An inductor component includes an element body and inductor wiring. Among outer surfaces of the element body, one specific surface is defined as a first main surface, one surface perpendicular to the first main surface is defined as a first end surface, and one surface perpendicular to the first main surface and the first end surface is defined as a bottom surface. The inductor wiring includes a winding portion. The winding portion includes an upper side portion, a lower side portion, and a first lateral side portion. The first lateral side portion linearly extends from an end of the lower side portion facing the first end surface to the same position as that of an end of the upper side portion facing the first end surface in a direction perpendicular to the first end surface.
A circuit board of a switching power supply device includes a positive terminal circuit pattern and a negative terminal circuit pattern that are provided on a component mount surface and respectively supply currents from input parts to two input terminals of a common mode choke coil. The positive terminal circuit pattern and the negative terminal circuit pattern are positioned in parallel and close to each other. The component mount surface of the circuit board includes a component mount surface side ground pattern arranged below the common mode choke coil. A heat dissipation ground surface of the circuit board includes a ground pattern and a plurality of heat dissipation conductor patterns. Input terminals and output terminals of the common mode choke coil are respectively electrically and thermally connected to the heat dissipation conductor patterns via through-hole conductors provided between the component mount surface and the heat dissipation ground surface.
H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/14 - Arrangements for reducing ripples from dc input or output
H02M 1/32 - Means for protecting converters other than by automatic disconnection
An inductor component includes an element body and an inductor wiring. The element body has a planar first main surface. The inductor wiring extends inside the element body. The inductor wiring includes a plurality of wiring portions arrayed in a direction perpendicular to the first main surface. The element body includes a plurality of interlayer insulating layers filling spaces between the wiring portions that are adjacent to each other in a direction perpendicular to the first main surface. The interlayer insulating layers each contain an insulating base material and a plurality of filler particles dispersed within the base material. In a first interlayer insulating layer, which is one of the plurality of interlayer insulating layers, the average particle size of the filler particles is less than or equal to the standard deviation of the thickness of the first interlayer insulating layer.
A MEMS gyrocompass and method are provided to mitigate systematic error in determination of a north angle. The MEMS gyrocompass includes one or more MEMS gyroscopes having a sense axis within a reference plane. Samples from an output of the MEMS gyroscope are obtained in at least two angles of rotation about an axis perpendicular to the reference plane. First fit coefficients are determined by fitting samples with first fitting functions determined as function of time. Second fit coefficients are determined by fitting components of earth rotation rate projected on the reference plane based on samples obtained by all the MEMS gyroscopes, which fitting is performed with a second fitting function determined as a function of rotation angle of the MEMS gyroscope with respect to a reference angle. The north angle is determined as an angle between the reference angle and true north based on the second fit coefficients.
A composite electronic component includes circuit layers, each including an electronic component, that are laminated, first and second circuit layers, a ceramic electronic component between the first and second circuit layers and including via electrodes extending through a body mainly including ceramic and being exposed at a corresponding one of a main surface on one side and a main surface on another side, and a sealing resin covering at least the ceramic electronic component at a location between the first and second circuit layers. At least one electronic component included in each of the first and second circuit layers are electrically connected by the via electrodes.
H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
H01L 23/528 - Layout of the interconnection structure
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
An optical component including: a first block having a first refractive index and a first reflective surface; a first light absorbing member containing a first metal ion that absorbs light having a first specific wavelength and has a second refractive index different from the first refractive index; a first buffer layer between and in contact with each of the first light absorbing member and the first block, and having a third refractive index having a value between the first refractive index and the second refractive index, wherein the first light absorbing member, the first buffer layer, and the first block are arranged in this order in a first direction such that first block reflects light traveling in the first direction in a second direction different from the first direction on the first reflective surface.
An acoustic wave element includes a piezoelectric substrate, an IDT electrode including comb electrode fingers, and a reflector including reflective electrode fingers. An average value of all pitches of the comb electrode fingers is smaller than an average value of all pitches of the reflective electrode fingers. When a total number of the comb electrode fingers is defined as N, at least one n-th end-side pitch satisfying 1≤n≤(0.233×N) is smaller than the average value of all the pitches of the comb electrode fingers.
A filter device includes a piezoelectric substrate, a dielectric layer on the piezoelectric substrate, a first IDT electrode on the dielectric layer, a second IDT electrode positioned on the piezoelectric substrate in an area where the dielectric layer is not provided such that the first and second IDT electrodes are side by side in an acoustic wave propagation direction extending along a principal surface of the piezoelectric substrate, a first reflector on the dielectric layer and adjacent to the first IDT electrode on a side of the second IDT electrode, and a second reflector on the piezoelectric substrate and adjacent to the second IDT electrode on a side of the first IDT electrode. The dielectric layer includes an edge portion between the first and second reflectors in planar view seen from a stacking direction of the piezoelectric substrate and the dielectric layer.
Described is a power transmission gate which includes a charge pump, an NMOS transistor, and a gate driver circuit configured to power (or bias or “drive”) a gate of the NMOS transistor. With this arrangement, a power transmission gate capable of achieving substantially the same resistance provided by prior art power transmission gates while having a footprint of just over one NMOS size unit is provided.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.
An electronic component that includes: a base body; wiring inside the base body; a glass film covering an outer surface of the base body; an underlying electrode electrically connected to the wiring and covering a part of the glass film; and a metal layer covering the underlying electrode, wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 μm, and a boundary portion that is not covered with the underlying electrode and not separated from the outer edge of the underlying electrode by more than 10 μm, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 1/14 - Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.
A filter device has a first piezoelectric plate spanning a first and second cavity of a substrate. A first and second interdigital transducer (IDT) are on a front surface of the first piezoelectric plate over the first and second cavity. A dielectric layer is formed on the first piezoelectric plate and covers the first IDT and second IDT. A second piezoelectric plate is bonded to a front surface of the dielectric layer over the first cavity and the second cavity. A second dielectric layer is formed on a front surface of the second piezoelectric plate over the first cavity but not over the second cavity. The thickness of the dielectric layer, the first piezoelectric plate and the second piezoelectric plate can be selected to tune a shunt resonator over the first cavity and a series resonator over the second cavity.
