Abstract

Aspects and examples provide electronic elements and filter devices configured to prevent deterioration of the propagation characteristics caused by input and output signals being electromagnetically coupled to an electric conductor side wall. In one example an electronic filter (200) includes an element substrate (210) having a top surface (210a), a bottom surface (210b), a side surface (210b), and piezoelectric body. A circuit including a plurality of SAW resonators (231 - 273) is formed on the top surface of the element substrate. The electronic filter further includes a sealing substrate (220) having a top surface (220a) and a bottom surface (220b), and a side wall (270) including an electric conductor and formed to define a cavity between the top surface of the element substrate and the bottom surface of the sealing substrate, the side wall enclosing a periphery of the circuit and being connected to a ground potential of the circuit.

IPC Classes  ?

• H03H 9/10 - Mounting in enclosures
• H03H 9/05 - Holders or supports
• H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details

Abstract

An acoustic wave device that can be downsized.　Certain examples of the acoustic wave device include a substrate, an IDT electrode provided above the substrate, a wiring electrode provided above the substrate and connected to the IDT electrode, a sealing body sealing an excitation space in which the IDT electrode excites an acoustic wave, and a sealing wall provided above the wiring electrode and forming a part of the sealing body.　An outer periphery of the wiring electrode includes a protrusion.　In one example, the wiring electrode includes a first wiring electrode provided on an upper surface of the substrate and a second wiring electrode provided on an upper surface of the first wiring electrode, an outer periphery of the second wiring electrode being provided with the protrusion.

IPC Classes  ?

• H03H 9/10 - Mounting in enclosures
• H03H 9/05 - Holders or supports

Abstract

An acoustic wave filter including a substrate (112), a signal line (108) disposed on the substrate and connecting a first signal terminal (102) to a second signal terminal (104), a plurality of series resonators (S11, S12, S13, S14, S15) connected to the signal line (108) in series, and a plurality of parallel resonators (P11, P12, P13, P14, P15) connected to the signal line. At least one of the series resonator having an anti-resonant frequency closest to the passband of the filter among the plurality of series resonators, and/or at least one the parallel resonator (P13, P14) having a resonant frequency closest to the passband of the filter among the plurality of parallel resonators, is covered with a dielectric film (114) that has a thickness (T1) that is relatively thicker than a dielectric film having a thickness (T2) covering the other series and/or parallel resonators (P11, P15).

IPC Classes  ?

• H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
• H03H 9/64 - Filters using surface acoustic waves

Abstract

An acoustic wave element (100) according to certain examples includes a piezoelectric body (130), an interdigital transducer (IDT) electrode (140, 150) disposed above the piezoelectric body (130), and a connection electrode (160) disposed above the piezoelectric body (130) and connected to the IDT electrode (140, 150). A first insulation layer (172) covers the connection electrode (160), and a second insulation layer (174a, 174b) covers the IDT electrode (140, 150). The first insulation layer (172) disposed above the connection electrode (160) has a first thickness T in a direction perpendicular to an upper surface of the piezoelectric body (130) and the second insulation layer (174b) disposed above the IDT electrode (150) has a second thickness K in the direction perpendicular to the upper surface of the piezoelectric body (130). The first thickness T is less than the second thickness K based on FIG.2C and the relevant description.

IPC Classes  ?

• H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
• H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
• H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves

Abstract

An acoustic wave device including a substrate (12), an interdigital transducer electrode (13) provided on an upper surface of the substrate, a first wiring electrode (14, 15) provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film (16) that does not cover a first region (18) of the first wiring electrode but covers a second region (19) of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region (19), and a second wiring electrode (17) that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate. The dielectric film (16) may have a certain film thickness (T2) and a tapered thickness (T1) resulting from the underlying cutout. The tapered thickness may protect the IDT electrode (13) from chemical degradation and mechanical damage.

IPC Classes  ?

• H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
• H03H 9/05 - Holders or supports
• H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
• H03H 9/72 - Networks using surface acoustic waves

Abstract

An acoustic wave resonator (100) including comb-shaped electrodes (102) and reflector electrodes (103) formed on a piezoelectric substrate (101). In one example, an overlapping portion between the comb-shaped electrodes (102) includes a first overlapping region (104) and second overlapping regions (105). The second overlapping regions (105) can be provided on both outside edges of the first overlapping region (104). In one example, the overlapping width of the first overlapping region is greater than the overlapping width of the second overlapping region, and the electrode finger pitch in the second overlapping region is greater than the electrode finger pitch in the first overlapping region.

IPC Classes  ?

• H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
• H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details

Abstract

Methods and apparatus for reducing electric loss in an acoustic wave element. In one example, the acoustic wave element (60) includes a piezoelectric body (50) having an upper surface, an interdigital transducer (IDT) electrode (10, 20) disposed on the piezoelectric body, a connection wiring (30) disposed on the piezoelectric body and electrically connected to the IDT electrode, the connection wiring having a lower connection wiring and an upper connection wiring provided above the lower connection wiring, and a reinforcement electrode (40) provided above the connection wiring, the reinforcement electrode being in contact with and electrically connected to the lower connection wiring.

IPC Classes  ?

• H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
• H03H 9/64 - Filters using surface acoustic waves