Murata Manufacturing Co., Ltd.

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IPC Class
H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details 998
H01G 4/30 - Stacked capacitors 929
H01F 27/28 - Coils; Windings; Conductive connections 882
H01F 27/29 - Terminals; Tapping arrangements 784
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1.

INDUCTOR COMPONENT

      
Application Number 18490455
Status Pending
Filing Date 2023-10-18
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Sakaguchi, Shingo

Abstract

An inductor component includes an element body and inductor wiring. Among outer surfaces of the element body, one specific surface is defined as a first main surface, one surface perpendicular to the first main surface is defined as a first end surface, and one surface perpendicular to the first main surface and the first end surface is defined as a bottom surface. The inductor wiring includes a winding portion. The winding portion includes an upper side portion, a lower side portion, and a first lateral side portion. The first lateral side portion linearly extends from an end of the lower side portion facing the first end surface to the same position as that of an end of the upper side portion facing the first end surface in a direction perpendicular to the first end surface.

IPC Classes  ?

  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 17/00 - Fixed inductances of the signal type
  • H01F 27/29 - Terminals; Tapping arrangements
  • H01F 27/32 - Insulating of coils, windings, or parts thereof

2.

SWITCHING POWER SUPPLY DEVICE

      
Application Number 18399221
Status Pending
Filing Date 2023-12-28
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ishikura, Yuki
  • Hosotani, Tatsuya
  • Takatsuji, Hiroyuki

Abstract

A circuit board of a switching power supply device includes a positive terminal circuit pattern and a negative terminal circuit pattern that are provided on a component mount surface and respectively supply currents from input parts to two input terminals of a common mode choke coil. The positive terminal circuit pattern and the negative terminal circuit pattern are positioned in parallel and close to each other. The component mount surface of the circuit board includes a component mount surface side ground pattern arranged below the common mode choke coil. A heat dissipation ground surface of the circuit board includes a ground pattern and a plurality of heat dissipation conductor patterns. Input terminals and output terminals of the common mode choke coil are respectively electrically and thermally connected to the heat dissipation conductor patterns via through-hole conductors provided between the component mount surface and the heat dissipation ground surface.

IPC Classes  ?

  • H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
  • H02M 1/14 - Arrangements for reducing ripples from dc input or output
  • H02M 1/32 - Means for protecting converters other than by automatic disconnection

3.

INDUCTOR COMPONENT

      
Application Number 18488585
Status Pending
Filing Date 2023-10-16
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sano, Rikiya
  • Miyake, Isamu
  • Kondo, Kenta

Abstract

An inductor component includes an element body and an inductor wiring. The element body has a planar first main surface. The inductor wiring extends inside the element body. The inductor wiring includes a plurality of wiring portions arrayed in a direction perpendicular to the first main surface. The element body includes a plurality of interlayer insulating layers filling spaces between the wiring portions that are adjacent to each other in a direction perpendicular to the first main surface. The interlayer insulating layers each contain an insulating base material and a plurality of filler particles dispersed within the base material. In a first interlayer insulating layer, which is one of the plurality of interlayer insulating layers, the average particle size of the filler particles is less than or equal to the standard deviation of the thickness of the first interlayer insulating layer.

IPC Classes  ?

  • H01F 27/32 - Insulating of coils, windings, or parts thereof
  • H01F 27/28 - Coils; Windings; Conductive connections

4.

MITIGATING SYSTEMATIC ERROR IN GYROCOMPASSING

      
Application Number 18484878
Status Pending
Filing Date 2023-10-11
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Ruohio, Jaakko

Abstract

A MEMS gyrocompass and method are provided to mitigate systematic error in determination of a north angle. The MEMS gyrocompass includes one or more MEMS gyroscopes having a sense axis within a reference plane. Samples from an output of the MEMS gyroscope are obtained in at least two angles of rotation about an axis perpendicular to the reference plane. First fit coefficients are determined by fitting samples with first fitting functions determined as function of time. Second fit coefficients are determined by fitting components of earth rotation rate projected on the reference plane based on samples obtained by all the MEMS gyroscopes, which fitting is performed with a second fitting function determined as a function of rotation angle of the MEMS gyroscope with respect to a reference angle. The north angle is determined as an angle between the reference angle and true north based on the second fit coefficients.

IPC Classes  ?

  • G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
  • G01C 19/58 - Turn-sensitive devices without moving masses

5.

COMPOSITE ELECTRONIC COMPONENT

      
Application Number 18404939
Status Pending
Filing Date 2024-01-05
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Fujita, Yukihiro
  • Yamato, Ryutaro
  • Funaki, Tatsuya
  • Satake, Yoshiaki

Abstract

A composite electronic component includes circuit layers, each including an electronic component, that are laminated, first and second circuit layers, a ceramic electronic component between the first and second circuit layers and including via electrodes extending through a body mainly including ceramic and being exposed at a corresponding one of a main surface on one side and a main surface on another side, and a sealing resin covering at least the ceramic electronic component at a location between the first and second circuit layers. At least one electronic component included in each of the first and second circuit layers are electrically connected by the via electrodes.

IPC Classes  ?

  • H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
  • H01L 23/15 - Ceramic or glass substrates
  • H01L 23/528 - Layout of the interconnection structure
  • H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
  • H01L 23/64 - Impedance arrangements

6.

OPTICAL COMPONENT

      
Application Number 18400348
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Nagata, Masaki
  • Shimizu, Yasuhiro
  • Mori, Naoya
  • Shimada, Kazuho

Abstract

An optical component including: a first block having a first refractive index and a first reflective surface; a first light absorbing member containing a first metal ion that absorbs light having a first specific wavelength and has a second refractive index different from the first refractive index; a first buffer layer between and in contact with each of the first light absorbing member and the first block, and having a third refractive index having a value between the first refractive index and the second refractive index, wherein the first light absorbing member, the first buffer layer, and the first block are arranged in this order in a first direction such that first block reflects light traveling in the first direction in a second direction different from the first direction on the first reflective surface.

IPC Classes  ?

7.

ACOUSTIC WAVE ELEMENT, ACOUSTIC WAVE FILTER DEVICE, AND MULTIPLEXER

      
Application Number 18399791
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Konaka, Yohei

Abstract

An acoustic wave element includes a piezoelectric substrate, an IDT electrode including comb electrode fingers, and a reflector including reflective electrode fingers. An average value of all pitches of the comb electrode fingers is smaller than an average value of all pitches of the reflective electrode fingers. When a total number of the comb electrode fingers is defined as N, at least one n-th end-side pitch satisfying 1≤n≤(0.233×N) is smaller than the average value of all the pitches of the comb electrode fingers.

IPC Classes  ?

  • H03H 9/135 - Driving means, e.g. electrodes, coils for networks consisting of magnetostrictive materials
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/58 - Multiple crystal filters
  • H03H 9/70 - Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common or source

8.

FILTER DEVICE AND MULTIPLEXER

      
Application Number 18399792
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sato, Tomoya
  • Furusato, Hiroyuki
  • Okude, Takayuki
  • Kondo, Seima
  • Okubo, Kota
  • Kameoka, Yoshinori

Abstract

A filter device includes a piezoelectric substrate, a dielectric layer on the piezoelectric substrate, a first IDT electrode on the dielectric layer, a second IDT electrode positioned on the piezoelectric substrate in an area where the dielectric layer is not provided such that the first and second IDT electrodes are side by side in an acoustic wave propagation direction extending along a principal surface of the piezoelectric substrate, a first reflector on the dielectric layer and adjacent to the first IDT electrode on a side of the second IDT electrode, and a second reflector on the piezoelectric substrate and adjacent to the second IDT electrode on a side of the first IDT electrode. The dielectric layer includes an edge portion between the first and second reflectors in planar view seen from a stacking direction of the piezoelectric substrate and the dielectric layer.

IPC Classes  ?

  • H03H 9/05 - Holders or supports
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/64 - Filters using surface acoustic waves

9.

Power Transmission Gate Using Charge Pump

      
Application Number 18465384
Status Pending
Filing Date 2023-09-11
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Cook, Aaron
  • Perreault, David J.
  • Hoversten, John R.

Abstract

Described is a power transmission gate which includes a charge pump, an NMOS transistor, and a gate driver circuit configured to power (or bias or “drive”) a gate of the NMOS transistor. With this arrangement, a power transmission gate capable of achieving substantially the same resistance provided by prior art power transmission gates while having a footprint of just over one NMOS size unit is provided.

IPC Classes  ?

  • H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
  • H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode

10.

COMPOSITE COMPONENT

      
Application Number 18399324
Status Pending
Filing Date 2023-12-28
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Satake, Yoshiaki
  • Funaki, Tatsuya
  • Arai, Kei

Abstract

A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.

IPC Classes  ?

  • H01L 23/498 - Leads on insulating substrates
  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
  • H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
  • H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

11.

ELECTRONIC COMPONENT

      
Application Number 18400627
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ooshima, Tomoya
  • Hoshino, Yuuta
  • Yamada, Koichi
  • Sasaki, Miki
  • Nakano, Mitsuru

Abstract

An electronic component that includes: a base body; wiring inside the base body; a glass film covering an outer surface of the base body; an underlying electrode electrically connected to the wiring and covering a part of the glass film; and a metal layer covering the underlying electrode, wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 μm, and a boundary portion that is not covered with the underlying electrode and not separated from the outer edge of the underlying electrode by more than 10 μm, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.

IPC Classes  ?

  • H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
  • H01C 1/14 - Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors

12.

CIRCUIT MODULE

      
Application Number 18475392
Status Pending
Filing Date 2023-09-26
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Otsubo, Yoshihito

Abstract

A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.

IPC Classes  ?

  • H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components

13.

SANDWICHED XBAR FOR THIRD HARMONIC OPERATION

      
Application Number 18400668
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Garcia, Bryant
  • Adhikari, Pintu
  • Guyette, Andrew

Abstract

A filter device has a first piezoelectric plate spanning a first and second cavity of a substrate. A first and second interdigital transducer (IDT) are on a front surface of the first piezoelectric plate over the first and second cavity. A dielectric layer is formed on the first piezoelectric plate and covers the first IDT and second IDT. A second piezoelectric plate is bonded to a front surface of the dielectric layer over the first cavity and the second cavity. A second dielectric layer is formed on a front surface of the second piezoelectric plate over the first cavity but not over the second cavity. The thickness of the dielectric layer, the first piezoelectric plate and the second piezoelectric plate can be selected to tune a shunt resonator over the first cavity and a series resonator over the second cavity.