H03H 9/205 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having multiple resonators
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
A power amplifier circuit includes a first amplifier, a second amplifier, a third amplifier, and a harmonic suppression circuit. The first amplifier operates on power supplied through a first supply line, and amplifies a first transmit signal in a first frequency band. The second amplifier operates on power supplied through a second supply line connected to the first supply line, and amplifies a second transmit signal in a second frequency band different from the first frequency band. The third amplifier shares an antenna with the second amplifier, and amplifies a receive signal in the second frequency band received from the antenna. The harmonic suppression circuit generates, based on a harmonic of the first transmit signal, a suppression signal to suppress the harmonic to be transferred to the first supply line, and outputs the suppression signal to the first supply line or the second supply line.
A filter device includes input and output terminals, first and second ground electrodes opposed to each other, and a resonator connected to one of the input and output terminals. The resonator includes a third ground electrode, and first, second, and third resonant portions. The third ground electrode is between and connected to the first and second ground electrodes. The first resonant portion is between the first and third ground electrodes, and connected to the third ground electrode and one of the input and output terminals. The second resonant portion is between the first and third ground electrodes, and connected to the third ground electrode. The third resonant portion is between the second and third ground electrodes, and connected to the third ground electrode.
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.
A pulse-shaping network configured for use in a radio frequency (rf) power amplifier system, the pulse-shaping network comprising: a coupled magnetic element comprising a first inductive element magnetically coupled to a second inductive element, the first inductive element comprising a first winding disposed about a first portion of a core, and the second inductive element comprising a second winding disposed about a second portion of a core, wherein the first and second inductive elements are electrically coupled to provide three output terminals of the coupled magnetic element.
A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.
H01F 27/245 - Magnetic cores made from sheets, e.g. grain-oriented
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
In a vibration wave radiating device, when a distance between a connection portion and a reflecting plane portion in a direction orthogonal to the reflecting plane portion is TD, an angle defined by a virtual line parallel to the reflecting plane portion and a back surface of a vibrating portion in a longitudinal section is θ, a shortest distance between a peripheral edge of the back surface at an end of the vibrating portion opposite to the connection portion and a peripheral edge of the reflecting plane portion is L, and a wavelength of a vibration wave emitted from the vibrating portion is λ, a relationship indicated by 0.78λ≤L≤1.19λ or 1.5λ≤L≤2.14λ is satisfied when TD=0 and 35°≤θ≤55°.
A cylindrical battery is provided and includes a columnar electrode body, a cylindrical battery can in which one end portion is opened and the electrode body is accommodated, and a current interrupt device provided at the one end portion. The current interrupt device includes a cover, a holder provided inside the cover, and a disk provided inside the holder.
H01M 50/578 - Devices or arrangements for the interruption of current in response to pressure
H01M 10/04 - Construction or manufacture in general
H01M 50/586 - Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries inside the batteries, e.g. incorrect connections of electrodes
An inductor component includes an element body and inductor wiring. The element body has first and second electrodes connected to first and second ends of the inductor wiring, respectively. One outer surface of the element body is a first main surface, one surface perpendicular to the first main surface is a first end surface, and one surface perpendicular to the first main and end surfaces is a bottom surface. The first electrode includes a first bottom surface electrode portion and a first end surface electrode portion. A size of the first bottom surface electrode portion in a direction perpendicular to the bottom surface is a thickness, and a portion of the first bottom surface electrode portion farthest from the first end surface is a leading end. The thickness of at least part of the first bottom surface electrode portion including the leading end decreases toward the leading end.
A biosignal electrode that includes a substrate having first and second opposed main surfaces; a conductive material pattern on the first main surface of the substrate, the conductive material pattern defining a plurality of open spaces extending through the conductive material pattern and exposing the first surface of the substrate therethrough; and a biocompatible glue material within the plurality of open spaces of the conductive material pattern.
A noise reduction circuit includes a surface-mount common mode choke coil mounted on a circuit board. Output terminals of the common mode choke coil are connected to an input capacitor via second circuit patterns. Two terminals of the input capacitor are connected to two input ends of a switching circuit via third circuit patterns. Path lengths of the second circuit patterns are longer than path lengths of the third circuit patterns. Of a plurality of current paths, the path lengths of the third circuit patterns are shortest in comparison with path lengths of other current paths. First circuit patterns are parallel and face each other to form a first parasitic capacitance, and the second circuit patterns are parallel and face each other to form second parasitic capacitances.
H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/14 - Arrangements for reducing ripples from dc input or output
H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
24.
SYSTEMS AND METHODS FOR GENERATING AN OPTIMIZED ACOUSTIC WAVE (AW) RESONATOR USING THE FINITE ELEMENT TEARING AND INTERCONNECTING (FETI) METHOD
Techniques described herein relate to systems and methods for generating an optimized acoustic wave (AW) structure, including: receiving, by a computing system, a set of frequency response requirements and a physical model of the AW structure; partitioning the physical model into a plurality of subdomains that are non-overlapping; determining and applying transmission conditions (TCs) for each of the plurality of subdomains to couple neighboring subdomains; reducing a subdomain problem for each subdomain of the plurality of subdomains to a local interface problem; assembling degrees of freedoms (DOFs) from all local interface problems to form a global interface system; solving the global interface system by monitoring for convergence accelerated by the applied TCs; deriving a frequency response of the AW structure at least partially from the solved global interface system; comparing the frequency response to the set of frequency response requirements; and optimizing the AW structure based on the comparison.
An apparatus for filtering radio frequency signals is provided. The apparatus includes a substrate and a membrane coupled to the substrate that includes piezoelectric material. The apparatus also includes an interdigital transducer (IDT) coupled to the membrane and includes a plurality of interleaved fingers. The apparatus also includes a lid, in which the membrane is arranged between the substrate and the lid with a first cavity having a first height between the lid and a first main surface of the membrane and a second cavity having a second height between the substrate and a second main surface of the membrane that opposes the first main surface. Moreover, the first height between the lid and the first main surface of the membrane is greater than a pitch of at least one pair of interleaved fingers of the plurality of interleaved fingers and at most four times greater than the second height.
An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.
An acoustic wave device includes a support substrate with a thickness in a first direction, an intermediate layer on the support substrate, a piezoelectric layer on the intermediate layer, and an interdigital transducer electrode including a first electrode finger on a surface of the piezoelectric layer and extending in a second direction intersecting the first direction, a first busbar electrode connected to the first electrode finger, a second electrode finger opposed to the first electrode finger in a third direction orthogonal or substantially orthogonal to the second direction and extending in the second direction, and a second busbar electrode connected to the second electrode finger. The intermediate layer includes a space in a region in which at least a portion of the intermediate layer overlaps the interdigital transducer electrode in a plan view in the first direction, and an inner wall of the space includes at least one notch.
