A particulate measurement device, comprising: a light source (22); a particulate-light interaction chamber (40); a light detector (24); an optical element; wherein, the optical element is arranged in a light path (30) between the light source (22) and the particulate-light interaction chamber (40) and the optical element is operable to provide an asymmetric light intensity profile within the particulate-light interaction chamber (40), and the asymmetric intensity profile comprises a first part and a second part, the first part having a higher intensity than the second part, wherein the first part is further away from the light detector (24) than the second part.
The monitoring device for use in a heterogeneous receptor-ligand assay for detecting presence or amount of an analyte in a liquid comprises - one or more electrical consumers (41; D, T), e.g., a first light source (41); - a power supply unit (50) for supplying said one or more electrical consumers (41; D, T) with electrical energy. The power supply unit (50) comprises an energy receiving unit (51) for receiving energy from an external device (200), such as from a mobile phone. The energy receiving unit (51) can comprise a coil for wireless power transfer by electromagnetic induction. The first light source (41) can in particular be a vertical-cavity surface- emitting laser. The heterogeneous receptor-ligand assay device (100) comprises in addition to the monitoring device a carrier (10) held in the carrier holder (10a).
An optical apparatus comprising: a light-emitting device (106) coupled to a controllable voltage supply (301) configured to provide a supply voltage to the light-emitting device; a temperature sensor (304) arranged to sense a temperature of the light-emitting device; a driver die (300,800,900) comprising a driver circuit for driving the light-emitting device; and a control module (310) configured to: receive a voltage at the output of the light-emitting device; determine a target voltage that is to be provided at the output of the light-emitting device, wherein the control module is configured to determine the target voltage based on said temperature; and output a control signal to control the output of the light-emitting device to be at the target voltage in dependence on the voltage at the output of the light-emitting device.
A photodetector device for detection of electromagnetic radiation comprises a target substrate (500) having a main surface (550) and a multitude of photodetector chips (55). Each photodetector chip (55) comprises a device layer (20) that is arranged at a backside of the photodetector chip (55), wherein a photodetector element (50) is arranged in the device layer (20), and an intermetal dielectric (60) that is arranged at a front side of the photodetector chip (55), wherein contact pads (70) electrically connected to the photodetector element (50) are embedded in the intermetal dielectric (60) and accessible via pad openings (80) in the intermetal dielectric (60). Each detector chip (55) is mounted on the target substrate (500), such that the front side of the detector chip (55) faces the main surface (550) of the target substrate (500). A method for fabricating such photodetector device is also provided.
A particulate matter detector (1) a first, a second and a third waveguide (11, 12, 13), the third waveguide (13) being free of cladding, and a waveguide splitter (14). The first waveguide (11) is coupled to a light emitter (10) and comprises an interrogation region (16) formed by a cladding- free surface of the first waveguide (11), the surface being exposed to a gaseous environment (2) and configured to accumulate directly thereon particulate matter (3) from the gaseous environment (2). During a measurement phase, a first intensity of light in the first waveguide (11) is set for determining a change in the intensity of the light detected by the detector (15) in dependence of accumulated particulate matter (3). During a cleaning phase, a second intensity larger than the first intensity is set for directing the accumulated particulate matter (3) from the interrogation region (16) to the third waveguide (13) via optical forces.
Lighting Module for a VehicleA lighting module (200, 400, 500) for a vehicle (600) is disclosed. The lighting module comprises a plurality of Light-Emitting-Diodes (LEDs) (210, 410, 510) for vehicle exterior lighting, and at least one proximity sensor (215) for vehicle parking assistance. The lighting module also comprises a circuit (490, 590) configured to control the plurality of LEDs and the at least one proximity sensor. Also disclosed is a method of manufacturing the lighting module.
A method for manufacturing a sensor (10) is provided, the method comprising the steps of providing a lower cladding layer (11), depositing a waveguide layer (12) on the lower cladding layer (11), forming a sensing waveguide (13) and a reference waveguide (14) by photolithography and etching the waveguide layer (12) in places, forming a photoresist structure (15) on at least a part of the sensing waveguide (13) by photolithography, depositing an upper cladding layer (16) on the photoresist structure (15), the sensing waveguide (13), the reference waveguide (14) and the lower cladding layer (11), removing the photoresist structure (15) with the part of the upper cladding layer (16) deposited on the photoresist structure (15) so that an opening (17) within the upper cladding layer (16) is formed above at least a part of the sensing waveguide (13), and depositing a functionalization material (18) within the opening (17), wherein from the waveguide layer (12) at least one auxiliary structure (22) is formed by photolithography and etching the waveguide layer (12) in places, wherein the opening (17) is arranged above the auxiliary structure (22). Furthermore, a sensor (10) and a portable device (26) are provided.
G01N 21/45 - Refractivity; Phase-affecting properties, e.g. optical path length using Schlieren methods
G01N 21/77 - Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
An optical module (2) comprising an emitter (4) and a semiconductor device (6), the emitter (4) being attached to the semiconductor device (6) and being separated from the semiconductor device (6) by a gap (16), wherein the semiconductor device (6) comprises a waveguide (10) and a diffraction grating (8) located within semiconductor of the semiconductor device (6), the diffraction grating (8) being a coupling diffraction grating configured to couple light emitted from the emitter (4) into the waveguide (8), and wherein the semiconductor device (6) further comprises an additional diffraction grating (14) which is provided on a surface of the semiconductor device (6) which faces the emitter (4).
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/34 - Optical coupling means utilising prism or grating
G02B 6/42 - Coupling light guides with opto-electronic elements
A monolithically integrated optical assembly comprising a waveguide configured to receive light and a coupling element configured to couple light into the waveguide. The monolithically integrated optical assembly comprises an optical element comprising a pattern of features configured to control a propagation of light incident on the coupling element.
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/124 - Geodesic lenses or integrated gratings
G02B 6/34 - Optical coupling means utilising prism or grating
G02B 6/42 - Coupling light guides with opto-electronic elements
10.
DATA STORAGE APPARATUS COMPRISING CELL SECTION OPERABLE AS DOSIMETER AND METHOD OF OPERATING
A data storage apparatus comprises an integrated circuit further comprising a control unit (100) and a memory array (400) of charge-based memory cells. The memory array (400) comprises a first subsection (410) which is operable as a memory, and comprises a second subsection (420) which is operable as a dosimeter. The control unit (100) is operable to provide a reference current (Iref) and to conduct memory access operations to access the memory with reference to the reference current (Iref). The control unit (100) is further operable to analyze a statistical distribution of read currents (Iread) by using memory access operations in the second subsection (420). Said analysis involves counting of logical read errors of the memory access operations and calibrating the reference current (Iref) depending on a number of counted logical read errors being indicative also of a Total Ionizing Dose, TID.
G11C 29/02 - Detection or location of defective auxiliary circuits, e.g. defective refresh counters
G11C 16/26 - Sensing or reading circuits; Data output circuits
G11C 7/14 - Dummy cell management; Sense reference voltage generators
G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
G11C 29/04 - Detection or location of defective memory elements
G11C 29/50 - Marginal testing, e.g. race, voltage or current testing
A current mirror arrangement comprises an input stage (10) with a series connection of an input mirror transistor (11) and an input cascode transistor (12) between supply terminals (VDD_HV, GND). A buffer stage (20) is configured to generate an input control voltage (vbiasn) based on an input voltage (vin) for a gate terminal of the input mirror transistor (11), to generate an intermediate control voltage (vbiasn_i) at a replica terminal (23) based on the input voltage (vin) and to generate a compensation control voltage (vcomp) based on the input control voltage (vbiasn), the buffer stage (20) comprising a compensation current mirror with an input side connected to a feedback terminal (25) and with an output side being connected to the replica terminal (23). An output stage (30) comprises a compensation stage (35) and a series connection of an output mirror transistor (31) and an output cascode transistor (32), wherein the compensation stage (35) comprises a compensation resistor (RC) connected between the replica terminal (23) and an output control terminal (37) that is coupled to a gate terminal of the output mirror transistor (31), is configured to generate, at the output control terminal (37), an output control voltage (vbiasn_i+1) based on the compensation control voltage (vcomp), and is configured to generate, at a compensation terminal (39) being connected to the feedback terminal (25), a compensation current based on the compensation control voltage (vcomp).