IPC Classes  ?

  • H03H 9/205 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having multiple resonators
  • H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/56 - Monolithic crystal filters
  • H03H 9/60 - Electric coupling means therefor

14.

POWER AMPLIFIER CIRCUIT

      
Application Number 18403741
Status Pending
Filing Date 2024-01-04
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Takezono, Naofumi
  • Yoshimi, Shunji

Abstract

A power amplifier circuit includes a first amplifier, a second amplifier, a third amplifier, and a harmonic suppression circuit. The first amplifier operates on power supplied through a first supply line, and amplifies a first transmit signal in a first frequency band. The second amplifier operates on power supplied through a second supply line connected to the first supply line, and amplifies a second transmit signal in a second frequency band different from the first frequency band. The third amplifier shares an antenna with the second amplifier, and amplifies a receive signal in the second frequency band received from the antenna. The harmonic suppression circuit generates, based on a harmonic of the first transmit signal, a suppression signal to suppress the harmonic to be transferred to the first supply line, and outputs the suppression signal to the first supply line or the second supply line.

IPC Classes  ?

  • H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

15.

FILTER DEVICE AND RADIO FREQUENCY FRONT END CIRCUIT

      
Application Number 18530295
Status Pending
Filing Date 2023-12-06
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Kikuda, Masayuki

Abstract

A filter device includes input and output terminals, first and second ground electrodes opposed to each other, and a resonator connected to one of the input and output terminals. The resonator includes a third ground electrode, and first, second, and third resonant portions. The third ground electrode is between and connected to the first and second ground electrodes. The first resonant portion is between the first and third ground electrodes, and connected to the third ground electrode and one of the input and output terminals. The second resonant portion is between the first and third ground electrodes, and connected to the third ground electrode. The third resonant portion is between the second and third ground electrodes, and connected to the third ground electrode.

IPC Classes  ?

  • H03H 7/01 - Frequency selective two-port networks
  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 27/40 - Structural association with built-in electric component, e.g. fuse
  • H01G 4/30 - Stacked capacitors
  • H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations

16.

CIRCUIT MODULE

      
Application Number 18483929
Status Pending
Filing Date 2023-10-09
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Otsubo, Yoshihito
  • Nakagoshi, Hideo
  • Yoshimori, Hiroki

Abstract

An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.

IPC Classes  ?

  • H05K 1/14 - Structural association of two or more printed circuits
  • H05K 1/02 - Printed circuits - Details

17.

Pulse-Shaping Networks with Coupled Magnetics

      
Application Number 18185832
Status Pending
Filing Date 2023-03-17
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Hoversten, John R.
  • Perreault, David J.
  • Tkachenko, Yevgeniy A.

Abstract

A pulse-shaping network configured for use in a radio frequency (rf) power amplifier system, the pulse-shaping network comprising: a coupled magnetic element comprising a first inductive element magnetically coupled to a second inductive element, the first inductive element comprising a first winding disposed about a first portion of a core, and the second inductive element comprising a second winding disposed about a second portion of a core, wherein the first and second inductive elements are electrically coupled to provide three output terminals of the coupled magnetic element.

IPC Classes  ?

  • H03F 9/04 - Magnetic amplifiers voltage-controlled, i.e. the load current flowing in only one direction through a main coil, e.g. Logan circuits

18.

COIL COMPONENT

      
Application Number 18400597
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yamanaka, Hiromitsu
  • Oishi, Masayuki

Abstract

A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.

IPC Classes  ?

  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 27/245 - Magnetic cores made from sheets, e.g. grain-oriented
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

19.

VIBRATION WAVE RADIATING DEVICE

      
Application Number 18404938
Status Pending
Filing Date 2024-01-05
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Ito, Ryota

Abstract

In a vibration wave radiating device, when a distance between a connection portion and a reflecting plane portion in a direction orthogonal to the reflecting plane portion is TD, an angle defined by a virtual line parallel to the reflecting plane portion and a back surface of a vibrating portion in a longitudinal section is θ, a shortest distance between a peripheral edge of the back surface at an end of the vibrating portion opposite to the connection portion and a peripheral edge of the reflecting plane portion is L, and a wavelength of a vibration wave emitted from the vibrating portion is λ, a relationship indicated by 0.78λ≤L≤1.19λ or 1.5λ≤L≤2.14λ is satisfied when TD=0 and 35°≤θ≤55°.

IPC Classes  ?

  • H02N 99/00 - Subject matter not provided for in other groups of this subclass

20.

CYLINDRICAL BATTERY

      
Application Number 18402367
Status Pending
Filing Date 2024-01-02
First Publication Date 2024-04-25
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor Sodeyama, Kunio

Abstract

A cylindrical battery is provided and includes a columnar electrode body, a cylindrical battery can in which one end portion is opened and the electrode body is accommodated, and a current interrupt device provided at the one end portion. The current interrupt device includes a cover, a holder provided inside the cover, and a disk provided inside the holder.

IPC Classes  ?

  • H01M 50/578 - Devices or arrangements for the interruption of current in response to pressure
  • H01M 10/04 - Construction or manufacture in general
  • H01M 50/586 - Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries inside the batteries, e.g. incorrect connections of electrodes
  • H01M 50/591 - Covers

21.

INDUCTOR COMPONENT

      
Application Number 18447004
Status Pending
Filing Date 2023-08-08
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Sakaguchi, Shingo

Abstract

An inductor component includes an element body and inductor wiring. The element body has first and second electrodes connected to first and second ends of the inductor wiring, respectively. One outer surface of the element body is a first main surface, one surface perpendicular to the first main surface is a first end surface, and one surface perpendicular to the first main and end surfaces is a bottom surface. The first electrode includes a first bottom surface electrode portion and a first end surface electrode portion. A size of the first bottom surface electrode portion in a direction perpendicular to the bottom surface is a thickness, and a portion of the first bottom surface electrode portion farthest from the first end surface is a leading end. The thickness of at least part of the first bottom surface electrode portion including the leading end decreases toward the leading end.

IPC Classes  ?

22.

BIOSIGNAL ELECTRODE

      
Application Number 18480702
Status Pending
Filing Date 2023-10-03
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yoshida, Koji
  • Torita, Takeshi
  • Okamura, Ichitaro
  • Sugiura, Kosuke
  • Fujiwaki, Mika

Abstract

A biosignal electrode that includes a substrate having first and second opposed main surfaces; a conductive material pattern on the first main surface of the substrate, the conductive material pattern defining a plurality of open spaces extending through the conductive material pattern and exposing the first surface of the substrate therethrough; and a biocompatible glue material within the plurality of open spaces of the conductive material pattern.

IPC Classes  ?

  • A61B 5/265 - Bioelectric electrodes therefor characterised by the electrode materials containing silver or silver chloride
  • A61B 5/257 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes
  • A61B 5/273 - Connection of cords, cables or leads to electrodes
  • A61B 5/28 - Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
  • A61B 5/291 - Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]

23.

SWITCHING POWER SUPPLY DEVICE

      
Application Number 18403297
Status Pending
Filing Date 2024-01-03
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Hosotani, Tatsuya
  • Takatsuji, Hiroyuki
  • Ishikura, Yuki

Abstract

A noise reduction circuit includes a surface-mount common mode choke coil mounted on a circuit board. Output terminals of the common mode choke coil are connected to an input capacitor via second circuit patterns. Two terminals of the input capacitor are connected to two input ends of a switching circuit via third circuit patterns. Path lengths of the second circuit patterns are longer than path lengths of the third circuit patterns. Of a plurality of current paths, the path lengths of the third circuit patterns are shortest in comparison with path lengths of other current paths. First circuit patterns are parallel and face each other to form a first parasitic capacitance, and the second circuit patterns are parallel and face each other to form second parasitic capacitances.

IPC Classes  ?

  • H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
  • H02M 1/14 - Arrangements for reducing ripples from dc input or output
  • H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters

24.

SYSTEMS AND METHODS FOR GENERATING AN OPTIMIZED ACOUSTIC WAVE (AW) RESONATOR USING THE FINITE ELEMENT TEARING AND INTERCONNECTING (FETI) METHOD

      
Application Number 18486699
Status Pending
Filing Date 2023-10-13
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Li, Hongliang
  • Jin, Jianming
  • Koskela, Julius
  • Massey, Jackson
  • Willemsen, Balam

Abstract

Techniques described herein relate to systems and methods for generating an optimized acoustic wave (AW) structure, including: receiving, by a computing system, a set of frequency response requirements and a physical model of the AW structure; partitioning the physical model into a plurality of subdomains that are non-overlapping; determining and applying transmission conditions (TCs) for each of the plurality of subdomains to couple neighboring subdomains; reducing a subdomain problem for each subdomain of the plurality of subdomains to a local interface problem; assembling degrees of freedoms (DOFs) from all local interface problems to form a global interface system; solving the global interface system by monitoring for convergence accelerated by the applied TCs; deriving a frequency response of the AW structure at least partially from the solved global interface system; comparing the frequency response to the set of frequency response requirements; and optimizing the AW structure based on the comparison.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details

25.

ACOUSTIC RESONATOR LID FOR THERMAL TRANSPORT

      
Application Number 18488277
Status Pending
Filing Date 2023-10-16
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Koulakis, John
  • Dyer, Greg
  • Mchugh, Sean
  • Turner, Patrick

Abstract

An apparatus for filtering radio frequency signals is provided. The apparatus includes a substrate and a membrane coupled to the substrate that includes piezoelectric material. The apparatus also includes an interdigital transducer (IDT) coupled to the membrane and includes a plurality of interleaved fingers. The apparatus also includes a lid, in which the membrane is arranged between the substrate and the lid with a first cavity having a first height between the lid and a first main surface of the membrane and a second cavity having a second height between the substrate and a second main surface of the membrane that opposes the first main surface. Moreover, the first height between the lid and the first main surface of the membrane is greater than a pitch of at least one pair of interleaved fingers of the plurality of interleaved fingers and at most four times greater than the second height.

IPC Classes  ?

  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/56 - Monolithic crystal filters

26.

ELECTRONIC COMPONENT

      
Application Number 18400401
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yokomizo, Satoshi
  • Chikuma, Shinobu
  • Mukobata, Yohei

Abstract

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.

IPC Classes  ?