In an acoustic wave element, a distance between a comb electrode finger closest to a reflector and a reflective electrode finger closest to an interdigital transducer (IDT) electrode is set as an IDT-reflector gap. An inter-center distance between adjacent electrode fingers is set as a pitch. The electrode fingers in a direction from the comb electrode finger closest to the reflector toward a center are sequentially set as an n-th end-side electrode finger, and a pitch between the n-th end-side electrode finger and an (n+1)-th end-side electrode finger is set as an n-th end-side pitch. An average value of each pitch by all the comb electrode fingers is set as an average IDT pitch, and an average value of each pitch by the reflective electrode fingers is set as an average reflector pitch.
A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.
H01L 23/367 - Cooling facilitated by shape of device
H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
H05K 1/14 - Structural association of two or more printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A circuit board that includes a ceramic substrate; a protruding electrode on a surface of the ceramic substrate; and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate.
A thermal analysis method and apparatus, and a computer program that enable highly accurate heat transfer simulation of a structure or space, while reducing calculation costs. By performing thermal analysis on a structure or space using the calculation meshes generated by initial dividing means, the spatial distribution of heat flux vectors J and temperature gradient vectors ∇T are calculated; by calculating the volume integrals of the inner products J·∇T of the heat flux vectors J and the temperature gradient vectors ∇T for individual partitioned regions and acquiring the absolute values of the volume integrals, thermal management sensitivity indices are calculated for the partitioned regions. Subsequently, partition of calculation meshes and subdivision of partitioned regions are performed on a predetermined number of partitioned regions that indicate greater indices among the calculated thermal management sensitivity indices, for example one partitioned region. Thermal analysis is performed again using the calculation meshes.
A power amplifier circuit includes an amplifier transistor having a collector terminal, an emitter terminal, and a base terminal, bias circuits, and a current limiter circuit. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current from an emitter terminal to the base terminal. The current limiter circuit includes a current limiting transistor an emitter terminal of which is connected to the bias circuit, a resistive element connected between the current limiting transistor and a power supply terminal, and a resistive element connected between the current limiting transistor and the constant current amplifier transistor. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current i3 from an emitter terminal to the base terminal.
A coil component includes a first outer magnetic body, a first outer insulator, a first inner magnetic body, an inner insulator, a second inner magnetic body, a second outer insulator, and a second outer magnetic body stacked sequentially, and a coil in the inner insulator and an internal magnetic body inside the coil. Volumes A, B, C, and D of the first and second outer insulators, the inner insulator, the coil, and the internal magnetic body, respectively, and volume E of the first outer magnetic body, the first inner magnetic body, the second inner magnetic body, and the second outer magnetic body satisfy 0.05≤A≤0.07, 0.2≤B≤0.4, 0.01≤C≤0.08, 0.03≤D≤0.05, and 0.4≤E≤0.71, where 0.05B≤C≤0.2B and A+B+C+D+E=1.
An inductor component includes first and second internal wiring lines, an interlayer insulating layer between the first and second internal wiring lines and having a first main surface facing the first internal wiring line, a second main surface facing the second internal wiring line, and a via extending between the first main surface and the second main surface, and a via wiring line inserted through the via that electrically connects the first and second internal wiring lines. In a first section including a central axis of the via wiring line, the first main surface includes a first portion in contact with the first internal wiring line. The second main surface includes a second portion that is parallel to the first portion. A straight line that includes the first portion is a first reference line. A straight line that includes the second portion is a second reference line.
An inductor component includes: a first internal conductor; a second internal conductor; an insulating interlayer disposed between the first internal conductor and the second internal conductor and having a first main surface on the first internal conductor side, a second main surface on the second internal conductor side, and a via extending therethrough between the first main surface and the second main surface; and a via conductor inserted through the via and electrically connecting the first internal conductor and the second internal conductor. In a first section including a central axis of the via conductor, the via conductor has a wedge portion interposed between the insulating interlayer and the first internal conductor in a direction parallel to the central axis.
A directional coupler includes a main line, a first sub-line, a second sub-line, a first phase shift circuit, a first short-circuit path, and a first short-circuit switch. The first phase shift circuit is connected between the first sub-line and the second sub-line. The first short-circuit path short-circuits both ends of the first phase shift circuit. The first short-circuit switch switches between conduction and non-conduction of the first short-circuit path.
H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
A highly reliable multilayer coil component in which the internal stress is further alleviated, and a method for producing the same. The method produces a multilayer coil component that includes an insulator portion, a coil that is embedded in the insulator portion and includes a plurality of coil conductor layers electrically connected to one another, and an outer electrode that is disposed on a surface of the insulator portion and is electrically connected to an extended portion of the coil. The method includes forming a conductive paste layer by using a conductive paste; forming an insulating paste layer by using an insulating paste; forming a multilayer compact that includes the conductive paste layer and the insulating paste layer; and firing the multilayer compact, in which the conductive paste has a PVC of 60% or more and 80% or less (i.e., from 60% to 80%).
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
There is provided a power amplifier circuit capable of adjusting the gain according to the power mode. A power amplifier circuit includes: a splitter outputting an input signal by splitting the input signal to a signal RF1 and a signal RF2; amplifiers connected to the splitter; and an amplifier provided in or on a signal path branching from between the splitter and an input of the amplifier, connected in parallel with the amplifier, and connected to a biasing terminal supplied with a third bias current or voltage.
A Doherty amplifier circuit includes a carrier amplifier including one or more amplifiers, and a peaking amplifier including one or more amplifiers. At least one of the amplifiers includes a first transistor and a current draw circuit. The first transistor receives, at its base or gate, a first radio frequency signal, and outputs, from its emitter or source, a second radio frequency signal obtained by amplifying the first radio frequency signal. The current draw circuit draws, from the emitter or source of the first transistor, a current based on a control signal.
An inductor component includes a base body, first and second inner wiring line inside the base body, an inter-layer insulation layer, and a via-wiring line. The inter-layer insulation layer is inside the base body, and between the first and second inner wiring lines. The inter-layer insulation layer includes first and second major faces and a via-hole. The first major face faces the first inner wiring line. The second major face faces the second inner wiring line. The via-hole extends through the inter-layer insulation layer between the first and second major faces. The via-wiring line is in the via-hole, and electrically connects the first and second inner wiring lines. As seen in a first cross-section including a center axis of the via-wiring line, the via-wiring line includes a first portion in contact with the first inner wiring line, and a second portion in contact with the second inner wiring line.