An optical filter (100) and method of manufacturing an optical filter comprising a stack of layers, the stack comprising at least one layer comprising amorphous deuterated silicon (104), and at least layer of a dielectric material (106), wherein within a targeted transmission band the refractive index of the dielectric material is less than a refractive index of the amorphous deuterated silicon (104).
A sensing system comprising a light filtering apparatus configured to pass a first wavelength of light corresponding to an emission spectrum characteristic of Mercury. The sensing system comprises a sensor configured to receive light passed by the light filtering apparatus and produce a sensor response that is indicative of the light passed by the light filtering apparatus. The sensing system comprises a processor configured to use the sensor response to distinguish between light emitted by a fluorescent light source and light emitted by a light emitting diode.
An optical device is disclosed. The optical device comprises a substrate, a radiation- emitting device such as a vertical cavity surface emitting laser (VCSEL) disposed on the substrate, and a conformal coating layer covering the radiation-emitting device. The conformal coating layer is moisture-resistant and substantially transparent to electromagnetic radiation emissions of the radiation-emitting device. Also disclosed are methods of manufacturing such an optical device.
H01S 5/02234 - Material of the housings; Filling of the housings the housings being made of resin
H01S 5/0683 - Stabilisation of laser output parameters by monitoring the optical output parameters
H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
A method for forming a lift-off mask structure (1) comprises providing a substrate body (10), depositing a layer (11) of bottom anti-reflective coating, BARC, over a surface of the substrate body (10), and depositing a layer (12) of photosensitive resist over the BARC layer (11). The method further comprises exposing the resist layer (12) to electromagnetic radiation (21) through a photomask (20), and forming the lift-off mask structure (1) by applying a developer for selectively removing a portion of the BARC layer (11) and of the resist layer (12) such that an underlying portion of the surface of the substrate body (10) is exposed.
It is proposed to use self-mixing interferometry for determining an absorption. The monitoring device for use in lateral flow testing for detecting presence or amount of an analyte (1) in a liquid (L) comprises a housing, the housing comprising a carrier holder for holding a carrier (10) for transport of the liquid (L); at least a first light source (41) which is a resonant-cavity light source having a cavity (C); and an evaluation unit (50), operationally connected to at least the first light source (41) for detecting a measurement signal. The first light source (41) is structured and arranged to illuminate with light a test range in a test area (13) of a carrier (10) held in the carrier holder; and to couple back into the cavity (C) of the first light source (41) a portion of the light coming back from the test range (13).
G01N 21/45 - Refractivity; Phase-affecting properties, e.g. optical path length using Schlieren methods
G01N 21/78 - Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator producing a change of colour
G01N 21/84 - Systems specially adapted for particular applications
G01N 21/77 - Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
G01N 33/558 - Immunoassay; Biospecific binding assay; Materials therefor using diffusion or migration of antigen or antibody
17.
LOW-DROPOUT REGULATOR FOR LOW VOLTAGE APPLICATIONS
A low-dropout regulator (1) for low voltage applications comprises a buffer circuit (500) being arranged between an output terminal (O100) of an error amplifier (100) and a control node (C200) of a pass device (200). The buffer circuit (500) includes a driver comprising a first transistor (11) being embodied as an NMOS transistor. The output terminal (O100) of the error amplifier (100) is coupled to the control node (C11) of the first transistor (11). The control node (C200) of the pass device (200) is coupled to an internal node (N1) of a first current path (10) including the first transistor (11). The low-dropout regulator (1) has high load capability, even if an input supply voltage is very low.
G05F 1/565 - Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices sensing a condition of the system or its load in addition to means responsive to deviations in the output of the system, e.g. current, voltage, power factor
G05F 1/575 - Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices characterised by the feedback circuit
18.
DRIVER CIRCUIT FOR LOW VOLTAGE DIFFERENTIAL SIGNALING, LVDS, LINE DRIVER ARRANGEMENT FOR LVDS AND METHOD FOR OPERATING AN LVDS DRIVER CIRCUIT
In one embodiment a driver circuit for low voltage differential signaling, LVDS, comprises a phase alignment circuit (20) comprising an input (21) configured to receive an input signal (Vin), a first output (22) configured to provide an internal signal (Vint) as a function of the input signal (Vin), and a second output (23) configured to provide an inverted internal signal (VintN), which is the inverted signal of the internal signal (Vint), and an output driver circuit (30) coupled to the phase alignment circuit (20), the output driver circuit (30) comprising a first input (31) configured to receive the internal signal (Vint), a second input (32) configured to receive the inverted internal signal (VintN), a first output (33) configured to provide an output signal (Vout) as a function of the internal signal (Vint) and a second output (34) configured to provide an inverted output signal (VoutN) which is the inverted signal of the output signal (Vout). Therein the phase alignment circuit (20) is configured to provide the inverted internal signal (VintN) with its phase being aligned to a phase of the internal signal (Vint).
H03K 5/151 - Arrangements in which pulses are delivered at different times at several outputs, i.e. pulse distributors with two complementary outputs
H03K 19/094 - Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
The present disclosure relates to a photodiode device (1), which overcomes the drawbacks of conventional devices like increased dark currents. The photodiode device (1) comprises a semiconductor substrate (2), at least one doped well (6) of a first type of electric conductivity at a main surface (3) of the substrate (2) and at least one doped region (9) of a second type of electric conductivity being adjacent to the doped well (6). The at least one doped well (6) and the at least one doped region (9) are electrically contactable. On a portion of an upper surface (7) of the doped well (6) a protection structure (11) is arranged. The protection structure (11) protects the upper surface (7) of the underlying doped well (6) from an etching process for removing a spacer layer (27).
H01L 31/103 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PN homojunction type
H01L 31/115 - Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
H01L 31/101 - Devices sensitive to infrared, visible or ultraviolet radiation
An apparatus comprises a display screen, and an optical sensor module which is disposed behind the display screen. The optical sensor module further comprises a light emitter operable to generate light having a wavelength for transmission through the display screen toward a target object. A light sensor is operable to sense light reflected by the target object and having the wavelength. A reducer is arranged for reducing the optical power density by increasing a diameter of a light beam generated by the light emitter on the display screen, wherein the reducer is disposed between the light emitter and the display screen so as to intersect the light beam generated by the light emitter.
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
An optical detector (1) on an application specific integrated circuit (ASIC) comprises at least one photodiode (5) for receiving incident light and configured to provide at least one diode signal, a modulator (2) configured to provide an AC drive signal and to provide a reference signal associated with the AC drive signal; and a lock-in amplifier (6) configured to receive said at least one diode signal from said at least one photodiode (5) and to receive the reference signal from the modulator (2), and to determine at least one of a phase and an amplitude of said at least one diode signal using the reference signal.
The present disclosure relates to an optoelectronic device for manipulating electromagnetic radiation. Drawbacks of conventional systems like material constraints, system complexity and tuning speed are overcome by the optoelectronic device (1) comprising a substrate (2) with at least one tuning structure (4) arranged on the substrate (2), wherein the tuning structure (4) comprises an electro-optical material. The tuning structure (4) comprises a first and a second electrical contact (7, 8). A cover layer (10) covers the at least one tuning structure (4). An optical structure (12) is arranged on the cover layer (10). A voltage source (15) is electrically connected to the first and the second electrical contact (7, 8) and provided for generating electric fields within the at least one tuning structure (4).
G02B 1/00 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements
G02B 26/06 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the phase of light
G02F 1/03 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels or Kerr effect
23.