  • H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/30 - Stacked capacitors

27.

ACOUSTIC WAVE DEVICE

      
Application Number 18401759
Status Pending
Filing Date 2024-01-02
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Kimura, Tetsuya

Abstract

An acoustic wave device includes a support substrate with a thickness in a first direction, an intermediate layer on the support substrate, a piezoelectric layer on the intermediate layer, and an interdigital transducer electrode including a first electrode finger on a surface of the piezoelectric layer and extending in a second direction intersecting the first direction, a first busbar electrode connected to the first electrode finger, a second electrode finger opposed to the first electrode finger in a third direction orthogonal or substantially orthogonal to the second direction and extending in the second direction, and a second busbar electrode connected to the second electrode finger. The intermediate layer includes a space in a region in which at least a portion of the intermediate layer overlaps the interdigital transducer electrode in a plan view in the first direction, and an inner wall of the space includes at least one notch.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/05 - Holders or supports
  • H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
  • H03H 9/25 - Constructional features of resonators using surface acoustic waves

28.

ACOUSTIC WAVE ELEMENT, ACOUSTIC WAVE FILTER DEVICE, AND MULTIPLEXER

      
Application Number 18401756
Status Pending
Filing Date 2024-01-02
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Konaka, Yohei

Abstract

In an acoustic wave element, a distance between a comb electrode finger closest to a reflector and a reflective electrode finger closest to an interdigital transducer (IDT) electrode is set as an IDT-reflector gap. An inter-center distance between adjacent electrode fingers is set as a pitch. The electrode fingers in a direction from the comb electrode finger closest to the reflector toward a center are sequentially set as an n-th end-side electrode finger, and a pitch between the n-th end-side electrode finger and an (n+1)-th end-side electrode finger is set as an n-th end-side pitch. An average value of each pitch by all the comb electrode fingers is set as an average IDT pitch, and an average value of each pitch by the reflective electrode fingers is set as an average reflector pitch.

IPC Classes  ?

  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/56 - Monolithic crystal filters

29.

CIRCUIT MODULE

      
Application Number 18483870
Status Pending
Filing Date 2023-10-09
First Publication Date 2024-04-25
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Otsubo, Yoshihito

Abstract

A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H01L 23/367 - Cooling facilitated by shape of device
  • H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
  • H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
  • H05K 1/14 - Structural association of two or more printed circuits
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components

30.

CIRCUIT BOARD

      
Application Number 18397274
Status Pending
Filing Date 2023-12-27
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Ishikawa, Kumiko

Abstract

A circuit board that includes a ceramic substrate; a protruding electrode on a surface of the ceramic substrate; and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate.

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

31.

THERMAL ANALYSIS METHOD, THERMAL ANALYSIS APPARATUS, AND COMPUTER PROGRAM

      
Application Number 18391784
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yamayose, Yuu
  • Shibahara, Teruhisa
  • Fukunishi, Masataka

Abstract

A thermal analysis method and apparatus, and a computer program that enable highly accurate heat transfer simulation of a structure or space, while reducing calculation costs. By performing thermal analysis on a structure or space using the calculation meshes generated by initial dividing means, the spatial distribution of heat flux vectors J and temperature gradient vectors ∇T are calculated; by calculating the volume integrals of the inner products J·∇T of the heat flux vectors J and the temperature gradient vectors ∇T for individual partitioned regions and acquiring the absolute values of the volume integrals, thermal management sensitivity indices are calculated for the partitioned regions. Subsequently, partition of calculation meshes and subdivision of partitioned regions are performed on a predetermined number of partitioned regions that indicate greater indices among the calculated thermal management sensitivity indices, for example one partitioned region. Thermal analysis is performed again using the calculation meshes.

IPC Classes  ?

  • G06F 30/23 - Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]

32.

POWER AMPLIFIER CIRCUIT AND COMMUNICATION DEVICE

      
Application Number 18394165
Status Pending
Filing Date 2023-12-22
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Tahara, Kenji
  • Wakabayashi, Ryo
  • Yamamoto, Kae

Abstract

A power amplifier circuit includes an amplifier transistor having a collector terminal, an emitter terminal, and a base terminal, bias circuits, and a current limiter circuit. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current from an emitter terminal to the base terminal. The current limiter circuit includes a current limiting transistor an emitter terminal of which is connected to the bias circuit, a resistive element connected between the current limiting transistor and a power supply terminal, and a resistive element connected between the current limiting transistor and the constant current amplifier transistor. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current i3 from an emitter terminal to the base terminal.

IPC Classes  ?

  • H03F 1/30 - Modifications of amplifiers to reduce influence of variations of temperature or supply voltage
  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/195 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

33.

COIL COMPONENT

      
Application Number 18544050
Status Pending
Filing Date 2023-12-18
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Annen, Kazunori

Abstract

A coil component includes a first outer magnetic body, a first outer insulator, a first inner magnetic body, an inner insulator, a second inner magnetic body, a second outer insulator, and a second outer magnetic body stacked sequentially, and a coil in the inner insulator and an internal magnetic body inside the coil. Volumes A, B, C, and D of the first and second outer insulators, the inner insulator, the coil, and the internal magnetic body, respectively, and volume E of the first outer magnetic body, the first inner magnetic body, the second inner magnetic body, and the second outer magnetic body satisfy 0.05≤A≤0.07, 0.2≤B≤0.4, 0.01≤C≤0.08, 0.03≤D≤0.05, and 0.4≤E≤0.71, where 0.05B≤C≤0.2B and A+B+C+D+E=1.

IPC Classes  ?

34.

INDUCTOR COMPONENT

      
Application Number 18479889
Status Pending
Filing Date 2023-10-03
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Kunimori, Keisuke

Abstract

An inductor component includes first and second internal wiring lines, an interlayer insulating layer between the first and second internal wiring lines and having a first main surface facing the first internal wiring line, a second main surface facing the second internal wiring line, and a via extending between the first main surface and the second main surface, and a via wiring line inserted through the via that electrically connects the first and second internal wiring lines. In a first section including a central axis of the via wiring line, the first main surface includes a first portion in contact with the first internal wiring line. The second main surface includes a second portion that is parallel to the first portion. A straight line that includes the first portion is a first reference line. A straight line that includes the second portion is a second reference line.

IPC Classes  ?

  • H01F 27/32 - Insulating of coils, windings, or parts thereof
  • H01F 27/28 - Coils; Windings; Conductive connections

35.

INDUCTOR COMPONENT

      
Application Number 18451717
Status Pending
Filing Date 2023-08-17
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Tominaga, Ryuichiro

Abstract

An inductor component includes: a first internal conductor; a second internal conductor; an insulating interlayer disposed between the first internal conductor and the second internal conductor and having a first main surface on the first internal conductor side, a second main surface on the second internal conductor side, and a via extending therethrough between the first main surface and the second main surface; and a via conductor inserted through the via and electrically connecting the first internal conductor and the second internal conductor. In a first section including a central axis of the via conductor, the via conductor has a wedge portion interposed between the insulating interlayer and the first internal conductor in a direction parallel to the central axis.

IPC Classes  ?

  • H01F 27/32 - Insulating of coils, windings, or parts thereof

36.

DIRECTIONAL COUPLER, HIGH FREQUENCY MODULE, AND COMMUNICATION APPARATUS

      
Application Number 18481373
Status Pending
Filing Date 2023-10-05
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Miyazaki, Yuuta
  • Furutani, Koji
  • Akashi, Naoya

Abstract

A directional coupler includes a main line, a first sub-line, a second sub-line, a first phase shift circuit, a first short-circuit path, and a first short-circuit switch. The first phase shift circuit is connected between the first sub-line and the second sub-line. The first short-circuit path short-circuits both ends of the first phase shift circuit. The first short-circuit switch switches between conduction and non-conduction of the first short-circuit path.

IPC Classes  ?

  • H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
  • H01P 1/18 - Phase-shifters

37.

MULTILAYER COIL COMPONENT

      
Application Number 18389615
Status Pending
Filing Date 2023-12-19
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Hiraki, Makoto
  • Imada, Katsuhisa
  • Hamano, Morihiro
  • Mizobata, Ryouji

Abstract

A highly reliable multilayer coil component in which the internal stress is further alleviated, and a method for producing the same. The method produces a multilayer coil component that includes an insulator portion, a coil that is embedded in the insulator portion and includes a plurality of coil conductor layers electrically connected to one another, and an outer electrode that is disposed on a surface of the insulator portion and is electrically connected to an extended portion of the coil. The method includes forming a conductive paste layer by using a conductive paste; forming an insulating paste layer by using an insulating paste; forming a multilayer compact that includes the conductive paste layer and the insulating paste layer; and firing the multilayer compact, in which the conductive paste has a PVC of 60% or more and 80% or less (i.e., from 60% to 80%).

IPC Classes  ?

  • H01F 17/00 - Fixed inductances of the signal type
  • H01F 27/255 - Magnetic cores made from particles
  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 27/32 - Insulating of coils, windings, or parts thereof
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

38.

POWER AMPLIFIER CIRCUIT

      
Application Number 18392166
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sukemori, Yoshiaki
  • Tahara, Kenji

Abstract

There is provided a power amplifier circuit capable of adjusting the gain according to the power mode. A power amplifier circuit includes: a splitter outputting an input signal by splitting the input signal to a signal RF1 and a signal RF2; amplifiers connected to the splitter; and an amplifier provided in or on a signal path branching from between the splitter and an input of the amplifier, connected in parallel with the amplifier, and connected to a biasing terminal supplied with a third bias current or voltage.

IPC Classes  ?

  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
  • H01P 5/16 - Conjugate devices, i.e. devices having at least one port decoupled from one other port
  • H03F 1/56 - Modifications of input or output impedances, not otherwise provided for

39.

DOHERTY AMPLIFIER CIRCUIT

      
Application Number 18484660
Status Pending
Filing Date 2023-10-11
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Imai, Shohei

Abstract

A Doherty amplifier circuit includes a carrier amplifier including one or more amplifiers, and a peaking amplifier including one or more amplifiers. At least one of the amplifiers includes a first transistor and a current draw circuit. The first transistor receives, at its base or gate, a first radio frequency signal, and outputs, from its emitter or source, a second radio frequency signal obtained by amplifying the first radio frequency signal. The current draw circuit draws, from the emitter or source of the first transistor, a current based on a control signal.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation

40.