A solid electrolytic capacitor that includes: an anode plate made of a valve metal; a porous layer on at least one of principal surface of the anode plate; a dielectric layer on a surface of the porous layer; a cathode layer that includes a solid electrolyte layer on the dielectric layer, the cathode layer including two or more cathode portions; a first insulating layer that surrounds at least one of the cathode portions as viewed in a thickness direction of the solid electrolytic capacitor, wherein a material of the first insulating layer fills a portion of the porous layer and is also present on a surface of the filled portion of the porous layer; and a first piercing section that pierces through both of the porous layer and the first insulating layer in the thickness direction.
A resonance device that includes: a first substrate having a first silicon substrate and a resonator, wherein the resonator includes a single-crystal silicon film and a first silicon oxide film interposed between the single-crystal silicon film and the first silicon substrate, and a through hole that passes through the single-crystal silicon film and the first silicon oxide film; a second substrate opposite the first substrate; a frame shaped bonding portion that bonds the first substrate to the second substrate to seal a vibration space of the resonator; and a first blocking member disposed in an interior of the through hole and surrounding a vibration portion of the resonator in a plan view of the first substrate so as to divide the first silicon oxide film, wherein the first blocking member has a lower helium permeability than the first silicon oxide film.
H03H 3/007 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
H03H 9/24 - Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
43.
RADIO FREQUENCY CIRCUIT, COMMUNICATION DEVICE, AND CONTROL METHOD
A radio frequency circuit that supports simultaneous communication using downlink MIMO in a first band and uplink communication in a second band includes first and second power amplifiers connected to first and second antenna terminals, respectively. When a first SRS in the first band is output through the first antenna terminal, the first power amplifier amplifies the first SRS, according to a first deterioration amount of a signal-to-noise ratio in the first band due to distortion of a transmission signal in the second band having leaked in through the first antenna terminal, and when a second SRS in the first band is output through the second antenna terminal, the second power amplifier amplifies the second SRS, according to a second deterioration amount of the signal-to-noise ratio in the first band due to distortion of the transmission signal in the second band having leaked in through the second antenna terminal.
A power amplifier circuit includes external input and output terminals; a first power amplifier with first input and output terminals, the first input terminal being connected to the external input terminal, the first output terminal being connected to the external output terminal; a second power amplifier having second input and output terminals, the second input terminal being connected to the external input terminal, the second output terminal being connected to the external output terminal; a power supply terminal that receives a power supply voltage that is supplied to the first power amplifier and controllably supplied to the second power amplifier; and a switch having first and second terminals, the first terminal being connected to the power supply terminal, the second terminal being connected to the second power amplifier.
An electrical device includes a thermally insulating layer including first and second opposing surfaces. The first surface of the thermally insulating layer is on a first surface of the electrical device. A thermally conductive layer is on the second surface of the thermally insulating layer. The electrical device further includes one or more thermal conductors in thermal contact with the thermally conductive layer to transfer heat away from the thermally conductive layer via one or more coolers provided externally to the electrical device. Such a composite layer arrangement maintains a temperature of a surface at a low value, allowing low temperature rated electronic components to be mounted directly onto the electrical device.
Methods and devices addressing power tracking of transmission systems using antenna arrays are disclosed. The disclosed teachings may be implemented on a channel element to channel element basis, are adaptive and can be implemented on short time durations such as time slots. Power efficiency can be improved when applying the described methods to the design of systems with antenna arrays.
A directional coupler includes a main line, a sub-line, an output terminal, a first termination circuit, and a termination switch. The sub-line includes a first end and a second end. The output terminal is connected to one end of the first end and the second end. The first termination circuit connects a first output path, which connects the one end and the output terminal, to a ground. The termination switch switches between connection and non-connection between the first output path and the first termination circuit.
H03H 7/06 - Frequency selective two-port networks including resistors
H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
H03H 7/46 - Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
48.
Reduced Gate Drive for Power Converter with Dynamically Switching Ratio
Circuits and methods for selectable conversion ratio power converters that include low-dropout (LDO) power supplies adapted to select voltage inputs based on the selected conversion ratio while achieving high efficiency. The LDO power supplies limit current through power FETs of power converters, thereby mitigating or eliminating potentially damaging events. In some embodiments, first and second full gate-drive LDOs have “wired-OR” outputs which may power a target circuit such as a pre-driver (and optionally, a level-shifter) coupled to the gate of a power FET. In some embodiments, first and second reduced gate-drive LDOs have “wired-OR” outputs that may power a final driver coupled to the gate of a power FET. Some embodiments have dual full gate-drive LDOs that power a target circuit such as a pre-driver (and optionally, a level-shifter), while dual reduced gate-drive LDOs that power a final driver coupled to the gate of the power FET.
H02M 3/157 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
A CPAP device includes a main unit including a first electric circuit including a blower and a connection terminal connected to the first electric circuit, and a base unit connectable to the main unit, including a blower tube, a second electric circuit different from the first electric circuit, and a connection terminal connected to the second electric circuit. The main unit has a first electrical connection portion including an exposed portion of the connection terminal and a first peripheral portion surrounding the first electrical connection portion. The base unit has a second electrical connection portion including an exposed portion of the connection terminal and a second peripheral portion surrounding the second electrical connection portion.
A CPAP device includes a main unit including an inlet, an outlet, and a first electric circuit including a blower; and a base unit, to which the main unit is attachable, including an outlet, an inlet, a blower tube, and a second electric circuit different from the first electric circuit. The main unit has a lower wall, and the lower wall has multiple connection terminals connected to the first electric circuit. The base unit has an upper wall, and the upper wall has multiple connection terminals connected to the second electric circuit. The multiple connection terminals and the multiple connection terminals are disposed side by side in a direction substantially parallel to a direction in which the lower wall and the upper wall face each other. One of the multiple connection terminals and the multiple connection terminals includes a biasing force generation member that generates biasing force.
An antenna module includes an antenna substrate and a feed circuit. The antenna substrate has an upper surface and a lower surface, and a radiating element having a flat plate shape is arranged in the antenna substrate. The feed circuit 105 is mounted on the lower surface of the antenna substrate and supplies a radio frequency signal to the radiating element. The antenna substrate includes a dielectric substrate on which the radiating element is arranged, a ground electrode, a feed wiring, and carbides. The ground electrode is arranged between the radiating element and the lower surface in the dielectric substrate. The feed wiring transmits the radio frequency signal supplied from the feed circuit to the radiating element. The carbides are disposed on at least a part of a side surface connecting the upper surface and the lower surface in the dielectric substrate.