SPECTROMETER, PORTABLE DEVICE AND METHOD FOR DETECTING ELECTROMAGNETIC RADIATION
A spectrometer (10) comprises an emitter (11) that is configured to emit electromagnetic radiation, a sample area (12) that is arranged at an outer face (13) of the spectrometer (10), a modulation unit (14) comprising an electrochromic material, an optical filter (15), an optical detector (16), an integrated circuit (17) that has a main plane of extension, and an optical path for electromagnetic radiation emitted by the emitter (11) towards the optical detector (16) via the sample area (12), the modulation unit (14) and the optical filter (15), wherein the electrochromic material is electrically connected with the integrated circuit (17), and the modulation unit (14) is configured to modulate electromagnetic radiation temporally. Furthermore, a method for detecting electromagnetic radiation is provided.
The peak comparator circuitry (1) comprises a differential amplifier circuit (100) having an output node (O100) to generate a differential amplifier output signal (Out1) in response to an amplification of a difference of an input signal (Vin) and a reference signal (Vref1), and a comparator circuit (200) having an output node (O200) to generate a comparator output signal (Out2). A feedback path (FP) of the peak comparator circuitry (1) is arranged between the output node (O200) of the comparator circuit (200) and the output node (O100) of the differential amplifier circuit (100). The proposed peak comparator circuitry (1) allows for a low voltage supply, a low current consumption and a fast output validity.
An optical module (100) for reading a test region of an assay. The optical module comprises: a first light source (101) for illuminating the test region of the assay; an optical detector (103), comprising an optical input for receiving light emitted from the test region and an electrical output; a substrate (104) for mounting the first light source (101) and the optical detector (103); and a housing (105) comprising: a first opening (106) for providing a first optical path from the first light source (101) to the test region (103); wherein the housing (105) and the substrate (104) enclose and positionally align the first source (101) and the optical detector (103) relative to the first opening (106). The housing (105) may comprise one or more legs (108), such as a flexible hook portion which secures the housing (105) to the substrate (104) with a snap-fit engagement, extending from a first and/or second outer surface of the housing (105) in a vertical direction. Beneficially, the snap-fit engagement provided by the flexible hook portion allows the housing to be aligned and secured without the need to use glue or for example a screw and thread that can be difficult to control and/or risks misalignment of the housing.
G01N 21/84 - Systems specially adapted for particular applications
G01N 21/78 - Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator producing a change of colour
G01N 21/77 - Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
26.
AN INTERFERENCE FILTER, OPTICAL DEVICE AND METHOD OF MANUFACTURING AN INTERFERENCE FILTER
An interference filter comprises a substrate, a filter stack and at least one absorption layer. The filter stack comprises alternating layers of optical coatings with different refractive indices arranged on the substrate. The at least one absorption layer is comprised of an optically absorbing material which is arranged on the substrate.
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (Singapore)
AMS AG (Austria)
Inventor
Liu, Zhengtong
Teng, Jinghua
Chu, Hong Son
Wang, Qian
Deng, Jie
Ang, Soo Seng Norman
Tang, Xiao Song Eric
Png, Ching Eng Jason
Fasching, Gernot
Mai, Lijian
Singulani, Anderson
Pulko, Jozef
Abstract
Various embodiments may relate to an optical system. The optical system may include a lens structure configured to generate an outgoing Gaussian beam based on an incoming Gaussian beam. The optical system may also include a light source configured to provide the incoming Gaussian beam to the lens structure. The lens structure may be a flat lens or a phase plate.
We disclose herein a method of compressing data for data transfer within an electronic device. The method comprises: receiving, at a first processing member of the electronic device, a plurality of data samples produced by a member of the electronic device, wherein the data samples comprise numerical bits; restructuring, by the first processing member, the plurality of data samples into a plurality of data packets; labelling each data packet with a sample indicator bit to indicate a plurality of groups across the plurality of data packets; transferring a bit stream comprising at least some of the plurality of data packets across an interface of the electronic device to a receiving member of the electronic device; and decoding the bit stream, by a second processing member of the electronic device, to obtain at least some of the plurality of the data samples, the decoding being based at least in part on the sample indicator bits.
A method of forming a sandwich passivation layer (405) on a semiconductor device (400) comprising a bond pad (404) is provided. The method comprises forming a first layer (406) over a surface of the semiconductor device (400), removing a part of the first layer (406) to expose a surface of the bond pad (404), forming a second layer (407) over the first layer (406) and the surface of the bond pad (404), and forming a third layer (408) over the second layer (407), wherein the surface of the bond pad (404) is not in contact with the first layer (406) or third layer (408).
An optical element for introducing a predetermined phase delay into incident electromagnetic radiation. The optical element comprises a first layer and a second layer arranged in a propagation path of a portion of the electromagnetic radiation. The first layer comprises a transmission regions (306a - 306c) configured to introduce a first phase delay into the portion of electromagnetic radiation propagating therethrough. The second layer comprises a metasurface configured to introduce a second phase delay into the portion of electromagnetic radiation propagating therethrough. The metasurface comprises subwavelength sized strcutures (305).
A method for starting a system-on-a-chip, SoC, without read only memory, ROM, comprises the steps of receiving (S1), by a processor (10) comprised by the SoC, a reset signal, monitoring (S2), by a monitoring component comprised by the SoC, a connection (12) between the processor and at least a non-volatile memory (11), both comprised by the SoC,upon occurrence of a first read access (S3) of the processor to the non-volatile memory via the connection checking (S4), by the monitoring component, whether a data value (DV1) returned in response to the first read access via the connection conforms to a pre-set value, and if the returned data value differs from the pre-set value, stopping (S5), by the monitoring component, operation of the processor.
A method of sensing a level of ambient light in an electronic device comprising sensing a combined light level of ambient light and light from the display, integrating this to determine an integrated light level, determining an integrated display light level, and compensating the integrated light level using the integrated display light level to determine the ambient light level. The device modulates the display between first and second brightness levels and determining the integrated display light level comprises sensing a combination of light from the display and ambient light when at each of the first and second brightness levels, determining a difference, and applying a calibration value to the difference to determine the integrated display light level.
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 5/00 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
33.
PEAK-DETECTOR CIRCUIT AND METHOD FOR EVALUATING A PEAK OF A FIRST INPUT VOLTAGE
A peak-detector circuit (10) comprises a first input terminal (11) for providing a first input voltage (VIN1), a first rectifying element (15) with an anode connected to the first input terminal (11), a first capacitor (16) with a first electrode connected to a cathode of the first rectifying element (15), a first terminal (13) coupled to the first electrode of the first capacitor (16), a second rectifying element (20) with a cathode connected to the first input terminal (11), a second capacitor (21), a first switch (23) coupling an anode of the second rectifying element (20) to a first electrode of the second capacitor (21), and a second terminal (22) coupled to the first electrode of the second capacitor (21).
A noise cancellation system for an ear-mountable playback device (HP) having a speaker (SP), a feedforward microphone (FF_MIC) and an error microphone (FB_MIC) comprises a filter chain (FF_CH) for coupling the feedforward microphone (FF_MIC) to the speaker (SP), the filter chain (FF_CH) comprising a series connection or parallel connection of a coarse filter (FF_C) and a fine filter (FF_F), and a noise control processor (SCP). The fine filter (FF_F) is formed of a set of sub-filters having a predefined frequency range, wherein the predefined frequency range of each of the sub- filters together forms an effective overall frequency range of the fine filter (FF_F). The noise control processor (SCP) is configured to calculate an error signal based on a first noise signal sensed by the feedforward microphone (FF_MIC) and on a second noise signal sensed by the error microphone (FB_MIC), to perform an adaptation of coarse filter parameters of the coarse filter (FF_C) based on the error signal, and to perform a limited adaptation of fine filter parameters of each of the sub-filters based on the error signal, wherein limits of the limited adaptation comprise the predefined frequency ranges of the sub-filters and at least one of a gain limit and a Q factor limit.
G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
An apparatus (1) for detecting objects comprises an optical interferometer (2) that is configured to receive electromagnetic radiation from a light source (3), and emit electromagnetic radiation to a detector (4). The optical interferometer (2) is coupled to an environment and further configured to respond to objects (10) in the environment intruding into an interaction volume (5) of the optical interferometer (2) by varying an intensity of the electromagnetic radiation emitted to the detector (4) based on a property of the objects (10) in the interaction volume (5). A signal processor is configured to generate an output signal based on the intensity of the electromagnetic radiation emitted to the detector (4).