INDUCTOR COMPONENT

      
Application Number 18480915
Status Pending
Filing Date 2023-10-04
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Kunimori, Keisuke

Abstract

An inductor component includes a base body, first and second inner wiring line inside the base body, an inter-layer insulation layer, and a via-wiring line. The inter-layer insulation layer is inside the base body, and between the first and second inner wiring lines. The inter-layer insulation layer includes first and second major faces and a via-hole. The first major face faces the first inner wiring line. The second major face faces the second inner wiring line. The via-hole extends through the inter-layer insulation layer between the first and second major faces. The via-wiring line is in the via-hole, and electrically connects the first and second inner wiring lines. As seen in a first cross-section including a center axis of the via-wiring line, the via-wiring line includes a first portion in contact with the first inner wiring line, and a second portion in contact with the second inner wiring line.

IPC Classes  ?

  • H01F 27/32 - Insulating of coils, windings, or parts thereof
  • H01F 27/29 - Terminals; Tapping arrangements

41.

SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING SOLID ELECTROLYTIC CAPACITOR

      
Application Number 18396233
Status Pending
Filing Date 2023-12-26
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Furukawa, Takeshi

Abstract

A solid electrolytic capacitor that includes: an anode plate made of a valve metal; a porous layer on at least one of principal surface of the anode plate; a dielectric layer on a surface of the porous layer; a cathode layer that includes a solid electrolyte layer on the dielectric layer, the cathode layer including two or more cathode portions; a first insulating layer that surrounds at least one of the cathode portions as viewed in a thickness direction of the solid electrolytic capacitor, wherein a material of the first insulating layer fills a portion of the porous layer and is also present on a surface of the filled portion of the porous layer; and a first piercing section that pierces through both of the porous layer and the first insulating layer in the thickness direction.

IPC Classes  ?

  • H01G 9/10 - Sealing, e.g. of lead-in wires
  • H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ
  • H01G 9/048 - Electrodes characterised by their structure
  • H01G 9/15 - Solid electrolytic capacitors

42.

RESONANCE DEVICE AND METHOD FOR MANUFACTURING SAME

      
Application Number 18398422
Status Pending
Filing Date 2023-12-28
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Fukumitsu, Masakazu
  • Higuchi, Yoshiyuki
  • Kishi, Takehiko

Abstract

A resonance device that includes: a first substrate having a first silicon substrate and a resonator, wherein the resonator includes a single-crystal silicon film and a first silicon oxide film interposed between the single-crystal silicon film and the first silicon substrate, and a through hole that passes through the single-crystal silicon film and the first silicon oxide film; a second substrate opposite the first substrate; a frame shaped bonding portion that bonds the first substrate to the second substrate to seal a vibration space of the resonator; and a first blocking member disposed in an interior of the through hole and surrounding a vibration portion of the resonator in a plan view of the first substrate so as to divide the first silicon oxide film, wherein the first blocking member has a lower helium permeability than the first silicon oxide film.

IPC Classes  ?

  • H03H 9/10 - Mounting in enclosures
  • H03H 3/007 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
  • H03H 9/24 - Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive

43.

RADIO FREQUENCY CIRCUIT, COMMUNICATION DEVICE, AND CONTROL METHOD

      
Application Number 18530301
Status Pending
Filing Date 2023-12-06
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Nagumo, Shoji

Abstract

A radio frequency circuit that supports simultaneous communication using downlink MIMO in a first band and uplink communication in a second band includes first and second power amplifiers connected to first and second antenna terminals, respectively. When a first SRS in the first band is output through the first antenna terminal, the first power amplifier amplifies the first SRS, according to a first deterioration amount of a signal-to-noise ratio in the first band due to distortion of a transmission signal in the second band having leaked in through the first antenna terminal, and when a second SRS in the first band is output through the second antenna terminal, the second power amplifier amplifies the second SRS, according to a second deterioration amount of the signal-to-noise ratio in the first band due to distortion of the transmission signal in the second band having leaked in through the second antenna terminal.

IPC Classes  ?

  • H04B 1/401 - Circuits for selecting or indicating operating mode
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

44.

POWER AMPLIFIER CIRCUIT AND POWER AMPLIFICATION METHOD

      
Application Number 18395786
Status Pending
Filing Date 2023-12-26
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Tahara, Kenji
  • Sukemori, Yoshiaki
  • Yamamoto, Kae
  • Wakabayashi, Ryo

Abstract

A power amplifier circuit includes external input and output terminals; a first power amplifier with first input and output terminals, the first input terminal being connected to the external input terminal, the first output terminal being connected to the external output terminal; a second power amplifier having second input and output terminals, the second input terminal being connected to the external input terminal, the second output terminal being connected to the external output terminal; a power supply terminal that receives a power supply voltage that is supplied to the first power amplifier and controllably supplied to the second power amplifier; and a switch having first and second terminals, the first terminal being connected to the power supply terminal, the second terminal being connected to the second power amplifier.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/195 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
  • H03F 3/72 - Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal

45.

ELECTRICAL DEVICE

      
Application Number 18392298
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Warnakulasuriya, Kapila

Abstract

An electrical device includes a thermally insulating layer including first and second opposing surfaces. The first surface of the thermally insulating layer is on a first surface of the electrical device. A thermally conductive layer is on the second surface of the thermally insulating layer. The electrical device further includes one or more thermal conductors in thermal contact with the thermally conductive layer to transfer heat away from the thermally conductive layer via one or more coolers provided externally to the electrical device. Such a composite layer arrangement maintains a temperature of a surface at a low value, allowing low temperature rated electronic components to be mounted directly onto the electrical device.

IPC Classes  ?

46.

Antenna Array Element by Element Power Tracking

      
Application Number 18489658
Status Pending
Filing Date 2023-10-18
First Publication Date 2024-04-18
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor
  • Kimball, Donald Felt
  • O’leary, Mark James

Abstract

Methods and devices addressing power tracking of transmission systems using antenna arrays are disclosed. The disclosed teachings may be implemented on a channel element to channel element basis, are adaptive and can be implemented on short time durations such as time slots. Power efficiency can be improved when applying the described methods to the design of systems with antenna arrays.

IPC Classes  ?

  • H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
  • H01Q 21/00 - Antenna arrays or systems

47.

DIRECTIONAL COUPLER, HIGH-FREQUENCY MODULE, AND COMMUNICATION DEVICE

      
Application Number 18482199
Status Pending
Filing Date 2023-10-06
First Publication Date 2024-04-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Miyazaki, Yuuta
  • Shimizu, Katsuya

Abstract

A directional coupler includes a main line, a sub-line, an output terminal, a first termination circuit, and a termination switch. The sub-line includes a first end and a second end. The output terminal is connected to one end of the first end and the second end. The first termination circuit connects a first output path, which connects the one end and the output terminal, to a ground. The termination switch switches between connection and non-connection between the first output path and the first termination circuit.

IPC Classes  ?

  • H03H 7/06 - Frequency selective two-port networks including resistors
  • H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
  • H03H 7/46 - Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source

48.

Reduced Gate Drive for Power Converter with Dynamically Switching Ratio

      
Application Number 17960712
Status Pending
Filing Date 2022-10-05
First Publication Date 2024-04-11
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor
  • Routledge, Antony Christopher
  • Vangara, Satish Kumar

Abstract

Circuits and methods for selectable conversion ratio power converters that include low-dropout (LDO) power supplies adapted to select voltage inputs based on the selected conversion ratio while achieving high efficiency. The LDO power supplies limit current through power FETs of power converters, thereby mitigating or eliminating potentially damaging events. In some embodiments, first and second full gate-drive LDOs have “wired-OR” outputs which may power a target circuit such as a pre-driver (and optionally, a level-shifter) coupled to the gate of a power FET. In some embodiments, first and second reduced gate-drive LDOs have “wired-OR” outputs that may power a final driver coupled to the gate of a power FET. Some embodiments have dual full gate-drive LDOs that power a target circuit such as a pre-driver (and optionally, a level-shifter), while dual reduced gate-drive LDOs that power a final driver coupled to the gate of the power FET.

IPC Classes  ?

  • H02M 3/157 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
  • H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion

49.

CPAP DEVICE

      
Application Number 18474550
Status Pending
Filing Date 2023-09-26
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Konishi, Yoshiro
  • Inaba, Keisuke

Abstract

A CPAP device includes a main unit including a first electric circuit including a blower and a connection terminal connected to the first electric circuit, and a base unit connectable to the main unit, including a blower tube, a second electric circuit different from the first electric circuit, and a connection terminal connected to the second electric circuit. The main unit has a first electrical connection portion including an exposed portion of the connection terminal and a first peripheral portion surrounding the first electrical connection portion. The base unit has a second electrical connection portion including an exposed portion of the connection terminal and a second peripheral portion surrounding the second electrical connection portion.

IPC Classes  ?

  • A61M 16/00 - Devices for influencing the respiratory system of patients by gas treatment, e.g. mouth-to-mouth respiration; Tracheal tubes
  • A61M 16/16 - Devices to humidify the respiration air

50.

CPAP DEVICE

      
Application Number 18480041
Status Pending
Filing Date 2023-10-03
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Inaba, Keisuke

Abstract

A CPAP device includes a main unit including an inlet, an outlet, and a first electric circuit including a blower; and a base unit, to which the main unit is attachable, including an outlet, an inlet, a blower tube, and a second electric circuit different from the first electric circuit. The main unit has a lower wall, and the lower wall has multiple connection terminals connected to the first electric circuit. The base unit has an upper wall, and the upper wall has multiple connection terminals connected to the second electric circuit. The multiple connection terminals and the multiple connection terminals are disposed side by side in a direction substantially parallel to a direction in which the lower wall and the upper wall face each other. One of the multiple connection terminals and the multiple connection terminals includes a biasing force generation member that generates biasing force.

IPC Classes  ?

  • A61M 16/00 - Devices for influencing the respiratory system of patients by gas treatment, e.g. mouth-to-mouth respiration; Tracheal tubes
  • A61M 16/16 - Devices to humidify the respiration air

51.