A method is provided for sealing and contacting a microelectromechanical device that includes a silicon device wafer with MEMS device structures and a cap wafer with an electrical circuit. The device wafer includes a sealing region and an interconnection region. Moreover, the cap wafer includes a corresponding sealing region and an interconnection region. Layers of eutectic metal alloy material are deposited on the sealing and the interconnection regions of the device wafer and the cap wafer. The cap wafer is bonded to the device wafer so that the interconnection region of the device wafer is aligned with the interconnection region of the cap wafer and the sealing region of the device wafer is aligned with the sealing region of the cap wafer.
A displacement detection device includes a transmitter, a receiver, and a controller configured or programmed to output a first transmission signal to the transmitter to transmit a modulated wave and acquire a responsive first reception signal in a first measurement period, extract first phase information indicating a phase defined in a correlation between a first transmission signal and a reception signal, output a second transmission signal to the transmitter and acquire a responsive second reception signal in a second measurement period after the first measurement period, extract second phase information indicating a phase defined in a correlation between the second transmission signal and reception signal, and detect a displacement of an object between the first and second measurement periods, depending on a difference between the first and second phase information.
A battery pack includes a plurality of batteries, an isolating member that is arranged between the plurality of batteries and isolates the plurality of batteries from each other, and a heat absorbing agent that is housed inside the isolating member. The isolating member has a first housing space for housing the heat absorbing agent, and contains an amorphous engineering plastic. In addition, the isolating member has a first thin portion having a locally thin wall thickness in at least a part of a region where the first housing space faces each of the plurality of batteries.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
H01M 50/291 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
H01M 50/293 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
H01M 50/383 - Flame arresting or ignition-preventing means
55.
SOLID ELECTROLYTIC CAPACITOR ELEMENT AND SOLID ELECTROLYTIC CAPACITOR
A solid electrolytic capacitor element that includes: a valve acting metal substrate having a dielectric layer thereon; an insulating mask layer on the dielectric layer and separating the valve acting metal substrate into positive and negative electrode portions; a solid electrolyte layer on the dielectric layer, a tip of the solid electrolyte layer covering an outer surface of the insulating mask layer; a carbon layer on the solid electrolyte layer, a tip of the carbon layer covering a same position as the tip of the solid electrolyte layer or a position closer to the negative electrode portion; and a negative conductor layer on the carbon layer, a tip of the negative conductor layer covering a position closer to the negative electrode portion, and wherein the negative electrode portion has a negative conductor layer-non-formed region where the negative conductor layer does not cover a part of the carbon layer.
A filter device includes first and second terminals, a first inductor located between the first and second terminals, and an LC series resonator connected in parallel to the first inductor and including a first capacitor and a second inductor. The first and second inductors are magnetically coupled to each other. An inductance of the first inductor is smaller than an inductance of the second inductor.
An inductor including an element body containing metal magnetic powder and resin and having a coil conductor that has a winding portion, an extended portion extended from the winding portion, and an outer electrode connection portion leading to the extended portion and connected to an outer electrode and is embedded in the element body; and an element body coat covering a surface of the element body. The outer electrode is formed on a surface of the element body and connected to the outer electrode connection portion, in which the outer electrode connection portion has a region covered with the element body coat and a region connected to the outer electrode on the surface of the element body.
A sintered body that includes: a spinel ferrite oxide having a main constituent of metal elements of Fe, Ni, Cu, and Zn; and Zr, Mn, Al, Co, and Cr. Wherein, when Zn, Ni, Cu, Zr, Mn, Al, Co, and Cr have a contained mole part: “a”, “b”, “c”, “d”, “e”, “f”, “g”, and “h”, respectively, and based on Fe being 100 mole parts: 49.0<100−a−b−c+2d+(1/2)e<50.0, 50.2
C04B 35/26 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
An object detection device includes a wave transmitter to transmit a sound wave to an object, a wave receiver to receive the sound wave and generate a signal representing a reception result, and a controller to control transmission of the sound wave by the wave transmitter and obtain the receive signal from the wave receiver. The controller is configured or programmed to output a transmit signal to cause the wave transmitter to transmit the sound wave and obtain a corresponding receive signal. The controller is configured or programmed to generate detection information about the object by performing complexification on a correlation signal representing a correlation between the transmit signal and the receive signal. A signal corrector is configured or programmed to correct any of the correlation signal, the receive signal, and the transmit signal to mitigate a direct-current component in the correlation signal targeted for the complex analysis.
G01S 7/539 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisation; Target signature; Target cross-section
G01S 7/52 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
G01S 15/10 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves
A tire observation apparatus includes a computer and an imaging device including a camera and range sensors positioned at different angles relative to a ground surface. The computer is configured or programmed to calculate a position of a tire relative to the camera by using various distances to the tire calculated by the range sensors. By using the position of the tire, the computer is configured or programmed to calculate an amount of adjustment usable by the imaging device to adjust the position and an angle of the camera such that an imaging center of the camera is directed at a center of the tire or at a surface of the tire that is to be measured.
A communication circuit includes a transmission terminal to which a transmission signal is supplied, a first duplexer that has a transmission node, a reception node, and a common node, a first filter that has a first end part electrically connected to the common node of the first duplexer and a second end part electrically connected to an antenna terminal, a first auxiliary output terminal that outputs the transmission signal to an external circuit, an inductor that is part of a second filter and has a first end part and a second end part that is electrically connected to the first auxiliary output terminal, and a first switch that switches the electrical connection destination of the transmission terminal between the transmission node of the first duplexer and the first end part of the inductor.
A coil component includes a drum core including a winding core portion, and first and second flange portions; and a first metal terminal which includes a bonding portion, a connecting portion, a mounting portion, an extending portion, and a joining portion. The first flange portion includes a main body portion, an end-surface-side protruding portion protruding from an outer end surface of the main body portion and a bottom-surface-side protruding portion protruding from a bottom surface of the main body portion. In a direction parallel to a second axis, a shortest distance from an end of the end-surface-side protruding portion on the second positive direction side to the joining portion is a first distance. A maximum distance from the end of the end-surface-side protruding portion to a side end surface of the end-surface-side protruding portion is a second distance. The first distance is larger than the second distance.