An apparatus for sensing particulate matter in a fluid includes a fluid flow conduit fluidically connected to an interaction chamber; a light source positioned to illuminate the interaction chamber; and a light detector assembly positioned to receive light scattered by particulate matter present in the interaction chamber. The light detector assembly includes a light detector; and an optical element, the optical element configured to provide light to the light detector based on an incidence angle of the scattered light.
Bus system (1) comprising a first bus (11) and a second bus (12), wherein the first bus (11) is connected to the second bus (12) through a bridge (15) and a multiplexer (16). A first master (110) has access to the second bus (12) via the first bus (11), the bridge (15) and the multiplexer (16). A second master (120) has access to the second bus (12) via the multiplexer (16). The bridge (15) comprises an arbitration unit (150) which is arranged to allow both a first master (110) and a second master (120) access to the second bus (12) in such a way that no access is disturbed or lost.
A method is proposed of producing a semiconductor body with a trench. The semiconductor body (10) comprises a substrate (16). The method comprising the step of etching the trench (11) into the substrate (16) using an etching mask (38). An oxide layer (12) is formed at least on a sidewall (14) of the trench (11) by oxidation of the substrate (16). A passivation layer (13) is formed on the oxide layer (12) and the bottom (15) of the trench (11). The passivation layer (13) is removed from the bottom (15) of the trench (11). Finally, a metallization layer (18) is deposited into the trench (11).
A sensor front-end (1) is presented for processing a measurement signal (MS) from a sensing unit (2), wherein the sensing unit (2) is configured to receive a stimulus signal (ST) from an evaluation unit (10) of the sensor front-end (1), generate the measurement signal (MS) from the stimulus signal (ST) by altering an amplitude of the stimulus signal (ST) based on a measurement parameter, and provide the measurement signal (MS) to the evaluation unit (10). The sensor front-end (1) comprises the evaluation unit (10) that is configured to generate a simulated measurement signal (MSS) from the stimulus signal (ST) by controlling an amplitude of the stimulus signal (ST) based on a predetermined control variable (CV), to generate a simulated output signal (OSS) based on the stimulus signal (ST) and the simulated measurement signal (MSS), and to determine an error condition based on a comparison of the simulated output signal (OSS) and the predetermined control variable (CV) or a signal derived from the predetermined control variable (CV).
G01D 3/02 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group with provision for altering or correcting the transfer function
G01D 5/24 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
G01D 5/20 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
40.
AUDIO SYSTEM AND SIGNAL PROCESSING METHOD FOR AN EAR MOUNTABLE PLAYBACK DEVICE
An audio system (AS) for an ear mountable playback device (HP) comprises a speaker (SP) and an error microphone (FB_MIC) that is configured to sense sound being output from the speaker (SP) and ambient sound. The audio system (AS) further comprises a detection engine (DET) that is configured to determine a driver response between the speaker (SP) and the error microphone (FB_MIC), and to estimate a leakage condition from the determined driver response.
G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
An audio system (AS) for an ear mountable playback device (HP) comprises a compensation filter (C) configured to generate a third compensation signal (CS3) by applying filter operations to an audio signal (IN), and an error compensation unit (ECU) configured to generate a compensated error signal (EM) on the basis of the third compensation signal (CS3) and a disturbed audio signal (E) from an error microphone (FB_MIC). The audio system (AS) further comprises a first noise filter (F) configured to be adapted based on the compensated error signal (EM), and a detection unit (DET) configured to estimate the acoustic leakage condition on the basis of the first noise filter (F) or of the disturbed audio signal (E) and an audio output signal. The compensation filter (C) is configured to be adapted based on the acoustic leakage condition.
G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H03K 17/06 - Modifications for ensuring a fully conducting state
H03K 17/14 - Modifications for compensating variations of physical values, e.g. of temperature
43.
BONDED STRUCTURE AND METHOD FOR MANUFACTURING A BONDED STRUCTURE
A bonded structure (1) comprises a substrate component (20) having a plurality of first pads (21) arranged on or within a surface (22) of the substrate component (20), and an integrated circuit component (10) having a plurality of second pads (11) arranged on or within a surface (12) of the integrated circuit component (10). The bonded structure (1) further comprises a plurality of connection elements (31) physically connecting the first pads (21) to the second pads (11). The surface (12) of the integrated circuit component (10) is tilted obliquely to the surface (22) of the substrate component (22) at a tilt angle (α) that results from nominal variations of surface sizes of the first and second pads (21, 11).
An open through-substrate via (1), TSV, comprises an insulation layer (20) disposed adjacent to at least a portion of side walls (15) of a trench (14) and to a surface (13) of a substrate body (10). The TSV further comprises a metallization layer (30) disposed adjacent to at least a portion of the insulation layer (20) and to at least a portion of a bottom wall (16) of said trench (14), a redistribution layer (40) disposed adjacent to at least a portion of the metallization layer (30) and a portion of the insulation layer (20) disposed adjacent to the surface (13), and a capping layer (50) disposed adjacent to at least a portion of the metallization layer (30) and to at least a portion of the redistribution layer (40). The insulation layer (20) and/or the capping layer (50) comprise sublayers (21, 22, 51, 52) that are distinct from each other in terms of material properties. A first of the sublayers (21, 51) is disposed adjacent to at least a portion of the side walls (15) and to at least a portion of the surface (13) and a second of the sublayers (22, 52) is disposed adjacent to at least a portion of the surface (13).
A signal processor (10) is provided, the signal processor (10) comprising a transaction buffer (11), a processing memory (12), a processing unit (13), and a bus connection (14) that is configured to be connected to a bus system (15) for data transmission, wherein the transaction buffer (11) is configured to receive and save a set of data packets (DP) from the bus system (15), the data packets (DP) each comprise payload data (PD) and attributed address data, where the address data relate to an address of the processing memory (12), the processing memory (12) is connected with the processing unit (13), the processing unit (13) is configured to run a process routine (PR), and the transaction buffer (11) is configured to transfer payload data (PD) between the processing memory (12) and the transaction buffer (11) at a selectable instant of time during the process routine (PR) run by the processing unit (13). Furthermore, a method for transferring data is provided.
An optoelectronic device (1) comprises a substrate (2) with a photosensitive structure (4), a dielectric layer (5) on a main surface (3) of the substrate (2), the dielectric layer (5) having a top surface (6) facing away from the substrate (2). At least one wiring layer (7) is arranged in the dielectric layer (5) in places and at least one contact area (9) is formed by a portion of the at least one wiring layer (7). An opening (11) is formed at the top surface (6) of the dielectric layer (5), the opening (11) extending towards the contact area (9). An optical element (12) is arranged on the top surface (6) of the dielectric layer (5) above the photosensitive structure (4) and an optical filter (13) is arranged on the top surface (6) of the dielectric layer (5), the optical filter (13) being electrically conductive, covering a portion of the optical element (12) and being in electrical contact with the contact area (9). Furthermore, a method for producing an optoelectronic device (1) is provided.
An apparatus includes an integrated sensor module for detection of chemical substances. The sensor module includes a UV radiation source operable to emit UV radiation onto a sample. The sensor module also includes a sensor including dedicated channels disposed so as receive UV radiation reflected by the sample. Each of the channels is selectively sensitive to a different respective portion of the UV spectrum; collectively, the channels cover at least part of the UV spectrum sufficient for reconstruction of a spectral curve of the sample. An electronic control unit can be used to identify a composition of the sample based on signals from the channels.
G01N 21/33 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using ultraviolet light
48.
TEST STRIP, MONITORING DEVICE AND METHOD FOR FABRICATING A TEST STRIP
A test strip (10) comprises a porous material (14), a photodetector (15) and a substrate (11) with a first and a second side (12, 13). The porous material (14) is attached to the first side (12) of the substrate (11). The photodetector (15) is attached to the second side (13) of the substrate (11).
