Shengyi Technology Co., Ltd.

Chine

 
Quantité totale PI 253
Rang # Quantité totale PI 4 987
Note d'activité PI 2,9/5.0    115
Rang # Activité PI 6 052
Symbole boursier 600183 (sse)
Capitalisation 38.781B  (CNY)
Industrie Electronic Components
Secteur Technology
Classe Nice dominante Métaux communs et minerais; obje...

Brevets

Marques

59 1
0 0
193 0
0
 
Dernier brevet 2024 - Thermosetting resin composition ...
Premier brevet 2004 - Double-sided metallic laminate a...
Dernière marque 2011 - SYTECH
Première marque 2011 - SYTECH

Industrie (Classification de Nice)

Derniers inventions, produits et services

2022 Invention Fluorine-containing resin copper-clad laminate and multi-layer circuit board. Provided in the pre...
Invention Non-woven fabric prepreg, metal-foil-clad plate and printed circuit board. The present invention ...
Invention Low dielectric loss non-woven fabric, preparation method thereof and use thereof. Provided are a...
Invention Resin composition and use thereof. The present invention provides a resin composition and use the...
Invention Resin composition and use thereof. ff, better drilling processability and higher electrical stren...
Invention Resin composition and application thereof. The present invention provides a resin composition and...
Invention Resin composition and application thereof. Provided by the present invention a resin composition ...
Invention Fluorine-containing resin-based resin composition and application thereof. The present invention ...
2021 Invention Thermosetting resin composition and application thereof. The present invention relates to a ther...
Invention Resin composition, resin adhesive film, and application thereof. Resin composition, resin adhesi...
Invention Resin composition and resin film, prepreg, laminated board, copper-clad board and printed circuit...
Invention Thermosetting resin composition and application thereof. The present invention relates to a therm...
Invention Resin composition, resin adhesive film, and application thereof. Provided are a resin composition...
Invention Resin composition and adhesive film and cover film comprising same. The present invention provide...
Invention Circuit material and circuit board containing the same. The present application provides a circui...
Invention Resin composition, and prepreg and circuit material using the same. The present application provi...
Invention Laminate coated with asymmetric metal foils, and printed circuit board including same. A laminat...
Invention Laminate coated with asymmetric metal foils, and printed circuit board including same. Provided a...
Invention Thermosetting resin composition, and prepreg and copper clad laminate using same. kff; the heat r...
Invention Resin composition and use thereof. The present invention relates to a resin composition and the u...
Invention Halogen-free flame-retardant resin composition and application thereof. The present invention rel...
Invention Thermosetting resin composition, resin adhesive liquid containing same, prepreg, laminate, copper...
2020 Invention Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, la...
Invention Thermosetting resin composition, and prepreg, laminate, and high-frequency circuit substrate cont...
Invention Fluorine-containing resin composition and resin glue solution comprising same, fluorine-containin...
Invention Resin composition and resin glue solution containing same, prepreg, laminated board, copper-clad ...
Invention Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising same. A m...
Invention Maleimide-modified active ester, preparation method therefor and use thereof. Provided are a male...
Invention Magnetic dielectric resin composition and application thereof. Provided are a magnetic dielectric...
Invention Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising same. A ma...
Invention Resin composition and prepreg sheet using same, and insulating plate. The present invention relat...
Invention Modified maleimide compound, preparation method therefor and use thereof. The present invention r...
Invention Thermosetting resin composition, and prepreg, laminate and printed circuit board using same. Prov...
Invention Thermosetting resin composition and prepreg, laminate and printed circuit board using same. Prov...
Invention Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board usin...
Invention Thermosetting resin composition and prepreg, laminate and printed circuit board using same. Provi...
Invention Copper clad laminate and printed-circuit board. A copper clad laminate and a printed-circuit boa...
2019 Invention Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board. A res...
Invention Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board. Provid...
Invention Active ester with amino groups at two ends, preparation method therefor, thermosetting resin comp...
Invention Resin composition, prepreg containing same, laminate, and printed circuit board. The present dis...
Invention Resin composition, prepreg containing same, and laminate board and printed circuit board. The pr...
Invention Thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed ci...
2018 Invention Resin composition, prepreg, laminate and metal foil-clad laminate. An epoxy resin composition, a...
Invention Resin composition, prepreg for printed circuit and metal-coated laminate. Provided is a resin com...
Invention Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof. Prov...
2017 Invention Thermosetting resin composition, and prepreg and metal foil clad laminate made therefrom. Thermo...
2011 P/S Copper clad laminates for use in the manufacture of printed circuit boards