To suppress a decrease in mounting strength of a coil component, a coil component includes a drum core including a winding core portion, and first and second flange portions. The coil component includes a first metal terminal which includes a bonding portion, a connecting portion, and a mounting portion. The bonding portion is bonded to the first flange portion with an adhesive. The mounting portion is closest to the first positive direction side in the first metal terminal and is separated from the first flange portion toward the first positive direction side. The connecting portion connects the bonding and mounting portions. The first flange portion has a facing surface that faces the mounting portion, a bonding surface, and a first inclined surface between the facing and bonding surfaces. The distance from the facing surface increases in a direction parallel to the first axis toward the bonding surface.
To suppress deformation of a mounting portion, a coil component includes a drum core including a winding core portion, a first flange portion, and a second flange portion. The coil component includes a first metal terminal. The first metal terminal includes a joining portion, a mounting portion, and an extending portion. A first wire end of the first wire is connected to a surface of the joining portion facing a first positive direction. The mounting portion is located closest to the first positive direction in the first metal terminal. The extending portion connects the mounting portion and the joining portion. The extending portion includes a second portion having a thickness dimension smaller than the thickness dimension of the mounting portion.
A Doherty amplifier circuit includes a carrier amplifier including one or more amplifiers, and a peaking amplifier including one or more amplifiers. At least one of the amplifiers includes a transistor and a feedback circuit. The transistor receives, at its base or gate, a radio frequency signal and a bias voltage or current which changes, and outputs an amplified radio frequency signal from its collector or drain. The feedback circuit provides, to the base or gate or the emitter or source of the transistor, a voltage or a current based on the amplified radio frequency signal.
An acoustic wave device includes a support substrate with a thickness in a first direction, an intermediate layer on the support substrate, a piezoelectric layer on the intermediate layer, and an IDT electrode including a first electrode finger at the piezoelectric layer in the first direction and extending in a second direction intersecting the first direction, a first busbar electrode connected to the first electrode finger, a second electrode finger facing the first electrode finger in a third direction orthogonal or substantially orthogonal to the second direction and extending in the second direction, and a second busbar electrode connected to the second electrode finger. The intermediate layer includes a void portion at least partially overlapping the IDT electrode in plan view, and a surface roughness of an inner sidewall of the intermediate layer is about 0.0055 μm or more.
A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).
H01F 27/30 - Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
Commissariat A L'Energie Atomique Et Aux Energies Alternatives (France)
Inventor
Oukassi, Sami
Sallaz, Valentin
Voiron, Frédéric
Abstract
A supercapacitor that includes: a first electrode; a second electrode; and a composite solid electrolyte disposed between the first electrode and the second electrode. The composite solid electrolyte includes a dielectric matrix and an ionic conductor disposed in channels/pores in the dielectric matrix. Methods of fabricating such supercapacitors are also disclosed.
An acoustic wave device includes a piezoelectric material layer, and an IDT electrode on the piezoelectric material layer and including first electrode fingers and second electrode fingers arranged periodically. The electrode fingers each include at least one electrode layer including at least one of Nb, Pd, or Ni. A sum of thicknesses of the at least one electrode layer, calculated assuming that the electrode layer(s) includes Mo and based on a density ratio between the electrode layer(s) and Mo, is at least about 10% of a spatial period of the electrode fingers.
An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support substrate, a space overlapping at least a portion of the piezoelectric layer, and a functional electrode on the piezoelectric layer. The support includes a space at a position at least partially overlapping the functional electrode in plan view. The functional electrode includes a first metal layer and a second metal layer on at least a portion of the first metal layer. A linear expansion coefficient of the second metal layer is smaller than a linear expansion coefficient of the first metal layer.
A coil component includes an element body including a multilayer body in which a first ferrite layer, a first glass layer, and a second ferrite layer are laminated in that order; a coil embedded in the first glass layer; and an outer electrode provided on an outer surface of the element body and electrically connected to the coil. The first glass layer includes regions in which Cu and Mg coexist.
An amplifier module includes an antenna that includes four power feed points, and four power amplifiers. Output ends of the four power amplifiers are connected to the four power feed points in a one-to-one relationship. The four power feed points are arranged rotationally symmetrically around a center of the antenna when a main surface of the antenna is viewed in plan.
A power amplifier circuit and an LC circuit are included. The power amplifier circuit amplifies a radio frequency signal by switching between the first mode, in which power is amplified by using the envelope tracking system, and the second mode, in which power is amplified by using the average power tracking system. The LC circuit is connected, at its first end, to the power supply path of the power amplifier circuit and that is grounded, at its second end, through a switch circuit. The LC circuit includes a first capacitor and an inductor that is connected in series to the first capacitor. The switch circuit is controlled to be switched off in the first mode and is controlled to be switched on in the second mode.
An amplifier module includes an input terminal; a first preamplifier formed in or on a first substrate and configured to amplify a signal that is input to the input terminal; a first postamplifier and a second postamplifier that are formed in or on a second substrate and that are configured to receive an output of the first preamplifier and output a differential signal; an output balun configured to receive the differential signal that is output from the first postamplifier and the second postamplifier; and a variable capacitance element. The output balun includes a primary winding subjected to the differential signal and a secondary winding, and the variable capacitance element is connected in parallel with the primary winding of the output balun.
An amplifier circuit includes amplifiers, transformers, and a transmission line. A first end of an input-side coil is connected to an output terminal of the amplifier, a second end of the input-side coil is connected to an output terminal of the amplifier via the transmission line, a first end of an input-side coil is connected to an output terminal of the amplifier, a second end of the input-side coil is connected to the output terminal of the amplifier via the transmission line, a first end of an output-side coil is connected to an output terminal, a second end of the output-side coil is connected to a ground, a first end of an output-side coil is connected to an output terminal, and a second end of the output-side coil is connected to the ground.
An electronic component that includes: a base body having an outer surface defining a recess with an inner surface, wherein, when the recess is viewed in a direction orthogonal to the outer surface, at least a part of an outer edge of the recess is curved, and when the recess is viewed in a section orthogonal to the outer surface, at least a part of the inner surface of the recess is curved; a wiring inside the base body; and a glass film covering the outer surface of the base body and not covering the inner surface of the recess.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 1/14 - Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
An acoustic wave device includes a support, a piezoelectric layer with an anisotropic coefficient of linear expansion, and including first and second main surfaces, at least one through-hole, a first electrode in or on the first main surface, and a second electrode in or on the second main surface and opposed to the first electrode. A cavity is provided in the support. At least a portion of the first and second electrodes overlaps the cavity in plan view. In plan view, the at least one through-hole is line symmetric about an axis of symmetry that passes a center of the cavity in a region where the first and second electrodes overlap each other and that extends in a direction in which the coefficient of linear expansion of the piezoelectric layer is greatest.