An apparatus includes an integrated waveguide structure, and a first light source operable to produce a probe beam having a first wavelength, wherein the probe beam is coupled into a first end of the waveguide structure. A second light source is operable to produce an excitation beam with having a second wavelength to excite gas molecules in close proximity to a path of the probe beam. A light detector is coupled to a second end of the integrated waveguide structure and is operable to detect the probe beam after it passes through the waveguide structure. The apparatus is operable such that excitation of the gas molecules results in a temperature increase of the gas molecules that induces a change in the probe beam that is measurable by the light detector.
G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
G01N 21/39 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using tunable lasers
50.
SEMICONDUCTOR DEVICE FOR INFRARED DETECTION, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR INFRARED DETECTION AND INFRARED DETECTOR
A semiconductor device for infrared detection comprises a stack of a first semiconductor layer (1), a second semiconductor layer (2) and an optical coupling layer (3). The first semiconductor layer (1) has a first type of conductivity and the second semiconductor layer (2) has a second type of conductivity. The optical coupling layer (3) comprises an optical coupler (31) and at least a first lateral absorber region (32). The optical coupler (31) is configured to deflect incident light towards the first lateral absorber region (32). The first lateral absorber region (32) comprises an absorber material with a bandgap Eg in the infrared, IR.
H01L 31/109 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PN heterojunction type
H01L 31/0232 - Optical elements or arrangements associated with the device
H01L 31/028 - Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System
G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/34 - Optical coupling means utilising prism or grating
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/10 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
A particle detector. The particle detector comprises one or more light sources, an optical sensor, and a controller. The one or more light sources are collectively operable to simultaneously produce at least two wavelength ranges of emitted light. The optical sensor is configured to sense light of the at least two wavelength ranges emitted by the one or more light sources and to distinguish each range. The controller is configured to detect particles based on the light sensed by the optical sensor.
A particulate matter sensor module is operable based on sensing light scattered by particulate matter. The sensor includes one or more metalenses, which can help achieve a compact design in some implementations.
A semiconductor body comprises a buried layer (25) of a first type of conductivity, a first region (26) of the first type of conductivity, a shallow region (27) of a second type of conductivity at a first surface (13) of the semiconductor body (11), a sinker (35) of the first type of conductivity located at the first surface (13) of the semiconductor body (11), and a separating region (60, 60') of the first type of conductivity encircling at least one of the sinker (35) and the buried layer (25). The first region (26) is between the buried layer (25) and the shallow region (27).
H01L 31/107 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier working in avalanche mode, e.g. avalanche photodiode
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
54.
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
COMMISSARIAT A I'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (France)
Inventor
Hofrichter, Jens
Kaschowitz, Manuel
Poelzl, Bernhard
Rohracher, Karl
Jouve, Amandine
Balan, Viorel
Crochemore, Romain
Fournel, Frank
Maitrejean, Sylvain
Abstract
A semiconductor device comprises a substrate body (2) with a surface (3), a conductor (5) comprising a conductor material (5a) covering at least part of the surface (3), and a dielectric (4) that is arranged on a part of the surface (3) that is not covered by the conductor (5). Therein, the conductor (5) is in contact with the substrate body (2), the conductor (5) and the dielectric (4) form a layer (8), and a bonding surface (6) of the layer (8) has surface topographies of less than 10 nm, with the bonding surface (6) facing away from the substrate body (2). Moreover, the semiconductor device (1) is free of a diffusion barrier.
H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
55.
MOBILE COMMUNICATIONS DEVICE WITHOUT PHYSICAL SCREEN-OPENING FOR AUDIO
A mobile communications device that does not have a physical opening on the screen for audio is operable to transmit a signal to which a photoacoustic effect can be employed by interaction with water vapor in an ear of a user so as to generate audio in the ear or the immediate vicinity of the user's ear. Related methods, apparatuses, systems, techniques and articles are also described.
A sensing system comprising a measurement sensor configured to detect electromagnetic radiation and a reference sensor configured to detect a source of measurement uncertainty. The sensing system further comprises a shield configured to reduce an interaction between the electromagnetic radiation and the reference sensor.
G01J 1/42 - Photometry, e.g. photographic exposure meter using electric radiation detectors
G01J 1/02 - Photometry, e.g. photographic exposure meter - Details
G01J 1/16 - Photometry, e.g. photographic exposure meter by comparison with reference light or electric value using electric radiation detectors
H01L 31/107 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier working in avalanche mode, e.g. avalanche photodiode
57.
ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONTACT TO BOND PADS
An apparatus includes an optical device (22) and an electrically conductive bond pad (32). A multi-layer stack (42,44,46) of electrically conductive materials is disposed on the bond pad (32). An ITO layer (48) is disposed at least partially on the optical device (22) and makes ohmic contact with the multi-layer stack (42,44,46).
H01L 51/10 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier - Details of devices
An apparatus comprises an optical sensor package that includes an optical sensor die. The optical sensor package further includes a reflow-stable optical diffuser disposed over the optical sensor die. The optical diffuser is surrounded laterally by an epoxy molding compound.
An audio system (AS) for an ear mountable playback device (HP) comprises a speaker (SP), an error microphone (FB_MIC) configured to predominantly sense sound being output from the speaker (SP) and a further microphone (FF_MIC) configured to predominantly sense ambient sound. The system further comprises a first noise filter (FNF) coupling the further microphone (FF_MIC) to the speaker (SP), a second noise filter (SNF) coupling the error microphone (FB_MIC) to the speaker (SP) and an adaptation engine (ADP). The adaptation engine is configured to adapt a response of the first noise filter (FNF) depending on error signals from at least the error microphone (FB_MIC), estimate a leakage condition from the response of the first noise filter (FNF), and adapt a response of the second noise filter (SNF) depending on the estimated leakage condition.
G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
An audio system for an ear mountable playback device (HP) comprises a speaker (SP), an error microphone (FB_MIC) predominantly sensing sound being output from the speaker (SP) and a feed-forward microphone (FF_MIC) predominantly sensing ambient sound. The audio system further comprises a voice activity detector (VAD) which is configured to record a feed-forward signal (FF) from the feed-forward microphone (FF_MIC). Furthermore, an error signal (ERR) is recorded from the error microphone (FB_MIC). A detection parameter is determined as a function of the feed-forward signal (FF) and the error signal (ERR). The detection parameter is monitored and a voice activity state is set depending on the detection parameter.
G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
G10L 25/78 - Detection of presence or absence of voice signals
61.
AUDIO SYSTEM AND SIGNAL PROCESSING METHOD FOR AN EAR MOUNTABLE PLAYBACK DEVICE
An audio system for an ear mountable playback device (HP) includes a speaker (SP), an error microphone (FB_MIC), which senses sound being output from the speaker (SP), and a sound control processor. The processor is configured for controlling and/or monitoring a playback of a detection signal or a filtered version of the detection signal via the speaker (SP), recording an error signal from the error microphone (FB_MIC), and determining whether the playback device (HP) is in a first state, where the playback device (HP) is worn by a user, or in a second state, where the playback device (HP) is not worn by a user, based on processing of the error signal.
G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
An apparatus includes a light senor having directional sensitivity. The light sensor includes multiple light sensitive elements disposed below the same aperture. Each of the light sensitive elements has a respective field of view through the aperture that differs from the field of view of the other light sensitive elements. Signals from the light sensor can facilitate determining the direction of incoming light.
A voltage regulator comprises an output transistor (MPOUT) with a controlled section connected between a first supply terminal (VS) and an output terminal (OUT). An amplifier (AMP) comprises a reference input (VR) and a feedback input (VFB). A current mirror comprising a replica transistor (MREP). The current mirror is configured to mirror and attenuate a load current supplied by the output transistor (MPOUT) to the replica transistor (MREP). A filter circuit (RC) is coupled to a controlled section of the replica transistor (MREP) and coupled to the feedback input (VFB) of the amplifier (AMP) via the output terminal (OUT).
G05F 1/575 - Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices characterised by the feedback circuit
64.
