (4) embedded in the insulating layer (12), a metal film (9) covering at least one surface of the component (4), and a roughened portion (10) in which at least a portion of the surface of the metal film (9) has been subject to roughening processing and formed. Preferably, the invention is also provided with: a conducting layer (6) which has been patterned on at least a bottom surface (7), which is at least one surface of the insulating layer (12); and a bonding agent (3), which bonds the conducting layer (6) to a mount surface (8), which is one surface of the component (4), and comprises a material that is different from the insulating layer (12). The metal film (9) is formed on only the surface on the opposite side of the mount surface (8), and the thickness of the bonding agent (3) is less than the thickness from the metal film (9) to the top surface (11), which is another surface of the insulating layer (12).
This method for manufacturing an embedded-component-containing substrate (16) includes the following steps: a pattern/via-window formation step in which a conductive metal material that is different from a metal material used in a metal plate (1) is used to form a conductor pattern (4) and a via window, which is to become part of a via, on the surface of said metal plate (1); a component mounting step in which an adhesive (6) is applied so as to cover the aforementioned via window and a terminal (8) is provided, and an electric or electronic component (7) mounted, on top of the via window with the adhesive (6) interposed therebetween; a via formation step in which a via is formed through the via window all the way to the terminal (8); a conductive-via formation step in which the via is plated and filled with a metal material, forming a conductive via (14); and a pattern exposure step in which the metal plate (1) is removed so as to expose the conductor pattern (4).
This method for manufacturing an embedded-component-containing substrate includes the following steps: a plate-body formation step in which a plate body, comprising a conductive layer (1) and a nickel-comprising nickel layer (2) in close contact with each other, is formed; a solder-application-region formation step in which part of the nickel layer (2) is removed, exposing the conductive layer (1) and forming a solder-application region (5) in which to apply a solder paste; a component mounting step in which a solder paste is applied to the solder-application region (5) and a terminal (8) for an electric or electronic component (7) is mounted on top of said solder paste; a removal step in which the nickel layer (2) is removed; a lamination step in which the aforementioned component (7) is buried in an insulating layer comprising an insulating material; and a pattern formation step in which a conductive pattern is formed in the abovementioned conductive layer (1).
According to the present invention, in an installation step, an electric or electronic embedded component (20) and dummy embedded components (31, 32) are installed at a predetermined distance from each other on a core layer (13). In an embedding step, the embedded component (20) and the dummy embedded components are embedded in an insulation substrate (50). In an electroconductive layer formation step, an electroconductive layer (60) is formed on the insulation substrate (50) so as to face an electrode (20b) of the embedded component (20). In a hole formation step, a portion of the insulation substrate (50) and the electroconductive layer (60) corresponding to the electrode (20b) of the embedded component (20) is removed, and a through hole (60c) extending to the electrode (20b) of the embedded component (20) is formed. In an electroconductivity processing step, the electroconductive layer (60) and the electrode (20b) of the embedded component (20) are electrically connected via the through hole (60c) formed in the hole formation step.
The reduced pressure adhesion device (1) is provided with: a reduced pressure adhesion section (2), which abuts against the object (9) of the reduced pressure adhesion and in which multiple suction holes (8) are formed; side walls (3) and a top wall (4) for forming a negative pressure chamber (10) in cooperation with the reduced pressure adhesion section (2); pin-shaped valve bodies (13) that extend from the negative pressure chamber (10) into the suction holes (8); and blocking parts (16) for blocking the suction holes (8) by the close adhesion of a portion of the valve body (13) to a portion of the inner wall of the suction hole (8) as a result of the valve body (13) sliding inside the suction hole (8). The valve bodies (13) have a base (13a), which is the end that is located in the negative pressure chamber (10). The base (13a) is fixed to a flexible sheet-shaped body (17), which is extended and fixed between the side walls (3) inside the negative pressure chamber (10). The flexible body (17) has multiple perforations (19).
A component-embedded substrate (20), provided with: an insulation layer (12) including an insulation resin material; an electric or electronic component (4) embedded in the insulation layer (12); terminals (15) representing electrodes of the component (4); a conductor pattern (18) formed on the surface of the insulation layer (12); and conducting vias (21) for electrically connecting the conductor pattern (18) and the terminals (15) to each other. Each of the conducting vias (21) is formed from, in sequence from the conductor pattern (18) to the terminal (15), a large-diameter section (21a) having a large diameter and a small-diameter section (21b) having a smaller diameter than the large-diameter section (21a). A step section (17) is formed between the large-diameter section (21a) and the small-diameter section (21b). The large-diameter section (21a) is formed so as to penetrate a sheet-shaped glass cloth (11) disposed in the insulation layer (12).
This component-embedded substrate is characterized in being provided with: a plate-shaped first member (400) having a component (500) disposed on one surface thereof in which a protrusion (720b) is formed; and a second member (700) that is joined to the one surface of the first member (400) so as to sandwich the component (500) therebetween after the component (500) is disposed on the one surface of the first member (400). A tip of the protrusion (720b) formed on the one surface of the first member (400) abuts the second member (700) when the first member (400) and the second member (700) are joined together, and the first member (400) and the second member (700) are electrically connected to each other.
This circuit board is provided with: an insulating board (14) having a first surface (10) and a second surface (12) on a side opposite to the first surface (10); surface metal layers (20a, 20b) provided on the first surface (10) and the second surface (12); through holes (16) passing through from the first surface (10) to the second surface (12); a hole lining metal layer (28) that covers the inner wall surfaces of the through holes (16) and connects the surface metal layer (20a) provided on the first surface (10) with the surface metal layer (20b) provided on the second surface (12). The hole lining metal layer (28) is provided so as to be thicker than the thickness of the surface metal layers (20a, 20b).
