HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

Chine

 
Quantité totale PI 124
Rang # Quantité totale PI 10 241
Note d'activité PI 2,9/5.0    134
Rang # Activité PI 5 199

Brevets

Marques

112 0
0 0
12 0
0
 
Dernier brevet 2024 - Circuit board connection structu...
Premier brevet 2013 - Chip package structure and metho...

Derniers inventions, produits et services

2023 Invention Circuit board assembly. The disclosure provides a circuit board assembly, which includes a core ...
Invention Circuit board connection structure and preparation method therefor. A preparation method for a c...
Invention Circuit board. A circuit board includes an inner circuit substrate and an outer circuit substrat...
2022 Invention Circuit board and method for manufacturing the same. A circuit board with improved heat dissipat...
Invention Circuit board connection structure and manufacturing method therefor. A manufacturing method for ...
Invention Buried thermistor and method of fabricating the same. A buried thermistor includes a lower subst...
Invention Packaging structure with embedded electronic components and method for manufacturing the same. A ...
Invention Packaging structure. A packaging structure, includes: a dielectric layer; at least one inner wir...
Invention Circuit board and method for manufacturing the same. A circuit board, with inbuilt protection ag...
Invention Camera module of reduced size and method for manufacturing the same. A camera module of reduced s...
Invention Method for manufacturing a circuit board. A method for manufacturing a circuit board comprises: a...
Invention Circuit board with embedded component and method of fabricating the same. A circuit board with e...
Invention Circuit board and method of manufacturing circuit board. A circuit board includes a substrate, a ...
2021 Invention Manufacturing method of circuit board assembly. The disclosure provides a circuit board assembly,...
Invention Circuit board and method of manufacturing thereof. A circuit board includes a dielectric substra...
Invention Circuit board assembly and manufacturing method thereof. The disclosure provides a circuit board ...
Invention Method of manufacturing display module with light emitting diode free of a split-screen boundary ...
Invention Method for manufacturing multilayer printed circuit board. A method for manufacturing such multi...
Invention Wiring substrate and method of manufacturing the same. A wiring substrate includes a first insula...
Invention Circuit board and manufacturing method thereof. The present application provides a circuit board...
Invention Circuit board and manufacturing method therefor. The present application provides a circuit board...
Invention Method of manufacturing composite circuit board. A composite circuit board includes a composite c...
Invention Method for manufacturing flexible circuit board. A method for manufacturing a flexible circuit bo...
Invention Method for manufacturing a circuit board. A circuit board with improved heat dissipation function...
Invention Circuit board and method for manufacturing the same. A method for manufacturing a circuit board e...
Invention Method for manufacturing a circuit board. A circuit board includes a circuit substrate, a solder,...
Invention Circuit board, method for manufacturing the same. A circuit board includes a circuit substrate, a...
Invention Circuit board and manufacturing method therefor. Provided in the present application is a circuit...
Invention All-directions embeded module, method for manufacturing the all-directions embeded module, and al...
2020 Invention Method of manufacturing circuit board with embedded conductive circuits. A method for manufacturi...
Invention Method of manufacturing composite circuit board and composite circuit board. A composite circuit ...
Invention Method for manufacturing a circuit board with embedded nickel resistor. A method for manufacturin...
Invention Flexible circuit board and method for manufacturing the same. A flexible circuit board capable of...
Invention Lens module and manufacturing method therefor. A lens module (100), comprising: a substrate (10),...
Invention Multilayer printed circuit board and method for manufacturing the same. A multilayer printed circ...
Invention Multi-layer circuit board with embedded components and method for manufacturing same. A multi-la...
Invention Embedded circuit board and method for manufacturing same. Disclosed is an embedded circuit board ...
Invention Circuit board and preparation method thereof. A circuit board and a manufacturing method therefo...
Invention Circuit board and manufacturing method therefor. A circuit board (100) and a manufacturing method...
Invention Circuit board and manufacturing method therefor. A circuit board, comprising an electromagnetic s...
Invention Board-to-board connection structure and method for manufacturing the same. The present disclosur...
Invention Plate-to-plate connection structure and fabrication method therefor. Provided in the present appl...
Invention Circuit board with embedded electronic component and method for manufacturing the same. A method ...
Invention Electronic component-embedded circuit board, and manufacturing method. A manufacturing method of ...
2019 Invention Method for manufacturing a packaging structure. A packaging structure, includes: a dielectric lay...
Invention Method for manufacturing transparent circuit board. A method for manufacturing a transparent circ...
Invention Package structure and method for manufacturing the same. A package structure includes an inner wi...