HOST COMMUNICATION CIRCUIT, CLIENT COMMUNICATION CIRCUIT, COMMUNICATION SYSTEM, SOUND REPRODUCING DEVICE AND COMMUNICATION METHOD
A host side is adapted to be connected to a client side by means of a clock wire (CLKW), a selection wire (SELW), a first data wire (DW1) and a second data wire (DW2). The host side is configured to transmit a digital selection signal over the selection wire (SELW) to the client side, the selection signal determining either an audio transmission mode or a client communication mode. Further, the host side is configured to transmit digital audio data of a first channel and a second channel over the first and the second data wire (DW1, DW2) to the client side in the audio transmission mode, and to perform client communication over the first and the second data wire (DW1, DW2) in the client communication mode.
An amplifier circuit includes a circuit path (320) of serially connected complementary type transistors (Mp1, Mn1). First and second feedback loops include a loop amplifier (301), the transistors (Mp1, Mn1) of the circuit path (320) and a corresponding resistor (302, 303).
A noise cancellation enabled audio system for tonal tinnitus treatment using ambient noise comprises an audio processor (PROC) and at least one filter having an adjustable filter function. An ear mountable playback device (HP) further comprises a speaker (SP) and at least one feedforward microphone (FF_MIC). The audio processor (PROC) is configured to receive an input signal (Z(s)) from the feedforward microphone (FF_MIC) indicative of ambient noise and determine a filter transfer function (HF(s)) to realize a predetermined target transfer function (HT(s)), wherein the target transfer function (HT(s)) is configured to attenuate and/or amplify the input signal (Z(s)) in a predetermined frequency range. The filter function is adjusted depending on the filter transfer function (HF(s). The filter is configured to provide a system output signal (Y(s)) by filtering the input signal (Z(s)) depending on the filter function.
In one embodiment a temperature sensor has a first sensing unit (20) operable to provide a first pseudo-differential unipolar analog signal (31) representing a first temperature value of a power unit (19), an interface circuit (21) operable to provide a second pseudo-differential unipolar analog signal (32) representing a second temperature value of a powered unit (22), a multiplexer circuit (23) which is operable to provide a pseudo-differential unipolar multiplexed analog signal (33) comprising the first analog signal (31) or the second analog signal (32), and a first analog-to-digital converter (ADC) component (24) operable to provide a first digital signal (34) from the multiplexed analog signal (33), the first digital signal (34) comprising a digital representation of the first analog signal (31) or the second analog signal (32). Therein, the operation of the first ADC component (24) is synchronized with a control signal (30) designed for activating the power unit (19).
H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
An optical device includes an emitter operable to emit a first light wave. The optical device also includes a detector operable to detect a second light wave that is based on the first light wave. The second light wave is susceptible to being coupled with an undesired light wave that is based on the first light wave. The optical device further includes an interference filter disposed on the detector. The interference filter includes a first filter portion and a second filter portion having a first set of layers formed from a first material and a second set of layers formed from a second, different material. The interference filter is operable to attenuate undesired light waves in multiple distinct environments based on the first and second sets of layers in the second filter portion.
G01S 7/00 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , ,
G01S 17/00 - Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
G01D 5/30 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using optical means, i.e. using infrared, visible or ultraviolet light with deflection of beams of light, e.g. for direct optical indication the beams of light being detected by photocells
G01J 3/46 - Measurement of colour; Colour measuring devices, e.g. colorimeters
G01S 17/04 - Systems determining the presence of a target
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
G01V 8/00 - Prospecting or detecting by optical means
An apparatus and method for circuit failure detection for a diode array. The apparatus includes a diode array, a diode array test circuit electrically coupled to the diode array and operable to perform circuit failure detection during a test mode when a test input voltage is applied, the diode array test circuit includes an input resistor, an input voltage node, a buffered amplifier circuit, and a plurality of amplifier circuit switches. The apparatus further includes a current detector electrically coupled to the output of the buffered amplifier circuit and operable to determine, during the test mode, a current measurement of the pulse laser diode array.
An apparatus and method for current peak detection. The apparatus includes a pulse laser diode array, a sense resistor, a capacitive voltage divider (CVD) electrically coupled to the pulse laser diode array, a first current rectifier, a second current rectifier, a first current peak detector, a second current peak detector, an analog-to-digital converter (ADC) operable to convert the analog outputs from each current peak detector to a digital output signal, and a digital signal processing (DSP) unit operable to detect, from the digital output signal, a current peak pulse at the top and the bottom of the sense resistor.
A sensor arrangement for light sensing for light-to-frequency conversion. The sensor arrangement includes a photodiode, an analog-to-digital converter (ADC) operable to perform a chopping technique in response to a first clock signal (CLK1), and convert a photocurrent (IPD) into a digital comparator output signal (LOUT). The ADC includes a sensor input coupled to the photodiode, an output for providing the digital comparator output signal (LOUT), an integrator including an integrator input coupled to the sensor input and operable to receive an integrator input signal, a first set of chopping switches coupled to a first amplifier, a second set of chopping switches electrically coupled to an output of the first amplifier and electrically coupled to input terminals of a second amplifier, and an integrator output providing an integrator output signal (OPOUT).
An integrated sensing system for characterizing blood flow in a subject includes a light source assembly including a light source configured to emit light of a particular wavelength. The integrated sensing system includes an integrated circuit electrically connected to the light source assembly. The integrated circuit includes a light detector assembly including multiple light detectors configured to detect light of the particular wavelength; and a correlator configured to determining a delay between optical signals detected by respective light detectors of the light detector assembly.
A transconductor circuitry (10) with adaptive biasing comprises a first input terminal (ElOa) to apply a first input signal (inp), and a second input terminal (ElOb) to apply a second input signal (inn). A control circuit (200) is configured to control a first controllable current source (110) in a first current path (101) and a second controllable current source (120) in a second current path (102) in response to at least one of a first potential of a first node (Nl) of the first current path (101) and a second potential of a second node (N2) of the second current path (102). The first node (Nl) is located between a first transistor (150) and the first controllable current source (110), and the second node (N2) is located between a second transistor (160) and the second controllable current source (120).
A system including a multi-layer analog neural network and a system controller is described. The multi-layer analog neural network has a single layer of physical analog neurons that is re-usable for implementing a plurality of layers of the multi-layer analog neural network. Each of the physical analog neurons is configured to receive a neuron input and to process the neuron input to generate a neuron output that is fed as input to all physical analog neurons of the single layer, and each of the physical analog neurons includes a respective weight memory. The system controller is operable to: obtain, for each physical analog neuron, a respective set of neuron weight vectors with each neuron weight vector corresponding to a respective layer of the plurality of layers of the multi-layer analog neural network; store, for each physical analog neuron, the respective set of neuron weights in the respective weight memory of the physical analog neuron; receive a network input for the multi-layer analog neural network; and process the network input through the plurality of layers to generate a network output by repeatedly using the single layer of physical analog neurons, wherein for each layer of the plurality of layers, each of the physical analog neurons uses a neuron weight vector in the respective set of neuron weight vectors that corresponds the current layer to process the neuron input of the physical analog neuron.
An integrated optical biosensor module includes one or more light sources operable to produce light for emission from the module, and an integrated circuit chip including a photosensitive region. The photosensitive region includes one or more photodetectors operable to detect light produced by the one or more light sources and reflected by a subject that is outside the module. The integrated circuit chip is operable to determine a physiological condition of the subject based on signals from the one or more photodetectors. A clear mold covering encapsulates the one or more light sources, wherein the clear mold covering includes one or beam shaping elements each of which is disposed so as to intersect a path of a light beam from an associated one of the one or more light source.
A61B 5/1455 - Measuring characteristics of blood in vivo, e.g. gas concentration, pH-value using optical sensors, e.g. spectral photometrical oximeters
A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
76.