ANTENNA MODULE, COMMUNICATION DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING ANTENNA MODULE

      
Application Number 18480541
Status Pending
Filing Date 2023-10-04
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Kinugawa, Kouta
  • Kasuya, Atsushi
  • Yokoyama, Michiharu
  • Onaka, Kengo

Abstract

An antenna module includes an antenna substrate and a feed circuit. The antenna substrate has an upper surface and a lower surface, and a radiating element having a flat plate shape is arranged in the antenna substrate. The feed circuit 105 is mounted on the lower surface of the antenna substrate and supplies a radio frequency signal to the radiating element. The antenna substrate includes a dielectric substrate on which the radiating element is arranged, a ground electrode, a feed wiring, and carbides. The ground electrode is arranged between the radiating element and the lower surface in the dielectric substrate. The feed wiring transmits the radio frequency signal supplied from the feed circuit to the radiating element. The carbides are disposed on at least a part of a side surface connecting the upper surface and the lower surface in the dielectric substrate.

IPC Classes  ?

  • H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
  • H01Q 9/04 - Resonant antennas

52.

METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE

      
Application Number 18483980
Status Pending
Filing Date 2023-10-10
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Iihola, Antti
  • Lindroos, Jeanette

Abstract

A method is provided for sealing and contacting a microelectromechanical device that includes a silicon device wafer with MEMS device structures and a cap wafer with an electrical circuit. The device wafer includes a sealing region and an interconnection region. Moreover, the cap wafer includes a corresponding sealing region and an interconnection region. Layers of eutectic metal alloy material are deposited on the sealing and the interconnection regions of the device wafer and the cap wafer. The cap wafer is bonded to the device wafer so that the interconnection region of the device wafer is aligned with the interconnection region of the cap wafer and the sealing region of the device wafer is aligned with the sealing region of the cap wafer.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81B 7/00 - Microstructural systems

53.

DISPLACEMENT DETECTION DEVICE AND METHOD

      
Application Number 18536530
Status Pending
Filing Date 2023-12-12
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Watabe, Yuuma
  • Asada, Takaaki
  • Sasaki, Shinichi

Abstract

A displacement detection device includes a transmitter, a receiver, and a controller configured or programmed to output a first transmission signal to the transmitter to transmit a modulated wave and acquire a responsive first reception signal in a first measurement period, extract first phase information indicating a phase defined in a correlation between a first transmission signal and a reception signal, output a second transmission signal to the transmitter and acquire a responsive second reception signal in a second measurement period after the first measurement period, extract second phase information indicating a phase defined in a correlation between the second transmission signal and reception signal, and detect a displacement of an object between the first and second measurement periods, depending on a difference between the first and second phase information.

IPC Classes  ?

  • G01S 15/62 - Sense-of-movement determination
  • G01S 7/524 - Transmitters
  • G01S 7/53 - Means for transforming co-ordinates or for evaluating data, e.g. using computers

54.

BATTERY PACK

      
Application Number 18538017
Status Pending
Filing Date 2023-12-13
First Publication Date 2024-04-11
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor Bannai, Yoshiyuki

Abstract

A battery pack includes a plurality of batteries, an isolating member that is arranged between the plurality of batteries and isolates the plurality of batteries from each other, and a heat absorbing agent that is housed inside the isolating member. The isolating member has a first housing space for housing the heat absorbing agent, and contains an amorphous engineering plastic. In addition, the isolating member has a first thin portion having a locally thin wall thickness in at least a part of a region where the first housing space faces each of the plurality of batteries.

IPC Classes  ?

  • H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
  • H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
  • H01M 50/291 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
  • H01M 50/293 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
  • H01M 50/383 - Flame arresting or ignition-preventing means

55.

SOLID ELECTROLYTIC CAPACITOR ELEMENT AND SOLID ELECTROLYTIC CAPACITOR

      
Application Number 18539769
Status Pending
Filing Date 2023-12-14
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Tamatani, Yasuhiro
  • Kusuda, Kazuya

Abstract

A solid electrolytic capacitor element that includes: a valve acting metal substrate having a dielectric layer thereon; an insulating mask layer on the dielectric layer and separating the valve acting metal substrate into positive and negative electrode portions; a solid electrolyte layer on the dielectric layer, a tip of the solid electrolyte layer covering an outer surface of the insulating mask layer; a carbon layer on the solid electrolyte layer, a tip of the carbon layer covering a same position as the tip of the solid electrolyte layer or a position closer to the negative electrode portion; and a negative conductor layer on the carbon layer, a tip of the negative conductor layer covering a position closer to the negative electrode portion, and wherein the negative electrode portion has a negative conductor layer-non-formed region where the negative conductor layer does not cover a part of the carbon layer.

IPC Classes  ?

56.

FILTER DEVICE, ANTENNA DEVICE, AND ANTENNA MODULE

      
Application Number 18391743
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Tachibana, Shinya

Abstract

A filter device includes first and second terminals, a first inductor located between the first and second terminals, and an LC series resonator connected in parallel to the first inductor and including a first capacitor and a second inductor. The first and second inductors are magnetically coupled to each other. An inductance of the first inductor is smaller than an inductance of the second inductor.

IPC Classes  ?

  • H03H 7/01 - Frequency selective two-port networks
  • H01Q 1/50 - Structural association of antennas with earthing switches, lead-in devices or lightning protectors

57.

INDUCTOR

      
Application Number 18453128
Status Pending
Filing Date 2023-08-21
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Shimomura, Yasuo
  • Kobayashi, Takeshi
  • Harada, Kenichi
  • Ishida, Daisuke

Abstract

An inductor including an element body containing metal magnetic powder and resin and having a coil conductor that has a winding portion, an extended portion extended from the winding portion, and an outer electrode connection portion leading to the extended portion and connected to an outer electrode and is embedded in the element body; and an element body coat covering a surface of the element body. The outer electrode is formed on a surface of the element body and connected to the outer electrode connection portion, in which the outer electrode connection portion has a region covered with the element body coat and a region connected to the outer electrode on the surface of the element body.

IPC Classes  ?

58.

SINTERED BODY

      
Application Number 18535025
Status Pending
Filing Date 2023-12-11
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Kobayashi, Eigo

Abstract

A sintered body that includes: a spinel ferrite oxide having a main constituent of metal elements of Fe, Ni, Cu, and Zn; and Zr, Mn, Al, Co, and Cr. Wherein, when Zn, Ni, Cu, Zr, Mn, Al, Co, and Cr have a contained mole part: “a”, “b”, “c”, “d”, “e”, “f”, “g”, and “h”, respectively, and based on Fe being 100 mole parts: 49.0<100−a−b−c+2d+(1/2)e<50.0, 50.2

IPC Classes  ?

  • C04B 35/26 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
  • H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites

59.

OBJECT DETECTION DEVICE AND METHOD

      
Application Number 18537871
Status Pending
Filing Date 2023-12-13
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Watabe, Yuuma
  • Asada, Takaaki
  • Sasaki, Shinichi

Abstract

An object detection device includes a wave transmitter to transmit a sound wave to an object, a wave receiver to receive the sound wave and generate a signal representing a reception result, and a controller to control transmission of the sound wave by the wave transmitter and obtain the receive signal from the wave receiver. The controller is configured or programmed to output a transmit signal to cause the wave transmitter to transmit the sound wave and obtain a corresponding receive signal. The controller is configured or programmed to generate detection information about the object by performing complexification on a correlation signal representing a correlation between the transmit signal and the receive signal. A signal corrector is configured or programmed to correct any of the correlation signal, the receive signal, and the transmit signal to mitigate a direct-current component in the correlation signal targeted for the complex analysis.

IPC Classes  ?

  • G01S 7/539 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisation; Target signature; Target cross-section
  • G01S 7/52 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
  • G01S 15/10 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves

60.

TIRE OBSERVATION APPARATUS

      
Application Number 18542828
Status Pending
Filing Date 2023-12-18
First Publication Date 2024-04-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Innami, Seiji

Abstract

A tire observation apparatus includes a computer and an imaging device including a camera and range sensors positioned at different angles relative to a ground surface. The computer is configured or programmed to calculate a position of a tire relative to the camera by using various distances to the tire calculated by the range sensors. By using the position of the tire, the computer is configured or programmed to calculate an amount of adjustment usable by the imaging device to adjust the position and an angle of the camera such that an imaging center of the camera is directed at a center of the tire or at a surface of the tire that is to be measured.

IPC Classes  ?

  • G06T 7/80 - Analysis of captured images to determine intrinsic or extrinsic camera parameters, i.e. camera calibration
  • G06T 7/00 - Image analysis

61.

COMMUNICATION CIRCUIT AND COMMUNICATION DEVICE

      
Application Number 18471315
Status Pending
Filing Date 2023-09-21
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Ishikawa, Mizuho

Abstract

A communication circuit includes a transmission terminal to which a transmission signal is supplied, a first duplexer that has a transmission node, a reception node, and a common node, a first filter that has a first end part electrically connected to the common node of the first duplexer and a second end part electrically connected to an antenna terminal, a first auxiliary output terminal that outputs the transmission signal to an external circuit, an inductor that is part of a second filter and has a first end part and a second end part that is electrically connected to the first auxiliary output terminal, and a first switch that switches the electrical connection destination of the transmission terminal between the transmission node of the first duplexer and the first end part of the inductor.

IPC Classes  ?

  • H04B 1/00 - TRANSMISSION - Details of transmission systems not characterised by the medium used for transmission

62.

COIL COMPONENT

      
Application Number 18475145
Status Pending
Filing Date 2023-09-26
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yoshida, Natsumi
  • Yoshida, Takashi
  • Nakamura, Yuki
  • Ishida, Takuya

Abstract

A coil component includes a drum core including a winding core portion, and first and second flange portions; and a first metal terminal which includes a bonding portion, a connecting portion, a mounting portion, an extending portion, and a joining portion. The first flange portion includes a main body portion, an end-surface-side protruding portion protruding from an outer end surface of the main body portion and a bottom-surface-side protruding portion protruding from a bottom surface of the main body portion. In a direction parallel to a second axis, a shortest distance from an end of the end-surface-side protruding portion on the second positive direction side to the joining portion is a first distance. A maximum distance from the end of the end-surface-side protruding portion to a side end surface of the end-surface-side protruding portion is a second distance. The first distance is larger than the second distance.

IPC Classes  ?

  • H01F 17/04 - Fixed inductances of the signal type with magnetic core
  • H01F 27/29 - Terminals; Tapping arrangements

63.