The screen printing plate (12) is provided with: a roughly rectangular frame (7) inside which a metal sheet-shaped mask (15) of a roughly rectangular shape is disposed; an adapter (13), which protrudes inward from the frame (7) and holds the outer edges of the metal mask (15); and an open edge (14), which in top view of the frame (7) is prescribed by the sides of the adapter (13) at the innermost positions. The adapter (13) has moving sections (16) capable of moving between a closed position in which the open edge (14) is located to the inside of the outer edge of the metal mask (15) and an open position in which at least one side of the open edge (14) is located to the outside of the outer edge of the metal mask (15). The frame (7) has a tensioning unit for applying an outward tension on the metal mask (15) by moving the adaptor (13) outward while holding the metal mask (15).
This method for production of an embedded board (1) is characterized by including: a circuit formation step in which, in a first member of tabular form having a second metal layer of a different type of metal than the metal used for a first layer, formed on one surface of the first layer, and a third metal layer of a different type of metal than the metal used for the first layer, formed on the other surface of the first layer, a portion of the second metal layer is removed from the one surface of the first metal layer, and a circuit is formed from the remaining portion; a heating element installation step in which a heating element is installed within an exposed area from which the second metal layer was removed in the circuit formation step; a heating element embedding step in which a second member of tabular form is installed onto the first member, so as to face the one surface of the first metal layer and sandwich the heating element between itself and the first metal layer; and a heat dissipating portion formation step in which a portion of the third metal layer is removed in such a way as to leave behind a zone into which the heating element is projected in the perpendicular direction onto the third metal layer at the surface thereof facing the heating element, and a heat dissipating portion is formed from the remaining portion.
According to the invention, in a mark forming process of a component-embedded substrate manufacturing method which involves positioning an electronic component (14) with reference to a mark (12) formed on a copper layer (4), the mark (12) is formed so as to have an outer ridgeline (25) present at a position where the length of a mark reference line (82) would be at least 30% of the length of a search reference line (80). The search reference line (80) is a virtual line extending from a search center (74), which is the center of a search area (72) of a sensor, to an edge side (78) of the search area (72), and the mark reference line (82) is a virtual line extending from a mark center (76), which is the center of the mark (12), to the outer ridgeline (25) of the mark in the same direction as the search reference line (80) when the mark center (76) is aligned with the search center (74).
This component-embedded substrate manufacturing method is provided with: a first insulator forming step wherein a board-like first insulator (5) is formed on a metal layer (12) formed on a supporting board (11); a hole-making step wherein an opening (14) that penetrates the first insulator (5) is formed; a component mounting step wherein a bonding layer (10) is formed on the metal layer (12) exposed in the opening (14), and an electric or electronic component (3) is mounted on the bonding layer (10); a second insulator forming step wherein a board-like second insulator (8) is formed on the first insulator (5); and a laminating step wherein an insulating layer is formed by pressurizing the first insulator (5) and the second insulator (8), and the component (3) is embedded in the insulating layer.
This component-embedded substrate (15) comprises: a conductor pattern formed on the surface of a substrate; an adhesive layer (10) formed on the inner side of the conductor pattern; an electric or electronic component (3) that adheres to the adhesive layer (10); an electrode (3a) of the component (3); an insulating layer (2) made of an insulating material in which the component (3) is embedded; and a conduction section that penetrates the adhesive layer (10) and electrically connects the conductor pattern and the electrode (3a). A component group (16-20) including a plurality of types of said components (3) is embedded in the insulating layer (2). Each said electrode (3a) is covered with a metal-made metal film. Each said conduction section is formed so as to enter the metal film. The metal films on the respective electrodes (3a) of the respective components (3) included in the component group (16-20) all have the same etching rate or each have an etching rate of from 1 µm/minute to 2 µm/minute.
This method for manufacturing an embedded component substrate is equipped with: a support body formation step, wherein a support body (5) is formed by adhering a metal film (12) on at least both surfaces of a support plate (11); a mounting step, wherein an intermediate body (10) is formed by mounting, on at least one of the surfaces of the support body (5), electric or electronic components (3) and insulating bodies (4); and a lamination step, wherein the insulating bodies (4) are pressed, thereby forming an insulation layer and embedding the components (3) within the insulation layer. In the lamination step a laminated body (15) is formed by stacking multiple intermediate bodies (10), with a support body (5) at the top of the stack, and applying pressure from above and below the laminated body (15).
An embedded component substrate (15) equipped with: a conductor pattern (6) formed on a substrate surface; an adhesive layer (10) formed on the inside of the conductor pattern (6); electric or electronic components (3) adhered to the adhesive layer (10); electrodes (3b) covering the component main body (3a) forming each component (3) and covering the left and right ends of the component main body (3a); an insulation layer (2) comprising an insulation material and in which a component group (14) formed of multiple components (3) is buried; and conductive vias (7) that electrically connect the conductor pattern (6) and the electrodes (3b), and are formed by performing a plating process with respect to vias (13) formed by penetrating the adhesive layer (10) by means of a laser. The electrodes (3b) have a step (16) that protrudes from the component main body (3a) toward the adhesive layer (10), and the lengths of all of the steps (16) of the components (3) forming the component group (14) are between 10-20 μm.