In a high frequency module, a plurality of filters is connected to an antenna terminal with a switch interposed. The plurality of filters includes a first filter that has a pass band including a frequency band of a first communication band and a second filter that has a pass band including a frequency band of a second communication band that is capable of simultaneous communication with the first communication band. A first electronic component having the first filter and a second antenna end resonator of the second filter is disposed on a first principal surface of the mounting substrate. A second electronic component having at least one second acoustic wave resonator other than a second antenna end resonator of the second filter is disposed on the first principal surface of the mounting substrate.
Filter devices and methods are disclosed. A single-crystal piezoelectric plate is attached to substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate. A conductor pattern formed on the piezoelectric plate defines a low band filter including low band shunt resonators and low band series resonators and a high band filter including high band shunt resonators and high band series resonators. Interleaved fingers of interdigital transducers (IDTs) of the low band shunt resonators are disposed on respective diaphragms having a first thickness, interleaved fingers of IDTs of the high band series resonators are disposed on respective diaphragms having a second thickness less than the first thickness, and interleaved fingers of IDTs of the low band series resonators and the high band shunt resonators are disposed on respective diaphragms having thicknesses intermediate the first thickness and the second thickness.
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An antenna module including a dielectric substrate having a long side and a short side, a ground electrode, a radiating element, a peripheral electrode, and a parasitic element. The radiating element is disposed to face the ground electrode. The peripheral electrode is disposed along the long side of the dielectric substrate and is electrically connected to the ground electrode. The parasitic element is disposed along the short side of the dielectric substrate and is disposed away from the radiating element. The radiating element is configured to emit radio waves in two polarization directions along the long side and the short side of the dielectric substrate. The shortest distance between the radiating element and the parasitic element is greater than the shortest distance between the radiating element and the peripheral electrode.
Described are concepts, circuits, systems and techniques directed toward N-phase control techniques useful in the design and control of supply generators configured for use in a wide variety of power management applications including, but not limited to mobile applications.
To provide a battery pack including a heat-absorbing member capable of suppressing permeation of a heat-absorbing agent. A battery pack includes a secondary battery and a heat-absorbing member that includes a heat-absorbing agent and an exterior member accommodating the heat-absorbing agent and is in contact with the secondary battery at least in part, wherein the exterior member includes a metal layer, a resin layer overlapping the metal layer, and a sealing portion sealing the heat-absorbing agent, the metal layer is located inside the exterior member, and the metal layers are joined to each other at the sealing portion.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
A coil component having improved magnetic characteristics. The coil component includes a body having a substantially hexahedral shape and including a winding portion formed by winding a conductive wire based on a winding axis and a magnetic body portion; and paired metal terminals having joint portions to which first and second ends of the conductive wire are electrically connected. Each of the paired metal terminals extends outside an outer surface of the body parallel to the winding axis. Of four quadrants separated from one another by imaginary coordinate axes that are orthogonal to one another with the center of the body as the origin in plan view in the winding axis direction, more than half the area of one of the joint portions is disposed in a quadrant not adjacent to the quadrant in which more than half the area of the other joint portion is disposed.
A multiplexer includes a common terminal, an inductor including a first end connected to the common terminal and a second end, a filter connected to the second end and having a first pass band, a filter connected to the common terminal and having a second pass band located on a higher frequency side relative to the first pass band, an inductor connected between a ground and a path that links the second end to the filter, and a capacitor connected between the path and the ground. A resonant frequency of an LC parallel resonance circuit including the inductor and the capacitor is located between the first pass band and the second pass band.
A method of controlling a converter apparatus operable based on a first frequency modulation control signal and at least one second frequency modulation control signal, includes determining updated periods of the first frequency modulation control signal and the at least one second frequency modulation control signal based on the output, for each second frequency modulation control signal, at a beginning of each period of the first frequency modulation control signal, determining a phase shift of the second frequency modulation control signal relative to the first frequency modulation control signal, when a difference between the phase shift and a target phase shift exceeds a predetermined threshold, determining the period of the second frequency modulation control signal as the updated period increased or decreased by a predetermined amplitude, otherwise determining the period of the second frequency modulation control signal as the updated period.
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
H02M 3/156 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
86.
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
A multilayer substrate includes a multilayer body including first insulator layers and a second insulator layer stacked on each other. The multilayer body includes first and second regions when viewed in a stacking direction. The first region is a region that does not include the second insulator layer when viewed in the stacking direction. The second region is a region that includes the second insulator layer when viewed in the stacking direction. The first insulator layers include a small-area first insulator layer located in the first region and not located in the second region. The small-area first insulator layer overlaps the second insulator layer when viewed in a first direction. A porosity of the second insulator layer is higher than an overall porosity of the first insulator layers.
A circuit module comprises a substrate module, an electronic component, and a first conductive joining member. The substrate module includes a circuit substrate having an upper main surface and a lower main surface, an insulating member covering the upper main surface of the circuit substrate, an insulating member covering the upper main surface of the circuit substrate, and a first metal pin that passes through the insulating member parallel to a vertical axis and is electrically connected to the circuit substrate. The first metal pin has a first exposed portion. The first exposed portion is exposed from the insulating member to face a right direction. A first outer electrode has a left projecting portion projecting in a left direction from the left surface. A first conductive joining member joins the first exposed portion and the left projecting portion to each other.
A circuit board includes a substrate, a first mounting conductor, a first ground conductor, a first floating conductor, a signal line conductor, and a connection conductor. The first mounting conductor is on a surface of the substrate and includes a first external connection conductor. The first ground conductor is positioned on the substrate opposite to the first mounting conductor. The floating conductor is between the first mounting conductor and the first ground conductor. The signal line conductor is inside the substrate. The connection conductor connects the first mounting conductor and the signal line conductor. When viewed in a thickness direction of the substrate, the signal line conductor and the connection conductor are each provided at a position different from the first external connection conductor, and the floating conductor overlaps an entirety or substantially an entirety of the first external connection conductor.