COIL COMPONENT

      
Application Number 18475151
Status Pending
Filing Date 2023-09-26
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sagara, Takuma
  • Takahashi, Katsuyuki
  • Nakamoto, Shingo

Abstract

To suppress a decrease in mounting strength of a coil component, a coil component includes a drum core including a winding core portion, and first and second flange portions. The coil component includes a first metal terminal which includes a bonding portion, a connecting portion, and a mounting portion. The bonding portion is bonded to the first flange portion with an adhesive. The mounting portion is closest to the first positive direction side in the first metal terminal and is separated from the first flange portion toward the first positive direction side. The connecting portion connects the bonding and mounting portions. The first flange portion has a facing surface that faces the mounting portion, a bonding surface, and a first inclined surface between the facing and bonding surfaces. The distance from the facing surface increases in a direction parallel to the first axis toward the bonding surface.

IPC Classes  ?

64.

COIL COMPONENT

      
Application Number 18475152
Status Pending
Filing Date 2023-09-26
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Honda, Hiroyuki
  • Ishida, Takuya
  • Ishida, Masayuki
  • Nakamoto, Shingo

Abstract

To suppress deformation of a mounting portion, a coil component includes a drum core including a winding core portion, a first flange portion, and a second flange portion. The coil component includes a first metal terminal. The first metal terminal includes a joining portion, a mounting portion, and an extending portion. A first wire end of the first wire is connected to a surface of the joining portion facing a first positive direction. The mounting portion is located closest to the first positive direction in the first metal terminal. The extending portion connects the mounting portion and the joining portion. The extending portion includes a second portion having a thickness dimension smaller than the thickness dimension of the mounting portion.

IPC Classes  ?

65.

DOHERTY AMPLIFIER CIRCUIT

      
Application Number 18476773
Status Pending
Filing Date 2023-09-28
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Imai, Shohei

Abstract

A Doherty amplifier circuit includes a carrier amplifier including one or more amplifiers, and a peaking amplifier including one or more amplifiers. At least one of the amplifiers includes a transistor and a feedback circuit. The transistor receives, at its base or gate, a radio frequency signal and a bias voltage or current which changes, and outputs an amplified radio frequency signal from its collector or drain. The feedback circuit provides, to the base or gate or the emitter or source of the transistor, a voltage or a current based on the amplified radio frequency signal.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation

66.

ACOUSTIC WAVE DEVICE

      
Application Number 18528843
Status Pending
Filing Date 2023-12-05
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Kimura, Tetsuya

Abstract

An acoustic wave device includes a support substrate with a thickness in a first direction, an intermediate layer on the support substrate, a piezoelectric layer on the intermediate layer, and an IDT electrode including a first electrode finger at the piezoelectric layer in the first direction and extending in a second direction intersecting the first direction, a first busbar electrode connected to the first electrode finger, a second electrode finger facing the first electrode finger in a third direction orthogonal or substantially orthogonal to the second direction and extending in the second direction, and a second busbar electrode connected to the second electrode finger. The intermediate layer includes a void portion at least partially overlapping the IDT electrode in plan view, and a surface roughness of an inner sidewall of the intermediate layer is about 0.0055 μm or more.

IPC Classes  ?

  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials

67.

COIL COMPONENT

      
Application Number 18529883
Status Pending
Filing Date 2023-12-05
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sukegawa, Takashi
  • Itani, Yasuhiro
  • Suzuki, Takanori
  • Kitadai, Yuuki
  • Maki, Yoshifumi
  • Matsuba, Reiichi

Abstract

A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).

IPC Classes  ?

  • H01F 17/04 - Fixed inductances of the signal type with magnetic core
  • H01F 27/02 - Casings
  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 27/29 - Terminals; Tapping arrangements
  • H01F 27/30 - Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 41/06 - Coil winding

68.

SUPERCAPACITORS, AND METHODS OF THEIR MANUFACTURE

      
Application Number 18532419
Status Pending
Filing Date 2023-12-07
First Publication Date 2024-04-04
Owner
  • Murata Manufacturing Co., Ltd. (Japan)
  • Commissariat A L'Energie Atomique Et Aux Energies Alternatives (France)
Inventor
  • Oukassi, Sami
  • Sallaz, Valentin
  • Voiron, Frédéric

Abstract

A supercapacitor that includes: a first electrode; a second electrode; and a composite solid electrolyte disposed between the first electrode and the second electrode. The composite solid electrolyte includes a dielectric matrix and an ionic conductor disposed in channels/pores in the dielectric matrix. Methods of fabricating such supercapacitors are also disclosed.

IPC Classes  ?

  • H01G 11/56 - Solid electrolytes, e.g. gels; Additives therein
  • H01G 11/06 - Hybrid capacitors with one of the electrodes allowing ions to be reversibly doped thereinto, e.g. lithium ion capacitors [LIC]
  • H01G 11/50 - Electrodes characterised by their material specially adapted for lithium-ion capacitors, e.g. for lithium-doping or for intercalation
  • H01G 11/84 - Processes for the manufacture of hybrid or EDL capacitors, or components thereof

69.

ACOUSTIC WAVE DEVICE

      
Application Number 18537872
Status Pending
Filing Date 2023-12-13
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Nagatomo, Sho

Abstract

An acoustic wave device includes a piezoelectric material layer, and an IDT electrode on the piezoelectric material layer and including first electrode fingers and second electrode fingers arranged periodically. The electrode fingers each include at least one electrode layer including at least one of Nb, Pd, or Ni. A sum of thicknesses of the at least one electrode layer, calculated assuming that the electrode layer(s) includes Mo and based on a density ratio between the electrode layer(s) and Mo, is at least about 10% of a spatial period of the electrode fingers.

IPC Classes  ?

  • H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
  • H03H 9/25 - Constructional features of resonators using surface acoustic waves

70.

ACOUSTIC WAVE DEVICE

      
Application Number 18540949
Status Pending
Filing Date 2023-12-15
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Kimura, Tetsuya

Abstract

An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support substrate, a space overlapping at least a portion of the piezoelectric layer, and a functional electrode on the piezoelectric layer. The support includes a space at a position at least partially overlapping the functional electrode in plan view. The functional electrode includes a first metal layer and a second metal layer on at least a portion of the first metal layer. A linear expansion coefficient of the second metal layer is smaller than a linear expansion coefficient of the first metal layer.

IPC Classes  ?

  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details

71.

COIL COMPONENT

      
Application Number 18365713
Status Pending
Filing Date 2023-08-04
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ono, Kouta
  • Matsuura, Kouhei
  • Sato, Tomoyuki

Abstract

A coil component includes an element body including a multilayer body in which a first ferrite layer, a first glass layer, and a second ferrite layer are laminated in that order; a coil embedded in the first glass layer; and an outer electrode provided on an outer surface of the element body and electrically connected to the coil. The first glass layer includes regions in which Cu and Mg coexist.

IPC Classes  ?

72.

AMPLIFIER MODULE AND COMMUNICATION APPARATUS

      
Application Number 18471337
Status Pending
Filing Date 2023-09-21
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Tahara, Kenji
  • Yamamoto, Kae

Abstract

An amplifier module includes an antenna that includes four power feed points, and four power amplifiers. Output ends of the four power amplifiers are connected to the four power feed points in a one-to-one relationship. The four power feed points are arranged rotationally symmetrically around a center of the antenna when a main surface of the antenna is viewed in plan.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
  • H03F 3/60 - Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators

73.

RADIO-FREQUENCY CIRCUIT

      
Application Number 18474232
Status Pending
Filing Date 2023-09-26
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Ohmae, Yuki

Abstract

A power amplifier circuit and an LC circuit are included. The power amplifier circuit amplifies a radio frequency signal by switching between the first mode, in which power is amplified by using the envelope tracking system, and the second mode, in which power is amplified by using the average power tracking system. The LC circuit is connected, at its first end, to the power supply path of the power amplifier circuit and that is grounded, at its second end, through a switch circuit. The LC circuit includes a first capacitor and an inductor that is connected in series to the first capacitor. The switch circuit is controlled to be switched off in the first mode and is controlled to be switched on in the second mode.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/19 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only

74.

AMPLIFIER MODULE

      
Application Number 18477992
Status Pending
Filing Date 2023-09-29
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Shimamoto, Kenichi

Abstract

An amplifier module includes an input terminal; a first preamplifier formed in or on a first substrate and configured to amplify a signal that is input to the input terminal; a first postamplifier and a second postamplifier that are formed in or on a second substrate and that are configured to receive an output of the first preamplifier and output a differential signal; an output balun configured to receive the differential signal that is output from the first postamplifier and the second postamplifier; and a variable capacitance element. The output balun includes a primary winding subjected to the differential signal and a secondary winding, and the variable capacitance element is connected in parallel with the primary winding of the output balun.

IPC Classes  ?

  • H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
  • H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
  • H03F 3/45 - Differential amplifiers

75.

AMPLIFIER CIRCUIT AND RADIO FREQUENCY CIRCUIT

      
Application Number 18528810
Status Pending
Filing Date 2023-12-05
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Tahara, Kenji
  • Yamamoto, Kae
  • Sukemori, Yoshiaki

Abstract

An amplifier circuit includes amplifiers, transformers, and a transmission line. A first end of an input-side coil is connected to an output terminal of the amplifier, a second end of the input-side coil is connected to an output terminal of the amplifier via the transmission line, a first end of an input-side coil is connected to an output terminal of the amplifier, a second end of the input-side coil is connected to the output terminal of the amplifier via the transmission line, a first end of an output-side coil is connected to an output terminal, a second end of the output-side coil is connected to a ground, a first end of an output-side coil is connected to an output terminal, and a second end of the output-side coil is connected to the ground.

IPC Classes  ?

  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
  • H03F 3/66 - Amplifiers simultaneously generating oscillations of one frequency and amplifying signals of another frequency

76.

ELECTRONIC COMPONENT

      
Application Number 18536992
Status Pending
Filing Date 2023-12-12
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ooshima, Tomoya
  • Hoshino, Yuuta
  • Yamada, Koichi
  • Sasaki, Miki

Abstract

An electronic component that includes: a base body having an outer surface defining a recess with an inner surface, wherein, when the recess is viewed in a direction orthogonal to the outer surface, at least a part of an outer edge of the recess is curved, and when the recess is viewed in a section orthogonal to the outer surface, at least a part of the inner surface of the recess is curved; a wiring inside the base body; and a glass film covering the outer surface of the base body and not covering the inner surface of the recess.

IPC Classes  ?

  • H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C 1/14 - Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
  • H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient

77.