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA
An intermetal dielectric (3) and metal layers (4) embedded in the intermetal dielectric (3) are arranged on a substrate (1) of semiconductor material. A via hole (7) is formed in the substrate, and a metallization (9) contacting a contact area (4*) of one of the metal layers (4') is applied in the via hole. The metallization (9), the metal layer (4')comprising the contact area (4*) and the intermetal dielectric (3) are partially removed at the bottom of the via hole in order to form a hole (16) penetrating the intermetal dielectric and extending the via hole.A continuous passivation (12) is arranged on sidewalls within the via hole (7) and the hole (16), and the metallization (9) contacts the contact area (4*) around the hole (16).Thus the presence of a thin membrane of layers, which is usually formed at the bottom of a hollow through-substrate via, is avoided.
Forming a three-dimensional structure includes applying photoresist on a layer and using a photolithography system to expose the photoresist. The photolithography system includes a photomask having a pattern thereon, where the pattern provides varying pattern density across a surface of the photomask and has a pitch that is less than a resolution of the photolithography system. The method includes subsequently developing the photoresist such that photoresist remaining on the layer has a three-dimensional profile defined by the photomask. An isotropic etchant is used to etch the layer such that the three-dimensional profile of the photoresist is transferred to the layer.
A humidity sensor system (10) includes a monolithically integrated semiconductor device (12). The monolithically integrated semiconductor device (12) includes an optical waveguide (14), a thermo-electric cooling device (16), a temperature measurement probe (18), and control circuitry (26) operable to cause the thermo-electric cooling device (16) to adjust a temperature of the monolithically integrated semiconductor device (12). The optical waveguide (14) is operable to receive an input optical signal from a light source (20) and to provide an output optical signal for sensing by a light detector (22). The humidity sensor system (10) further includes processing circuitry operable to receive output signals from the light detector (22) and from the temperature measurement probe (18) and operable to determine a relative humidity based on the output signals from the light detector (22) and the temperature measurement probe (18).
G01N 25/68 - Investigating or analysing materials by the use of thermal means by investigating moisture content by investigating dew-point by varying the temperature of a condensing surface
A sensor includes a substrate; and a corrugated diaphragm offset from the substrate. The corrugated diaphragm is configured to deflect responsive to a sound wave impinging on the corrugated diaphragm. A cavity is defined between the corrugated diaphragm and the substrate, the corrugated diaphragm forming a top surface of the cavity and the substrate forming a bottom surface of the cavity. A pressure in the cavity is lower than a pressure outside of the cavity.
Techniques are described for portable computing devices and other apparatus that include an ambient light sensor. The techniques can be particularly advantageous for situations in which the ambient light sensor is disposed behind a display screen of a host device such that ambient light detected by the sensor passes through the light emitting display before being detected by the sensor.
G09G 3/3208 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
81.
CAPACITANCE TO DIGITAL CONVERTER, INTEGRATED SENSOR INTERFACE AND SENSOR DEVICE
A capacitance to digital converter, CDC, has a first and a second reference terminal (T1, T2) for receiving first and second reference voltages (VREFP, VREFN), a reference block (GREF) comprising one or more reference charge stores and being coupled to the first and second reference terminals (T1, T2) via a first switching block (SWB1), a scaling block (SOB) for providing at third and fourth reference terminals (T3, T4) downscaled voltages (SVREFP, SVREFN) from the first and second reference voltages (VREFP, VREFN) depending on a scaling factor, first and second measurement terminals (M1, M2) for connecting a capacitive sensor element (CS), the first measurement terminal (Ml) being coupled to the third and fourth reference terminals (T3, T4) via a second switching block (SWB2), and a processing block (PROG) coupled to the reference block (GREF) and to the second measurement terminal (M2) and being configured to determine a digital output signal based on a charge distribution between the sensor element (CS) and the reference block and based on the scaling factor, the output signal representing a capacitance value of the sensor element (CS).
G01R 27/26 - Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants
G01R 31/312 - Contactless testing by capacitive methods
G01D 5/24 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
Modulated light is generated using a light source of a sensor module. Using a photodetector of the sensor module, an intensity of modulated light reflected from an object towards the photo detector is measured over a period of time. An electronic control device bins the measured intensity of the reflected modulated light according to a plurality of temporal bins, determines a first temporal bin having the greatest intensity among the plurality of temporal bins, and estimates a distance between the sensor module and the object based on a first temporal bin, and one or more additional temporal bins of the plurality of temporal bins.
G01S 7/4915 - Time delay measurement, e.g. operational details for pixel components; Phase measurement
G01S 7/48 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
G01S 17/36 - Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
G01S 17/18 - Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves wherein range gates are used
G01S 17/931 - Lidar systems, specially adapted for specific applications for anti-collision purposes of land vehicles
83.
INTEGRATED OPTICAL TRANSDUCER AND METHOD FOR FABRICATING AN INTEGRATED OPTICAL TRANSDUCER
An integrated optical transducer (2) for detecting dynamic pressure changes comprises a micro - electro - mechanical system, MEMS, die (10) having a MEMS diaphragm (12) with a first side (13) exposed to the dynamic pressure changes and a second side (14). The transducer (2) further comprises an application specific integrated circuit, ASIC, die (11) having an evaluation circuit configured to detect a deflection of the MEMS diaphragm (12), in particular of the second side (14) of the MEMS diaphragm (12). The MEMS die (10) is arranged with respect to the ASIC die (11) such that a gap with a gap height is formed between the second side (14) of the diaphragm (12) and a first surface (19) of the ASIC die (11) and the MEMS diaphragm (12), the ASIC die (11) and a suspension structure (15) of the MEMS die (10) delineate a back volume (4) of the integrated optical transducer (2).
A micro-electro-mechanical system, MEMS, microphone assembly comprises an enclosure (10) defining a first cavity (11), and a MEMS microphone (20) arranged inside the first cavity (11). The microphone (20) comprises a first die (21) with bonding structures (23) and a MEMS diaphragm (24), and a second die (22) having an application specific integrated circuit, ASIC. The second die (22) is bonded to the bonding structures (23) such that a gap (28) is formed between a first side (25) of the diaphragm (24) and the second die (22), with the gap (28) defining a second cavity (31). The first side (25) of the diaphragm (24) is interfacing with the second cavity (31) and a second side (26) of the diaphragm (24) is interfacing with the environment (2) via an acoustic inlet port (12) of the enclosure (10). The bonding structures (23) are arranged such that pressure ventilation openings (30) are formed that connect the first cavity (11) and the second cavity (31).
A circuit arrangement comprises a first branch (101) comprising a resistor of variable resistance (131) and a diode-connected bipolar transistor (134) and a second branch comprising a resistor of fixed resistance (141) and another diode-connected bipolar transistor (135). A control loop (110) reproduces a voltage drop at the resistor of variable resistance (131) to a voltage drop at the resistor of fixed resistance (141). Output terminals (136, 137) are connected to the bipolar transistors (134, 135) to supply a differential voltage (VBE1, VBE2). The circuit arrangement may be used as an analog frontend circuit in a gas sensor or a temperature sensor arrangement.
H03K 17/94 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the way in which the control signals are generated
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01K 7/21 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit for modifying the output characteristic, e.g. linearising
G01K 7/25 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit for modifying the output characteristic, e.g. linearising
86.
SENSOR DEVICE, SENSOR MODULE, IMAGING SYSTEM AND METHOD TO OPERATE A SENSOR DEVICE
A sensor device is proposed and comprises an array (10) of photodetectors. A readout circuit (30) is connected to the array (10) of photodetectors and provides dedicated readout paths for each photodetector in the array (10), respectively. Further, the readout circuit (20) comprises at least one control terminal (23). An array of time-to-digital converters (TDC1, TDC2, TDC3, TDC4) is electrically connected to converter output terminals (TDC_OUT) of the readout circuit (30). Depending on a control signal (SEL) to be applied at the at least one control terminal (23), the readout circuit (20) is arranged to electrically connect through the readout paths of photodetectors of a first subarray (11) to the converter output terminals (TDC_OUT) of the readout circuit (20), respectively, thereby rendering the photodetectors of the first subarray (11) active and photodetectors of a second subarray (12) inactive.