The deterioration in characteristics of a filter is reduced. In a high frequency module, the filter includes a first substrate, a first functional electrode provided on the first substrate and forming a part of an antenna end resonator, a second substrate separate from the first substrate, and a second functional electrode provided on the second substrate and forming a part of at least one acoustic wave resonator other than the antenna end resonator among a plurality of acoustic wave resonators. A first electronic component including the first substrate and the first functional electrode is disposed on the first main surface of the mounting substrate. An inductor is adjacent to the first electronic component in a plan view from a thickness direction of the mounting substrate. The inductor does not overlap the antenna end resonator in a side view from a direction of a winding axis of a winding portion.
An alignment device includes a pallet including a flat plate portion and a lateral wall portion defining an alignment area to which chips are supplied, recessed portions defining holding positions in the alignment area to hold the chips in an alignment state, a supply port defined by a portion of the lateral wall portion being open and allowing the chips to be supplied into the alignment area from outside of the lateral wall portion, and a magnet defining a moving holder at least at either one of the flat plate portion or the lateral wall portion to cause each of the chips supplied from the supply port to the alignment area to move to a corresponding one of the recessed portions and hold each of the chips at a corresponding one of the recessed portions.
H01G 13/00 - Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups
H01G 4/012 - Form of non-self-supporting electrodes
A case includes a case body including an accommodation space to accommodate electronic components and a discharge port to discharge the electronic components accommodated in the accommodation space, a shutter slidable relative to the case body to open and close the discharge port, a slider integral with the shutter to perform a slide operation of the shutter, and an operation opening in the case body to expose the slider to outside to allow for operation of the slider. A seal including a portion that covers and seals at least the operation opening is attachable to the case body.
An antenna module has a substrate, a radiating element disposed in or on the substrate, a power feeding line, and a dielectric body. The substrate has a rectangular shape including first and second sides adjacent to each other. The power feeding line extends in a normal direction of the substrate and transfers radio frequency signals supplied from an RFIC to the radiating element. The dielectric body is disposed on a side surface of the substrate. The power feeding line is coupled to the radiating element at a position offset from the center of the radiating element in a first direction toward the first side. The dielectric body is disposed so as to cover the side surface of the substrate including the first side. The dielectric constant of the dielectric body is higher than the dielectric constant of the substrate.
H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
93.
HIGH FREQUENCY CIRCUIT AND COMMUNICATION APPARATUS
A high frequency circuit includes a power amplifier and a matching circuit connected to an output terminal of the power amplifier. The matching circuit includes an inductor connected in series to an output transmission path of the power amplifier, a capacitor connected in series to and between one end of the inductor and the ground, an inductor connected in series to and between the capacitor and the ground, a switch having a common terminal, a selection terminal, and a selection terminal, a capacitor connected in series to and between the common terminal and the one end of the inductor. The selection terminal is connected to the ground, and the selection terminal is connected to the other end of the inductor.
An acoustic wave device includes a monocrystalline spinel substrate made of a magnesium aluminate single crystal, a piezoelectric layer on the monocrystalline spinel substrate, and an IDT electrode on the piezoelectric layer. Euler angles (ϕ, θ, ψ) of the magnesium aluminate single crystal of the monocrystalline spinel substrate are within a range of any of regions A in FIGS. 5 to 41.
A multilayer coil component includes a multilayer body and outer electrodes. The multilayer body includes insulating layers and a coil. The insulating layers are stacked on top of one another in a stacking direction. The coil is embedded in the multilayer body. The outer electrodes are on an outer surface of the multilayer body and are electrically connected to the coil. The coil includes coil conductors, which are stacked together with the insulating layers in the stacking direction and electrically connected to each other. The coil includes a parallel section in which two or more of the coil conductors stacked in layers are electrically connected in parallel by via conductors interposed therebetween. The parallel section includes a first parallel section and a second parallel section, which is electrically connected in series with the first parallel section.
A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a connection terminal, and a wiring layer. The second electronic component is disposed on the second main surface of the mounting substrate. The connection terminal is disposed on the second main surface of the mounting substrate and is connected to the mounting substrate and the wiring layer. The wiring layer faces the second main surface of the mounting substrate with the second electronic component interposed therebetween and is in contact with the connection terminal. The wiring layer has a base material and an external connection electrode. The base material has a second conductive member connected to the first conductive member of the mounting substrate with the connection terminal interposed therebetween. The external connection electrode is connected to the second conductive member. The wiring layer is in contact with the second electronic component.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/552 - Protection against radiation, e.g. light
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
97.
ELECTROLYTIC SOLUTION FOR SECONDARY BATTERY, AND SECONDARY BATTERY
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The electrolytic solution includes an electrolyte salt and a lithium fluorophosphate. The electrolyte salt includes an imide anion, and the imide anion includes at least one of an anion represented by Formula (1), an anion represented by Formula (2), an anion represented by Formula (3), or an anion represented by Formula (4). The lithium fluorophosphate includes lithium monofluorophosphate, lithium difluorophosphate, or both.
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, base electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers and each including glass and copper, and plated layers respectively provided on an outer side of the base electrode layers. A protective layer including sulfur is provided between the glass included in the base electrode layers and the plated layers.
A wireless power transmission system includes a structure surrounded as a whole by an electromagnetic wave-shielding member having an appropriate conductivity, at least one power transmission unit, and at least one power reception unit. A power reception unit includes a power receiver including a dielectric substrate, a rectifier circuit, and a power reception antenna. The power reception antenna includes power reception antenna lines in a same plane on the dielectric substrate. One ends of the power reception antenna lines are connected to the rectifier circuit, and other ends different from the one ends connected to the rectifier circuit are open ends. A planar shape of the dielectric substrate is a 2N-sided polygon with line symmetry (where N is an integer of two or more), and the power reception antenna lines are along N sides that are adjacent to and different from each other of the dielectric substrate.
A first receiving band and a first transmission band in band A and a second transmission band and a second receiving band in band B are listed in frequency order. A radio frequency module includes: first and second boards; a first filter having a passband that is the first transmission band; second and sixth filters each having a passband that is the first receiving band; third and fifth filters each having a passband that is the second receiving band; a first power amplifier connected to the first filter; a fourth filter having a passband that is the second transmission band; and a second power amplifier connected to the fourth filter. The first to third filters and the first power amplifier are disposed on the first board, and the fourth to sixth filters and the second power amplifier are disposed on the second board.