ACOUSTIC WAVE DEVICE

      
Application Number 18537870
Status Pending
Filing Date 2023-12-13
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Omura, Masashi

Abstract

An acoustic wave device includes a support, a piezoelectric layer with an anisotropic coefficient of linear expansion, and including first and second main surfaces, at least one through-hole, a first electrode in or on the first main surface, and a second electrode in or on the second main surface and opposed to the first electrode. A cavity is provided in the support. At least a portion of the first and second electrodes overlaps the cavity in plan view. In plan view, the at least one through-hole is line symmetric about an axis of symmetry that passes a center of the cavity in a region where the first and second electrodes overlap each other and that extends in a direction in which the coefficient of linear expansion of the piezoelectric layer is greatest.

IPC Classes  ?

  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials

78.

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

      
Application Number 18538304
Status Pending
Filing Date 2023-12-13
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ito, Takanori
  • Kita, Terumichi
  • Takayanagi, Shinichiro
  • Tanoue, Yuudai
  • Iwanaga, Minoru

Abstract

In a high frequency module, a plurality of filters is connected to an antenna terminal with a switch interposed. The plurality of filters includes a first filter that has a pass band including a frequency band of a first communication band and a second filter that has a pass band including a frequency band of a second communication band that is capable of simultaneous communication with the first communication band. A first electronic component having the first filter and a second antenna end resonator of the second filter is disposed on a first principal surface of the mounting substrate. A second electronic component having at least one second acoustic wave resonator other than a second antenna end resonator of the second filter is disposed on the first principal surface of the mounting substrate.

IPC Classes  ?

  • H04L 5/14 - Two-way operation using the same type of signal, i.e. duplex
  • H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
  • H03H 9/25 - Constructional features of resonators using surface acoustic waves
  • H03H 9/64 - Filters using surface acoustic waves

79.

MULTI-PORT FILTER USING TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATORS

      
Application Number 18538939
Status Pending
Filing Date 2023-12-13
First Publication Date 2024-04-04
Owner MURATA MANUFACTURING CO., LTD (Japan)
Inventor
  • Guyette, Andrew
  • Fenzi, Neal
  • Turner, Patrick

Abstract

Filter devices and methods are disclosed. A single-crystal piezoelectric plate is attached to substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate. A conductor pattern formed on the piezoelectric plate defines a low band filter including low band shunt resonators and low band series resonators and a high band filter including high band shunt resonators and high band series resonators. Interleaved fingers of interdigital transducers (IDTs) of the low band shunt resonators are disposed on respective diaphragms having a first thickness, interleaved fingers of IDTs of the high band series resonators are disposed on respective diaphragms having a second thickness less than the first thickness, and interleaved fingers of IDTs of the low band series resonators and the high band shunt resonators are disposed on respective diaphragms having thicknesses intermediate the first thickness and the second thickness.

IPC Classes  ?

  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
  • H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/56 - Monolithic crystal filters

80.

ANTENNA MODULE AND COMMUNICATION DEVICE INCLUDING THE SAME

      
Application Number 18539314
Status Pending
Filing Date 2023-12-14
First Publication Date 2024-04-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Onaka, Kengo
  • Komura, Ryo
  • Mori, Hirotsugu

Abstract

An antenna module including a dielectric substrate having a long side and a short side, a ground electrode, a radiating element, a peripheral electrode, and a parasitic element. The radiating element is disposed to face the ground electrode. The peripheral electrode is disposed along the long side of the dielectric substrate and is electrically connected to the ground electrode. The parasitic element is disposed along the short side of the dielectric substrate and is disposed away from the radiating element. The radiating element is configured to emit radio waves in two polarization directions along the long side and the short side of the dielectric substrate. The shortest distance between the radiating element and the parasitic element is greater than the shortest distance between the radiating element and the peripheral electrode.

IPC Classes  ?

  • H01Q 9/04 - Resonant antennas
  • H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
  • H01Q 1/48 - Earthing means; Earth screens; Counterpoises
  • H01Q 5/378 - Combination of fed elements with parasitic elements

81.

Supply generator and associated control methods

      
Application Number 18180886
Grant Number 11949383
Status In Force
Filing Date 2023-03-09
First Publication Date 2024-04-02
Grant Date 2024-04-02
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Perreault, David J.
  • Garrett, James
  • Pakala, Sri Harsh
  • Metzner, Brendan
  • Duzevik, Ivan
  • Hoversten, John R.
  • Tkachenko, Yevgeniy A.

Abstract

Described are concepts, circuits, systems and techniques directed toward N-phase control techniques useful in the design and control of supply generators configured for use in a wide variety of power management applications including, but not limited to mobile applications.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only

82.

BATTERY PACK

      
Application Number 18226976
Status Pending
Filing Date 2023-07-27
First Publication Date 2024-03-28
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor Bannai, Yoshiyuki

Abstract

To provide a battery pack including a heat-absorbing member capable of suppressing permeation of a heat-absorbing agent. A battery pack includes a secondary battery and a heat-absorbing member that includes a heat-absorbing agent and an exterior member accommodating the heat-absorbing agent and is in contact with the secondary battery at least in part, wherein the exterior member includes a metal layer, a resin layer overlapping the metal layer, and a sealing portion sealing the heat-absorbing agent, the metal layer is located inside the exterior member, and the metal layers are joined to each other at the sealing portion.

IPC Classes  ?

  • H01M 10/6555 - Rods or plates arranged between the cells
  • H01M 10/613 - Cooling or keeping cold
  • H01M 10/643 - Cylindrical cells
  • H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
  • H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic

83.

COIL COMPONENT

      
Application Number 18365855
Status Pending
Filing Date 2023-08-04
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sato, Kozo
  • Ohba, Yuichi

Abstract

A coil component having improved magnetic characteristics. The coil component includes a body having a substantially hexahedral shape and including a winding portion formed by winding a conductive wire based on a winding axis and a magnetic body portion; and paired metal terminals having joint portions to which first and second ends of the conductive wire are electrically connected. Each of the paired metal terminals extends outside an outer surface of the body parallel to the winding axis. Of four quadrants separated from one another by imaginary coordinate axes that are orthogonal to one another with the center of the body as the origin in plan view in the winding axis direction, more than half the area of one of the joint portions is disposed in a quadrant not adjacent to the quadrant in which more than half the area of the other joint portion is disposed.

IPC Classes  ?

84.

MULTIPLEXER

      
Application Number 18370645
Status Pending
Filing Date 2023-09-20
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Ozasa, Motoki

Abstract

A multiplexer includes a common terminal, an inductor including a first end connected to the common terminal and a second end, a filter connected to the second end and having a first pass band, a filter connected to the common terminal and having a second pass band located on a higher frequency side relative to the first pass band, an inductor connected between a ground and a path that links the second end to the filter, and a capacitor connected between the path and the ground. A resonant frequency of an LC parallel resonance circuit including the inductor and the capacitor is located between the first pass band and the second pass band.

IPC Classes  ?

  • H03H 9/64 - Filters using surface acoustic waves
  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
  • H03H 9/54 - Filters comprising resonators of piezoelectric or electrostrictive material

85.

CONVERTER APPARATUS AND CONTROL METHOD

      
Application Number 18370694
Status Pending
Filing Date 2023-09-20
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Chan, Chukhung

Abstract

A method of controlling a converter apparatus operable based on a first frequency modulation control signal and at least one second frequency modulation control signal, includes determining updated periods of the first frequency modulation control signal and the at least one second frequency modulation control signal based on the output, for each second frequency modulation control signal, at a beginning of each period of the first frequency modulation control signal, determining a phase shift of the second frequency modulation control signal relative to the first frequency modulation control signal, when a difference between the phase shift and a target phase shift exceeds a predetermined threshold, determining the period of the second frequency modulation control signal as the updated period increased or decreased by a predetermined amplitude, otherwise determining the period of the second frequency modulation control signal as the updated period.

IPC Classes  ?

  • H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
  • H02M 3/156 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators

86.

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

      
Application Number 18383550
Status Pending
Filing Date 2023-10-25
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Okuda, Noriaki

Abstract

A multilayer substrate includes a multilayer body including first insulator layers and a second insulator layer stacked on each other. The multilayer body includes first and second regions when viewed in a stacking direction. The first region is a region that does not include the second insulator layer when viewed in the stacking direction. The second region is a region that includes the second insulator layer when viewed in the stacking direction. The first insulator layers include a small-area first insulator layer located in the first region and not located in the second region. The small-area first insulator layer overlaps the second insulator layer when viewed in a first direction. A porosity of the second insulator layer is higher than an overall porosity of the first insulator layers.

IPC Classes  ?

87.

CIRCUIT MODULE AND SUBSTRATE MODULE

      
Application Number 18469479
Status Pending
Filing Date 2023-09-18
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sugiyama, Tomohiko
  • Takashima, Junichi
  • Nakagawa, Takuya
  • Suzuki, Mayu
  • Nakashima, Daisuke

Abstract

A circuit module comprises a substrate module, an electronic component, and a first conductive joining member. The substrate module includes a circuit substrate having an upper main surface and a lower main surface, an insulating member covering the upper main surface of the circuit substrate, an insulating member covering the upper main surface of the circuit substrate, and a first metal pin that passes through the insulating member parallel to a vertical axis and is electrically connected to the circuit substrate. The first metal pin has a first exposed portion. The first exposed portion is exposed from the insulating member to face a right direction. A first outer electrode has a left projecting portion projecting in a left direction from the left surface. A first conductive joining member joins the first exposed portion and the left projecting portion to each other.

IPC Classes  ?

  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components

88.

CIRCUIT BOARD AND ELECTRONIC COMPONENT

      
Application Number 18525949
Status Pending
Filing Date 2023-12-01
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Matsuda, Kenji

Abstract

A circuit board includes a substrate, a first mounting conductor, a first ground conductor, a first floating conductor, a signal line conductor, and a connection conductor. The first mounting conductor is on a surface of the substrate and includes a first external connection conductor. The first ground conductor is positioned on the substrate opposite to the first mounting conductor. The floating conductor is between the first mounting conductor and the first ground conductor. The signal line conductor is inside the substrate. The connection conductor connects the first mounting conductor and the signal line conductor. When viewed in a thickness direction of the substrate, the signal line conductor and the connection conductor are each provided at a position different from the first external connection conductor, and the floating conductor overlaps an entirety or substantially an entirety of the first external connection conductor.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components

89.