G01S 7/491 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of non-pulse systems
Fuel-cell-type gas sensor comprising an electrochemical solid electrolyte film, a plurality of electrodes coupled with the electrochemical film; and a semiconductor wafer coupled with the plurality of electrodes. A preferred embodiment is an alcohol sensor in breath comprising a NAFION membrane as the electrochemical film
Apparatus for reading a test region (6, 7) of an assay, e.g. on a lateral flow test strip (5), the apparatus comprising: an optical detector (2, 4; fig. 1c), comprising an optical input for receiving light emitted from the test region (6, 7) of the assay and an electrical output; an electrical signal processor, electrically coupled to the electrical output; and a plurality of spectral filters (fig. 1b) substantially transparent to a plurality of different wavelengths.
A method of manufacturing an optical sensor arrangement comprising the steps of providing a substrate (10) having a surface (11) and providing an integrated circuit (20) comprising an optical detector (21) arranged for detecting light of a desired wavelength range. The integrated circuit (20) and a light emitter (30) are mounted onto the surface (11), wherein the light emitter (30) is arranged for emitting light in the desired wavelength range. The integrated circuit (20) and the light emitter (30) are electrically connected to each other and to the substrate (10). A light barrier (40) is formed between the optical detector (21) and the light emitter (30) by dispensing a first optically opaque material along a profile (24) of the integrated circuit (20). A mold layer (50) is formed by at least partly encapsulating the substrate (10), the integrated circuit (20) and the light emitter (30) with an optically transparent material. A casing (60), made from a second optically opaque material, is mounted on the light barrier (40) and thereby encloses a hollow space between the casing (60) and the mold layer (50).
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
G01S 17/02 - Systems using the reflection of electromagnetic waves other than radio waves
G01S 17/08 - Systems determining position data of a target for measuring distance only
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
H01L 51/44 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation - Details of devices
H01L 31/12 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
A particulate matter sensor module includes a light source and a light detector mounted on a substrate. A housing is attached to the substrate and includes first and second sections attached to one another in a stack over the substrate such that the first section is disposed between the substrate and the second section. The first and second sections, in combination, define a light reflection chamber, a fluid flow conduit, a particle-light interaction chamber, and a light trap chamber. The first section has a first aperture through which light emitted by the light source can pass to a reflective surface within the light reflection chamber. The reflective surface is configured to reflect the light toward the particle-light interaction chamber where the light can interact with particles in a fluid flowing in the fluid flow conduit. The first section has a second aperture through which light scattered in the particle-light interaction chamber as a result of interaction with one or more of the particles can pass for sensing by the detector. The fluid flow conduit includes a fluid inlet portion having an end coupled directly to the particle-light interaction chamber.
An apparatus includes a display screen, an ambient light sensor disposed behind the display screen, and an electronic control unit operable to control a brightness of the display screen based on a duty cycle of a PWM signal. The electronic control unit is operable to sample an output of the ambient light sensor, identify a pair of consecutive samples of the ambient light sensor output that represent a greatest difference in magnitudes of their values, and to estimate a brightness of the display screen based on the difference.
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
92.
FILTER ASSEMBLY, DETECTOR, AND METHOD OF MANUFACTURE OF A FILTER ASSEMBLY
A filter assembly comprises an incident medium (10), a spacer (30), at least one dielectric filter (50) and an exit medium (70). The spacer (30) is arranged between the incident medium (10) and the at least one dielectric filter (50) such that the incident medium (10) and the at least one dielectric filter (50) are spaced apart by a working distance (32) and thereby enclose a medium of lower index of refraction than the incident medium (10). The at least one dielectric filter (50) is arranged on the exit medium (70).
A system includes a first spectral modulator, a second spectral modulator, a light guide optically, a photodetector, and an electronic control device. The first spectral modulator receives sample light, and modulates the sample light according to a first spectral response pattern to produce first modulated light. The second spectral modulator receives the first modulated light from the first spectral modulator via the light guide, modulates the first modulated light according to a second spectral response pattern to produce second modulated light, and transmits the second modulated light to the photodetector. The photodetector measures an intensity of the second modulated light incident on the photodetector, and generates one or more signals corresponding to the intensity of the second modulated light. The electronic control device determines a spectral distribution of the sample light based on the one or more signals.
The disclosure describes techniques that can be useful for situations in which an ambient light sensor is disposed behind a display screen of a host device such that ambient light detected by the sensor passes through the light emitting display before being detected by the sensor.
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
An apparatus includes a display screen, an ambient light sensor disposed behind the display screen, and an electronic control unit. An integration time of the ambient light sensor is unsynchronized to a frame rate of the display screen. The electronic control unit is operable to control a brightness of the display screen based on a duty cycle of a PWM blanking signal, wherein at least one OFF time of the PWM blanking signal occurs fully within a first integration period of the ambient light sensor, and wherein at least one other integration period ON time of the PWM blanking signal occurs fully during an ON time of the PWM blanking signal. The electronic control unit is further operable to acquire samples of an output of the ambient light sensor, to identify a highest value and a lowest value from among a consecutive group of the samples, and to estimate a magnitude of an ambient light signal based at least in part on the highest value and the lowest value.
G09G 3/3208 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
96.
METHOD AND CIRCUIT FOR TEMPERATURE SENSING, TEMPERATURE SENSOR AND ELECTRICAL APPLIANCE
In an embodiment a method for temperature sensing comprises the steps of feeding an analog signal (Sin) comprising a first value of a temperature of an object, performing (S1) an analog-to-digital conversion of the analog signal using a first analog-to-digital converter (10), ADC, and therefrom providing a first digital signal (Sout1) representing an initial digital temperature value, performing (S2) an analog-to-digital conversion of the analog signal (Sin) using a second ADC (20) and therefrom providing a second digital signal (Sout2)representing a digital reference temperature value, regularly feeding the analog signal (Sin) comprising a successive value of the temperature of the object,performing (S3) an analog-to-digital conversion of the analog signal (Sin) using the second ADC (20) and therefrom providing the second digital signal (Sout2) representing a successive digital temperature value,and calculating a digital delta temperature value according to a difference between the successive digital temperature value and the digital reference temperature value, and repeating the latter step as long as the digital delta temperature value lies within the predefined range
The present disclosure describes a method and apparatus for enabling an imaging sensor to perform Time-of-Flight measurements while requiring less histogram memory and in many cases less power consumption. A light source is operated to cause multiple light emissions and a coarse/estimated distance is determined based on a first echo received based on the first light emission. A histogram is saved and a fine distance is calculated from the coarse distance and data derived from the echo of a second light emission.
A position encoder arrangement is configured to detect the position of a movable source based on a source field, which is a magnetic field or an electric field, emitted by the source. The position encoder arrangement comprises a number of sensor elements that are evenly distributed and each is configured to provide a sensor value based on the source field at the sensor element's location. The arrangement further comprises an evaluation unit that is configured to determine a fine position value for the position of the movable source, and to determine from the sensor values a trustworthiness of the fine position value and/or an error flag indicating whether a failure status of the position encoder arrangement is present.
G01D 5/244 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means generating pulses or pulse trains
G01D 3/08 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group with provision for safeguarding the apparatus, e.g. against abnormal operation, against breakdown
An optical device (306) includes an internal cavity and an emitter (102) disposed in the internal cavity (210). The emitter is operable to emit a first light wave (220). The optical device also includes a detector (104) disposed in the internal cavity. The detector is operable to detect a second light wave (225) that is based on the first light wave. The second light wave is susceptible to being coupled with an undesired light wave (235) that is based on the first light wave. The optical device further includes an interference filter (310) disposed on the detector. The interference filter has a filter property that causes the interference filter to attenuate the interfering light wave.
The invention relates to a method for manufacturing a planarized etch-stop layer (13), ESL, for a hydrofluoric acid, HF, vapor phase etching process. The method comprises providing a first planarized layer (17) on top of a surface of a substrate (10), the first planarized layer (17) comprising a patterned and structured metallic material (20) and a filling material (22). The method further comprises depositing on top of the first planarized layer (17) the planarized ESL (13) of an ESL material (23) with low HF etch rate, wherein the planarized ESL (13) has a low surface roughness and a thickness of less than 150nm, in particular of less than 100nm.
patents