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

      
Application Number 18527826
Status Pending
Filing Date 2023-12-04
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Takayanagi, Shinichiro
  • Kita, Terumichi
  • Ito, Takanori

Abstract

The deterioration in characteristics of a filter is reduced. In a high frequency module, the filter includes a first substrate, a first functional electrode provided on the first substrate and forming a part of an antenna end resonator, a second substrate separate from the first substrate, and a second functional electrode provided on the second substrate and forming a part of at least one acoustic wave resonator other than the antenna end resonator among a plurality of acoustic wave resonators. A first electronic component including the first substrate and the first functional electrode is disposed on the first main surface of the mounting substrate. An inductor is adjacent to the first electronic component in a plan view from a thickness direction of the mounting substrate. The inductor does not overlap the antenna end resonator in a side view from a direction of a winding axis of a winding portion.

IPC Classes  ?

90.

ALIGNMENT DEVICE AND METHOD OF FORMING EXTERNAL ELECTRODE

      
Application Number 18533265
Status Pending
Filing Date 2023-12-08
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Shimizu, Yasuhiro

Abstract

An alignment device includes a pallet including a flat plate portion and a lateral wall portion defining an alignment area to which chips are supplied, recessed portions defining holding positions in the alignment area to hold the chips in an alignment state, a supply port defined by a portion of the lateral wall portion being open and allowing the chips to be supplied into the alignment area from outside of the lateral wall portion, and a magnet defining a moving holder at least at either one of the flat plate portion or the lateral wall portion to cause each of the chips supplied from the supply port to the alignment area to move to a corresponding one of the recessed portions and hold each of the chips at a corresponding one of the recessed portions.

IPC Classes  ?

  • H01G 13/00 - Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups
  • H01G 4/012 - Form of non-self-supporting electrodes

91.

CASE AND SEAL

      
Application Number 18534792
Status Pending
Filing Date 2023-12-11
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Shimizu, Yasuhiro
  • Nakagawa, Kiyoyuki

Abstract

A case includes a case body including an accommodation space to accommodate electronic components and a discharge port to discharge the electronic components accommodated in the accommodation space, a shutter slidable relative to the case body to open and close the discharge port, a slider integral with the shutter to perform a slide operation of the shutter, and an operation opening in the case body to expose the slider to outside to allow for operation of the slider. A seal including a portion that covers and seals at least the operation opening is attachable to the case body.

IPC Classes  ?

  • H05K 5/00 - Casings, cabinets or drawers for electric apparatus
  • H05K 5/02 - Casings, cabinets or drawers for electric apparatus - Details
  • H05K 13/02 - Feeding of components

92.

ANTENNA MODULE AND COMMUNICATION DEVICE EQUIPPED WITH THE ANTENNA MODULE

      
Application Number 18536241
Status Pending
Filing Date 2023-12-12
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Gouchi, Naoki
  • Komura, Ryo

Abstract

An antenna module has a substrate, a radiating element disposed in or on the substrate, a power feeding line, and a dielectric body. The substrate has a rectangular shape including first and second sides adjacent to each other. The power feeding line extends in a normal direction of the substrate and transfers radio frequency signals supplied from an RFIC to the radiating element. The dielectric body is disposed on a side surface of the substrate. The power feeding line is coupled to the radiating element at a position offset from the center of the radiating element in a first direction toward the first side. The dielectric body is disposed so as to cover the side surface of the substrate including the first side. The dielectric constant of the dielectric body is higher than the dielectric constant of the substrate.

IPC Classes  ?

  • H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
  • H01Q 9/04 - Resonant antennas
  • H01Q 21/00 - Antenna arrays or systems
  • H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction

93.

HIGH FREQUENCY CIRCUIT AND COMMUNICATION APPARATUS

      
Application Number 18346897
Status Pending
Filing Date 2023-07-05
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Takematsu, Yuji

Abstract

A high frequency circuit includes a power amplifier and a matching circuit connected to an output terminal of the power amplifier. The matching circuit includes an inductor connected in series to an output transmission path of the power amplifier, a capacitor connected in series to and between one end of the inductor and the ground, an inductor connected in series to and between the capacitor and the ground, a switch having a common terminal, a selection terminal, and a selection terminal, a capacitor connected in series to and between the common terminal and the one end of the inductor. The selection terminal is connected to the ground, and the selection terminal is connected to the other end of the inductor.

IPC Classes  ?

  • H04B 1/04 - Circuits
  • H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

94.

ACOUSTIC WAVE DEVICE

      
Application Number 18371046
Status Pending
Filing Date 2023-09-21
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Yamane, Takashi

Abstract

An acoustic wave device includes a monocrystalline spinel substrate made of a magnesium aluminate single crystal, a piezoelectric layer on the monocrystalline spinel substrate, and an IDT electrode on the piezoelectric layer. Euler angles (ϕ, θ, ψ) of the magnesium aluminate single crystal of the monocrystalline spinel substrate are within a range of any of regions A in FIGS. 5 to 41.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details

95.

MULTILAYER COIL COMPONENT

      
Application Number 18469594
Status Pending
Filing Date 2023-09-19
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Yamada, Shoyo

Abstract

A multilayer coil component includes a multilayer body and outer electrodes. The multilayer body includes insulating layers and a coil. The insulating layers are stacked on top of one another in a stacking direction. The coil is embedded in the multilayer body. The outer electrodes are on an outer surface of the multilayer body and are electrically connected to the coil. The coil includes coil conductors, which are stacked together with the insulating layers in the stacking direction and electrically connected to each other. The coil includes a parallel section in which two or more of the coil conductors stacked in layers are electrically connected in parallel by via conductors interposed therebetween. The parallel section includes a first parallel section and a second parallel section, which is electrically connected in series with the first parallel section.

IPC Classes  ?

  • H01F 27/32 - Insulating of coils, windings, or parts thereof
  • H01F 17/00 - Fixed inductances of the signal type

96.

RADIO FREQUENCY MODULE AND COMMUNICATION APPARATUS

      
Application Number 18496304
Status Pending
Filing Date 2023-10-27
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Kitajima, Hiromichi
  • Uejima, Takanori
  • Matsumoto, Naoya

Abstract

A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a connection terminal, and a wiring layer. The second electronic component is disposed on the second main surface of the mounting substrate. The connection terminal is disposed on the second main surface of the mounting substrate and is connected to the mounting substrate and the wiring layer. The wiring layer faces the second main surface of the mounting substrate with the second electronic component interposed therebetween and is in contact with the connection terminal. The wiring layer has a base material and an external connection electrode. The base material has a second conductive member connected to the first conductive member of the mounting substrate with the connection terminal interposed therebetween. The external connection electrode is connected to the second conductive member. The wiring layer is in contact with the second electronic component.

IPC Classes  ?

  • H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
  • H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
  • H01L 23/498 - Leads on insulating substrates
  • H01L 23/552 - Protection against radiation, e.g. light
  • H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits

97.

ELECTROLYTIC SOLUTION FOR SECONDARY BATTERY, AND SECONDARY BATTERY

      
Application Number 18510854
Status Pending
Filing Date 2023-11-16
First Publication Date 2024-03-28
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor Ihara, Masayuki

Abstract

A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The electrolytic solution includes an electrolyte salt and a lithium fluorophosphate. The electrolyte salt includes an imide anion, and the imide anion includes at least one of an anion represented by Formula (1), an anion represented by Formula (2), an anion represented by Formula (3), or an anion represented by Formula (4). The lithium fluorophosphate includes lithium monofluorophosphate, lithium difluorophosphate, or both.

IPC Classes  ?

  • H01M 10/0568 - Liquid materials characterised by the solutes
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
  • H01M 10/0569 - Liquid materials characterised by the solvents

98.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18524673
Status Pending
Filing Date 2023-11-30
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Kitahara, Keita
  • Saito, Yuta
  • Ookawa, Noriyuki
  • Akazawa, Riyousuke
  • Takahashi, Takefumi
  • Wakashima, Masahiro
  • Kurosu, Yuta
  • Mori, Akito

Abstract

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, base electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers and each including glass and copper, and plated layers respectively provided on an outer side of the base electrode layers. A protective layer including sulfur is provided between the glass included in the base electrode layers and the plated layers.

IPC Classes  ?

  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/008 - Selection of materials
  • H01G 4/12 - Ceramic dielectrics
  • H01G 4/30 - Stacked capacitors

99.

WIRELESS POWER TRANSMISSION SYSTEM AND POWER RECEIVER

      
Application Number 18528334
Status Pending
Filing Date 2023-12-04
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Saeki, Hiromasa

Abstract

A wireless power transmission system includes a structure surrounded as a whole by an electromagnetic wave-shielding member having an appropriate conductivity, at least one power transmission unit, and at least one power reception unit. A power reception unit includes a power receiver including a dielectric substrate, a rectifier circuit, and a power reception antenna. The power reception antenna includes power reception antenna lines in a same plane on the dielectric substrate. One ends of the power reception antenna lines are connected to the rectifier circuit, and other ends different from the one ends connected to the rectifier circuit are open ends. A planar shape of the dielectric substrate is a 2N-sided polygon with line symmetry (where N is an integer of two or more), and the power reception antenna lines are along N sides that are adjacent to and different from each other of the dielectric substrate.

IPC Classes  ?

  • H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
  • H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power
  • H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices

100.

RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE

      
Application Number 18530266
Status Pending
Filing Date 2023-12-06
First Publication Date 2024-03-28
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ono, Atsushi
  • Mori, Hirotsugu
  • Yagura, Yoshiki
  • Sakano, Kiwamu
  • Noguchi, Akira

Abstract

A first receiving band and a first transmission band in band A and a second transmission band and a second receiving band in band B are listed in frequency order. A radio frequency module includes: first and second boards; a first filter having a passband that is the first transmission band; second and sixth filters each having a passband that is the first receiving band; third and fifth filters each having a passband that is the second receiving band; a first power amplifier connected to the first filter; a fourth filter having a passband that is the second transmission band; and a second power amplifier connected to the fourth filter. The first to third filters and the first power amplifier are disposed on the first board, and the fourth to sixth filters and the second power amplifier are disposed on the second board.

IPC Classes  ?

  • H04B 1/00 - TRANSMISSION - Details of transmission systems not characterised by the medium used for transmission
  • H04B 1/50 - Circuits using different frequencies for the two directions of communication
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